vps 101 2a

Leader in Vapor Phase Technologywww.rdtechnicalservices.com

David SuihkonenHosted by AMS Materials. LLC

Scott ShafferAMS Materials, LLC 866-772-5108

AMS Materials, LLC 866-772-5108

Vapor Phase was one of the first SMT reflow methods

• Vapor Phase uses an Inert liquid that when heated, creates a stable, uniform, heat transfer medium in the form of saturated vapor AMS Materials, LLC 866-772-5108

• The process condenses this saturated vapor to product surfaces evenly, without the effects of “shadowing”, “deflection”, or “reflection”.

• Vapor blanket remains at a constant temperature throughout, with no side to side or front to back variations.

• Vapor Phase offers absolute limits to maximum temperature at reflow. This is a key safety feature of Vapor Phase.


• Cooling coils are generally used to contain the vapor blanket.

• On board filtration systems help keep working fluids clean.

• Convected or I/R preheat sections add flexibility to the reflow thermal curve.


• Conveyor systems transport product through 4 critical stages of the oven: Preheat, Reflow, Flash Off, and Cooldown.

• Oven types available as Inline, Batch/Inline, Batch, as well as Custom designs.

• The Vapor Phase process is so stable that a minimum amount of thermal profiling is required.


• Combining all these features, we now have a process that takes the board or assembly through a nearly ideal reflow curve.

• This process or more appropriately, this combination of processes provides for stability and uniformity, yet is extremely flexible and cost effective, while maintaining the highest quality and reliability.


Vapor Phase ProfileWith Convected Preheat

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Advantages to Vapor Phase Reflow

Uniform Temperatures

Fast Even Heat Transfer

Repeatable

Absolute Limits to Maximum Temperatures

Low Oxygen Environment

Minimum Liquidus Times

Easy to Use Short Setup Times


Uses For Vapor Phase Reflow

Lead Free Solder Reflow

High End Electronic Packages

BGA Reflow

Low Volume High Mix Production

Large Back Planes and Motherboards

High Temperature Applications

Large Mass Differentials

Tin Lead Plating Reflow

Curing Conductive Inks

Mechanical Attachment

Desoldering Plastic Package Testing


Typical Equipment Design and

Internal Systems:

Batch Type, Inline Type


RDL Features• Touch screen operator interface

• Open net PLC control

• 6” x 9” working envelope

• 1.5” product clearance

• Top and bottom IR preheat section

• Palletized conveyor system

• Semi- automatic product cycle


R&D Batch Type Reflow OvensModel RDL Table Top Batch Vapor Phase


RD1 Features• Touch screen operator interface


• 12” x 10” working envelope



• Palletized conveyor system

• Filter system for working fluids

• Auxiliary fluid tank

• Semi- automatic product cycle AMS Materials, LLC 866-772-5108

• Model RD1 Batch Vapor Phase


RD2 Features

• Touch Screen Operator Interface• Open net PLC control• 15” x 18” working envelope• 2.5” product clearance• Top and bottom IR preheat section• Palletized conveyor system• Filter system for working fluids• Auxiliary fluid tank• Semi-automatic product cycle


RD3 Features• Touch screen operator interface• Open net PLC control• 24” x 24” working envelope• 2.5” or 5” product clearance• Top and bottom IR preheat section• Palletized conveyor system• Filter system for working fluids• Auxiliary fluid tank• Semi-automatic product cycle


RD4 Features• Touch screen operator interface• Open net PLC control• 14” x 18” working envelope• 2.5” – 4” product clearance• 3 stage top and bottom IR preheat section• Palletized conveyor system, rigid or flexible pallet

available• Filter system for working fluids• Auxiliary fluid tank• Left to right product flow


R&D Inline Type Reflow Ovens• Model RD4 Inline Vapor Phase


RD10 Features

• Touch screen operator interface


• 8” belted conveyor system



• Filter system for working fluids

• Auxiliary fluid tank

• Left to right product flow


Model RD10 Inline Vapor Phase


AC4 Features

• Exclusively designed for conductive inks• Touch screen operator interface• Open net PLC controls• 24” x 24” working envelope• 1.5” product clearance• Conveyor utilizes flexible pallet system• No preheat section• Filter system for working fluids• Auxiliary fluid system


Model AC4 Inline Vapor Phase


What’s New?


