vertical probe card for wafer test - computer systems & …soc.yonsei.ac.kr/test/lectures/seiken...

SEIKEN KOREA

Vertical Probe Card

for Wafer Test

Total Test Solution, Testing Support and High-Fine Pitch Test Technology

SEIKEN KOREAVertical Probe Card Technology

Pin Technology

1

1) Probe Pin

2) Tubeless Pin

3) Micro Cube Pin

Testable Pitch:03(Matrix)Minimum Pin Length:2.67High Speed TestApplication:Test SocketLife Time:＞500000Insulation Material:에코놀(Sumika Super S-1000)Vertical Probing

Testable Pitch:≥100(Matrix)Minimum Pin Length:≥3.0Application:High Density PCB(Flipchip), TAB Probe Card, TCP Test Probe CardLife Time:＞1000,000Insulation Material:에코놀(Sumika Super S-1000), 세라믹, 지르코니아Vertical Probing

Testable Pitch:25Pin Length:Variable(Probe Card5.4)Pin Thickness:VariableApplication:TFT LCD/Organic EL Cell Test Probe Card,Wafer Test Probe CardLife Time:＞300,000Insulation Material:세라믹,지르코니아Vertical Probing


SEIKEN KOREA

Pin Pitch for Test Technology

2

1) Tubeless Pin

Straight:100

Matrix:100

2) Micro Cube Pin

Straight:25

Zigzag:

1)12.5

Vertical Probe Card Technology


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Pin Edge & Available Pad Size

3

< ×500 / 45도 Tilt by SEM >

Damage 면적:9~12×10~15(Ellipse)

Available Target Pad Size:≥20×20

2) Micro Cube Pin

1) Tubeless Pin

1 2 3

Φ 10~100

Damage 면적:Min φ15(Circle)Available Target Pad Size:Min25×25



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Micro Precision Technology

4

1) Micro Drilling

2) Micro 가공

Micro Slot 가공Slot Width:Min 12

세라믹가공지르코니아가공

Micro Hole 가공Hole Diameter:Min 50

Engineering Plastic 가공



SEIKEN KOREA

5

Mother Board

Wafer Chip PAD

Interface Pin

Micro Cube Pin

Wafer

PCB

Pogo Tower

Pin Block

Wafer

Interface Pin

Ground Plate

Micro Cube Pin

Mother Board

Vertical Probe Card Technology(Micro Cube)

Concept


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6

Structure

<Top View>

<Bottom View>

Pin Block

Pin Block Cover

Mother Board

Base Block

Board Guide Ring



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7

Pin Block

Base Block

Interface Pin Setting Block

Micro Cube Pin Setting Block

Fix Block

Center Block

Ground Plate

Interface PinMicro Cube Pin

Center Block Retaining Screw



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8

Micro Cube Pin Block



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9

Interface Pin Block



10

Pin Interface

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11

Cross Section of Probe Card

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Base Block

Interface Pin Setting Block

Micro Cube Pin Setting Block

Fix Block

Center Block

Ground Plate

Interface Pin

Micro Cube Pin

Center Block Retaining Screw Pin Block Cover

Mother Board



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Features

1. Vertical Probing

2. Fine Pitch Probing

3. High Precision Accuracy(Uniformity & Pitch)

4. Recycling이가능

5. 작은면적의 Pad Test가가능

6. Contact Force가일정하다.

7. Damage 면적이작다.

8. Pin의오염이작다.(Soft Brush Cleaning or Tape Cleaning)

9. Pin Inspection이간편하다.



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13

Micro Cube Pin

1. Pin Material:Ni＋Au(0.3) / HV5002. Thickness:

1)24:＞Pitch 402)20:≤ Pitch 403)12:≤ Pitch 20~25

3. Pin Height:5.44. Pin Length:8.4465. Pin Accuracy:±1.56. Pin Force: 10 30 50 70 100

20 1.0 2.6 4.1 5.7 8.024 1.1 2.8 4.4 6.1 8.612 4.0

Stroke

Pin Force(g)

Mechanical Specification

1. Testable Pitch:≥252. Available Target Pad Size:≥20×203. Pin Uniformity:±54. Pin Pitch Accuracy:±45. Life Time:＞300,000 6. Setting Stroke: 60

Full Stroke:100



SEIKEN KOREA

14

수직운동을하나각도때문에수평으로이동되면서

Scratch 및 Damage 발생. Damage가큼.Fine Pitch화에따라 PAD면적이좁아지면심각한문제발생.각도차이로인한 Contact Force가균일하지못함.오염으로인한 Cleaning Cycle이짧다.Fine Pitch Test가어려움.개별 Pin Repair가어려움.

정확한수직운동.Damage 최소(12×15이하).수직운동으로인한오염최소화.Fine Pitch Test 가능.개별 Pin Repair 가능.

