wireless power development board user’s...

2017 Microchip Technology Inc. Advance Information DS50002623A

Wireless PowerDevelopment Board

User’s Guide

DS50002623A-page 2 Advance Information 2017 Microchip Technology Inc.

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Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

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• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

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Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of ourproducts. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such actsallow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

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== ISO/TS 16949 ==

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The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

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Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

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© 2017, Microchip Technology Incorporated, All Rights Reserved.

ISBN: 978-1-5224-1722-4

EU Declaration of Conformity This declaration of conformity is issued by the manufacturer. The development/evaluation tool is designed to be used for research and development in a laboratory environment. This development/evaluation tool is not a Finished Appliance, nor is it intended for incorporation into Finished Appliances that are made commercially available as single functional units to end users under EU EMC Directive 2004/108/EC and as supported by the European Commission's Guide for the EMC Directive 2004/108/EC (8th February 2010). This development/evaluation tool complies with EU RoHS2 Directive 2011/65/EU. This development/evaluation tool, when incorporating wireless and radio-telecom functionality, is in compliance with the essential requirement and other relevant provisions of the R&TTE Directive 1999/5/EC and the FCC rules as stated in the declaration of conformity provided in the module datasheet and the module product page available at www.microchip.com. For information regarding the exclusive, limited warranties applicable to Microchip products, please see Microchip’s standard terms and conditions of sale, which are printed on our sales documentation and available at www.microchip.com. Signed for and on behalf of Microchip Technology Inc. at Chandler, Arizona, USA.

Object of Declaration: Wireless Power Development Board

2017 Microchip Technology Inc. Advance Information DS50002623A-page 3

Wireless Power Development Board User’s Guide

NOTES:


WIRELESS POWER DEVELOPMENTBOARD USER’S GUIDE

Table of Contents

Safety Notice ................................................................................................................. 7

Preface ........................................................................................................................... 9

Chapter 1. Introduction1.1 Overview ...................................................................................................... 131.2 Wireless Power Development Board Functionality and Features ................ 141.3 Electrical Specifications ................................................................................ 19

Chapter 2. Hardware2.1 Board Assembly ........................................................................................... 212.2 Signal Configuration ..................................................................................... 222.3 Application Components .............................................................................. 232.4 Board Connectors ........................................................................................ 23

Chapter 3. Demonstration Program Operation3.1 Program Demonstration ............................................................................... 253.2 Program Top Level Description .................................................................... 263.3 Wireless Transmitter Board Waveforms ....................................................... 26

Appendix A. Board Layout and Schematics.............................................................. 31

Worldwide Sales and Service .................................................................................... 36



NOTES:


WIRELESS POWER DEVELOPMENTBOARD USER’S GUIDE

Safety Notice

The following safety notices and operating instructions should be adhered to in order to avoid a safety hazard. If in any doubt, consult your supplier.

WARNING – The Wireless Power Development Board generates AC voltages in excess of 144 Vpk-pk on the resonator circuit, which consists of the primary winding coil (L1) and resonator capacitors (C10, C18 and C24).

General Notices:

• The Wireless Power Development Board is intended for evaluation and development purposes, and should only be operated in a normal laboratory environment, as defined by IEC 61010-1:2001.

• Clean with a dry cloth only.

• Operate flat on a bench away from any surface items that might come in contact with the board. Do not move during operation and avoid direct contact with the bottom layer of the board.

• The Wireless Power Development Board should not be connected or operated if there is any apparent damage to the unit.



NOTES:


WIRELESS POWER DEVELOPMENT
BOARD USER’S GUIDE
Preface

INTRODUCTION

This preface contains general information that will be useful to know before using the Wireless Power Development Board. Topics discussed in this preface include:

• Document Layout• Conventions Used in this Guide• Recommended Reading• The Microchip Web Site• Development Systems Customer Change Notification Service• Customer Support• Document Revision History

DOCUMENT LAYOUT

This user’s guide provides an overview of the Wireless Power Development Board. The document is organized as follows:

• Chapter 1. “Introduction” – This chapter introduces the Wireless Power Development Board and provides a brief overview of its features.

• Chapter 2. “Hardware” – This chapter describes the board layout and the main components of the Wireless Power Development Board.

• Chapter 3. “Demonstration Program Operation” – This chapter describes the demonstration software that is preloaded on the device that accompanies the Wireless Power Development Board.

• Appendix A. “Board Layout and Schematics” – This appendix provides diagrams of the hardware layout, as well as schematic diagrams for the Wireless Power Development Board.

NOTICE TO CUSTOMERS

All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our web site (www.microchip.com) to obtain the latest documentation available.

Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is “DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level of the document.

For the most up-to-date information on development tools, see the MPLAB® IDE on-line help. Select the Help menu, and then Topics to open a list of available on-line help files.


http://www.microchip.com


CONVENTIONS USED IN THIS GUIDE

This manual uses the following documentation conventions:

DOCUMENTATION CONVENTIONS

Description Represents Examples

Arial font:

Italic characters Referenced books MPLAB® IDE User’s Guide

Emphasized text ...is the only compiler...

Initial caps A window the Output window

A dialog the Settings dialog

A menu selection select Enable Programmer

Quotes A field name in a window or dialog

“Save project before build”

Underlined, italic text with right angle bracket

A menu path File>Save

Bold characters A dialog button Click OK

A tab Click the Power tab

N‘Rnnnn A number in verilog format, where N is the total number of digits, R is the radix and n is a digit.

4‘b0010, 2‘hF1

Text in angle brackets < > A key on the keyboard Press <Enter>, <F1>

Courier New font:

Plain Courier New Sample source code #define START

Filenames autoexec.bat

File paths c:\mcc18\h

Keywords _asm, _endasm, static

Command-line options -Opa+, -Opa-

Bit values 0, 1

Constants 0xFF, ‘A’

Italic Courier New A variable argument file.o, where file can be any valid filename

Square brackets [ ] Optional arguments mcc18 [options] file [options]

Curly braces and pipe character: { | }

Choice of mutually exclusive arguments; an OR selection

errorlevel {0|1}

Ellipses... Replaces repeated text var_name [, var_name...]

Represents code supplied by user

void main (void){ ...}


Preface

RECOMMENDED READING

This user’s guide describes how to use the Wireless Power Development Board. The device-specific data sheets contain current information on programming the specific microcontroller or Digital Signal Controller (DSC) devices. The following Microchip documents are available and recommended as supplemental reference resources:

MPLAB® C Compiler for PIC24 MCUs and dsPIC® DSCs User’s Guide (DS51284)

This comprehensive guide describes the usage, operation and features of Microchip’s MPLAB C compiler (formerly MPLAB C30) for use with 16-bit devices.

MPLAB® X IDE User’s Guide (DS50002027)

This document describes how to set up the MPLAB X IDE software and use it to create projects and program devices.

dsPIC33 ‘GS’ Data Sheets

Refer to these documents for detailed information on the dsPIC33 ‘GS’ SMPS Digital Signal Controllers (DSCs). Reference information found in these data sheets include:

• Device memory maps

• Device pinout and packaging details

• Device electrical specifications

• List of peripherals included on the devices

dsPIC33/PIC24 Family Reference Manual Sections

Family Reference Manual (FRM) sections are available, which explain the operation of the dsPIC® DSC and PIC24 MCU family architecture and peripheral modules. The specifics of each device family are discussed in the individual family’s device data sheet.

To obtain any of these documents, visit the Microchip web site at www.microchip.com.

THE MICROCHIP WEB SITE

Microchip provides online support via our web site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information:

• Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software

• General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing

• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives




DEVELOPMENT SYSTEMS CUSTOMER CHANGE NOTIFICATION SERVICE

Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest.

To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions.

The Development Systems product group categories are:

• Compilers – The latest information on Microchip C compilers and other language tools. These include the MPLAB® C compiler; MPASM™ and MPLAB 16-bit assemblers; MPLINK™ and MPLAB 16-bit object linkers; and MPLIB™ and MPLAB 16-bit object librarians.

• Emulators – The latest information on the Microchip MPLAB REAL ICE™ in-circuit emulator.

• In-Circuit Debuggers – The latest information on the Microchip in-circuit debugger, MPLAB ICD 3.

• MPLAB X IDE – The latest information on Microchip MPLAB X IDE, the Windows® Integrated Development Environment for development systems tools. This list is focused on the MPLAB X IDE, MPLAB SIM simulator, MPLAB X IDE Project Manager, and general editing and debugging features.

• Programmers – The latest information on Microchip programmers. These include the MPLAB PM3 device programmer and the PICkit™ 3 development programmers.

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.

Technical support is available through the web site at: http://support.microchip.com

DOCUMENT REVISION HISTORY

Revision A (May 2017)

This is the initial released version of this document.


