vinay barde : program manager alexis reusch: program facilitator jason marks: lead ee alfred lee:...

Vinay Barde : Program Manager

Alexis Reusch: Program Facilitator

Jason Marks: Lead EE

Alfred Lee: Lead CE

Balance Tower(P12005)

• Seated balance to help physical therapist teach wheel chair bound patients to improve the strength of their core muscles.

• Currently have a tower that is built that has seven large panels in a vertical line that are separated by 3 tri-colored LEDs.

• When activated the LED’s will be blue, if the patient touches the target they will turn green and if they miss they will become red.

• There are two games in the MCU : Random & Timed Trial

• Second tower will be added to the game to add more challenges for the patients. This tower will be a slave to the first tower and help to increase a patients side to side reaching distance.

Project Overview

Scope:

• Design and build the electrical components of two towers so that they may communicate wirelessly to one another

• Perfect software that was developed by team P10005 for the towers to add in a second tower as well as more games and components

• Add a measuring device to the outside of the tower so the therapist can measure the distance between the tower and the patient

Scope & DeliverablesDeliverables:

• Two functional towers

• Upgrade current wiring in Tower #1

• Populate Tower #2

• Wireless Communication between towers

• Distance Sensor on each tower

Customer Needs

Engineering SpecificationsMetric

No.Need Nos.

Engineering SpecificationsMetric Imp Units

Desired Direction

Marginal Value

Ideal Value

1 7,8 Time to sanitize 1 sec down 90 602 5 game response time 9 ms down 60 403 9 set up time ( movement of towers) 1 mins down 2 14 1,3,14 Proximity to activate panels 3 in down 0.75 0.255 1,20 Number of game options (rounds, endurance, competition, duration) 3 # complete up 2 46 6 Accuracy of measurement between person and tower 3 in down 1 07 2,22,23 Functional reach measurement range 9 ft up 3 58 6,23 Functional reach measurement accuracy 9 in down 2 09 9 Time to program games 3 minutes down 5 2

10 4,14 Delays for wireless 9 ms down 25 1011 2 Range of heights where proximity measurements can be taken 3 ft target 2 512 9,11 Size of box for the Ultra Sonic Ping sensor (Length and width) 1 in down 3 313 2,9,11 Weight for entire system (per tower) 1 lbs down 20 1514 12 Wireless range (Maximum tower separation without the use of wires) 1 ft up 20 4015 10,22 Range of Ping sensor 9 ft up 7 1516 9,24 Time between maintenance (replace or recharge batteries) 3 min down 2 117 1,3,4,6,19 Total number of games 9 # of games up 2 318 1,4,12 Towers involved in games 9 # of towers up 1 219 13 LED indication to be ready to use 1 sec down 5 320 21 volume of audio ( indication of sucessful touch) 1 db target 65-70 50-6021 16 Size of LCD screen so that it fits in the tower (width ) 1 in. down 3.5 422 15 LED Indication for which buttons are selected 1 sec down 7 523 17, 18 Device will display results (hit, miss, average time, separate results per tower) 3 boolean yes yes yes

MetricNo.

NeedNos.

SafetyMetric Imp Units

DesiredDirection

MarginalValue

IdealValue

1 7 Fillet of track corners 3 Degs Down 30 152 7,8 Optical Visibility ( % of lights seen by the client) 3 % up 75 1003 7,8 Cleanliness of the towers 3 % Down 15 5

System Architecture

Capacitive Touch Chip Choice

Capacitive Chip Layout Schematic

Capacitive Chip Schematic

Distance Sensor Selection

Sensor Schematic

Wireless Communication between Towers (Ez430-RF2500 )

Tower #1(Master)

Tower #2(Slave)

User Input

RF Communication( Transmit/Receive)

Ex430-RF2500• Frequency @ 2.4

GHZ• Communicates

with Evaluation boards through I2C via SimpliciTi protocol

Ez430-RF2500 • 16-MIPS performance• 200-ksps 10-bit SAR

ADC• Two built-in operational

amplifiers• Watchdog timer, 16-bit

Timer_A3 and Timer_B3• USCI module supporting

UART/LIN, (2) SPI, I2C, or IrDA

• Five low-power modes drawing as little as 700 nA in standby• 2.4-GHz radio-frequency (RF) transceiver

• Programmable data rate up to 500 kbps• Low current consumption• USB debugging and programming interface featuring a driverless

installation and application backchannel• 18 available development pins• Highly integrated, ultra-low-power MSP430 MCU with 16-MHzperformance

