wireless control and measurement system for a hydropower
TRANSCRIPT
TVE15056
Examensarbete 30 hpJuni 2015
Wireless control and measurement system for a hydropower generator with brushless exciter
Fredrik Evestedt
Masterprogram i förnybar elgenereringMaster Programme in Renewable Electricity Production
Teknisk- naturvetenskaplig fakultet UTH-enheten Besöksadress: Ångströmlaboratoriet Lägerhyddsvägen 1 Hus 4, Plan 0 Postadress: Box 536 751 21 Uppsala Telefon: 018 – 471 30 03 Telefax: 018 – 471 30 00 Hemsida: http://www.teknat.uu.se/student
Abstract
Wireless control and measurement system for ahydropower generator with brushless exciter
Fredrik Evestedt
Hydropower has been around for more than a century and is considered a maturetechnology, but with recent advancements in power electronics and simulationcapability new exciting ways to increase efficiency and reliability is possible. AtUppsala University a brushless exciter has been constructed for the experimental testrig, SVANTE. Power electronics are mounted on the shaft for control of thegenerator's excitation current. In addition a wireless control and measurementsystem is needed to provide the desired switching patterns to the power electronicsand to evaluate performance of the system.
In this thesis a shaft mounted embedded system for control and measurement isconstructed as well as magnetic field sensors with measurement range up to 700mT.The computational power comes from a National Instruments sbRIO-9606. Thesystem has 14 individual totem pole power electronics driving channels, 48 analoginput channels for current signals and it communicates wirelessly through a bluetoothconnection.
The system is tested and works satisfactory but has not been mounted on therotating side of the generator due to delays in the manufacturing.
TVE15056Examinator: Juan de SantiagoÄmnesgranskare: Urban LundinHandledare: José Perez
Sammanfattning
Vattenkraft har det senaste arhundradet varit och ar fortfarande en av Sveriges framsta kallortill elektrisk energi. Tekniken som vattenkraft bygger pa ar mogen och driftsaker, men med densenaste tidens utveckling inom kraftelektronik och simuleringsverktyg oppnas nya mojligheter attoka effektivitet, styrbarhet och driftsakerhet.
Pa Uppsala Universitet finns en experimentgenerator, SVANTE, dar nya tekniker kan utvarderas.Pa generatorns axel har en borstlos matare monterats och for att kunna kora denna kravs kraftelek-tronik for att kontrollera exciteringsstrommen till rotorn. Kraftelektroniken behover i sin tur re-gleras samt att olika storheter sasom spanning, strom och magnetfalt behover matas.
Detta examensarbete handlar om konstruktionen av ett inbyggt system for att tradlost hamta inmatdata fran sensorer samt styra kraftelektronik som sitter monterat pa axeln i ett vattenkraftverk.Detta implementeras i programvaran LabVIEW fran National Instruments pa en sbRIO-9606.Utover detta konstrueras kretskort for matning av magnetfalt upp till 700mT.
Det konstruerade systemet fungerar tillfredsstallande och testas genom att en vaxelriktare samt enDC-DC omvandlare styrs fran systemet. Magnetfaltsensorerna fungerar bra over hela matomradetmed bra linjaritet och matnoggrannhet. Allt som allt har fyra kretskort designats och utvarderatsdessutom har LabVIEW-kod skrivits.
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Contents
1 Introduction 31.1 Background . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31.2 Project description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2 Theory 62.1 Excitation systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62.2 Power electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62.3 Bluetooth . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62.4 Serial peripheral interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72.5 Aliasing and anti-aliasing filters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92.6 Successive approximation analog to digital converters . . . . . . . . . . . . . . . . . . 92.7 The Hall effect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102.8 Current measurement techniques . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.8.1 Resistive current sensing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112.8.2 Current transformer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112.8.3 Hall effect based current measurement . . . . . . . . . . . . . . . . . . . . . . 12
2.9 Voltage measurement techniques . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122.9.1 Resistive divider . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122.9.2 Hall effect based voltage measurement . . . . . . . . . . . . . . . . . . . . . . 13
2.10 LabVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3 Method 143.1 System overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143.2 Single Board RIO, sbRIO-9606 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 153.3 General purpose inverter controller, NI 9683 . . . . . . . . . . . . . . . . . . . . . . . 163.4 Rotor main board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.4.1 Power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173.4.2 RN41XV, bluetooth module . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183.4.3 ADC input signal conditioning . . . . . . . . . . . . . . . . . . . . . . . . . . 183.4.4 AD7490, analog to digital converter . . . . . . . . . . . . . . . . . . . . . . . 203.4.5 Relay control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.5 Current measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 203.6 Voltage measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213.7 Magnetic field measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223.8 Serial communication in LabVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233.9 SPI in LabVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4 Results 254.1 Magnetic field sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 254.2 Rotor main board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 284.3 The finished main unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 294.4 Rotor distribution boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4.4.1 Distribution board for rotor power electronics and SPI . . . . . . . . . . . . . 314.4.2 Distribution board for rotor sensors . . . . . . . . . . . . . . . . . . . . . . . 32
1
5 Conclusions 33
Bibliography 34
Appendices 36
Appendix A LabVIEW code 36
Appendix B Schematics and Layouts 41
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1 Introduction
The first modern hydropower plant in Sweden was constructed at the end of the ninetieth century,it was situated in the river Viskan and could produce 2.2kW. An extremely small generator bytoday’s standards but it was the start of an enormous exploitation of the Swedish rivers. Today,the total installed power is 16.15GW and in 2013, hydropower supplied 60.8TWh of energy to theSwedish grid. This corresponds to 41% of the total energy consumption [1].
The majority of today’s big hydropower plants were built in the 1950s and 1960s as a result of theconstruction of a 400kV transmission line from Harspranget to Hallsberg. The power plants aregetting old so refurbishment and upgrades are required to keep up with today’s standards. In thisprocess new technologies can be implemented to potentially increase reliability, controllability andefficiency.
1.1 Background
At the Division of Electricity, Uppsala University, an 185kVA experimental generator called SVANTEis available. Specifications of the machine can be seen in Tab. 1 [2].
Table 1: Main specifications of SVANTE.
Frequency 50HzNumber of pole pairs 6Speed 500rpmSlots per pole and phase 3Number of stator slots 108Stator inner diameter 725mmStator length 303mmAir gap length 8.3mmPower of driving motor 75kWRotor weight 900kgStator weight 700kg
At the moment upgrades are done to facilitate new research projects, below is a list of the newadditions.
• New shaft lathed to fit the new additions.
• A six-phase brushless exciter.
• Permanent magnet thrust bearing.
• Electromagnetic thrust actuator.
• Power electronics for active control of the exciter and rotor currents.
• Sensor and control electronics.
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A CAD-drawing of the experimental rig with the new components installed can be seen in Fig. 1.
Figure 1: CAD-drawing of SVANTE with the new shaft [3].
1.2 Project description
With the installation of a brushless exciter on the shaft, there is a need for a way to rectify andcontrol the excitation current in the main generator. An embedded control and measurement systemmounted on the shaft is needed for for this purpose, the system shall communicate wirelessly to amain control unit and be able to drive power electronics devices.
The project is separated into two parts with two thesis workers cooperating. This thesis will be
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about the construction of the control and measurement systems while the other part is about thepower electronics and the related control scheme.
A specification of requirements is presented below.
• Simultaneous sampling of currents and voltages relevant to the control of the active rectifierand the buck converters.
• Enough processing power to implement space vector modulation.
• Accurate measurement of magnetic field up to 700mT on the rotor poles.
• Magnetic field measurements of 28 positions on the shaft.
• Wireless communication to the system.
• LabVIEW-programmable hardware
The thesis describing the power electronics can be found here [4].
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2 Theory
2.1 Excitation systems
Excitation systems can be classified into three categories based on the power source for the excita-tion.
DC excitation systemsDC generators are used as power source and provide the current to the rotor through sliprings. They were used in early hydropower systems but got superseded by AC exciters in themid 1960s.
AC excitation systemsA second generator is used as power source, generally the generator is on the same shaft asthe main generator. The AC output is then rectified and fed into the rotor windings. Therectification can either be stationary with current being fed through slip rings to the rotor,or it can be rotating and no slip rings is needed.
Static excitation systemsStatic excitation systems supply the excitation current through slip rings and take their powerdirectly from the main generator [6].
2.2 Power electronics
Power electronics is defined as the application of solid-state electronics to the control and conversionof electric power. It is based primarily on switching power semiconductor devices to generate adesired voltage or current [7].