Chapter 1. Introduction

This chapter introduces the Wireless Power Development Board and provides an overview of its features. The topics covered include:

• Wireless Power Development Board Functionality and Features

• Electrical Specifications

FIGURE 1-1: WIRELESS POWER DEVELOPMENT BOARD

1.1 OVERVIEW

The Microchip Wireless Power Development Board supports the Qi 1.2.2 standard. The board is a single coil transmitter that operates with a +12V input. The Wireless Power Development Board includes digital demodulation, Foreign Object Detection (FOD), LED status indicators and LED power level indicators. The Qi 1.2.2 standard is implemented with a Microchip dsPIC® DSC. These devices include a powerful CPU core, multiple PWM generators and advanced analog modules, allowing you to customize wireless power transfer applications and designs.



1.2 WIRELESS POWER DEVELOPMENT BOARD FUNCTIONALITY AND FEATURES

The Microchip Wireless Power Development Board is based on the Qi specified single coil, MP-A2 design topology. Figure 1-2 illustrates the high-level block diagram of the Wireless Power Development Board. A capacitance of 247 nF (±5%) and an inductance of 10 µF (±10%) comprises the resonant circuit. These two components determine the analog ping frequency for mobile device/wireless power receiver detection. This board includes MOSFET drivers, MOSFETs, a current sense amplifier, power transfer/power LED indicators and an envelope detector for demodulation.

FIGURE 1-2: WIRELESS POWER DEVELOPMENT BOARD BLOCK DIAGRAM

dsPIC33EP32GS202

MCU

RB10/RB11/RB12/

+12V

K2(2)

FILTER

3.3V VDD

AVDD

AN2

VCAP

VSS

10 µF

J3(1)

(ICSP™)

5

POWER TRANSFERSTATUS LEDs

POWER INDICATORLED BANK

3

8I/O

EXPANDER

2

DEMODULATOR

FETDRIVERS

K1(2)

Current Sense Amplifier

2

2

0.050

FB/HBINVERTERCIRCUIT

C Tx Coil(Primary)

VIN_FB

AN1

AN0

SCK/SDA

I_SENSE

PWM1H/PWM2H

DEMOD

TEMP AN6

Note 1: J3 includes VDD, GND, PGED2, PGEC2 and MCLR.2: K1 and K2 are circuit gains.

J1Power


Introduction

The software state machine for the power transmitter includes seven distinct phases for communication and power transfer. When receiving messages from a mobile device, the power transmitter demodulates the Amplitude Shift Keyed (ASK) encoded messages. When communicating with a wireless power receiver (mobile device), the power transmitter uses Frequency Shift Keying (FSK) for message encoding. FSK communication from the power transmitter applies to v1.2.2 medium power receivers. The medium power transmitter is both Qi v1.1 (Low Power – 5W) and Qi v1.2.2 (Medium Power – 15W) specification compatible.

The medium power wireless transmitter development board uses PI closed-loop frequency control for power transfer. The dsPIC DSC device provides the necessary memory and peripherals for current/voltage measurements, PWM generation, analog signal comparison, input capture and general purpose I/Os, eliminating the need to perform these functions with external circuitry.

The dsPIC ‘GS’ devices are specifically designed to provide design flexibility at low-cost. dsPIC ‘GS’ devices for wireless power applications offer the benefit of additional on-chip resources for added design functionality based on system needs and limited only by designer creativity.

The dsPIC ‘GS’ family of devices provides the following features:

• Integrated program and data memory on a single chip

• Ultra-fast interrupt response time with interrupt priority logic

• High-speed ADC with multiple Sample-and-Hold (S&H) circuits

• High-resolution PWM generators, specially designed to support different power topologies

• High-speed analog comparators for control loop implementation and system protection

• On-chip system communications (I2C/SPI/UART)

• On-chip Fast RC (FRC) oscillator for lower system cost

• Alternate Working register sets for context switching for improved control loop execution

1.2.1 System Resources Utilized

The following information summarizes the memory resources used with Level 1 optimization:

• Under 20% of RAM memory

• Under 45% of Flash memory

The following list summarizes the analog channels used:

• AN0 – Demodulation Signal

• AN1 – Transmitter Coil Current

• AN2 – VIN Feedback

• AN6 – Temperature Sensor

The following list summarizes the peripherals used:

• IC1 – Input capture (in conjunction with AN0)

• Timer1 – 1 ms system synchronization clock

• ADCMP0 – Digital comparator for +12V DC input over/undervoltage protection

• I2C1 – Used for communication with the I/O expander for power transfer LED control

• PWM1H/2H – Full-bridge inverter drive signals

• GPIO – For Status LED control



1.2.2 Power Stage

The power transmitter consists of a full-bridge power inverter. If the mobile device placed on the transmitter is a low-power receiver, the inverter will operate in Half-Bridge mode. If the mobile device placed on the transmitter is a medium power receiver, the inverter will operate in Full-Bridge mode. The inverter may revert back to Half-Bridge mode from Full-Bridge mode if the medium power receiver renegotiates for low-power transfer for increased efficiency at loads less than 5W.