RGB LED Schematic

LED Drive Circuit

MSP-EXP430F5438 Evaluation Board

MCU I/O Map Tower 1

MCU I/O Map Tower 2

UML Class Diagram

Balance Tower State Diagram

Sequence Diagram

Power Layout Schematic

Power Estimate

Component Min Input Voltage (V)Max Input Voltage

(V) Avg Supply Current (mA) Max Supply Current (mA) MSP-EXP430F5438 2.2 3.6 1 2

LEDs 2.5 4 20 25 LCD 4.7 5.5 5 15

Capacitive Buttons 2 5.5 5 10 Wireless 1.8 3.6 18 22

Ultra Sound Ping Sensor 5 5 30 35

Case Usage (mAh) Usage (mWh) Total Power (mW) Battery Life (%) Total hours of Life Days

Defintion

Supply Current*Hours Used

Supply Current* Vout*Hours Used Power Usage/Hours Used Power Used in

Hour/Battery Power in Hour(Battery Power-

Minimum Battery Req)/Total Power

Total Hours/ Hours Used per day

AVG 598.000 1973.40 493.35 3.43 111.13 13.89Max 840.667 2774.20 693.55 4.82 79.05 9.88

Voltage Output (V) 3.3 Note: Ping sensor calculations take into account the

brief time it will be active.Hours Used per day 4.00

V mAh mWhBattery 6 9600 57600 Only 6 LEDs are assumed to be on

Minimum Battery requirement 5 462.37 2774.2

Test 1: Subsystem/ Function/ Feature Name: Tower Setup

Date Completed: _________________

Performed By: __________________

Description: Test the time it will take to set up and perform maintenance on tower(s) for next use.

Test Plan

Engr. Spec.

#

Specification (description)

Unit of Measu

re

Marginal

ValueComments/Status

1 Time to Sanitize

sec 90

3 Set up Time

mins 2

10 Time to program games mins 2

17Time to change out the batteries

mins 2

Engr. Spec. #

Instrumentation or equipment (description)

1 Clorox disinfectant wipe, stop watch3 Stop watch10 Stop watch17 Stop watch

Test 2:

Subsystem/ Function/ Feature Name: PCB

Date Completed: _________________

Performed By: __________________

Description: Perform tests on PCB to verify correct operating conditions.

Test Plan

Engr. Spec.

#


Unit of Measu

re

Marginal


- Check voltage rails on PCB V 5, 3.3

- Check for physical damage - -

- Check continuity Ohms Open

-Cross check with schematics for functionality

- -

Engr. Spec.

# Instrumentation or equipment (description)

- Multimeter- Visual Inspection- Multimeter- Visual Inspection

Test 3:

Subsystem/ Function/ Feature Name: Hardware Test of MCU Connections

Date Completed: _________________

Performed By: __________________

Description: Checking input/output lines from MCU for correctness.

Test Plan

Engr. Spec.

#


Unit of Measu

re

Marginal


- Check I2C lines - - - Check power lines V 5, 3.3

- Check LED lines V 3.3

Engr. Spec.


- Oscilloscope - Multimeter- Multimeter

Test 4:Subsystem/ Function/ Feature Name: Software

Date Completed: _________________

Performed By: __________________

Description: Testing functionality of program, and interaction between peripherals and MCU.

Test Plan

Engr. Spec.

#


Unit of Measu

re

Marginal


- Program functionality test - works 2 Game response time ms 60

4

Proximity to activate panels in 2

Delays for wireless

15Wireless range (Maximum tower separation without the use of wires)

ft 20

20LED indication to be ready to use

sec 5

23LED Indication for which buttons are selected

sec 7 Engr. Spec.


- Computer2 Stop watch4 Tape measure15 Tape measure, computer20 Stop watch23 Stop watch

Test 5:

Subsystem/ Function/ Feature Name: Ping Sensor Setup

Date Completed: _________________

Performed By: __________________

Description: Test the functional reach test of the sensor for accuracy and distance. Use a piece of black plastic with a bulls eye to test the reach of the laser. Observe the sensor can detect the patient’s hand. Test should be completed 10 times.

Test Plan

Engr. Spec.

#


Unit of Measu

re

Marginal


7Accuracy of measurement between person and tower

in 1

8 Functional reach measurement range

ft 3

12Range of heights where proximity measurements can be taken

ft 1.25

13Size of box for the Ultra Sonic Ping sensor (Length and width)

in 3 Engr. Spec. #


7 Tape measure8 Tape measure, laser pointer12 Tape measure13 Tape measure

Test 6:Subsystem/ Function/ Feature Name: Games

Date Completed: _________________

Performed By: __________________

Description: User will play the game and test it for game response, activation time, and if correct operation

Test Plan

Engr. Spec.

