water cooled minichannel heat sinks for microprocessor cooling: effect of fin spacing
DESCRIPTION
Heat sink with different fin spacing mounted on a microprocessor were tested for their heatTRANSCRIPT
Water cooled minichannel heat sinks for microprocessor
cooling: Effect of fin spacing
Saad Ayub, Wajahat Ali, Hafiz Muhammad, Aysha Maryam
• Department of Mechanical and Aeronautical Engineering
University of Engineering and Technology, Taxila, Pakistan
• Department of Electrical Engineering,
Comsats Institute of Information Technology, Wah, Pakistan
Presenters
• Danial Sohail ME-089
• Osaid Haq ME-102
• Daniyal Iqbal ME-103
• Owais Ali ME-105
Abstract
• Heat Sinks With Five Different Fin Spacing
• Lowest Base Temperature achieved from finest fin spacing
• Modifying Geometry results in 9% less base temperature than commercial heat sink
• 60% Higher Heat Transfer Coefficient in case of 0.2 mm fin spacing
Introduction
• Microprocessor Operating Temperature 60℃ to 80℃
• Air Cooling Limitations
• Optimize Liquid Cooling
• Modify Thermophysical Properties of Coolant
• Modify Heat Sink Geometry Using Ordinary Coolant
Optimize Liquid Cooling
Modify Thermophysical Properties of Coolant
• Use of Nanofluids
• Heat Transfer Enhancement from 20% to 160%
• Use is still Ambiguous due to:
• Higher Cost
• More Maintenance
Modify Heat Sink Geometry
• Heat Transfer increases by decreasing Channel
Width
• Miniature Jet Stream
• This paper deals with effect of Sink Geometry
Authors Area of Study Conclusion
X.L. Xie
W.Q. Tao
Y.L. He
Heat transfer characteristics of water cooled mini
channel heat sinks
• Heat removal increased with
decrease in channel width.
• Thermal resistance increase with
increase in channel width
B.P. Whelan
R. Kempers
CPU cooling by liquid jet array impingement water
block
• Increased heat transfer than
commercial cooling block
P. Naphon
S. Wongwises
Experimental analysis of liquid jet impingement
cooling system on real processor
• Lowered CPU temperature than
commercial cooling blocks
M.R.O. Panão
J.P.P.V. Guerreiro
Analysis of intermittent multi-jet spray system • Higher efficiency and intelligent
thermal management
C. Bower
A. Ortega
C. Green
Water cooled Silicon carbide mini channel heat
sink for high power electronic appliances
• Resulted higher performance than
air cooled Silicon carbide.
Literature Review
Authors Area of Study Conclusion
J.A. Eastman
S.U.S. Choi
S. Li
Anomalously increased effective thermal
conductivities of ethylene glycol based nano fluids
containing copper nanoparticles
• 40% increase in thermal
conductivity observed
A. Ijam
B. R. Saidur
Comparison of water cooled and nano fluid cooled
multichannel heat sinks
• Nano fluid performed better than
water.
N.A. Roberts
D.G. Walker
Performance of Al2O3 – water nano fluid in
commercial cooling system
• 20% enhancement in heat transfer
and comparatively higher nano
fluid temperature at outlet under
same heat flux conditions.
M.R.O. Panão
J.P.P.V. Guerreiro
A.L.N. Moreieira
Analysis of intermittent multi-jet spray system • Higher efficiency and intelligent
thermal management
C.T. Nguyen
G. Roy
C. Gauthier
N. Galanis
Heat transfer enhancement using Al2O3 - water
nano fluid for an electronic liquid cooling system
• Resulted 38%increase in
convective heat transfer coefficient
Parameters for comparison of 5 heat
sinks with different fin spacing
Base Temperature
(T base) Experiment
Overall heat transfer coefficient
(U)
𝑈 =𝑚 𝐶𝑝(𝑇𝑜𝑢𝑡 − 𝑇𝑖𝑛)
𝐴 (𝐿𝑀𝑇𝐷)
Thermal Resistance
(R th)
𝑅𝑡ℎ = 𝐿𝑀𝑇𝐷
𝑄
Active Area Enhancement (A en)
𝐴𝑒𝑛 =𝐴𝑐𝑡𝑖𝑣𝑒 𝑎𝑟𝑒𝑎 𝑜𝑓 𝑓𝑖𝑛𝑛𝑒𝑑 𝑒𝑎𝑡 𝑠𝑖𝑛𝑘
𝐴𝑐𝑡𝑖𝑣𝑒 𝑎𝑟𝑒𝑎 𝑜𝑓 𝑓𝑙𝑎𝑡 𝑝𝑙𝑎𝑡𝑒
Enhanced overall heat transfer coefficient
(U en)
𝑈𝑒𝑛 = 𝑈 𝑓𝑜𝑟 𝑓𝑖𝑛𝑛𝑒𝑑 𝑔𝑒𝑜𝑚𝑒𝑡𝑟𝑦
𝑈 𝑓𝑜𝑟 𝑓𝑙𝑎𝑡 𝑝𝑙𝑎𝑡𝑒 𝑒𝑎𝑡 𝑠𝑖𝑛𝑘
Schematic of experimental setup
Heat sink
Fin Material Copper
Fin thickness 1.0 mm
Fin height 3.0 mm
Fin base area 28.7 × 28.7 mm
Fin base protrusion 0.5 mm
Heating block
Block Material Copper
Heating Power 325 watts
DC power 197 watts 1.65 amp
Insulation Fiberglass wool
Liquid cooling system
Vendor – product Gigabyte - galaxy
Coolant Water
Experimental Apparatus
Experiment
• 0.2 mm
• 0.5 mm
• 1.0 mm
• 1.5 mm
• Flat surface
Fin Spacings
• 0.5 LPM
• 0.75 LPM
• 1.0 LPM
Flow rates
Results
• Comparison with commercially available Nano fluid. • Temperature of base is directly proportional to flow rate
Conclusion
• Lowest Base Temperature of 40.50C
• Usage of water
• Focus on Altering Geometries