R&D Technical Services introduces a new model in our equipment line, the RD52.

The RD52 is considered an “Inline" type of vapor phase reflow oven. It offers left to right flow and higher volume production capabilities.

Features: Adjustable edge guided conveyors, top and bottom multi-stage preheat, a vertical reflow tank, PLC controls and all the standard equipment you've come to expect from R&D Technical Services.

This is an excellent unit for customers who want inline versatility.


Model VRS Features• The VRS connects in series with the

exhaust vent from a vapor phase reflow oven and exhausts to the factory vent system

• Quick start up

• Can be wired to turn on automatically when vapor phase is in operation

• Removes vapor laden air from vapor phase and captures this fluid for reuse


VRS Vapor Recovery

System

• Guaranteed to Reduce primary fluid usage by 50%


Facts about vapor phase reflow

• Vapor Phase is the most uniform reflow environment available

• Vapor Phase has no shadowing or deflection as with IR and Convected IR Ovens

• No CFC’s contained in primary working fluid


Facts about vapor phase reflow

• Affordable, many models cost less than $5.00/hour to run

• Easy to use, run, and set up

• No lengthy wait for the oven to become ready

• Absolute maximum to reflow temperature

• Lower O2 levels than most ovens using N2


Fluid Manufacturers and

Vapor Temperature Ratings


3M Corporation

Model Vapor Temp. °C FC5311 215FC5312 215FC70 215FC71 255


Dupont Corporation

Model Vapor Temp. °CK6 222K7 250K8 280K9 300K10 320


Solvay Solexis/Ausimont (Galden)

Model Vapor Temp °CLS200 200LS215 215LS230 230HS240 240HS260 260


Pb Free SolderAnd

Vapor Phase Reflow


• Most realistic Pb free solders will force the melting point up. Somewhere between 210°C - 221°C This will require even higher convection oven temperatures.

• Higher oven temperatures will cause difficulty for components and many board materials. SnCuAg melts at 217°C. This means a reflow profile with a peak between 230°C - 240°C. Large boards with a poor delta T in the oven may need as much as 260°C. These temperatures could easily damage components and circuit boards.


• Higher oven temperatures will also mean the solder residues will be darker and harder to clean.

• The main advantage of Vapor Phase with Pb free reflow is the absolute limit to maximum temperature.

• By using a 230°C or 240°C Vapor Phase fluid, the user can effectively limit their exposure to higher temperatures.

• Because Vapor Phase is inherently more uniform and provides faster more even heat transfer, it becomes ideal for Pb free reflow of even the largest most difficult applications


2/16/05

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Typical Pb Free Thermal Curve

In Vapor Phase


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Alternative Style PB Free

Thermal Curve In Vapor Phase


R&D Technical ServicesPartial Customer List

Hughes Hi-Rel Connector Systems

Honeywell Lucent Technologies

Intel Alcatel

Samsung Hitachi

ITT Cannon Emerson Electronics

Dallas Semiconductor ITT Aerospace

Weibel Sorenson Vision

ADC Telecommunications Litton Solid State

Northrup Grumman Applied Physics Lab

Conductive Circuits Rockwell

Houston Sigma Murata

Jerrick Connecting Devices Spectrum Control

Digirad Celestica

University of Arkansas Space Dynamics Lab

FCI Schlumberger

Jet Propulsion Laboratory Fujitsu

IBM Baxter Health Care

Raytheon NASA Marshall Space Flight Center

Teradyne Cooper/Bussman


12261 Nicollet Avenue South Suite A

Burnsville, MN. USA 55337

Phone: 952-707-1931; Fax: 952-707-6739

Email:[email protected]

Website: www.rdtechnicalservices.com

AMS Materials, LLC

Scott Shaffer

866-772-5108


mailto:[email protected]

http://www.rdtechnicalservices.com/

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