why pop package is challenging

Reworking POP Packages

Your BEST choice in Solder Rework/Repair/Test, Solder Training & Soldering Tools

Overview of POP ReworkReview of Package Configurations

Challenges in POP Rework• Difficulty in inspection

• Shields

• Neighboring components

• Underfill

• Package warpage

Overview of POP Rework-continued

Different POP Rework Methods• Stack, reflow and place

• Place, place and reflow

POP Configurations

POP Rework Challenges-Inspection

X-Ray Imaging

Single Piece Shield

Two Piece Shield

POP Rework Challenges- Shields

Single Piece RF Shield Rework“Cold” scoring process-The Patch

Single Piece RF Shield ReworkPortion over top of device to be reworked is removed. No shield removal required. Patent Pending Process.

Single Piece RF Shield ReworkRF Shield Re-Applied. No RF shield reflow required. Fast process. Increased yields.

Conductive RF Shield Rework

Photos Courtesy of OK International

Measuring Warpage

POP Rework Challenges-Underfill

POP Rework Challenges-Close In Components

POP Rework MethodsFirst Make the Stack, then Place the Stack

POP Rework MethodsPlace First Layer, then Next and Reflow Entire Stack

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