2.3 Bluetooth
Bluetooth is a wireless technology for exchanging data, invented by Ericsson in 1994. It uses the2.4GHz ISM band with gaussian frequency shift keying (GFSK) as modulation scheme. In GFSKthe frequency of the carrier is shifted to carry the modulation, a binary 1 is represented by apositive deviation in frequency while a binary 0 is represented by a negative frequency deviation.Communication is based on a master-slave principle. One master device can control 7 slaves in apiconet, see Fig. 2.
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Figure 2: Bluetooth master-slave architecture with one master and four slaves.
Bluetooth uses frequency hopping techniques to avoid interference. A transmission changes channelwithin the 2.4GHz ISM band 1600 times per second in a random pattern, this makes it more immuneto interference. Version 2.1 + enhanced data rate (EDR) supports a bit rate of 3Mbps and utilizesphase shift keying (PSK) as well as GFSK as modulation schemes. Through the use of the protocolRFCOMM a wireless asynchronous serial port can be established between two devices, a usefulfeature for sending data between devices.
In Tab. 2 the different classes of bluetooth devices are listed. It is sorted based on the transmitpower, class 1 is mainly for industrial applications while class 2 is the standard for mobile phonesand similar items.
Table 2: Bluetooth classes and their corresponding transmit power and range.
Class Transmit power (dBm) Range (m)
1 20 1002 4 103 0 0.1
To start a bluetooth communication between devices a procedure known as pairing must take place.The process of pairing is as follows.
1. The devices look for other devices in range.
2. The user requests to pair with a specific device.
3. The device prompts for a passkey which is then compared with the other device.
4. If the keys are the same the connection is established.
This is only done once, afterwards the devices are paired until a user deletes the pair [8, 9].
2.4 Serial peripheral interface
Serial peripheral interface is a serial data transfer protocol developed by Motorola. It is usedfor communication between devices in full-duplex mode. Generally a bus has one master and anarbitrary amount of slaves connected to the same data lines. The following lines are available.
SCLK - Clock for the bus, controlled by the master.
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MOSI - Master Out Slave In, output from master to slave.
MISO - Master In Slave Out, output from slave to master.
SS - Slave Select, used to select which peripheral that is allowed to use the bus.
In Fig. 3 a block diagram of a typical SPI connection with two slaves is shown.
SCLKMOSIMISOSS1SS2
MasterSlave 1
Slave 2
SCLK
SCLK
MOSIMISOSS1
MOSIMISOSS2
Figure 3: Block diagram of a SPI bus with one master and two slaves.
Since SPI is full duplex, data is exchanged simultaneously from and to the master. This is accom-plished by using a circular buffer consisting of one shift register in the master and one in the slave,see Fig. 4, data exchange is done by shifting the bits between these two registers [10].
A0 A1 A2 A3 A4 A5 A6 A7 B0 B1 B2 B3 B4 B5 B6 B7
MASTER SLAVE
MOSI
MISO
Figure 4: Circular buffer between master and slave.
In Fig. 5 the timing diagram for a transfer of one byte is shown. The communication starts bypulling SS low and the first bit is outputted from the master and the slave on MOSI and MISO. Onthe rising edge of the SCLK the bit on MISO is read by the master while the bit on MOSI is readby the slave. At the falling edge of SCLK a new bit is outputted on MISO and MOSI respectivelyand the process repeats until all bits are sent and SS is pulled high.
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Figure 5: Timing diagram for one byte transfer.
2.5 Aliasing and anti-aliasing filters
In sampled measurement systems the aliasing effect has to be considered. The Nyquist samplingtheorem says that if you have a signal that is band limited to a bandwidth of fo then you cancollect all information in that signal as long as your sample rate is higher than 2 ∗ fo, see Eq. (1).
fo <fsample
2(1)
If you sample a signal that does not fulfill (1), the frequency content abovefsample
2will be aliased
back into the original signal. This leads to distortion of the sampled signal [11].
2.6 Successive approximation analog to digital converters
Succesive approximation register (SAR) ADCs implements a binary search algorithm to sample thesignal. In Fig. 6 a functional block diagram of the architecture is available.
Track&HoldVIn
DAC SAR Data out
Comparator
Figure 6: Functional diagram of a SAR ADC.
When a sampling starts the analog input is held in a track/hold and the digital to analog converter(DAC) is set to, VREF /2. A comparison between the analog input and the DAC output is doneto determine if VIn is less, or greater than VDAC . The SAR-logic then saves the result in the firstposition of the register. The control logic then moves to the next bit and repeats the process allthe way down to least significant bit (LSB), when finished it outputs the N-bit digital word in theoutput register [12]. In Fig. 7 the operation of a 4-bit SAR ADC can be seen.
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Figure 7: Operation of a 4-bit SAR ADC.
2.7 The Hall effect
The hall effect can be used to get the magnitude of a magnetic field. The effect can be observedwhen an electric current is passed through a conductive material which is in a magnetic field withan orthogonal component to the current. A force is then exerted on the charged electrons accordingto Eq. (2)
~F = q~v × ~B (2)
This leads to a charge build up on one side and charge depletion on the other. The voltage thatarises is called the hall voltage. See Fig. 8 for a sketch.
Figure 8: Sketch that shows the principle of the hall effect [13].
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2.8 Current measurement techniques
2.8.1 Resistive current sensing
A shunt resistor is inserted in series with the circuit in which the current shall be measured. A lowresistance is important to ensure a negligible impact on the original function of the circuit. Eq. (3)is used to get the current.
I =U
R(3)
Since Rshunt has a low resistance, the voltage drop over it will be small so a good voltage measure-ment is needed to get good performance. See Fig. 9 for a circuit diagram.
i
Rshunt
+−V
V
Circuit
to be
measured
Figure 9: Current measurement of an arbitrary circuit with a shunt resistor.
2.8.2 Current transformer
Non intrusive measurement of alternating current can be done by means of a current transformer,it consists of a magnetic core with a hole through it. The wire in which the current of interestflows is passed through the hole making the primary side of the transformer one turn whilst thesecondary winding has lots of turns, see Fig. 10.
Figure 10: Basic sketch of current transformer.
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The output current of the secondary is measured. See Eq. (4) for the ratio between Is and Ip.
Is = IpNp
Ns(4)
Where Np and Ns is the number of turns on the primary side of the transformer and Ns is thenumber of turns on the secondary side.
2.8.3 Hall effect based current measurement
Non intrusive measurement of both DC and AC can be done by utilizing the hall effect. It worksin the same way as a current transformer except that the secondary winding is replaced by a smallair gap in which a hall element is placed, see Fig. 11. The hall element will output a voltageproportional to the magnetic flux through it. This is directly proportional to the current passingthrough the core.
Figure 11: Basic sketch of a hall effect based current measurement.
2.9 Voltage measurement techniques
2.9.1 Resistive divider
For measuring high voltages a resistive divider can be used, Eq. (5).
Vm =R2
R1 +R2Vsupply (5)
It provides an easy way to measure high voltages with a low voltage ADC. In Fig. 12, a basic circuitdiagram of a voltage divider used for measuring an arbitrary circuit is presented.
12
+−Vsupply
Circuit
to be
measured
R1
R2 V Vm
Figure 12: Voltage measurement of an arbitrary circuit with a resistive divider.
2.9.2 Hall effect based voltage measurement
Voltage can be measured with a hall effect based sensor. Rm is dimensioned to provide a specificcurrent at different voltage levels. This current is passed through a hall element and an outputvoltage is generated at its output terminals, Fig. 13. The main benefit of this compared to a resistivedivider is that the measurement system and the high power system is galvanically isolated.
+−V
Circuit
to be
measured
imRm
Hall Vm
Figure 13: Voltage measurement of an arbitrary circuit with a hall element.
2.10 LabVIEW
LabVIEW is a graphical programming platform from National Instruments. It is most commonlyused for control systems and data acquisition.
Programs are created by connecting functional blocks together and associating these to a frontpanel with controls. The programming language is by nature parallel since multiple loops can runsimultaneously, this makes it powerful as a programming language for standard applications as wellas programming of devices capable of running many threads in parallel, such as FPGAs [14].
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3 Method
3.1 System overview
In Fig. 14, a schematic for the power electronics system is presented. Measurements of voltage andcurrent are done in six locations.
The brushless exciter is represented by three voltage sources, the output current is measured andthen fed to an active rectifier constructed with MOSFETs. A DC voltage is generated at VDC,1, thenext stage is a buck converter which lowers the voltage and creates another DC rail at node VDC,2,both these voltages are measured. An H-bridge topology is used to control the current through therotor, LRotor, for this a current measurement is needed as feedback to the current controller thatgenerates switching patterns of the H-bridge. An extra current measurement is done at Lbuck toanalyse the inductor currents in the buck circuit.