INVERTER MODES:

• Half-Bridge: Load Requirements 5W

• Full-Bridge: Load Requirements 15W

1.2.3 Transmitter and Receiver User Interface Status Indicator LEDs

The power transmitter status user interface LED bank consists of D10, D11 and D12. These LEDs provide the status of the power transmitter while engaged to the power receiver. The LEDs are illuminated based on the base station status, as highlighted in Table 1-1:

1.2.4 Transmitter Power Transfer Level Indicator LEDs

The power transfer indicator LEDs are illuminated proportionately to the power being delivered to the receiver. This LED bank includes D13-D20. The illumination of the LEDs is normalized to the power rating of the receiver placed on the power transmitter.

1.2.5 Foreign Object Detection (FOD)

When a foreign object (electrical conductor) is placed on or near the alternating magnetic field of the Qi transmitter, there will be an induced electrical current in the for-eign object. This leads to power losses and a degradation of the overall system efficiency. Foreign Object Detection (FOD) is a feature that is implemented to rectify this issue.

Microchip’s transmitter board implements Foreign Object Detection based on the power loss method. In this method, the power difference between the transmitted power and received power is constantly monitored and compared to a threshold. The threshold is a function of the power rating of the receiver placed on the transmitter. If the power loss exceeds the specification threshold, the transmitter magnetic field is dis-abled and a red LED blinks on and off continuously to indicate the presence of a foreign object, prompting the user to remove the receiver from the transmitter and to remove the foreign object that is nearby.

TABLE 1-1: LED CONDITIONS

StatusGreen LED

Yellow LED

Red LED

Mobile Device is Detected ON OFF OFF

Charging or in Power Transfer Phase BLINKING OFF OFF

Charge is Complete ON BLINKING OFF

System Error OFF OFF ON

Reduced Power Delivery OFF ON OFF

Foreign Object is Detected OFF OFF BLINKING


Introduction

1.2.6 System Efficiency

The transmitter-receiver system efficiency is defined as the receiver load power divided by the transmitter inverter input power. The four main factors that influence the system efficiency are:

1. Transmitter inverter efficiency.

2. Receiver efficiency.

3. Receiver coil distance.

4. Receiver coil placement.

The first two factors are usually independent of each other and are attributed to circuit design and component selection. The third factor is defined by the Qi specification. The MP-A2 transmitter design requires a distance of 3 (+0.5/-0.25) mm from the surface of the transmitter coil to the interface surface. The acrylic cover fulfills this requirement. For best test results, it is recommended that the distance requirements for the test receiver, used alongside the wireless power transfer development board, be also followed (see Qi specification for test receiver-specific distance requirements). The fourth factor is heavily influenced by the displacement between the receiver and transmitter coils. The displacement can be with respect to the x-y coordinates relative to the surface of the transmitter coil and by the angular pitch. Tests have shown that displacement affects both efficiency and FOD. Therefore, from a user’s point of view, it is paramount that both the receiver coil and the transmitter coil be centrally aligned.

FIGURE 1-3: COIL ALIGNMENT

y

x

Coil Top View – x/y Displacement Side View – Pitch Angular Displacement

zReceiver Coil

Transmitter Coil

?

Transmitter Coil

Receiver Coil

?x

?y

Ideal Alignment: Displacement: ? x = ? y = 0Pitch: ? = 0°

x = y = 0

y

x



FIGURE 1-4: Qi SYSTEM EFFICIENCY MEASUREMENT METHODOLOGY

As shown in Figure 1-4, system efficiency per the Qi specification is calculated by dividing the receiver load power (POUT) by the transmitter inverter input power (PIN). The lines above and below the coils imply proper alignment.

FIGURE 1-5: TYPICAL MEASURED SYSTEM EFFICIENCY

Figure 1-5 shows typical measured system efficiencies when testing two low-power receivers, LP Rx1 and LP Rx2, and one medium power receiver, MP Rx.

Transmitter Receiver

Pin POUT

system =POUTPIN

Inverter

0

10

20

30

40

50

60

70

80

90

0 2 4 6 8 10 12 14 16

Load (W)

Load vs. Efficiency

MP_Rx

LP_Rx1

LP_Rx2

Eff

icie

ncy

(%

)


Introduction

1.2.7 Wireless Power Development Board Power

• J1: +12V Input Power Connector

• MIC39100 1A, 3.3V Low Quiescent Current LDO Regulator

1.2.8 Powering Up the Wireless Power Development Board

1. Ensure that there are no metallic materials on or near the coil of the transmitter.

2. Verify that the +12V power source is turned off.

3. Connect both GND and +12V from the power source to J1.

4. Turn on the power source, or if using a +12V adapter, plug it into the wall outlet.

5. Centrally align and place a low-power (Qi v1.1) or medium power (Qi v1.2.2) receiver coil onto the transmitter coil.

6. If the mobile device is successfully detected by the transmitter board, the green LED (D10) should become illuminated.

