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New Possibilities with ECT Solder

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Embedded Component Technology – ECT

Motivation

Existing Solutions to Embed Components

Introduction – ECT Solder

Components, Design Rules and EDA


Jürgen Wolf

Würth Elektronik GmbH & Co. KG

Product Manager

Embedded Component Technology

05.07.2016www.we-online.com/embedding Embedded Component Technology – ECT Webinar V2016/1


Motivation






Embedded Component Technology – ECTAdvantages of „buried“ components?

Miniaturization

Performance/Function

Reliability

• Integrated shielding

• Short signal paths

• Protection against plagiarism

• Protected against influences

• Secure fixing

• Thermal management

• Package replacement

• Space savings of assembly

area on the outer layers



Motivation






Embedded Component Technology – ECTExisting Solutions – ECT Microvia & ECT Flip-Chip

ECT Flip-Chip


ECT Microvia

HOWEVER

components

often not

available

in needed

configuration


Motivation






Embedded Component Technology – ECTECT Solder: Embedded SMD components

ECT Solder process flow

Core with footprint

for soldering

inner layer

core




Core with footprint

for soldering


solder resist

frames



Core with footprint

for soldering


combined solder

surface and

adhesion promoter



Core with footprint

for soldering

Assembly

(SMD – lead free

solder reflow)


thin core

assembly



Core with footprint

for soldering

Assembly

(SMD – lead free

solder reflow)

Multilayer

pressing


bottom copper foil



Core with footprint

for soldering

Assembly

(SMD – lead free

solder reflow)

Multilayer

pressing


prepreg



Core with footprint

for soldering

Assembly

(SMD – lead free

solder reflow)

Multilayer

pressing


assembled core



Core with footprint

for soldering

Assembly

(SMD – lead free

solder reflow)

Multilayer

pressing


cut prepregs



Core with footprint

for soldering

Assembly

(SMD – lead free

solder reflow)

Multilayer

pressing


2nd core



Core with footprint

for soldering

Assembly

(SMD – lead free

solder reflow)

Multilayer

pressing


prepreg



Core with footprint

for soldering

Assembly

(SMD – lead free

solder reflow)

Multilayer

pressing


top copper foil



Core with footprint

for soldering

Assembly

(SMD – lead free

solder reflow)

Multilayer

pressing

Remaining PCB

processes


outer layer

structuring



Core with footprint

for soldering

Assembly

(SMD – lead free

solder reflow)

Multilayer

pressing

Remaining PCB

processes


solder resist

and

solder surface


Embedding of

standard SMD

components



Motivation






ECT Solder

Embedded Component Technology – ECTAvailability of Components – ECT Solder

No-Goes

•Liquids / electrolytes in components

•Air inclusion (e.g.. Quartz Crystals

with metal lids)

•In principle each

solid SMD-

component

possible

•Max. thickness

depends on

layer stack


EDA-Tools for ECT:

The latest versions of these tools:

Embedded Component Technology – ECTDesign and layout?

Allegro® PCB Designer

Miniaturization Option

Further tools

possible,

but with limitations

with limitations


Embedded Component Technology – ECTECT Solder: Design Rules


Design Rules

comparable to

outer layer assembly

Solder resist

not fully

covering

the surface

Only frames

surrounding

the

solder pads

Solder resist bridges:

75 µm – 100 µm

Solder resist clearance:

≥ 50 µm

New possibilities with ECT Solder

Summary

Existing technologies:

ECT Microvia and ECT Flip-Chip

Complementing technology:

ECT Solder

ECT Solder – Solid SMD components usable

Embedded Component Technology – ECTWebinar


Thank you for your attention!

Contact details:

Product Management

Embedded Component Technology

Würth Elektronik GmbH & Co. KG

Circuit Board Technology

Rudolf-Diesel-Straße 10

74585 Rot am See

Germany

Tel.: +49 79 55 38 88 07 - 222

[email protected]

¡Gracias por su

atención!Děkuji vám

za pozornost!

Köszönöm a

figyelmüket! Tak for deres

opmærksomhed!

Merci de

votre attention!

Tack för er

uppmärksamhet!


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