VDC,1
VDC,2C1
Lbuck
C2
LRotor
Figure 14: Full high power system with ideal switch representation [4].
In Fig. 15 a simplified block diagram of the electronics is presented.
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Figure 15: Block diagram of the control and measurement system.
3.2 Single Board RIO, sbRIO-9606
The processing unit used is sbRIO-9606 from National Instruments, see Fig. 16.
Figure 16: Single board RIO, sbRIO-9606.
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It features a 400MHz real-time processor, a Xilinx Spartan-6 LX45 FPGA and I/O on a singleprinted circuit board. Access to 96 DIO-lines is available through a high-speed connector, thisenables connection of custom made daughter boards. Integrated Ethernet, CAN, RS232 and USBis also available. The system is programmed from LabVIEW. For RS232 specifications see Tab. 3[15].
Table 3: RS232 DTE Serial port specifications.
Baud rate support ArbitraryMaximum baud rate 230.4kbpsData bits 5, 6, 7, 8Stop bits 1, 2Parity Odd, Even, Mark, Space, NoneFlow control RTS/CTS, XON/XOFF, DTR/DSR, None
3.3 General purpose inverter controller, NI 9683
The general purpose inverter controller is an off the shelf daughter board for sbRIO. It contains I/Ofor control and monitoring of power electronics. 14 channels in push-pull configuration are availablefor driving power electronics, the voltage level is set by providing a voltage at the Vext-pin. In Tab. 4specifications are presented [16].
Table 4: Half-bridge digital output.
Number of channels 14Maximum continuous output current 10mAOutput impedance 100ΩExternal power supply voltage range 5 - 30VMinimum pulse width 500nsMaximum switching frequency (50 pF) 500kHz
There are 32 DIO channels directly linked to the FPGA available. In Tab. 5 specifications arepresented.
Table 5: LVTTL digital input/output.
Number of channels 32Maximum tested current (per channel) 3mAMaximum total current (all lines) 96mATTL voltage level 3.3V
The GPIC also provides 16 pseudo-differential analog input channels. In Tab. 6 specifications arepresented.
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Table 6: Simultaneous analog input specifications.
Number of channels 16ADC resolution 12 bitsInput range ±10V, ±5VSample rate (per channel) 100kS/sBandwidth 210kHz
Scanned analog channels are available for monitoring of slow processes, such as temperature. InTab. 7 specifications are presented.
Table 7: Scanned analog input specifications.
Number of channels 8ADC resolution 12 bitsInput range 0 - 5VSample rate (per channel) 1kS/sBandwidth 130kHz
3.4 Rotor main board
The main board connects to the GPIC through 2.54mm headers and provides bluetooth connec-tivity, 32 extra ADC channels, power supply and DSUB-cable connectivity.
3.4.1 Power supply
The power for the system is supplied from the high voltage DC rail of the active rectifier. ATDK-Lambda HWS100A-24/A is used to convert the high voltage DC to 24V [17]. This 24V railis connected to the ”Power in” connector in Fig. 34.
The on board power supply accepts an external voltage between 18 - 36V and provides ±15V, 5Vand 3.3V. The external voltage is passed to the sbRIO connector. The main DC/DC converter,Fig. 17, is a Traco Power TEN60-2423N, it is a switching regulator that can provide 60W. Theefficiency is up to 92% and the output ripple is 125mV peak-to-peak maximum when measuredwith 20 MHz bandwidth [18].
Figure 17: The main DC/DC converter.
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The 5V rail is supplied by a Texas Instruments LM340-N, which is a 5V linear regulator with 75µVspecified output noise and the 3.3V rail is supplied by a ST LD1117, a low drop out regulator with0.003% of Vout as output noise [19, 20].
3.4.2 RN41XV, bluetooth module
The bluetooth module RN41XV from Roving Networks is used, see Fig. 18. It supports bluetoothversion 2.1 and is a Class 1 module. Communication is done through a serial interface via UARTat a maximum rate of 240kbps. An external antenna can be connected, this is essential since thechip will be mounted inside and aluminium chassis [21].
Figure 18: RN41XV, bluetooth module.
3.4.3 ADC input signal conditioning
All analog signals in the system use current as the signal carrier to increase noise immunity. Thecurrent signal is converted to voltage by passing it through a resistor Rs close to the ADC. Thevalue of Rs is determined by Eq. (6) and the maximum input voltage to the ADC.
U = RI (6)
The voltage signal is then buffered into an anti-aliasing filter implemented with a Sallen-Key topol-ogy. In Fig. 19 the input stage to the ADC can be seen.
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−
+
R1 R2
C2
C1
VOut−
+
Rs
iIIn
Sallen-Key low pass filter
Figure 19: Input stage to ADC.
With R1, R2, C1 and C2 exchanged to impedances, see Fig. 20, the transfer function of the filtercan be calculated.
−
+
Z1 Z2
Z4
Z3
voutvin
v1
v+
v−
Figure 20: Sallen-Key with impedances.
In this analysis all components are assumed to be ideal, this leads to Eq. (7).
v+ = v− = vout (7)
Kirschoffs current law applied at v1, Eq. (8).
vin − v1Z1
=v1 − vout
Z3+v1 − vout
Z2(8)
Kirschoffs current law applied at v+, Eq. (9).
v1 − voutZ2
=voutZ4
(9)
From Eq. (9) the expression for v1 is obtained, Eq. (10).
v1 = vout
(Z2
Z4+ 1
)(10)
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The transfer function, Eq. (11) is found by combining Eq. (8) and (10).
voutvin
=Z3Z4
Z1Z2 + Z3(Z1 + Z2) + Z3Z4(11)
The cut-off frequency for the anti-aliasing filter is set to 10.6kHz with Q = 0.5 this reduces it’simpact on the signal of interest while filtering out high frequency noise. The following values are
used Z1 = Z2 = 15kΩ and Z3 = Z4 =1
s1 × 10−9. Eq. (12) shows the transfer function of the
filter.
H(s) =44.44 × 108
s2 + 13.33 × 104s+ 44.44 × 108(12)
3.4.4 AD7490, analog to digital converter
AD7490 is used as the ADC for the 32 additional analog input channels. It is a 16 channel, 12 bitconverter that uses the succesive approximation for conversion. For key specifications see Tab. 8.
Table 8: Key specifications of AD7490.
Number of channels 16ADC resolution 12 bitsInput range 0 - 5VSample rate (per channel) 1MS/sSignal-to-noise+distortion ratio 70.5dB
Serial communication with the integrated circuit (IC) is SPI compatible. The conversion clock andSPI clock is shared and comes from the SPI master, therefore conversion speeds is fully controllablefrom the software in the master [22].
3.4.5 Relay control
Four relays can be controlled from the main board. The output can handle 500mA continuouscurrent and has integrated flyback diodes. These can be used to connect and disconnect differentparts of the circuit when necessary.
3.5 Current measurement
For current measurement LEM LA55-P is used. It utilizes the hall effect to measure the current ina cable passing through the sensor, see Fig. 21.
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Figure 21: Current measurement board.
The sensor output is a current with conversion ratio 1:1000. A current of 50A in the main cablegenerates a 50mA output from the sensor, this current is then passed through a resistor close tothe measurement ADC and then sampled [23].
100nF
−15V
22µF
+15V
ioutIOutLEM LA55-p
Figure 22: Circuit diagram of a current sensor board.
Table 9: Specifications for LA55-P.
Overall accuracy ±0.65%Linearity error < 0.15%Response time < 1µsBandwidth (-1 dB) 200kHz
3.6 Voltage measurement
For voltage measurement LEM LV25-P is used, see Fig. 23. The measurement is based on the halleffect thus it provides galvanic isolation between the high voltage side and the measurement side.
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Figure 23: Voltage measurement board.
It is connected in parallel with the load and the desired measurement range is set by choosingresistor values on its input. The resistor should be set so that 10mA is passed into the device atthe nominal voltage. The current is then converted with a conversion ratio of 2500:1000, a 10mAcurrent into the terminal corresponds to a 25mA current on the output terminal [24].
im10kΩ 10kΩ
10kΩ 10kΩVm
100nF
−15V
22µF
+15V
ioutIOut
LEM LV25-p
Figure 24: Circuit diagram of a voltage sensor board..
Table 10: Specifications for LV25-P.
Overall accuracy ±0.9%Linearity error < 0.2%Response time 40µs
3.7 Magnetic field measurement
The magnetic field measurement need to be able to measure magnetic fields up to 700mT, for thispurpose the hall element, ChenYang CYSJ166A was used. Its main features is 0-3T measurementrange, good linearity and good temperature stability [25].
