xm1001-bd - macom · xm1001-bd 1 m/a-com technology solutions inc. (macom) and its affiliates...

Image Reject Mixer 12.0-40.0 GHz

Rev. V1

XM1001-BD

1 1

M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information.

For further information and support please visit: https://www.macom.com/support

1

Features

Fundamental Image Reject Mixer

8.0 dB Conversion Loss

20.0 dB Image Rejection

+25.0 dBm Input Third Order Intercept (IIP3)

100% On-Wafer RF Testing

100% Visual Inspection to MIL-STD-883 Method 2010

RoHS* Compliant and 260°C Reflow Compatible

Description

M/A-COM Tech’s 12.0-40.0 GHz GaAs MMIC fundamental image reject mixer can be used as an up- or down-converter. The device has a conversion loss of 8.0 dB with a 20.0 dB image rejection across the band. I and Q mixer outputs are provided and an external 90 degree hybrid is required to select the desired sideband. This MMIC uses M/A-COM Tech’s GaAs PHEMT device model technology, and is based upon electron beam lithography to ensure high repeatability and uniformity. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT applications.

Ordering Information

Part Number Package

XM1001-BD-000V “V” - vacuum release

gel paks

XM1001-BD-EV1 evaluation module

Absolute Maximum Ratings

Parameter Absolute Max.

Gate Bias Voltage (Vg) +0.3 VDC

Input Power (RF Pin) +20.0 dBm

Input Power (IF Pin) +20.0 dBm

Storage Temperature (Tstg) -65 °C to +165 °C

Operating Temperature (Ta) -55 °C to +125 °C

Chip Device Layout

http://www.macom.com/

http://www.macom.com/support


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XM1001-BD

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Electrical Specifications: 12-40 GHz (Upper Side Band) (Ambient Temperature T = 25°C)

Parameter Units Min. Typ. Max.

Frequency Range (RF) Lower Side Band GHz 12.0 - 38.0

Frequency Range (LO) GHz 8.0 - 42.0

Frequency Range (IF) GHz DC - 4.0

RF Return Loss (S11) dB - 10.0 -

IF Return Loss (S22) dB - TBD -

LO Return Loss (S33) dB - TBD -

Conversion Loss (S21) dB - 8.0 -

LO Input Drive (PLO) dBm - +12.0 -

Image Rejection dBc - 20.0 -

Isolation LO/RF dB - 16.0 -

Isolation LO/IF dB - TBD -

Isolation RF/IF dB - TBD -

Input Third Order Intercept (IIP3) dBm - +25.0 -

Gate Bias Voltage (Vg1) VDC -2.0 -0.5 +0.1




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XM1001-BD

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Typical Performance Curves

-14

-13

-12

-11

-10

-9

-8

-7

-6

-5

-4

-3

-2

-1

0

10.0 12.0 14.0 16.0 18.0 20.0 22.0 24.0 26.0 28.0 30.0 32.0 34.0 36.0 38.0 40.0

Max Median Mean -3sigma

-14

-13

-12

-11

-10

-9

-8

-7

-6

-5

-4

-3

-2

-1

0

10.0 12.0 14.0 16.0 18.0 20.0 22.0 24.0 26.0 28.0 30.0 32.0 34.0 36.0 38.0 40.0

ConversionLoss(dB)


-50

-45

-40

-35

-30

-25

-20

-15

-10

-5

0

10.0 12.0 14.0 16.0 18.0 20.0 22.0 24.0 26.0 28.0 30.0 32.0 34.0 36.0 38.0 40.0


-60

-55

-50

-45

-40

-35

-30

-25

-20

-15

-10

-5

0

10.0 12.0 14.0 16.0 18.0 20.0 22.0 24.0 26.0 28.0 30.0 32.0 34.0 36.0 38.0 40.0

ImageRejection(dBc)





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Typical Performance Curves (cont.)

