Vision

Small inexpensive computers in every device, appliance and piece of equipment in buildings, offices, classrooms, homes, cars, factories networked to each other and the Internet sensing and reacting intelligently to the environment

Information instantly accessible anywhere and anytime

Enormous new global market transforming the way U.S. industry does business transforming the way people live requiring the development of a measurement and standards infrastructure ensuring that U.S. manufacturers are not at a disadvantage

Goal

To provide measurement science and standards that allow the private sector to develop the technologies needed for the digital economy, e.g. miniaturization high speed wireless communications new methods of using information technology

Investing in Metrology & Infrastructure Today for Tomorrow

palm-sizecomputers28 million in 2006

E-Commerce$300 billion in 2001

smart phones13 million in 2006

screen phones

active badges

Forget-Me-Not

Worldwide Information Appliance Forecast

Unit Shipments (000)

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1997 1998 1999 2000 2001 2002

Appliances vs PCsUS Shipments, Consumer Devices,

In Millions

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PCs

IAs

Economic Growth via Integration of Information Technologies

• Information appliances and devices with integrated semiconductor, opto-electronic, and analog sensory components

• Communications and computing services simultaneously interfaced to multi-modal fixed and mobile infrastructure (wired and wireless; optical, microwave, and electronic; fiber, coaxial copper and other wired…)

• Human-computer interactions enabled by multi-modal communications (voice, sensory/tactile, still and full motion color images, data) with computing applications

All depend on • Faster, smaller, higher density, silicon-based integrated circuits• Standards and measurement capabilities

Wearable Computers

Source: http:/www.xybernaut.com/ix/ix.html

cigar box-sized PC worn at waist miniature monitor worn in front of eye microphone for voice input

Smart Meeting Room

Situation awareness Speech, natural language input Computer vision input Integration of handheld computers into room Retrieval and visualization of information Distributed collaboration

10

Internet Cars

• Daimler-Benz Concept Car

• PCs in trunk

• two backseat displays and one console display

• integrates GPS, PDAs, cell phones, video games

• provides wireless internet access

• provides IrDA inside vehicle

• e-mail, voice mail, web surfing, navigation assistance

FedEx BodyLAN 2000Package status data using wireless Local Area NetworkHandheld computers and printers

Digital Camera: From Chip to System

Miniaturization made camera on a chip possibleIntegration of CMOS & CCD technologiesEnabler for information technologies & services

Desktop videoStill pictures over the InternetDocument and image scanningHuman computer interaction (gestures, face recognition)

Image Source: Bell Labs Technology:Trends & Development

Metrology Needs: Semiconductors

Critical Component Technologies

Semiconductors - miniaturization & increased performance are key

Nanoscale Measurements - measure & manipulate individual atoms & molecules

Optoelectronics- replace electrical by optical transmission of signals on chips; optical data storage; advanced devices

Wireless Communication - interconnecting computers without physical constraints

Timestamping - accurate & secure recording of electronic transactions & events

Human Computer Interfaces - rich, natural forms of interaction beyond keyboard and mouse

Interoperability for Manufacturing - interoperability among competing vendors’ systems & subsystems

KEY NIST ROLE IN COMPONENT TECHNOLOGIES

TECHNOLOGY KEY METROLOGY & STANDARDS NEEDS

WHY ARE THEY KEY?

Semiconductors Characterize interconnect materials and performance at> 1 GHzPhysical and electronic properties of new materialsNew testing techniques for increasing levels ofintegrationMeasuring ever smaller dimensions: < 100 nm critical dimensions

New materials, measurement technology, and testing methods areneeded to overcome imminent barriers to continuedperformance/cost growth.