The output of the hall element is buffered then fed in to a XTR117 from Texas Instruments. It is a4 - 20mA current loop transmitter that enables a voltage signal to be converted to current and fedthrough the same wire as the power supply [26]. In this way only two wires for each sensor boardis required and the signal’s noise immunity is increased. See Fig. 25 for a complete circuit diagramof one sensor.
22
Hall-element −
+
10nF
iout
100nFVIn
NCIInIRET
IO
VREG
V+BE
XTR117
MCP6021
15kΩ
+VH
−VH
+V
−V
+4.7 V
npn
Figure 25: Circuit diagram for the magnetic field measurement board.
3.8 Serial communication in LabVIEW
LabVIEW’s integrated libraries for serial communication are used to communicate with the blue-tooth modules. A state machine is implemented that continuously checks the RX port for dataand then either reads the incoming data or writes measurement data back to the other device, seeFig. 26.
Figure 26: State diagram for the serial communication loop.
This state machine is used on the rotating side of the system. It should send measurement data allthe time until a new set point value for the rotor current is sent from the stationary system, whenthis becomes available it should be handled right away and then go back to sending measurementdata again. For the complete program see Appendix A.
3.9 SPI in LabVIEW
The SPI communication is implemented as a state machine, see Fig. 27. It initializes the transferby pulling SS low. Then it writes MOSI and reads MISO in 16 clock cycles before returning to theinitial state. In this way the clock frequency is configurable in LabVIEW [27]. For the completeprogram see Appendix A.
23
4 Results
For detailed schematics and layouts for the presented circuit boards, see Appendix B.
4.1 Magnetic field sensor
The hall element and the magnetic field sensor was characterized by applying a magnetic field from-700mT to 700mT. The magnetic field was generated by a C-core, see Fig. 28.
Figure 28: The magnetic C-core used for characterization of the magnetic field sensor [28].
The sensor was placed in the air gap of the C-core along with the measurement probe from aLakeShore 410 Gaussmeter. The output voltage from the sensor was measured with a Fluke 175multimeter, the accuracy of the two instruments are as follows.
• Gaussmeter, 2% of reading 0.1% of full scale at 25C.
• Multimeter, 0.15% + 2 counts.
Two hall elements were characterized, both elements was measured from -700mT to 700mT threetimes, the result can be seen in Fig. 29. The output voltage as a function of magnetic field ispresented.
25
Figure 29: Linear curve fit of output voltage at different magnetic fields with residual plot for thehall element.
A picture of a fully populated magnetic field sensor board can be seen in Fig. 30. It uses only twowires for signal transmission and for powering the circuit. The dimensions of the board is 10x18mmand the maximum height is 2mm.
Figure 30: Fully populated hall sensor board.
The magnetic field sensor board was characterized with the same amount of measurement points asthe hall element. The current signal was converted to voltage by passing its output current througha resistor with R = 200.2Ω. In Fig. 31 the output voltage as a function of magnetic field can beseen.
26
Figure 31: Linear curve fit of output voltage at different magnetic fields with residual plot for thecomplete hall measurement system.
Mounting positions for the magnetic field sensors can be seen in Fig. 32.
Figure 32: Mounting of the magnetic field sensors on the rotor.
27
4.2 Rotor main board
The main board has connectors to fit the GPIC board from National instruments. It extends itsfunctionality by adding power supply for the complete system, 32 extra ADC channels, bluetoothconnectivity, and distribution of signals to the rest of the system. Pictures of the fully populatedmain board with the function of each section marked can be seen in Fig. 33.
Figure 33: Top side of main board with sections marked.
The bottom of the main board is populated with all the connectors necessary to distribute thesignals in the system. The main cable standard for signals is DSUB. See Fig. 34 for an overview ofthe bottom side of the board with connectors and their function marked.
28
Figure 34: Bottom side of main board with individual connector’s function marked.
4.3 The finished main unit
In Fig. 35 the fully assembled main system is shown.
29
Figure 35: Fully assembled system.
The system in Fig. 35 was put in an aluminium box with holes milled for the connectors, see Fig. 36.
Figure 36: Aluminium box with the circuit boards mounted.
30
4.4 Rotor distribution boards
To distribute the signals from the main board two circuit boards were created to fit around theshaft close to the rotor. The boards are mounted on a bakelite piece used for connecting the rotorwindings, see Fig. 37.
Figure 37: Distribution boards mounted on a bakelite piece meant for connection of rotor windings.
4.4.1 Distribution board for rotor power electronics and SPI
A fully populated distribution board for rotor power electronics and SPI can be seen in Fig. 38.
31
Figure 38: Distribution board for power electronics.
4.4.2 Distribution board for rotor sensors
A fully populated distribution board for sensor connections can be seen in Fig. 39.
Figure 39: Distribution board for sensors.
32
5 Conclusions
The control and measurement system works well and has been tested. Voltage rails are withinspecifications, all ADC channels are fully functional and the half bridge output drivers works sat-isfactory. The system’s capability for driving power electronics was tested by mounting everythingin the box and drive a buck converter and a three phase inverter with SVM control scheme. Thiswas successful and current and voltage measurements were working well.
Figure 40: Box for control, measurement and power electronics (control board not mounted) [4].
The distribution boards fits nicely and no problems were discovered when analysing and testingthese boards.
The software for the system has basic functionality, it can sample the ADC channels via SPI andit can communicate wirelessly between two bluetooth modules. No elaborate programming toautomatize the bluetooth connection setup or the sending of data between the two units has beendone.
Magnetic field sensors with high linearity and a large measurement range has been constructed.The sensors have low noise floor, 24mVp−p at 0T and increased noise immunity since current isused as signal carrier. A first degree polynomial fit, y = 9.741×10−4x+2.850, was done and showsgood consistency and linearity with R2 = 0.995. For further improvement the vias for mounting thecables, see Fig. 30, should be changed to pads so that the whole bottom side is free from exposedconducting surfaces. A list of minor errors in the layout of the board were discovered, see list below.
• Hole size for 10 pin connector too small.
• Protection diodes for TTL pins were incorrectly positioned.
• Pad size for flyback diodes in relay channels too small.
33
References
[1] Elaret, 2013. Svensk energi. http://www.svenskenergi.se/Global/Statistik/El%C3%
A5ret/Sv%20Energi_el%C3%A5ret2013_versJUNI2014.pdf. [Accessed 27 May 15].
[2] M. Wallin. Measurement and modelling of unbalanced magnetic pull in hydropower generators.2013. ISSN 1651-6214; 1029.
[3] J. Jose Perez-Loya (personal communication, 2015)
[4] T. Johansson. Active rectification and control of magnetization currents in synchronous gener-ators with rotating exciters. 2015.
[5] P. Schavemaker and L. van der Sluis. Electrical power system essentials. Wiley, 2008.
[6] P. Kundur. Power Systems Stability and Control. McGraw-Hill, 1994.
[7] Rashid, M.H. (2004). Power electronics : Circuits, devices and applications, 3rd edition. UpperSaddle River, N.J. ; London: Pearson Prentice Hall. 2004.
[8] H. Labiod, H. Afific, C. de Santis. Wi-Fi, Bluetooth, ZigBee AND WiMax. Springer, 2007.
[9] Ian Poole. Radio Electronics. Available at: http://www.radio-electronics.com/info/
wireless/bluetooth/bluetooth_overview.php. [Accessed 01 June 15].
[10] Mayank Prasad. Available at: http://maxembedded.com/2013/11/
serial-peripheral-interface-spi-basics/. [Accessed 01 June 15].
[11] T. Wescott. Sampling: What Nyquist Didnt Say, and What to Do About It Available at:http://www.wescottdesign.com/articles/Sampling/sampling.pdf. [Accessed 01 June 15].
[12] Maxim Integrated. Understanding SAR ADCs: Their Architecture and Comparison with OtherADCs. Available at: http://pdfserv.maximintegrated.com/en/an/AN1080.pdf. [Accessed05 June 15].
[13] Picture from wikipedia. Available at: http://en.wikipedia.org/wiki/Hall_effect#
/media/File:Hall_Effect_Measurement_Setup_for_Electrons.png. [Accessed 05 June 15].
[14] LabVIEW homepage. Available at: http://www.ni.com/labview/. [Accessed 08 June 15].
[15] National Instruments. OEM operating instructions and specifications, NI sbRIO-9605/9606and NI sbRIO-9623/9626/9633/9636. 2012.
[16] National Instruments. User guide and specifications, NI 9683. 2013.
[17] TDK-Lambda. TDK-Lambda, HWS100A-24/A dataheet. 2015. Available at: http://www.
mouser.com/ds/2/400/hws-a-525007.pdf. [Accessed 23 June 15].