#


Unit of Measu

re

Marginal


2 Game response time ms 60 4 Proximity to activate panels in 2

5Number of game options (rounds, endurance, competition, duration)

#complete

2

9Functional reach measurement accuracy

in 2

19 Towers involved in games sec 5 Engr. Spec. #


2 Stop watch4 Tape measure5 Count9 Tape measure19 Stop watch

Test 7:

Subsystem/ Function/ Feature Name: Functionality of the Capacitive Chip

Date Completed: _________________

Performed By: __________________

Description: We will test to see what power we need for all outputs to work reliably. Power and Clock will be applied to the chip. The voltage will and we will vary the sinusoidal signal to make sure all eight outputs are functional.

Test Plan

Engr. Spec.

#


Unit of Measu

re

Marginal


4 Proximity to activate panels in .75

Engr. Spec. #


4Power supply, oscilloscope, function generator, Tape Measure

Project PlanTask

Responsible Member Start Date

Expected Date

Date Completed Dependency Comments

MSD II

Close Remaining Action Items from PMR

Group 3/12/2012 3/16/2012 21

Order rest of material needed for build Alexis 3/12/2012 3/16/2012

Software Code STUBS Alfred 3/12/2012 3/16/2012

PCB Layout prep for sending Jason, Vinay 3/12/2012 3/16/2012

Cap touch Chip/LED prototype boardVinay, Alexis

Jason3/12/2012 3/16/2012

Send out PCB For Fabrication Jason 3/19/2012 3/19/2012 21

Receive PCB and Begin TestingJason, Vinay,

Alexis3/26/2012 4/9/2012

Preliminary BuildsJason, Vinay,

Alexis3/19/2012 3/26/2012

Wire Up Led Banks (all 16) Jason, Alexis 3/19/2012 3/26/2012

Wire Up both ping sensor boards Vinay 3/19/2012 3/26/2012

LED portion of Code Complete Alfred 3/19/2012 3/26/2012

Software Development Alfred 3/12/2012 4/13/2012Initial main code for MCU ( Panels, LED, LCD code) ie. One Button Code Alfred 3/12/2012 3/30/2012

System Code (Expanding One Button Code) Alfred 3/30/2012 4/6/2012

Unit / Integration Tests for Touch panels, LEDs, LCD) with Cap Chip/LED proto baord

Vinay, Alfred 3/26/2012 4/12/2012

Ping Sensor Code Vinay 3/19/2012 3/26/2012

Integration of MCU code with sensor and wireless

Alfred, Vinay, Jason

4/13/2012 4/23/2012 24

EZ430-RF2500 Wireless Code Alfred 4/13/2012 4/23/2012

Test Wireless Alfred 4/20/2012 4/23/2012

Component Testing Group 3/26/2012 4/6/2012 23, 25

Test PCB Functionality (Test plan #2) Group 3/26/2012 3/30/2012

Test MCU Functionality (Test plan #3 ) Group 3/30/2012 4/6/2012 24

Tower 1 Build Group 4/6/2012 4/23/2012 24,25,26

Electronic PopulationAlexis, Vinay,

Jason4/6/2012 4/9/2012

Machine Tower for Sensor box attachment Jason, Alexis 4/9/2012 4/13/2012

Integration Testing ( Test Plan #4) Group 4/9/2012 4/23/2012

Tower 2 Build Group 4/20/2012 4/27/2012

Electronic PopulationAlexis, Vinay,

Jason4/20/2012 4/23/2012

Machine Tower for Sensor box attachment Jason, Alexis 4/23/2012 4/25/2012

Integration Testing ( Test Plan #4) Group 4/25/2012 4/27/2012

Complete System Integration Group 4/27/2012 5/4/2012Acceptence Testing (System functionality Test # 6) Group 4/27/2012 5/4/2012

Project Planning ( Continuously through quarter)

Group 3/16/2012 3/16/2012

Updated Risk Assessment Alexis 3/16/2012 5/18/2012

Update Project Plan Vinay 3/16/2012 5/18/2012

Update Edge Group 3/16/2012 5/18/2012

Poster Group 5/4/2012 11-May 27,28,29

Final Paper Group 5/11/2012 5/18/2012

User Manual Group 5/10/2012 5/11/2012

Performance Review With Customer Group 5/11/2012 5/11/2012 29

FINAL Project Management Review Group

RisksID Risk Item Effect Cause

Likelihood

Severity

Importance Action to Minimize Risk Owner

Describe the risk briefly

What is the effect on any or all of the

project deliverables if the cause actually

happens?

What are the possible cause(s) of

this risk?

L*S

What action(s) will you take (and by when) to prevent, reduce the impact of, or transfer the risk of

this occurring?

Who is responsible for following through on mitigation?

1Adding all of the new

elements into the code

This would cause our project to not work

correctly and not meet the customer needs

Team members coding things they

are not familiar with

3 9 27

Going to see the faculty that is versed in these areas as well as

looking up sample code on how to add these to the existing code.

Prioritize sections of code.