Needle Type

Micro Cube Type

Wire 성형 Type

Fine Pitch 불가능Contact Reliability 문제.M/C과의 Interface 문제(Stroke가짧다) Repair 가어려움.Cleaning이어려움.



SEIKEN KOREAVertical Probe Card Technology(Tubeless)

15Total Test Solution, Testing Support and High-Fine Pitch Test Technology

1. 전체구성, 구조, 세부명칭

1) Spring Diameter : 0.14, 0.1, 0.07, 0.05(개발중)

2) Total Length : 3.4, 3.0

3) Contact Edge : 10 ~ 100



① Spring② Plunger 1(Contact Point)③ Plunger 2(Interface Point)

SEIKEN KOREA


Vertical Probe Card Technology(Tubeless)

2. 특징

1) Contact 부위는 Spring 부와별도의구조로접촉에있어서최상의재질을적용가능.

2) Probe에예압이가해진상태로 Plunger가구조물에삽입되어있어서 Plunger 양측의압축이개별적으로가능.이로인해 Interface 부위의경우압축된상태로 Probing작업이이루어지므로접촉불량을최소화

3) 완전한직선형태로수직배치를하여 Spring 성능을극대화Pin 배치의제약을받지않으며, 수리가용의

4) Pin수에대한단납기제작이가능.

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0

2

4

6

8

10

12

14

16

18

20

0 500 1000 1500 2000 2500 3000 3500 4000 4500 5000

Pin Q ,ty

제작일수




3. 대응제품사양1) Pitch 대응

-100(Matrix) : 현재한계-80(Matrix) : 개발진행중※Matrix Pad Target 80 Pitch Test를위해 Spring Diameter를

50로개발진행중

2) Pin수-144Pin / Pitch 120 /Memory/Build up PCB Interface (실적)-4700Pin / Pitch 200 / MCM / 중계 Pin Interface (실적)-4700Pin / Pitch150 / 중계 Pin Interface (현재의한계)

※Probe Card PCB Interface의경우현재 FPC, 세라믹기판등다양한방법으로 Pin Pitch에대응할수있는기술개발중.

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1) Tubeless Pin 사양-재질 :

.Plunger : SK材(기타재질적용도가능)

.Spring : Music Wire(SWPA)

-표면처리 : Ni 2, Cu 4, 전해 Au 0.3

- Spring 부단면 : .67 X 20 / φ0.14.67 X 15 / φ0.10.67 X 15 / φ0.07.( ? ) / φ0.05 : 개발중


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4. 제품사양 . 특성1) Tubeless Pin 사양

-Plunger Contact 면적 : .φ0.1(Pin Diameter φ0.14).φ0.06(Pin Diameter φ0.10).φ0.04(Pin Diameter φ0.07).φ0.01~0.15(Pin Diameter φ0.10/φ0.07/φ0.05)

-Pin Length : 3.0 ~ 3.4(가변가능)-자체저항 : ≤300mΩ-허용전류 : 1A-Contact Force : 3.0g ~ 10g(0~300압축시):Pin의 Diameter에따라다름:3.5g은 Initial Force임. ex) 8.3g / 200압축 / Pin Diameter 0.14


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2) 일반사양

-Damage Size : φ20 ~ φ40(Probe Mark Size)-Scratch : 없슴(Vertical Probing)-Stroke 량 : 200~300(Max)-Cleaning : Tape(3M社)-Life Time : ≥1000,000회-Height Accuracy : ±10-Position Accuracy : ±10-Insulator Material : Sumika Super(S-1000)


SEIKEN KOREA

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1. Repair 용의 : 자체수리가능

2. Running Cost 절감 : Repair Time 감소 / 개별 Pin 교환가능

8-3. Long Life Time

4. Pin Contamination의최소화 : M/C MTBF 증대 / 생산성향상

5. Pad Damage 최소화 : Die Shrink 가능

6. Pad Contact Reliability 향상

7. YLD 향상기대

8. Fine Pitch 대응

3. Long Life Time


Benefits


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24

1. Multi Chip Probe Card 개발

2. Array Pad Chip Probe Card 개발

3. High Function Contact Pin 개발

고객생산성향상

Cost DownTarget Pitch : 40(Matrix)

Flipchip Wafer Test용 Probe CardWafer Level 제품대응Target Pitch : 80(Matrix)-Tubeless Pin

High SpeedHigh DensityFine Pitch



We will always do our best efforts for the bestquality and best customer service.

SEIKEN KOREA Co., Ltd.

SEIKEN KOREA Confidential Total Test Solution, Testing Support and High-Fine Pitch Test Technology

SEIKEN KOREA

vertical probe card for wafer test - computer systems & …soc.yonsei.ac.kr/test/lectures/seiken...

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