[18] Traco Power. Traco Power, TEN 60N Series dataheet. 2013. Available at: http://assets.
tracopower.com/TEN60N/documents/ten60n-datasheet.pdf. [Accessed 04 June 15].
[19] Texas Instruments. LM340-N, datasheet. 2013. Available at: http://www.ti.com/lit/ds/
symlink/lm340-n.pdf. [Accessed 04 June 15].
34
[20] ST Microelectronics. LD1117, datasheet. 2013. Available at: http://www.st.com/st-web-ui/static/active/en/resource/technical/document/datasheet/CD00000544.pdf. [Accessed04 June 15].
[21] Microchip. RN41XV, datasheet. 2012. Available at: http://ww1.microchip.com/downloads/en/DeviceDoc/RN41XV-RN42XV-ds-v1.0r.pdf. [Accessed 09 June 15].
[22] Analog Devices. AD7490 datasheet. 2012. Available at: http://www.analog.com/media/en/
technical-documentation/data-sheets/AD7490.pdf. [Accessed 08 June 15].
[23] LEM. LA55-P, datasheet. 2009. Available at: http://www.lem.com/docs/products/la%
2055-p%20e.pdf. [Accessed 04 June 15].
[24] LEM. LV25-P, datasheet. 2012. Available at: http://www.lem.com/docs/products/lv%
2025-p.pdf. [Accessed 04 June 15].
[25] ChenYang. CYSJ166A, datasheet. Available at: http://www.hallsensors.de/CYSJ166A.
pdf. [Accessed 04 June 15].
[26] Texas Instruments. XTR117, datasheet. 2012. Available at: http://www.ti.com/lit/ds/
symlink/xtr117.pdf. [Accessed 04 June 15].
[27] Implementing SPI Communication Protocol in LabVIEW FPGA. Available at: http://www.
ni.com/example/9117/en/. [Accessed 08 June 15].
[28] S. Sjokvist and S. Eriksson. Experimental Verification of a Simulation Model for Partial De-magnetization of Permanent Magnets. IEEE Transactions on Magnetics, vol.50, no.12, pp.1,5,Dec. 2014.
35
1 2 3 4
1 2 3 4
A
B
C
D
E
F
A
B
C
D
E
F
Date: 03 maj 2015KiCad E.D.A. kicad (after 2015-mar-04 BZR unknown)-product
Rev: ASize: A4Id: 1/12
Title: Rotating RIO ADD-ON boardFile: Add_on_Board_NI9683.schSheet: /Uppsala UniversityFredrik Evestedt
Bluetooth
Bluetooth.sch
PSU
PSU.sch
Half_Bridge
Half_Bridge.sch
Simultaneous_AI
Simultaneous_AI.sch
ADC1_2
ADC1_2.sch
Relay_CTRL
Relay_CTRL.sch
Scanned_AI_AO
Scanned_AI_AO.sch
Sourcing_DI
Sourcing_DI.sch
Global NETS
+2.5V_REF+3.3V+3.3V_MEZZ+5V+15V+24V-15VCOM
Ethernet
Ethernet.sch
H2
Hole
H3
Hole
H4
Hole
H5
Hole
Appendix B Schematics and Layouts
41
1 2 3 4
1 2 3 4
A
B
C
D
E
F
A
B
C
D
E
F
Date: 03 maj 2015KiCad E.D.A. kicad (after 2015-mar-04 BZR unknown)-product
Rev: ASize: A4Id: 2/12
Title: Rotating RIO BluetoothFile: Bluetooth.schSheet: /Bluetooth/Uppsala UniversityFredrik Evestedt
READY1
C1+2
V+3
C1-4
C2+5
C2-6
V-7
RIN8 ROUT 9INVALID 10
DIN 11FORCEON 12
DOUT 13GND 14VCC 15
FORCEOFF 16
U1
MAX3227E
C3
100n
C4
100n
1 1
2 2
3 3
4 4
5 5
6 6
7 7
8 8
9 9
10 10
X1
CON-10P
VDD_3V31
TXD2
RXD3
GPIO104
RESET_N5
GPIO66
GPIO97
GPIO48
GPIO119
GND10
AIO1 20
GPIO8 11RTS 12
GPIO2 13NC 14
GPIO5 15CTS 16
GPIO3 17GPIO7 18
AIO0 19
U2
RN41XV
R1
100k
R2
100k
R3
100k R
510
0k
R6
100k
R4
100k
12
D1
LED
C1
100n
C2
100n
C5
100n
C6
100n
C7
100n
C8
100n
+3.3V
COM
+3.
3V
H1
Hole
CO
M
Decoupling
1 2 3 4
1 2 3 4
A
B
C
D
E
F
A
B
C
D
E
F
Date: 03 maj 2015KiCad E.D.A. kicad (after 2015-mar-04 BZR unknown)-product
Rev: ASize: A4Id: 3/12
Title: Rotating RIO PSUFile: PSU.schSheet: /PSU/Uppsala UniversityFredrik Evestedt
+VIN1
-VIN2
RMT3
+15V 4
COM 5
-15V 6
U3
TEN_30-2423WIN
GN
D1
VO 2VI3
U4LD1117S33TR
C9
4.7u
C121n
C101n C13
220nF
C15
100n
C16
10u
12
P1
24V
_IN 1 2F1
FUSE
12
P2BA
TT
_IN 1 2F2
FUSE
D2
DIODE
D3
DIODE
+5V
+15VCOM-15V
+3.3V
+24V
12
P3
24V_RIO
24V_IN
BATT_IN
C14
100n
Vin1
GN
D2
Vout 3
GN
D4 U5
LM7805_sot223
1 2D16
LEDR1191.5k -15VCOM
V1 X9
+15V
V1 X10
+5V
V1 X11
+3.3V
V1 X12
-15V
V1 X13
COM
V1 X8
+24V
+24
V
+5V
+15
V
+3.
3V
-15V
CO
M
Test points Power LED
1 2 3 4
1 2 3 4
A
B
C
D
E
F
A
B
C
D
E
F
Date: 03 maj 2015KiCad E.D.A. kicad (after 2015-mar-04 BZR unknown)-product
Rev: ASize: A4Id: 4/12
Title: Rotating RIO Half-Bridge DriverFile: Half_Bridge.schSheet: /Half_Bridge/Uppsala UniversityFredrik Evestedt
123456789
10
20
11
21
12
22
13
23
14
24
15
25
16
26
171819
X2
HALF_BRIDGE_DOHB_DO13HB_VextHB_DO12GNDHB_DO11GNDHB_DO10GNDHB_DO9GNDHB_D08GNDHB_DO7HB_DO6GND
GND
GND
GND
GND
HB_DO5
HB_DO4
HB_DO3
HB_D02
HB_DO1
HB_DO0
1
2