7. If the transmitter successfully enters the power transfer phase, the green LED (D10) should begin blinking on and off.

8. If there is a load on the receiver, the LED bank, which consists of D13-D20, should be illuminated proportionately to the load applied.

9. Monitor the status LEDs, D10-D12, for any changes in the status of the system.

1.3 ELECTRICAL SPECIFICATIONS

1.3.1 Standby Power

The typical standby power when no mobile device is placed on the base station is 720 mW.

TABLE 1-2: ELECTRICAL SPECIFICATIONS

Parameter Minimum Typical Maximum Unit

Voltage 11 12 13 V

Current — — 2.4 A

Analog Ping Frequency — 101 — kHz

Digital Ping Frequency — 140 — kHz

Power Transfer Frequency 110 — 145 kHz



NOTES:


Chapter 2. Hardware

This chapter describes the hardware components of the Wireless Power Development Board. Topics covered include:

• Board Assembly

• Signal Configuration

• Application Components

• Board Connectors

2.1 BOARD ASSEMBLY

The board assembly is shown in Figure 2-1. Table 2-1 provides a description of the components.

FIGURE 2-1: WIRELESS POWER DEVELOPMENT BOARD ASSEMBLY



TABLE 2-1: WIRELESS POWER DEVELOPMENT BOARD

2.2 SIGNAL CONFIGURATION

Table 2-2 provides a list of test points provided on the Wireless Power Development Board, along with a brief functional description.

TABLE 2-2: Wireless Power Development Board Test Points

Feature # Description

1 Digital Signal Controller – dsPIC33EP32GS202

2 +3.3V LDO Circuit

3 Input Programming Connector

4 8-LED Power Transfer Level Indicator Circuit

5 FET Drivers

6 +12V Input Connector

7 Demodulation Circuit

8 Dual FET ICs

9 Resonance Capacitors

10 Temperature Sensor Circuit

11 Current Sensing Circuit

12 Transmitter Coil

Test Point Description

1 +12V_IN

2 3.3V

3 GND

4-6 RESONATOR

7 DEMOD

8 CURRENT SENSE

9 CS_LEFT

10 AVDD

11 PWM1H

12 PWM2H

13 AGND

14 CS_RIGHT

15 I/O – Used for General Development

16 I/O – Used for Verifying Demodulation Signal

17 12V


Hardware

2.3 APPLICATION COMPONENTS

Table 2-3 describes the application components that are available on the Wireless Power Development Board.

TABLE 2-3: APPLICATION COMPONENTS

2.4 BOARD CONNECTORS

Table 2-4 describes the hardware connections available on the Wireless PowerDevelopment Board.

TABLE 2-4: HARDWARE CONNECTIONS

Label Component Description

U1 AD8418 Current sense amplifier.

U2 MIC3900 +3.3V LDO voltage regulator for all +3.3V devices.

U3 MCP9700 Measures temperature near the coil.

U4 NCP3420DR2G Half-bridge FET drivers.

U5 dsPIC33EP32GS202 Provides the processing power for the demonstration applications.

U6 NCP3420DR2G Half-bridge FET drivers.

U7 MCP23008 I/O expander via I2C communication to drive the LED power indicator.

Q1 DMG4800LSD Half-bridge FETs – dual FET package.

Q2 DMG4800LSD Half-bridge FETs – dual FET package.

L1 760308103102 Transmitter coil.

Label Component Hardware Element Description

J1 2-TERM CONN +12V Input Power

J3 RJ25 dsPIC33EP32GS202 Programming Connector



NOTES:


Chapter 3. Demonstration Program Operation

The ‘GS’ series dsPIC® DSC on the Wireless Power Development Board is preprogrammed with Qi v1.2.2 SW to support both low-power and medium power charging applications.