Group

2Arguments within

team

Effect over all outcome and time

management

Teammates disagree on decisions

3 3 9Everybody has a say, discuss everything as a group. Learn

to compromiseGroup

3Unable to finish product design

Will lose total completion time on

project

Different parts of project plan not completed on

time

1 9 9Follow the project plan and frequently keep up to date

with everybody’s workGroup

4 Customer feedbackPrevent optimal

design

Inability to contact

customer3 9 27

Make multiple attempts to talk with customer, email,

call, etc.Alexis

5Current power not sufficient for new

parts

Affect budget, new parts

Using new parts in design

3 1 3

Not a big risk, can be accounted for buy increasing

power with more batteries etc.

Jason

6 Scheduling conflictsEffect over all

outcome of the project

Number of classes everyone is taking outside

of MSD

3 3 9

We will set long term goals so that as the deadline

approaches we will have time to ask another group member

for help if needed.

Vinay, Alexis

7Reliability of

measuring tool

Would affect customer

satisfaction

Some measuring tools are more reliable than others we will

need to do plenty of

research before choosing

3 3 9

Test the part that we choose and make sure that we have

research to support our choices

Vinay

8 Part AvailabilityWould slow down

progressLead times 3 3 9

Plan ahead, find substitute parts

Alexis

9 BudgetPrevent completion

of project

Ineffective budgeting/lack of

funding1 3 3

Only purchase parts when 100% sure they will be used

Alexis

10

Group member becomes unavailable

permanentlyLoss of resource

Dropping class/becomes ill

1 3 3

Attempt to convince the member to not drop the

course. Major redesign project plan may be needed

Group

11

Loss of TowersNo longer have a

deliverable productStolen/Misplaced 1 3 3

Major redesign project plan may be needed/Reconstruct

the tower. Group

12

Group member fails to deliver critical

component

Would slow down progress

Preoccupied with other classes

1 3 3

Have midweek and full week progress reports. This allows personal, and team evaluation

of progress, as well as allowing others to assist if

deemed necessary.

Group

13

Products purchased are insufficient for

Design

Prevent accurate modeling, and better design

Insufficient research before

purchasing3 9 27

Research needed parts, talk to experts in area of need

Group

14

Wireless module delaySlow down rate of

games

Wireless communication not fast enough

3 3 9Know how to optimize wireless

communication deviceAlfred, Vinay

15

PCB does not work correctly

Bad designWould have to redesign and

reorder3 9 27

Have team/prof review PCB layout

Jason

Risks

BOMBill of Materials

Part Name Manufacturer Manufacturer Part # Distributor Distributor Part # Unit PriceQuantity Needed

Total Price

1 RGB LED's Kingbright WP154A4SUREPBGVGAW DigiKey 754-1492-ND $1.37 60 $82.20

2 Microprocessor Board TI MSP-EXP430F5438 - - $149.00 2 $298.00

3 Rechargeable Batteries and Charger

Tenergy - All-Battery.com 8 Bay charger and 16 Batteries $36.49 1 $36.49

4 Voltage Regulator (3.3v) - - SparkFun COM-00526 $1.95 4 $7.80

5 EZ430-RF2500 TI EZ430-RF2500 - $49.00 1 $49.00

6 Ultra Sonic Ping Sensor Parallex 28015 DigiKey 28015-ND $29.99 2 $59.98

7 MSP430 USB JTAG TI MSP-FET430UIF - - $99.00 1 $99.00

8 PCB Advanced Circuits - Advanced Circuits - $33.00 3 $99.00

9 EZ RF Header Mill-Max 850-10-006-20-001000 ARROW - $1.14 2 $2.2810 LCD Screen Sparkfun GDM12864H Sparkfun GDM12864H $19.95 1 $19.9511 Transistors Faichild Semiconductor 2N4401D75ZCT-ND Digikey 2N4401TAR $0.21 30 $6.3012 Surface Mount Resistors 4.7K Panasonic P4.7KGDCT-ND Digikey ERJ-3GEYJ472V $0.02 20 $0.4013 Surface Mount Resistors 820K Panasonic P820KGCT-ND DigiKey ERJ-3GEYJ820V $0.01 50 $0.4614 Surface Mount Resistor 56 Panasonic P56GCT-ND DigiKey ERJ-3GEYJ560V $0.01 100 $0.7015 Surface Mount Capacitors .1uF Murata Electronics 490-1524-1-ND DigiKey GRM188R71E10KA01D $0.03 20 $0.5216 Surface Mount Capacitors 10uF TDK Corporation 445-6853-1-ND DigiKey C1608X5R1A106M $0.46 10 $4.5717 Header TE Connectivity A36395-ND DigiKey 1-5164713-0 $1.28 35 $44.88

Totals $811.53

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vinay barde : program manager alexis reusch: program facilitator jason marks: lead ee alfred lee:...

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