3
4
5
6
7
8
9
J6
DB9
1
2
3
4
5
6
7
8
9
J7
DB9
1
2
3
4
5
6
7
8
9
J4
DB9
1
2
3
4
5
6
7
8
9
J2
DB9
1
2
3
4
5
6
7
8
9
10
20
11
21
12
22
13
23
14
24
15
25
16
17
18
19
J1
DB25
GND
+15
VC
OM
+15V
COM
C120
10uF
C121
10uF
C122
10uF
C123
10uF
C124
10uF
C125
10uF
C127
10uF
C128
10uF
C129
10uF
Fault_ROTOR_HB
Fault_Buck
VCC1
AOUT2
AIN3
BOUT4
BIN5
COUT6
CIN7
VSS8 DIN 9DOUT 10
EIN 11EOUT 12
SEL 13FIN 14
FOUT 15VDD 16
U25
CD4504+15
V
CO
M
+5V
Fault_RectifierA1
B2
D3
E4
F5D+E+F 6
VSS 7
C8A+B+C 9
G+H+I 10
I11H12G13
VDD14
U26
CD4075
CO
M
+15
V
C130
100nF
C131
100nF
COM
+15V
C132
100nF
+5V
CO
M
C126
10uF
Power supply decoupling
CO
M
1 2 3 4
1 2 3 4
A
B
C
D
E
F
A
B
C
D
E
F
Date: 03 maj 2015KiCad E.D.A. kicad (after 2015-mar-04 BZR unknown)-product
Rev: ASize: A4Id: 5/12
Title: Rotating RIO Simultaneous AIFile: Simultaneous_AI.schSheet: /Simultaneous_AI/Uppsala UniversityFredrik Evestedt
12345678910
20
30
40
11
21
31
12
22
32
13
23
33
14
24
34
15
25
35
16
26
36
17
27
37
18
28
38
19
29
39
X3
SIMULTANEOUS_AI
ADC0_AI15+ADC0_AI15-ADC0_AI14+ADC0_AI14-ADC0_AI13+
ADC0_AI12+
ADC0_AI11+
ADC0_AI10+
ADC0_AI9+
ADC0_AI8+
ADC0_AI7+
ADC0_AI6+
ADC0_AI5+
ADC0_AI4+
ADC0_AI3+
ADC0_AI2+
ADC0_AI1+
ADC0_AI0+
ADC0_CS_COMADC0_CS_COMADC0_CS_COMADC0_CS_COM
ADC0_CS_COMADC0_CS_COMADC0_CS_COMADC0_CS_COM
ADC0_AI13-
ADC0_AI12-
ADC0_AI11-
ADC0_AI10-
ADC0_AI9-
ADC0_AI8-
ADC0_AI7-
ADC0_AI6-
ADC0_AI5-
ADC0_AI4-
ADC0_AI3-
ADC0_AI1-
ADC0_AI0-
R18
120
R17
120
R16
120
R15
120
R19
120
R20
120
R21
120
R22
120
R10
120
R9
120
R8
120
R7
120
R11
120
R12
120
R13
120
R14
120
1
2
3
4
5
6
7
8
9
J9
DB9
1
2
3
4
5
6
7
8
9
J10
DB9
1
2
3
4
5
6
7
8
9
J11
DB9
1
2
3
4
5
6
7
8
9
J12
DB9
1
2
3
4
5
6
7
8
9
J13
DB9
ADC0_AI15+ADC0_AI15-ADC0_AI14+ADC0_AI14-ADC0_AI13+
ADC0_AI12+
ADC0_AI11+
ADC0_AI10+
ADC0_AI9+
ADC0_AI8+
ADC0_AI7+
ADC0_AI6+
ADC0_AI5+
ADC0_AI4+
ADC0_AI3+
ADC0_AI1+
ADC0_AI0+
ADC0_CS_COMADC0_CS_COMADC0_CS_COMADC0_CS_COM
ADC0_CS_COMADC0_CS_COMADC0_CS_COMADC0_CS_COM
ADC0_AI13-
ADC0_AI12-
ADC0_AI11-
ADC0_AI10-
ADC0_AI9-
ADC0_AI8-
ADC0_AI7-
ADC0_AI6-
ADC0_AI5-
ADC0_AI4-
ADC0_AI3-
ADC0_AI0-
1
2
3
4
5
6
7
8
9
J8
DB9
CO
M+
15V
-15V
CO
MADC0_AI2-
CO
M
1 2 3 4
1 2 3 4
A
B
C
D
E
F
A
B
C
D
E
F
Date: 03 maj 2015KiCad E.D.A. kicad (after 2015-mar-04 BZR unknown)-product
Rev: ASize: A4Id: 6/12
Title: Rotating RIO ADC1_2File: ADC1_2.schSheet: /ADC1_2/Uppsala UniversityFredrik Evestedt
12345678910
20
30
40
50
60
11
21
31
41
51
12
22
32
42
52
13
23
33
43
53
14
24
34
44
54
15
25
35
45
55
16
26
36
46
56
17
27
37
47
57
18
28
38
48
58
19
29
39
49
59
X4
LVTTL
ADC_CH1
ADC_CH1.sch
ADC1_CS
ADC1_SCLK
ADC1_DIN
ADC1_DOUT
ADC1_VIN14+
ADC1_VIN15+ADC1_REFIN
ADC1_VIN15-
ADC1_VIN14-
ADC1_VIN12+
ADC1_VIN13+ADC1_VIN13-
ADC1_VIN12-
ADC1_VIN10+
ADC1_VIN11+ADC1_VIN11-
ADC1_VIN10-
ADC1_VIN8+
ADC1_VIN9+ADC1_VIN9-
ADC1_VIN8-
ADC1_VIN6+
ADC1_VIN7+ADC1_VIN7-
ADC1_VIN6-
ADC1_VIN4+
ADC1_VIN5+ADC1_VIN5-
ADC1_VIN4-
ADC1_VIN2+
ADC1_VIN3+ADC1_VIN3-
ADC1_VIN2-
ADC1_VIN0+
ADC1_VIN1+ADC1_VIN1-
ADC1_VIN0-
ADC_CH2
ADC_CH2.sch
ADC2_CS
ADC2_SCLK
ADC2_DIN
ADC2_DOUT
ADC2_REFIN
ADC2_VIN14+
ADC2_VIN15+ADC2_VIN15-
ADC2_VIN14-
ADC2_VIN12+
ADC2_VIN13+ADC2_VIN13-
ADC2_VIN12-
ADC2_VIN10+
ADC2_VIN11+ADC2_VIN11-
ADC2_VIN10-
ADC2_VIN8+
ADC2_VIN9+ADC2_VIN9-
ADC2_VIN8-
ADC2_VIN6+
ADC2_VIN7+ADC2_VIN7-
ADC2_VIN6-
ADC2_VIN4+
ADC2_VIN5+ADC2_VIN5-
ADC2_VIN4-
ADC2_VIN2+
ADC2_VIN3+ADC2_VIN3-
ADC2_VIN2-
ADC2_VIN0+
ADC2_VIN1+ADC2_VIN1-
ADC2_VIN0-
GND
GND
GNDDIO26
DIO25GND
DIO23GNDDIO22DIO21
GNDDIO20DIO19
GNDDIO18DIO17
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
DIO16DIO15
DIO14
DIO13
DIO12
DIO11
DIO10
DIO9
DIO8
DIO7
DIO6
DIO5
DIO4
DIO3
DIO2
DIO1
DIO0
CO
M
1
2
3
4
5
6
7
8
9
10
20
11
21
12
22
13
23
14
24
15
25
16
17
18
19
J14
DB25
1
2
3
4
5
6
7
8
9
10
20
11
21
12
22
13
23
14
24
15
25
16
17
18
19
J15
DB25
1
2
3
4
5
6
7
8
9
J16
DB9
VD
D1
GN
D2
2.5_V 3
U24
AD580
+5V
GNDA
+2.5V_REF
+2.5V_REF
1 2
3
D4
DOUBLE_SCHOTTKY_Correct
1 2
3
D5
DOUBLE_SCHOTTKY_Correct
1 2
3D6
DOUBLE_SCHOTTKY_Correct
1 2
3
D7
DOUBLE_SCHOTTKY_Correct
1 2
3
D8
DOUBLE_SCHOTTKY_Correct
1 2
3
D9
DOUBLE_SCHOTTKY_Correct
1 2
3
D10
DOUBLE_SCHOTTKY_Correct
1 2
3
D11
DOUBLE_SCHOTTKY_Correct
+2.5V_REF
+3.
3V_M
EZ
Z
+3.