Optoelectronics System level interoperability and test methods for densewavelength division mulitplexing (DWDM) Optical data rates > 40 Gb/s/wavelength Number of wavelengths > 200 channels

Increasing bandwidth demands require robust WDM systems tooperate with current single-mode fiber optic backbone

NanoscaleMeasurements

Extend measurement technologies (size, electronicproperties, magnetic properties, optical properties, etc.)to structures with sizes on the order of atoms Target critical dimensions: 1 nm

Future nanoscale devices will operate with fundamentally differentphysics than current microelectronic devices. Advancedmeasurement techniques are needed to manufacture, characterize,and improve future nanoscale devices.

Wireless Protocols and LMDS Measuring & testing quality of communications whileindoors, outdoors, stationary, & moving Outdoor & moving: Data bit rate: 1 Mb/s with RF Total transmission system power: 100 mW

Measuring performance under high user densities 1 user/sq m for 100 Kb/s for outdoors

Wireless systems must perform well in all these environments

The full promise of wireless communications cannot be achievedwithout operations in high user density spaces

Human Computer Interaction Measuring & testing effectiveness of informationextracted using human language technologies 2-3% word error rate in speech recognition for noisy environments & multiple speakers

Measuring & testing accuracy and quality of informationretrieved from databases 50% error in finding documents

High performance in human language technologies will result insystems that are easy and intuitive to use

Information retrieval technology is not useful unless it returns thecorrect information

Interoperability for Manufacturing Developing interoperability interface standards

Testing conformance to standards

Interoperability cannot be achieved without interface standards

All products should conform to the same interoperability standards

Timestamping Ability to record timing of sequential events to 1microsecond accuracy or better.

Electronic commerce and other applications require accurate timesequencing of transactions.

Interoperability for Manufacturing

Collaborators

Industry: National Industrial Information Infrastructure Protocols (NIIIP) Consortium, Object Management Group (OMG), National Center for Manufacturing Sciences, PDES Inc., Advanced Micro Devices, Black and Decker, Boeing, Caterpillar, Deneb Robotics, Ford, General Dynamics, Lockheed, Industrial Technology Institute, Software Engineering Institute, AIAG, CAM-I, USPro, SEMATECH

Academic: University of Michigan, RPI, University of Maryland, Florida International University, Ohio University, Stanford

Federal: NSF, DARPA, DOE

Goals Provide leadership in the development, testing, harmonization, and

deployment of standards supporting interoperability of manufacturing systems. Perform research in cooperation with industry that anticipates and addresses important interoperability

measurements and standards needs in a timely fashion. Technical Areas

• Information Modeling, Simulation Modeling and Virtual Reality, Collaboration technology, Distributed or remote testing,

• Ontological engineering, Object and agent architectures, Mediation services,

• Knowledge-based Engineering, Frameworks for Manufacturing Systems

Impacts• Reduced cycle time for new product introductions• Increased business opportunities between trading partners• Improved sharing of business and technical data across supply

chainsMilestones

• FY 00:Establish product data standards conformance and interoperability testing program.

• FY 00: Demonstrate working interoperability testbed enabling remote access to testing systems by vendors and industry users

• FY 01: Deploy web-based algorithm testing and calibration services

• FY 01 Demonstrate open infrastructure to support communications between enterprise and production levels

• FY01: Pilot new supply chain models to gain agreement on next generation standards for distributed manufacturing enterprises

• FY 02: Demonstrate set of value-added software tools for use by vendors and users for interoperability trials

• FY 02 Implement interoperability and communication protocols between design and manufacturing systems

Nanoscale Measurement Science forNew Generation Microelectronics

Collaborators

IndustrialIBM, Intel, Motorola, SEMATECH, NSIC

AcademicCornell University, Rice University, Harvard University,

University of Colorado

FederalNASANSA

Goals Provide the metrology and scientific tools to develop new generations of microelectronic and micromechanical technology, bypassing the limitations of existing technology, to develop devices that are smaller, faster, cheaper, and better.