This section covers the following topics:

• Program Demonstration

• Program Top Level Description

• Wireless Transmitter Board Waveforms

3.1 PROGRAM DEMONSTRATION

FIGURE 3-1: Qi v1.2.2 STATE MACHINE

SELECTION0

PING1

ID & CONFIGURATION

2

NEGOTIATION4

CABLIBRATION5

POWER TRANSFER

3

START

OBJECT DETECTED

NO RESPONSE ORNO POWER NEEDED

ERROR CONDITION

NO NEGOTIATION REQUESTED: NEG = ZERO( 5W POWER RECEIVERS ONLY)

POWER TRANSFER COMPLETE OR ERROR CONDITION

RENEGOTIATION6

RENEGOTIATION REQUEST

NEGOTIATION COMPLETED

CALIBRATION SUCCESSFUL

NEGOTIATION SUCCESSFUL

CALIBRATION FAILURE OR ERROR CONDITION

NEGOTIATION FAILURE OR ERROR CONDITION

RENEGOTIATE DEFAULTPOWER CONTRACT P > 5WNEG = ONE

Load <= 5W

0W < Load <= 15W

PI Control Loop

Half-Bridge

Full-Bridge

RECEIVER IS FIRST PLACED ON THE BASE STATION

Load 5W

0W < Load 15W



3.2 PROGRAM TOP LEVEL DESCRIPTION

The program begins in the selection phase, and continuously pings and stays in the selection phase until a receiver is detected. Once a valid receiver is detected, it moves to the ping phase, where the digital ping is applied. Once applied, it is Amplitude Shift Keyed (ASK) by the receiver to send messages to the transmitter. The state machine then moves to the configuration phase, where receiver information is collected by the transmitter, including the receiver power rating. If it is determined that the mobile device is a low-power receiver, it continues directly to the power transfer phase. If it is determined that it is a medium power receiver, it moves on to the negotiation phase, where the precise power rating of the mobile device is determined. After doing so, it moves on to the calibration phase, where the transmitted power is calibrated. Once the transmitted power is calibrated, it moves on to the power transfer phase for power transfer. If, at any point, the receiver needs to negotiate another power rating, it moves to the renegotiation phase. Once completed, it returns to the power transfer phase. If a Fault is encountered during any time, the state machine will return to the selection phase. For further details, please consult the Qi specification.

3.3 WIRELESS TRANSMITTER BOARD WAVEFORMS

3.3.1 Qi Analog Ping

FIGURE 3-2: ANALOG PING GRAPH


Demonstration Program Operation

FIGURE 3-3: ANALOG PING MAGNITUDE GRAPH

The analog ping is used for receiver detection. It provides an analog ping at the resonant frequency of ~100 kHz (1/(2 * * sqrt(LC)) every 500 ms. Each ping has a duration of approximately 70 µs, as shown in the figure.



3.3.2 Demodulation

FIGURE 3-4: DEMODULATION GRAPH

The waveforms in the above oscilloscope plot show the different stages in the demodulation signal. The digital ping is measured at the juncture where the L and C meet (TP6) in the resonance circuit. The digital ping is then passed through the demodulation circuit to extract the demodulated signal. This signal is passed to Analog Channel 0 (AN0), where it is then processed by the software to recreate the message that was sent by the receiver. The transmitter response is dependent on the message(s) received.


Demonstration Program Operation

3.3.3 Load Step

FIGURE 3-5: LOAD STEP GRAPH

The above figure shows a typical digital ping waveform when a load step from 10% to 100% is applied. Note the increase of the digital ping amplitude. This is to compensate for the additional power requirement from the transmitter.



NOTES:


Appendix A. Board Layout and Schematics

FIGURE A-1: WIRELESS POWER DEVELOPMENT BOARD LAYOUT (TOP)

L3



FIGURE A-2: WIRELESS POWER DEVELOPMENT BOARD LAYOUT (BOTTOM)


Board Layout and Schematics

FIGURE A-3: WIRELESS POWER DEVELOPMENT BOARD SCHEMATIC (PAGE ONE)