3V_M
EZ
Z
1
2
3
4
5
6
7
8
9
J3
DB9
DIO28
Fault_BuckFault_ROTOR_HBFault_Rectifier
12
P8
12
P9
12
P10
12
P11
DIO24
CO
M
ADC Reference
1 2 3 4
1 2 3 4
A
B
C
D
E
F
A
B
C
D
E
F
Date: 03 maj 2015KiCad E.D.A. kicad (after 2015-mar-04 BZR unknown)-product
Rev: ASize: A4Id: 7/12
Title: File: ADC_CH1.schSheet: /ADC1_2/ADC_CH1/Uppsala UniversityFredrik Evestedt
VOUTA1
VINA-2
VINA+3
VDD4
VINB+5
VINB-6
VOUTB7 VOUTC 8VINC- 9VINC+ 10
VSS 11VIND+ 12VIND- 13
VOUTD 14
U6
MCP6024
ADC1_CS
ADC1_SCLK
ADC1_DIN
ADC1_DOUT
ADC1_VIN14+
ADC1_VIN15+
AD
C1_
RE
FIN
C49
100nF
C50
10uF
C51
10uF
C52
10uF
C53
100nF
C54
100nF
C55
100nF
C56
100nF
C57
100nF
C58
10uF
R23200
R31200
R39R
R40R
R55R
R56R
C17 C C33 C
C18 C C34 C
GN
DA
GN
DA
VOUTA1
VINA-2
VINA+3
VDD4
VINB+5
VINB-6
VOUTB7 VOUTC 8VINC- 9VINC+ 10
VSS 11VIND+ 12VIND- 13
VOUTD 14
U7
MCP6024 R41R
R42R
R57R
R58R
C19 C C35 C
C20 CC36 C
GN
DA
GN
DA
VOUTA1
VINA-2
VINA+3
VDD4
VINB+5
VINB-6
VOUTB7 VOUTC 8VINC- 9VINC+ 10
VSS 11VIND+ 12VIND- 13
VOUTD 14
U8
MCP6024 R43R
R44R
R59R
R60R
C21 C C37 C
C22 C C38 C
GN
DA
GN
DA
VOUTA1
VINA-2
VINA+3
VDD4
VINB+5
VINB-6
VOUTB7 VOUTC 8VINC- 9VINC+ 10
VSS 11VIND+ 12VIND- 13
VOUTD 14
U9
MCP6024 R45R
R46R
R61R
R62R
C23 C C39 C
C24 C C40 C
GN
DA
GN
DA
VOUTA1
VINA-2
VINA+3
VDD4
VINB+5
VINB-6
VOUTB7 VOUTC 8VINC- 9VINC+ 10
VSS 11VIND+ 12VIND- 13
VOUTD 14
U10
MCP6024 R47R
R48R
R63R
R64R
C25 C C41 C
C26 C C42 C
GN
DA
GN
DA
VOUTA1
VINA-2
VINA+3
VDD4
VINB+5
VINB-6
VOUTB7 VOUTC 8VINC- 9VINC+ 10
VSS 11VIND+ 12VIND- 13
VOUTD 14
U11
MCP6024 R49R
R50R
R65R
R66R
C27 C C43 C
C28 CC44 C
GN
DA
GN
DA
VOUTA1
VINA-2
VINA+3
VDD4
VINB+5
VINB-6
VOUTB7 VOUTC 8VINC- 9VINC+ 10
VSS 11VIND+ 12VIND- 13
VOUTD 14
U12
MCP6024 R51R
R52R
R67R
R68R
C29 C C45 C
C30 C C46 C
GN
DA
GN
DA
VOUTA1
VINA-2
VINA+3
VDD4
VINB+5
VINB-6
VOUTB7 VOUTC 8VINC- 9VINC+ 10
VSS 11VIND+ 12VIND- 13
VOUTD 14
U13
MCP6024 R53R
R54R
R69R
R70R
C31 C C47 C
C32 C C48 C
GN
DA
GN
DA
C59
10uF
C60
100nF
C61
10uF
C62
10uF
C63
100nF
C64
100nF
C65
10uF
C66
10uF
ADC1_VIN15-
ADC1_VIN14-
ADC1_VIN12+
ADC1_VIN13+R24200
R25200
ADC1_VIN13-
ADC1_VIN12-
ADC1_VIN10+
ADC1_VIN11+R26200
R27200
ADC1_VIN11-
ADC1_VIN10-
ADC1_VIN8+
ADC1_VIN9+R28200
R29200
ADC1_VIN9-
ADC1_VIN8-
ADC1_VIN6+
ADC1_VIN7+R30200
R32200
ADC1_VIN7-
ADC1_VIN6-
ADC1_VIN4+
ADC1_VIN5+R33200
R34200
ADC1_VIN5-
ADC1_VIN4-
ADC1_VIN2+
ADC1_VIN3+R35200
R36200
ADC1_VIN3-
ADC1_VIN2-
ADC1_VIN0+
ADC1_VIN1+R37200
R38200
ADC1_VIN1-
ADC1_VIN0-
+3.3V_MEZZ
COM
+3.
3V_M
EZ
Z
+5V
CO
M
VIN111
VIN102
VIN93
NC4
VIN85
VIN76
VIN67
VIN58
VIN49
VIN310CS 20
VIN211
AGND 21
VIN112
VDD 22
VIN013
REF_IN 23
AGND14
AGND 24
DOUT 15
VIN15 25
SCLK 16
VIN14 26
VDRIVE 17
VIN13 27
NC 18
VIN12 28
DIN 19
U14
AD7490
+15V
CO
M
CO
M+
5V
+5V
CO
M
+5V
GNDA
1 2 3 4
1 2 3 4
A
B
C
D
E
F
A
B
C
D
E
F
Date: 03 maj 2015KiCad E.D.A. kicad (after 2015-mar-04 BZR unknown)-product
Rev: ASize: A4Id: 8/12
Title: File: ADC_CH2.schSheet: /ADC1_2/ADC_CH2/Uppsala UniversityFredrik Evestedt
VOUTA1
VINA-2
VINA+3
VDD4
VINB+5
VINB-6
VOUTB7 VOUTC 8VINC- 9VINC+ 10
VSS 11VIND+ 12VIND- 13
VOUTD 14
U15
MCP6024
ADC2_CS
ADC2_SCLK
ADC2_DIN
ADC2_DOUT
AD
C2_
RE
FIN
C99
10uF
C100
100nF
C101
10uF
C102
100nF
C103
100nF
C104
100nF
C105
100nF
C106
10uF
C107
10uF
C108
10uF
GNDA
+5V
R87R
R88R
R103R
R104R
C67 C C83 C
C68 C C84 C
GN
DA
GN
DA
VOUTA1
VINA-2
VINA+3
VDD4
VINB+5
VINB-6
VOUTB7 VOUTC 8VINC- 9VINC+ 10
VSS 11VIND+ 12VIND- 13
VOUTD 14
U16
MCP6024 R89R
R90R
R105R
R106R
C69 C C85 C
C70 CC86 C
GN
DA
GN
DA
VOUTA1
VINA-2
VINA+3
VDD4
VINB+5
VINB-6
VOUTB7 VOUTC 8VINC- 9VINC+ 10
VSS 11VIND+ 12VIND- 13
VOUTD 14
U17
MCP6024 R91R
R92R
R107R
R108R
C71 C C87 C
C72 C C88 C
GN
DA
GN
DA
VOUTA1
VINA-2
VINA+3
VDD4
VINB+5
VINB-6
VOUTB7 VOUTC 8VINC- 9VINC+ 10
VSS 11VIND+ 12VIND- 13
VOUTD 14
U18
MCP6024 R93R
R94R
R109R
R110R
C73 C C89 C
C74 CC90 C
GN
DA
GN
DA
VOUTA1
VINA-2
VINA+3
VDD4
VINB+5
VINB-6
VOUTB7 VOUTC 8VINC- 9VINC+ 10
VSS 11VIND+ 12VIND- 13
VOUTD 14
U19
MCP6024 R95R
R96R
R111R
R112R
C75 C C91 C
C76 C C92 C
GN
DA
GN
DA
VOUTA1
VINA-2
VINA+3
VDD4
VINB+5
VINB-6
VOUTB7 VOUTC 8VINC- 9VINC+ 10
VSS 11VIND+ 12VIND- 13
VOUTD 14
U20
MCP6024 R97R
R98R
R113R
R114R
C77 C C93 C
C78 C C94 C
GN
DA
GN
DA
VOUTA1
VINA-2
VINA+3
VDD4
VINB+5
VINB-6
VOUTB7 VOUTC 8VINC- 9VINC+ 10
VSS 11VIND+ 12VIND- 13
VOUTD 14
U21
MCP6024 R99R
R100R
R115R
R116R
C79 C C95 C
C80 C C96 C
GN
DA
GN
DA
VOUTA1
VINA-2
VINA+3
VDD4
VINB+5
VINB-6
VOUTB7 VOUTC 8VINC- 9VINC+ 10
VSS 11VIND+ 12VIND- 13
VOUTD 14
U22
MCP6024 R101R
R102R
R117R
R118R
C81 C C97 C
C82 C C98 C
GN
DA
GN
DA
C109
10uF
C110
100nF
C111
100nF
C112
100nF
C113
10uF
C114
10uF
C115
10uF
C116
100nF
ADC2_VIN14+
ADC2_VIN15+
R71200
R72200
ADC2_VIN15-
ADC2_VIN14-
ADC2_VIN12+
ADC2_VIN13+R73200
R74200
ADC2_VIN13-
ADC2_VIN12-
ADC2_VIN10+
ADC2_VIN11+R75200
R76200
ADC2_VIN11-
ADC2_VIN10-
ADC2_VIN8+
ADC2_VIN9+R77200
R78200
ADC2_VIN9-
ADC2_VIN8-
ADC2_VIN6+
ADC2_VIN7+R79200
R80200
ADC2_VIN7-
ADC2_VIN6-
ADC2_VIN4+
ADC2_VIN5+R81200
R82200
ADC2_VIN5-
ADC2_VIN4-
ADC2_VIN2+
ADC2_VIN3+R83200
R84200
ADC2_VIN3-
ADC2_VIN2-
ADC2_VIN0+
ADC2_VIN1+R85200
R86200
ADC2_VIN1-
ADC2_VIN0-
COM
C11
10uF
C117
100nF
C118
10uF
C119
100nF
+3.3V_MEZZ
+3.