Technical Areas• Atom-by-atom manipulation and assembly for advanced

devices• Coherent matter wave engineering• Development of new information technology based on electron

spin (rather than electron charge)• Development of molecular electronic devices

Impacts• Critical enabling technology • Current silicon semiconductor technology will be exhausted in

10 to 15 years• Continued expansion and new development in the >$700B US

IT market

Milestones FY2000-2004• Construct advanced cryogenic STM system for characterizing new

generation nanoscale electronic devices• Develop autonomous system for atom-by-atom manipulation of surfaces

to produce new nanoscale devices and structures• Develop techniques for manipulation of atoms using laser light and atom

optics (atom laser, atom hose, etc.) for production of nanoscale devices and structures

• Develop measurement technologies to fabricate and characterize spintronic devices (based on electron spin rather than charge)

• Develop measurement technologies to fabricate and characterize molecular electronic devices

• Develop measurement technologies for new computation and cryptography based on quantum mechanical properties of arrays of atoms and ions

Images of atomic and magnetic nanostructures

Metrology for Optoelectronics

Collaborators

Industry: This work is principally in support of and at the request of industry. Major industry associations and standards groups will provide consultation and recommendations on priority for better measurement techniques and standards.

Academic: Graduate students and post-docs will participate in research, thereby transferring measurement technology to industry;

Federal: Close connection with DoD (especially DARPA, AFOSR, ARO) will be maintained to assure that military needs for optoelectronic metrology will be met

Goals To provide the optoelectronics industry with more extensive

measurement technology and standards, in support of its efforts to compete more effectively in the international marketplace.

Technical Areas

• Improved measurements and standards for all major areas of optoelectronics will be addressed, e.g. optical communications, optical data storage, optoelectronic imaging, medicine and manufacturing.

Impacts

• The international market for optoelectronic components is currently about $35B per year and growing at 15% to 20% per year. U.S. companies have a strong technology base, but only 25% market share.

• The industry has identified improved measurements and standards as a key part of its strategy for improving market share, and has asked for NIST’s assistance.

Milestones

• FY 00: Standards for colorimetry for electronic publishing; standards for light emitting diodes (LEDs), for displays and traffic signals; improved measurements for multimode optical fiber for local communications

• FY 01: New composition standards for semiconductor laser materials; new standards for compact discs (CDs) and digital video discs (DVDs) used in consumer electronics and computers; new standards to support higher capacity optical communications needed for the Internet

• FY 02: New dimensional measurement techniques for advanced laser structures; new measurement techniques and standards for blue lasers needed for advanced optical storage technologies.

• FY 03: Measurements for ultra-high speed computer interconnects.

Semiconductor LasersComponents for CD Players

Optical Fiber Optical Waveguide Coupler

1

Authenticated Timestamping for Digital Transactions

Collaborators

Industrial:

Developing electronic notary services (e.g., Surety)

Academic:

University of Colorado

University of Delaware

Federal:

NIST PL / ITL

US Postal Service

Goals

Provide >100 million reliable, authenticated time messages per day directly traceable to the NIST time scale for timestamping of digital transactions

Technical Areas

• Internet and wireless dissemination of time signals• Advanced algorithms for Internet time delay corrections• Advanced public key time stamp signing for security• Development of user authentication hardware• Redundant authentication (network-based and telephone-based)

Impacts

• Critical enabling technology • Security and authenticity of $100B transactions daily• SEC requires timestamping of transactions synchronized to NIST

clock -- similar increased regulatory uses expected • Increased international digital transactions requiring new security

and authenticity measures

Milestones FY2000-2004

• Expand Internet time service capacity

• Design network authentication and security hardware

• Design network security overlay

• Modify standard Network Time Protocol for improved security

• Develop advanced network time service monitoring and control

algorithms

• Develop wireless time stamping security and authentication

>3,000,000daily requestsfor automatedInternet Time

Service

Human Computer Interaction

Collaborators

Industry: AT&T, BBN, Dragon Systems, IBM, Bellcore, Lexis-Nexis, SRI International, Claritech, Apple Computer, General Electric, Harris Corp.