NC

1

GN

D2

VO

UT

3

VD

D4

NC

5

U3

MC

P970

0

+3.3

V

0.1

µF50

V06

03

C6

120R

0603

1%R2

TEM

P_SE

NSE

1%10k

0603R5+3

.3V

GN

D

10 µ

F16

V08

05

C12

0.1

µF50

V06

03

C13

0.1

µF50

V06

03

C17

AV

DD

GN

D

+3.3

V

0.1

µF50

V06

03

C16

L2

GN

D

SCK

SDA

2.2k

0603

1%R

6

2.2k

0603

1%R

7

+3.3

V

+3.3

V

130

pF50

V06

03

C14

130

pF50

V06

03

C15

GN

D

GN

D

MC

LR

10k

0603

1%R36

2.21

k06

031%R

3718

00pF

50V

0603

C27

BA

R43

S

1

23

D21

VIN_

FB +3.3

v

GN

DG

ND

GN

D

GR

EEN

D10

YEL

LOW

D11

REDD12

DEMO

DCU

RREN

T_SE

NSE

VIN_

FB

PWM1

H

DN

PTP

11

TP L

OO

P R

edTP

10

PWM2

HD

NP

TP12

TEMP

_SEN

SE

470R

0603

1%

R52

GN

D

+3.3

V

PGED

2PG

EC2

MCL

R

+3.3

V

GN

D

PGED

2PG

EC2

MC

LR1

AN

0/PG

A1P

1/C

MP1

A/R

A0

2

AN

1/PG

A1P

2/PG

A2P

1/C

MP1

B/R

A1

3

AN

2/PG

A1P

3/PG

A2P

2/C

MP1

C/C

MP2

A/R

A2

4

AN

3/PG

A2P

3/C

MP1

D/C

MP2

B/R

P32/

RB

05

AN

4/C

MP2

C/C

MP3

A/IS

RC

4/R

P41/

RB

96

AN

5/C

MP2

D/C

MP3

B/IS

RC

3/R

P42/

RB

107

VSS

8O

SC1/

CLK

I/AN

6/CM

P3C

/CM

P4A

/ISRC

2/RP

33/R

B1

9

OSC

2/C

LKO

/AN

7/PG

A1N

2/CM

P3D

/CM

P4B

/RP3

4/RB

210

PGED

2/A

N18

/DA

CO

UT1

/INT0

/RP3

5/R

B3

11

PGEC

2/A

DTR

G31

/EX

TREF

1/R

P36/

RB

412

VD

D13

PGED

3/SD

A2/

RP4

0/R

B8

14

PGEC

3/SC

L2/R

P47/

RB

1515

TDO

/AN

19/P

GA

2N2/

RP3

7/R

B5

16

PGED

1/TD

I/AN

20/S

CL1

/RP3

8/R

B6

17

PGEC

1/A

N21

/SD

A1/

RP3

9/R

B7

18

VSS

19

VC

AP

20

TMS/

PWM

3H/R

P43/

RB

1121

TCK

/PW

M3L

/RP4

4/R

B12

22

PWM

2H/R

P45/

RB

1323

PWM

2L/R

P46/

RB

1424

PWM

1H/R

A4

25PW

M1L

/RA

326

AV

SS27

AV

DD

28

U5

10 µ

F16

V08

05C1

GN

D

1k 0603

1%R40

1k 0603

1%R39

1k 0603

1%R11

+3.3

V

A2

1

A1

2A

03

RES

ET4

GP6

15

GP7

16

VSS

17V

DD

18

NC

5

NC

6

INT

7

NC

8

GP0

9

GP5

14G

P413

GP3

12G

P211

GP1

10SC

L19

SDA

20

EP21

MC

P230

08

U7

GN

D

+3.3

V

0.1

µF50

V06

03C26 G

ND

GN

DG

ND

SCK

SDA

GN

DG

ND

GN

DG

ND

GN

D

GR

EEN

D13

YEL

LOW

D15

YEL

LOW

D16

YEL

LOW

D17

YEL

LOW

D18

RED

D19

RED

D20

1kR

34

1kR

331k

R32

1kR

311k

R30

1kR

29

1kR

35

Load

Indic

ator L

ED B

ank

TP L

OO

P B

lack

AGN

D

1 μF

16V

0603

C35

1%10R

0603

R10

+12V

0R 0603R8

AG

ND

AG

ND

AG

ND

AG

ND

AG

ND

AG

ND

AG

ND

DN

PTP

15

DN

P

TP16DE

MOD_

REF

1 2 3 4 5 6

HD

R-2

.54

Mal

e 1x

6

J3

1kR

62

GN

DGR

EEN

D14

dsPIC33EP32GS202-I/SO



FIGURE A-4: WIRELESS POWER DEVELOPMENT BOARD SCHEMATIC (PAGE TWO)