3V_M
EZ
Z+
5V+
5V
CO
MC
OM
+5V
COM
VIN111
VIN102
VIN93
NC4
VIN85
VIN76
VIN67
VIN58
VIN49
VIN310CS 20
VIN211
AGND 21
VIN112
VDD 22
VIN013
REF_IN 23
AGND14
AGND 24
DOUT 15
VIN15 25
SCLK 16
VIN14 26
VDRIVE 17
VIN13 27
NC 18
VIN12 28
DIN 19
U23
AD7490
CO
M
+15V
+5V
GNDA
1 2 3 4
1 2 3 4
A
B
C
D
E
F
A
B
C
D
E
F
Date: 03 maj 2015KiCad E.D.A. kicad (after 2015-mar-04 BZR unknown)-product
Rev: ASize: A4Id: 9/12
Title: Rotating RIO Relay ControlFile: Relay_CTRL.schSheet: /Relay_CTRL/Uppsala UniversityFredrik Evestedt
123456789
10
20
30
40
11
21
31
12
22
32
13
23
33
14
24
34
15
25
35
16
26
36
17
27
37
18
28
38
19
29
39
X5
SINKING_DO
RL_DO3+RL_DO3-RL_DO2+RL_DO2-RL_DO1+RL_DO1-RL_DO0+RL_DO0-
GND
GND
D14
DIO
DE
D15
DIO
DE
GNDA
12
P5
RL3_OUT
12
P6
RL2_OUT
12
P7
RL1_OUT
12
P4
RL0_OUT
+24
V
GND
D13
DIO
DE
D12
DIO
DE
1 2 3 4
1 2 3 4
A
B
C
D
E
F
A
B
C
D
E
F
Date: 03 maj 2015KiCad E.D.A. kicad (after 2015-mar-04 BZR unknown)-product
Rev: ASize: A4Id: 10/12
Title: Rotating RIO Scanned AI_AOFile: Scanned_AI_AO.schSheet: /Scanned_AI_AO/Uppsala UniversityFredrik Evestedt
Scan_AI7Scan_AI6
Scan_AI2Scan_AI1Scan_AI0
1
2
3
4
5
6
7
8
9
J20
DB9
+15V
-15V
1
2
3
4
5
6
7
8
9
J5
DB9
+15V
-15V
COM
COM
COM
COM
R12
0R
R12
1R
R12
2R
R12
3R
R12
4R
R12
5R
CO
M
12345678910
20
111213141516171819
X6
SCANNED_AI_&_AO
1 2 3 4
1 2 3 4
A
B
C
D
E
F
A
B
C
D
E
F
Date: 03 maj 2015KiCad E.D.A. kicad (after 2015-mar-04 BZR unknown)-product
Rev: ASize: A4Id: 11/12
Title: Rotating RIO Sourcing DIFile: Sourcing_DI.schSheet: /Sourcing_DI/Uppsala UniversityFredrik Evestedt
123456789
10
20
30
11
21
31
12
22
32
13
23
33
14
24
34
15
25
16
26
17
27
18
28
19
29
X7
SOURCING_DIC
OM
1 2 3 4
1 2 3 4
A
B
C
D
E
F
A
B
C
D
E
F
Date: 03 maj 2015KiCad E.D.A. kicad (after 2015-mar-04 BZR unknown)-product
Rev: ASize: A4Id: 12/12
Title: Rotating RIO EthernetFile: Ethernet.schSheet: /Ethernet/Uppsala UniversityFredrik Evestedt
12345678
SH
IELD
9
J18
RJ4
5
12345678
SH
IELD
9
J19
RJ4
5
1 2 3 4
1 2 3 4
A
B
C
D
E
F
A
B
C
D
E
F
Date: 23 april 2015KiCad E.D.A. kicad (after 2015-mar-04 BZR unknown)-product
Rev: Rev ASize: A4Id: 1/1
Title: Rotor board (Drivers)File: Rotor_Board_driver.schSheet: /Uppsala UniversityFredrik Evestedt
1
2
3
4
5
6
7
8
9
10
20
11
21
12
22
13
23
14
24
15
25
16
17
18
19
J4
DB25
+15
V
CO
M
1
2
3
4
5
6
7
8
9
J1
DB9
1
2
3
4
5
6
7
8
9
J2
DB9
1
2
3
4
5
6
7
8
9
J3
DB9
1
2
3
4
5
6
7
8
9
J5
DB9
1
2
3
4
5
6
7
8
9
J6
DB9
1
2
3
4
5
6
7
8
9
J7
DB9
COM
COM
COM
COM
COM
COM
COM
COM
COM
COM
COM
COM
+15V
+15V
+15V
+15V
+15V
+15V
1
2
3
4
5
6
7
8
9
J8
DB9
1 2D1
LEDR17.15k+15V COM
COM_TTL
+3.3V
SCLKMISOMOSI
CS1
CS2
123456
P1
CO
NN
_01X
06
123456
P2
CO
NN
_01X
06
COM_TTL+3.3V
COM_TTL+3.3V
H1
Hole
H2
Hole
H3
Hole
Mounting holesSPI for two slaves Power LED
Half-bridge driver distribution
A1
B2
D3
E4
F5D+E+F 6
VSS 7
C8A+B+C 9
G+H+I 10
I11H12G13
VDD14
U1
CD4075
+15V COM
C1
100n
F
COM
FAULT
Fault_J1
Fault_J2
Fault_J3
Fault_J5
Fault_J6
Fault_J7
SW_J1
SW_J2
SW_J3
SW_J5
SW_J6
SW_J7
Enable_Rotor
1 2 3 4
1 2 3 4
A
B
C
D
E
F
A
B
C
D
E
F
Date: 23 april 2015KiCad E.D.A. kicad (after 2015-mar-04 BZR unknown)-product
Rev: Rev ASize: A4Id: 1/2
Title: Rotor board (sensors)File: Rotor_Board_sensor.schSheet: /Uppsala UniversityFredrik Evestedt
Hall_sensor_distribution
Hall_sensor_distribution.sch
1
2
3
4
5
6
7
8
9
J1
DB9
1
2
3
4
5
6
7
8
9
J3
DB9
1
2
3
4
5
6
7
8
9
J2
DB9 COM
COM
COM
COM
COM
+15V
COM
+15V COM1 2D1
LEDR17.15k
H1
Hole
H2
Hole
H3
Hole
1
2
3
4
5
6
7
8
9
J6
DB9
12
P25
12
P26
12
P27
12
P28
Mounting holes
Power LED
Arbitrary current loop input
VIN1
GN
D2
VOUT 3
U1
LM2937
C1
100nF
C2
10uF
CO
M
12V+15V
Damper winding measurement
1 2 3 4
1 2 3 4
A
B
C
D
E
F
A
B
C
D
E
F
Date: 23 april 2015KiCad E.D.A. kicad (after 2015-mar-04 BZR unknown)-product
Rev: Rev ASize: A4Id: 2/2
Title: Rotor board (sensors)File: Hall_sensor_distribution.schSheet: /Hall_sensor_distribution/Uppsala UniversityFredrik Evestedt
1
2
3
4
5
6
7
8
9
10
20
11
21
12
22
13
23
14
24
15
25
16
17
18
19
J4
DB25
12
P1
12
P3
12
P5
12
P7
12
P9
12
P11
12
P13
12
P15
12
P17
12
P19
12
P21
12
P23
1
2
3
4
5
6
7
8
9
10
20
11
21
12
22
13
23
14
24
15
25
16
17
18
19
J5
DB25
12
P2
12
P4
12
P6
12
P8
12
P10
12
P12
12
P14
12
P16
12
P18
12
P20
12
P22
12
P24
1 2 3 4
1 2 3 4
A
B
C
D
E
F
A
B
C
D
E
F
Date: 26 april 2015KiCad E.D.A. kicad (after 2015-mar-04 BZR unknown)-product
Rev: Rev BSize: A4Id: 1/1
Title: Hall sensor boardFile: Hall_sensor_board_RevB.schSheet: /Uppsala UniversityFredrik Evestedt
Vin+1 VH+ 2
Vin-3 VH- 4
U1
CYSJ166A-HALL
VOUT 1
VS
S2
VIN+3
VIN-4
VD
D5
U2
MCP6021NC1
Iin2
IRET3
IO4 E 5B 6
V+ 7VREG 8
U3
XTR117
R115k
R2
DN
P
B1
E2
C3
Q1
SOT-23NPNC1
1uF
1P1
CO
NN
_01X
01
1P2
CO
NN
_01X
01
C2
10nF
VREG
IRET
VH+
OP_FB
IIn
IO
V+
BE