Academic: U. of Maryland, Carnegie Mellon U., U. of Pittsburgh, Rutgers U., Boston U., Massachusetts Inst. of Technology, U. of Massachusetts, Cornell U., George Mason U., New Mexico State U., U. of North Carolina

Federal: DARPA, NSA, FBI, NIJ, NSF

Goals To develop measurement and test methods, and interoperability

specifications, for advanced human computer interaction technologies.

Technical Areas

• Human language technologies• Computer vision technologies• Multi-modal interaction• Information visualization• Usability engineering• Interactive tele-collaboration• Integration technologies

Impacts• Increased user-friendliness of computers, leading to greater sales

and acceptance by consumers• Interaction with small, embedded, mobile, & wearable computers• Pervasive use of computers at work, at play, and in people’s daily

lives

Milestones

• FY 00: Working with industry and academia, develop measurements and tests for advanced human computer interaction technologies

• FY 01: Build NIST testbeds and reference implementations for integrated human computer interaction technologies

• FY 02: Work with industry and academia to apply tests to research systems to push forward the state-of-the-art

• FY 03: Develop and apply approaches for testing usability of interface devices and interactive, collaborative systems

• FY 04: Work with industry to develop, apply and disseminate open interoperability standards and integration technologies

Broadband Wireless Communications

Collaborators

Federal:•National Telecommunications and Information Administration (NTIA)

-Institute for Telecommunications Sciences

Non-Profit Standards Body:•Institute of Electrical and Electronics Engineers (IEEE)

Industry:•Consortium to be formed:

-Wireless System Equipment Companies-Component Suppliers-Service Providers/License Holders

Goal•To foster the development of industry consensus standards for broadband wireless communications systems by providing reliable measurements and data through the National Wireless Electronic Systems Testbed (N-WEST).

Technical Areas•two-way point-to-multipoint digital wireless systems•millimeter-wave fields and electronics•coding and modulation

Applications•electronic commerce, videoconferencing, telecommuting, telemedicine, education

•services: ATM, high-speed Internet, digital TV, telephone

Impacts•drive down unit costs•enhance competition in telecommunications market•open the market to smaller companies •strengthen U.S. in international standards competition•pioneer new federal approach to U.S. standardization

Milestones

FY00:• standards consortium established within IEEE• testbed facilities built and data collection begun

FY01:• millimeter-wave components standardized

FY02:• coding and modulation standardized

FY03: • standards applied to satellite systems

FY04:• industry consensus standards adopted internationally

NSMP ACTIVITIES

Collaborators (At last count)

- 23 semiconductor manufacturers- 52 manufacturing equipment companies- 3 industry associations- 7 standards organizations- 40 universities- 12 government laboratories- 3 consortia

Goals • Deliver well-understood measurement techniques, standards, and

services to meet the semiconductor industry’s needs

Technical Areas• 29 existing NIST projects described in NSMP Project Portfolio FY 1998.• New projects planned:

- measurements for monitoring lithography tool performance- dimensional measurements for ever-smaller semiconductor devices- measurements for interconnect performance and device reliability- improved models for device performance- optical thermometry for spatial temperature uniformity and control- characterization of properties of very thin films- techniques for in-situ measurement of thin film deposition

Impacts• Supports competitiveness of the semiconductor industry and hence the

electronics industry, the country’s largest• Enables the industry to measure with confidence

- pattern dimensions on chips- performance and reliability of interconnections- properties of new thin film materials essential for coming chip generations

MilestonesFY 01: - establish atom-counting basis for calibrating lithographic dimensions - make full suite of thin-film metrology methods available to industry

FY 02: - devise absolute dimensional standards based on atom-counting - establish special test for x-ray photometry of lithography tools

FY 03: - transfer improved models of device performance to industry - deliver characterization methods for constant-impedance signal lines on chips

Low Frost Point Humidity Generator