01

23

45

67

89

1011

1213

1415

12.0 14.0 16.0 18.0 20.0 22.0 24.0 26.0 28.0 30.0 32.0 34.0 36.0


0

12

34

56

78

910

1112

1314

15

8.0 10.0 12.0 14.0 16.0 18.0 20.0 22.0 24.0 26.0 28.0 30.0 32.0


-55

-50

-45

-40

-35

-30

-25

-20

-15

-10

-5

0

8.0 10.0 12.0 14.0 16.0 18.0 20.0 22.0 24.0 26.0 28.0 30.0 32.0 34.0 36.0 38.0 40.0 42.0





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5


-50

-47.5

-45

-42.5

-40

-37.5

-35

-32.5

-30

-27.5

-25

-22.5

-20

-17.5

-15

-12.5

-10

-7.5

-5

-2.5

0

10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46

RF freq (GHz)

8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44

LO freq (GHz)

-50

-47.5

-45

-42.5

-40

-37.5

-35

-32.5

-30

-27.5

-25

-22.5

-20

-17.5

-15

-12.5

-10

-7.5

-5

-2.5

0

8 12 16 20 24 28 32 36 40

10 14 18 22 26 30 34 38 42

-20

-18

-16

-14

-12

-10

-8

10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46

-40

-35

-30

-25

-20

-15

-10

-5

0

8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44

LO freq (GHz)