GN

D

4.7

µF25

V08

05

C21

0.1

µF50

V06

03

C22

+12V

1%3.3k

0603

R12

1 µF

50V

0603

C20

GN

D

PWM

1HG

ND

SL11

0PL

D2

1%10R

0603R4 1%10

R06

03

R13

GN

D

DN

PTP4

GN

D

4.7

µF25

V08

05

C23

0.1

µF50

V06

03

C19

+12V

1%3.3k

0603

R27

1 µF

50V

0603

C11

GN

D

SL11

0PL

D8

1%10R

0603

R21 1% 10R

0603

R25

DN

PTP

5

PWM

2H

BST

1

IN2

OD

3

VC

C4

DR

VL

5PG

ND

6SW

N7

DR

VH

8N

CP3

420D

R2G

U6

+3.3

v

+12V

_ IN

CS_R

IGHT

CS_L

EFT

DN

PTP

6

GN

D

+3.3

V

GN

D

0.08

2 µF

10

0 V

DC

1210

C18

0.08

2 µF

100

VD

C12

10

C24

SL11

0PL

D5

VSEN

SE_C

OIL

0.06

8 µF

50V

1206

C30

3.0K

0805

1%R46

.082

µF

50V

0603C9

910R

0603

1%R41

12k

0603

1%R28

4.3k

0603

1%R47

12k

0603

R42

+3.3

V

0.03

9 µF

50V

0603

C31

+3.3

V

0.1

µF

0603

C32

DEMO

D

Demo

dulat

or C

ircuit

DN

PTP

7

VSEN

SE_C

OIL

GN

D

1 2 3 45678

DM

G48

00LS

D

Q2

1 2 3 45678

DM

G48

00LS

D

Q1

IN+

3

IN-

4

OU

T1

V-

2V+

5IN

+

IN-

OU

TV

-

V+

+

TMIC

6270

YM

5-TR

U10

10k

0603

R48

3.3k

0603

R49

CURR

ENT_

SENS

E

0.47

µF

16V

0603

C33

0.1

µF50

V06

03DN

PC

42

+3.3

V

Curre

nt Se

nsing

Circ

uit

TP14

DN

PTP

9

CS_L

EFT

CS_R

IGHT

TP L

OO

P B

lack

GN

D

1 2

J1

TP L

OO

P O

rang

e

+12V

_IN

25V

100

µF

D8

C29

GN

D

220

µF25

VD

8

C25

GN

D

0.1

µF50

V06

03

C3

1% 10R

0805R3

1% 10R

0805R9

1 µF 0603

C36

10 µ

F16

V08

05

C5

0.1

µF50

V06

03

C4

TP L

OO

P R

edTP

2

GR

EEN

D1

MIC

3910

0

VIN

1

GN

D2

VO

UT

3U

2+3

.3V

+12V

1k 0603

1%R1

1 µF

50V

0603

C7

iD

ista

nce

iD

ista

nce

GN

D

GN

D

GN

DG

ND

GN

D

0.08

2 µF

10

0 V

DC

1210

C10

Wur

th E

lekt

roni

k

10 μ

HC

oil

7603

0810

3102

L1

+3.3V

LDO

Volta

ge S

ource

AG

ND

AG

NDA

GN

DA

GN

DA

GN

D

AG

ND

AG

ND

AG

ND

1

23

BA

R43

S

D4

10k

0603

R22

DEMO

D

DEMO

D_RE

F

110R

0805

R24

0R 0603

DN

PR

180.

1 µF

0603

C8 510

pF

0603

C34

AG

ND

AG

ND

VR

EF2

3G

ND

2V+

6

VR

EF1

7

+IN

8

-IN

1

OU

T5

U1 A

D84

18

GN

D1

EN2

IN3

OU

T4

MIC

5203

/5V

U8

AG

ND

AG

ND

+12V

AG

ND

AG

ND

BST

1

IN2

OD

3

VC

C4

DR

VL

5PG

ND

6SW

N7

DR

VH

8

NC

P342

0

U4

NC

P342

0 SO

IC-8

0.05

R25

121%R15

100R

0603

1%R43

100R

0603

R20

0R 0603

R60

10 µ

F25

V08

05

C43

10 µ

F25

V08

05

DN

P GN

D

0R 0603

R64

0R 0603

R66

AG

ND

10 µ

F25

V08

05

DN

P

GN

D

10k

0603 1%R68

GN

D

10k

0603 1%R69

GN

D

10 µ

F25

V08

05

C46

GN

D

10 µ

F25

V08

05

C47

GN

D

10k

0603

1%R70

GN

D

10k

0603

1%R71

GN

D

0603

C49 2.7

nF

.082

µF

50V

0603

C48

0.1

µFC

50

AG

ND

DN

P

DN

P

DN

P

DN

P

DN

P

DN

P

DN

P

DN

P

DN

P

DN

P

10k

0805

R67

DN

PD

NP

DN

P

0R 0603

R63

AG

ND

DN

P

+12V

+12V

1 µF

0603

C51

GN

D

1 µF

0603

C52

GN

D

1206L3

DN

P

DN

P

100R

0603

1%R73

DN

PTP

8

620

pF06

03

C2

BA

R43

S

1

23

D3

+3.3

V

AG

ND

AG

ND

0.47

µH

C45

C44

Not

Use

d


Board Layout and Schematics

NOTES:



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