www.mosis.com 1/20 high-quality, low-cost ic fabrication with mosis
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High-Quality, Low-Cost IC Fabrication with MOSIS
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What is MOSIS ?An organization dedicated to offering:
• High-quality access to the latest production-proven semiconductor technologies.
• Low-cost engineering samples of IC designs.
• Small-volume production services.• Single-point of interface for additional
services or products offered by partners.• Support for questions on design rules,
SPICE models and design kits.
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What does MOSIS do?
Dedicated (DED) Runs.• 1/3 of the 100+
runs per year are Dedicated Runs.
Taxi-Runs (for IBM only).• Mid-way between
a DED and a MPW run.
Multi-Project Wafer (MPW) Runs.
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How does MOSIS do MPWs?
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Who Uses the MOSIS Service?
Companies with pilot-projects that require engineering samples for proof-of-concept.
Organizations with small-volume production.• Industrial firms.• Governmental agencies.• Academic institutions.
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MOSIS – ChronologyPhase I : 1981-1985
• DARPA direct funded era: 100% DARPA.
Phase II : 1985-1994• Multi-agency direct funding• DARPA : ~80% + DoD, NSF : ~15% (1985).DoD, NSF : ~15% (1985).• Commercial customers: ~5% (1985). Commercial customers: ~5% (1985).
Phase III : 1994-present• Self-sustaining operations.• Commercial customers provide 100% of
income.
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Why Customers Come to MOSIS?Quality and low cost + fast turn-around time.Access to leading technologies.
• Multiple processes - multiproject, dedicated runs.
Die size, quantity flexibility.• Examples: 2 x 2, 3 x 6, 7 x 6 mm;
40, 500, 2000 parts (die and/or packaged).
Design rules, spice parameters. Technology files, design kits.
• Includes standard cells, pads, others.
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MOSIS Capabilities (1/2)Organizes Multiproject, Dedicated, and
Taxi runs.• Gathers designs, handles purchase orders, etc.
Supports users.• Performs design-kit distribution.• Handles questions.
−Design rules, modeling, etc.
• Mpw runs include functional reference designs.• Works closely with design service providers.
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MOSIS Capabilities (2/2)
Orders masks, wafers.• Fully-checked, -merged reticle compatible
with production fabrication process.
Performs packaging/test.• Plastic, ceramic, flip-chip, etc.• Functional testing available.
Allows for die size, quantity flexibility.• Die cut into desired size, provides larger
quantities (e.g. 500, 2000) within runs (for MPW, Dedicated and Taxi).
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AMIS ProcessesFeature
SizeMetal Layers
Voltage (V)
Description
0.35 m 4 3.3 NPN, PNP capacitor (I3T80)
0.50 m 3 5.0 2-poly, resistor (C5F/N)
0.70 m 3 100 1-poly, resistor (I2T100)
1.50 m 2 5.0 2-poly, NPN (ABN)
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AMS Processes
Feature Size
Metal Layer
s
Voltage (V)
Description
0.35 m 4 3.3/5.0
CMOS (C35B4C3)
CMOS-Opto (C35B401)
CMOS (C35B4M3)
HV CMOS (H35B4D3)
4 2.5 SiGe (S35D4)
4 50 HV CMOS HiRes (H35B4D3)
0.80 m 2 50 HV CMOS (CXZ)
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IBM CMOS Processes
Feature Size
Metal Layers
Voltage (V)
Description
90 nm 7, 8 1.0
9SF (logic)
9LP (LP logic)
9RF (mixed-mode)
0.13 m 8 1.2/2.5 8RF-LM (logic)
8RF-DM (mixed-mode)
0.18 m 6 1.8/3.3 7SF (logic)
7RF (mixed-mode)
0.25 m 5 2.5/3.3 6RF (mixed-mode)
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IBM SiGe ProcessesFeature
SizeMetal Layers
Voltage (V)
Description
0.13 m 7 1.2/2.5 8HP
0.18 m 7 1.8/3.3 7WL
5 1.8,2.5/3.3 7HP
0.25 m 6, 7 2.5 6HP, 6DM
0.35 m 4 3.3/5.0 5HPE
0.50 m 3, 4, 5 3.3
5DM
5AM
5PA
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TSMC ProcessesFeature
SizeMetal Layers
Voltage (V)
Description
0.13 m 8 1.2/2.5 CL013G (Logic)
CR013G (Mixed-Mode)
0.18 m 6 1.8/3.3 CL018 (Logic)
CM018 (Mixed-Mode)
0.25 m 5 2.5/3.3 CL025 (Logic)
CM035 (Mixed-Mode)
0.35 m 4 3.3/5.0 CL035 (Logic)
CM035 (Mixed-Mode)
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MOSIS Education ProgramMEP-Instructional
• Enrollment forms to MOSIS at the beginning of each semester or quarter.
• Processes available:• AMIS ABN, and• AMIS C5F/N.
MEP-Research• Requires a proposal by the
PI + Dean’s letter.• Processes available:
• AMIS ABN and AMIS C5F/N.
• IBM BiCMOS SiGe (7WL) and CMOS (8RF-LM/8RF-DM, 7RF) processes
• TSMC 0.35 and 0.25 m CMOS processes.
Reporting requirements (INS vs RES)
Academic NDA every year.
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MOSIS Web Site
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MOSIS Web Forms
For Project Submission,
Tracking, etc.
Secure or Non-secure
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SummaryHigh-quality, low-cost, fast prototyping.Regularly scheduled prototype runs +
dedicated runs based on customer’s schedule needs.
Low volume production.Access to latest production technologies.Access to important 3rd-party resources for
design tools and packaging.Reference designs on MPW runs.Acting as the interface, MOSIS greatly
increases chances for first-pass success.
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Contact Information César Pina — Director.
— [email protected], tel. +1 310 448-9400 Wes Hansford — Deputy-Director.
— [email protected], tel. +1 310 448-9199 Customer Support Line.
— [email protected], tel. +1 310 448-9400 Hudson J. Mota de Alcântara — Customer Support
— [email protected], tel +1 310 448-8351. MOSIS Fax: (310) 823-5624