Conv Loss, =R11C5, PLO (dBm)=6




Im. Rej., =R11C5, PLO (dBm)=6




-20

-18

-16

-14

-12

-10

-8

8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42

-50

-45

-40

-35

-30

-25

-20

-15

-10

-5

0

10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44

Conv Loss, PLO (dBm)=6, =R11C5




Im. Rej., PLO (dBm)=6, =R11C5




-80

-70

-60

-50

-40

-30

-20

-10

0

20 21 22 23 24 25 26 27

Conv Loss Vg=-2.1

Conv Loss Vg=-1.9

Conv Loss Vg=-1.7

Conv Loss Vg=-1.5

Conv Loss Vg=-1.3

Conv Loss Vg=-1.1

Conv Loss Vg=-0.9

Conv Loss Vg=-0.7

Conv Loss Vg=-0.5

Conv Loss Vg=-0.3

Conv Loss Vg=-0.1

Conv Loss Vg=0.1

Image Rejection Vg=-2.1











Image Rejection Vg=0.1

-44

-42

-40

-38

-36

-34

-32

-30

-28

-26

-24

-22

-20

-18

-16

-14

-12

-10

-8

-6

-4

-2

0

16 17 18 19 20 21 22 23

Conv Loss Vg=-2.1

Conv Loss Vg=-1.9

Conv Loss Vg=-1.7

Conv Loss Vg=-1.5

Conv Loss Vg=-1.3

Conv Loss Vg=-1.1

Conv Loss Vg=-0.9

Conv Loss Vg=-0.7

Conv Loss Vg=-0.5

Conv Loss Vg=-0.3

Conv Loss Vg=-0.1

Conv Loss Vg=0.1












Image Rejection Vg=0.1




Rev. V1

XM1001-BD

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-10

-5

0

5

10

15

20

25

12 17 22 27 32 37

10 15 20 25 30 35

-10

-5

0

5

10

15

20

25

12 16 20 24 28 32 36

14 18 22 26 30 34 38

-10

-5

0

5

10

15

20

25

12 17 22 27 32 37

10 15 20 25 30 35

-10

-5

0

5

10

15

20

25

12 16 20 24 28 32 36

14 18 22 26 30 34 38

-10

-5

0

5

10

15

20

25

12 17 22 27 32 37

10 15 20 25 30 35

-10

-5

0

5

10

15

20

25

12 16 20 24 28 32 36

14 18 22 26 30 34 38




Rev. V1

XM1001-BD

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7


-10

-5

0

5

10

15

20

25

12 17 22 27 32 37

10 15 20 25 30 35

-10

-5

0

5

10

15

20

25

12 16 20 24 28 32 36

14 18 22 26 30 34 38

-70.00

-60.00

-50.00

-40.00

-30.00

-20.00

-10.00

0.00

14.00 15.00 16.00 17.00 18.00 19.00 20.00 21.00 22.00 23.00 24.00 25.00 26.00

12.00 14.00 16.00 18.00 20.00 22.00 24.00

-60.00

-50.00

-40.00

-30.00

-20.00

-10.00

0.00

14.00 15.00 16.00 17.00 18.00 19.00 20.00 21.00 22.00 23.00 24.00 25.00 26.00

16.00 17.00 18.00 19.00 20.00 21.00 22.00 23.00 24.00 25.00 26.00 27.00 28.00

0.00

5.00

10.00

15.00

20.00

25.00

30.00

14.00 15.00 16.00 17.00 18.00 19.00 20.00 21.00 22.00 23.00 24.00 25.00 26.00

0.00

5.00

10.00

15.00

20.00

25.00

30.00

12.00 13.00 14.00 15.00 16.00 17.00 18.00 19.00 20.00 21.00 22.00 23.00 24.00

0.00

5.00

10.00

15.00

20.00

25.00

30.00

14.00 15.00 16.00 17.00 18.00 19.00 20.00 21.00 22.00 23.00 24.00 25.00 26.00

0.00

5.00

10.00

15.00

20.00

25.00

30.00

16.00 18.00 20.00 22.00 24.00 26.00 28.00




Rev. V1

XM1001-BD

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Mechanical Drawing

Bias Arrangement

Bypass Capacitors - See App Note [2]

(Note:Engineering designator is20IRRFM0374)

Units:millimeters(inches)Bond pad dimensionsare shown to center of bond pad.Thickness:0.110 +/- 0.010 (0.0043+/- 0.0004),Backside isground,Bond Pad/BacksideMetallization:Gold

All Bond Padsare0.100 x 0.100 (0.004 x 0.004).Bond pad centersareapproximately 0.109 (0.004) from theedgeof the chip.Dicing tolerance:+/- 0.005 (+/- 0.0002).Approximateweight:1.592mg.

Bond Pad #1 (RF)Bond Pad #2 (IF1)

Bond Pad #3 (Vg)Bond Pad #4 (LO)

Bond Pad #5 (IF2)

0.831

(0.033)

2

3

4

5

1

1.945

(0.077)

0.364

(0.014)

0.0

0.0 0.831

(0.033)

1.320

(0.052)

1.567

(0.062)

0.968

(0.038)

2

3

4

5

1

Vg

IF1

RF

IF2




Rev. V1

XM1001-BD

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App Note [1] Biasing - As shown in the bonding diagram, the pHEMT mixer devices are operated using a separate gate voltage Vg1. Set Vg1=-0.5V for optimum conversion loss performance. App Note [2] Bias Arrangement - Each DC pad (Vg1) needs to have DC bypass capacitance (~100-200 pF) as close to the device as possible. Additional DC bypass capacitance (~0.01 uF) is also recommended. App Note [3] USB/LSB Selection -

USBLSB

IF1IF2

For Upper Side Band Operation (USB): With IF1 and IF2 connected to the direct port (0º) and cou-pled port (90º) respectively as shown in the dia-gram, the USB signal will reside on the isolated port. The input port must be loaded with 50 ohms. For Lower Side Band Operation (LSB): With IF1 and IF2 connected to the direct port (0º) and cou-pled port (90º) respectively as shown in the dia-gram, the LSB signal will reside on the input port. The isolated port must be loaded with 50 ohms. Note: The coupled port can be used as an alterna-tive input but the port location of the Coupled and Direct ports reverse.

An alternate method of Selection of USB or LSB:

-90o

In Phase Combiner

USB

In Phase Combiner

LSB

-90o

IF2 IF1 IF2 IF1




Rev. V1

XM1001-BD

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Handling Procedures

Please observe the following precautions to avoid damage:

Static Sensitivity

Gallium Arsenide Integrated Circuits are sensitive to electrostatic discharge (ESD) and can be damaged by static electricity. Proper ESD control techniques should be used when handling these class 2 devices.




Rev. V1

XM1001-BD

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M/A-COM Technology Solutions Inc. All rights reserved. Information in this document is provided in connection with M/A-COM Technology Solutions Inc ("MACOM")products. These materials are provided by MACOM as a service to its customers and may be used for informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM assumes no responsibility for errors or omissions in these materials. MACOM may make changes to specifications and product descriptions at any time, without notice. MACOM makes no commitment to update the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to its specifications and product descriptions. No license, express or implied, by estoppels or otherwise, to any intellectual property rights is granted by this document. THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, RELATING TO SALE AND/OR USE OF MACOM PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. MACOM FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. MACOM SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS, WHICH MAY RESULT FROM THE USE OF THESE MATERIALS. MACOM products are not intended for use in medical, lifesaving or life sustaining applications. MACOM customers using or selling MACOM products for use in such applications do so at their own risk and agree to fully indemnify MACOM for any damages resulting from such improper use or sale.



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