xtw01t4v011311 i dataplex
DESCRIPTION
technical certificate - part 2TRANSCRIPT
© 2006 IBM Corporation
This presentation is intended for the education of IBM and Business Partner sales personnel. It should not be distributed to customers.IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM
Corporation
IBM System x iDataPlex™:Internet Scale Computing
XTW01Topic 4
IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
Topic 4 - Course Overview
The objectives of this course of study are:
> List three emerging technologies for an iDataPlex solution
> List three business goals that iDataPlex addressed
> Identify elements of the iDataPlex rack design
> Match the server offering to its characteristics
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
Topic 4 - Course Agenda
> *Introducing IBM iDataPlex*
> Rack Unit
> iDataPlex Nodes Overview
> iDataPlex Management
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
An IBM Portfolio that Covers the Spectrum of Business Needs
BladeCenter
Enterprise eX5
iDataPlex
Enterprise Racks & Towers
Scale, Power, Density,
Optimization
Consolidation, Virtualization
Infrastructure Simplification,
Application Serving
Scale Out
Sca
le U
p
*This slide contains animations that will launch with slide.4
IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
Introducing IBM System x iDataPlex
> High volume, low cost computing for HPC and Cloud
> Innovative, flexible design for Internet-scale computing
> Up to 5X compute density for efficient space utilization
> Front-accessible and intelligent components simplify deployment, serviceability and manageability for Internet-scale computing
> Reduce cooling costs dramatically; minimize or even eliminate data center air conditioning expense
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
Tough Challenges Require Real Innovation
Decrease Server Power Consumptionby 50%
EliminateData Center Air Conditioning
Increase Compute Density by 10x
“More than 70% of the world’s global 1000 organizations will have to modify their data center facilities significantly during the next five years.”
-- Gartner, September 2007
Appropriate density for a given power envelopeScale data center computing with no new
construction
Attack largest operational expense itemsCap carbon footprint for data centers
Rising energy costs & rising energy demandPower & thermal issues inhibit operations
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
Fast, Cool, Dense, Flexible. TCO without compromise!
Why iDataPlex?
iDataPlex is:> Optimized both mechanically as a half-depth server
solution and component-wise for maximum power and cooling efficiency
> Designed to maximize utilization of Data Center floor space, power and cooling infrastructure with Industry-standards based server platform.
> Easy-to-maintain solution with individually serviceable servers, front access hard drives/cabling,
> Configurable for customer-specific compute, storage, or I/O needs and delivered pre-configured for rapid deployment
> Common tools across the System x portfolio for management at the node, rack or Data Center level
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
Topic 4 - Course Agenda
> Introducing IBM iDataPlex
> *The Rack Unit*
> iDataPlex Nodes Overview
> iDataPlex Management
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
Increases Density for Space Savings
Optional Rear Door Heat eXchanger
iDataPlexTypical Enterprise RackFull-fan air depth
Half-fan air depth
42U Enterprise Rack1
42U Enterprise Rack2
> Optimized rack design more than doubles server density per rack> Air flow efficiency equals power savings of up to 20% and 30-40% lower airflow impedance > IBM Rear Door Heat eXchanger provides the ultimate in cooling savings
Top-down view
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
iDataPlex Rack -vs.- Standard 19” Rack
Top View Top View
Standard 19” Rack iDataPlex Rack
600
mm
(8
40
mm
w/R
DH
x)
1200mm
446
x 40
0mm
446
x 40
0mm
RDHX
iDataPlex Rack design: Rack is rotated 90
– Half-depth, front-access servers. Low airflow impedance. Servers located side-by-side. Doubles server density in similar
footprint.– Greater cross-section for RDHX.
102U Rack– 84U for Nodes, etc.– 16U for switches, etc.(vertical) – 2U Rack Management Appliance
(horizontal) slots
Space-saving footprint– 1200mm wide x 600mm deep.
444
x 75
0mm
640mm
105
0mm
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
iDataPlex – Designed for Data Center Flexibility
PDUs
(rear)
3U Chassis
2U Chassis
iDataPlex Rear Door Heat ExchangerServer Tray
Storage Drives & Network Options
Dual IOTray
Storage Tray
Broad portfolio of customizable components that adjust to your computing needs
Switches
(front)
*This slide contains animations that will launch with slide.11
IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
Rear Door Heat eXchanger
Swings to provide access to rear PDUs Lock handle to
close/ open door
Industry Standard hose fittings
No Leaks Sealed Internal coils
Perforated Door for clear airflow
IBM patent pending hex airflow design
Liquid cooling at the rack is 75%-95% more efficient than air cooling by a CRAC
Can eliminate rack heat exhaust
No electrical or moving parts
No condensation
Chilled water or evaporative liquid
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
A New Way to Cool the Data Center
Provides Up to 100% Heat Extraction, and can even cool the room!
IR Thermal Camera View of RDHx with: top photo: water flow off
bottom photo: water flow on
iDataPlex rack can run at room
temperature (no air conditioning
required) when used with the
optional Rear Door Heat
eXchanger.
These photos were taken in the
Thermal Lab at IBM, showing the
iDataPlex rack without (top
image) and with (bottom image)
the Rear Door Heat eXchanger
closed and operational.
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
Easily Serviceable Integrated x86 Packaged Design
> All-front access eliminates accessing rear of rack
> Swappable server trays in chassis
> Chassis docks directly into power
> Chassis guides keep upper servers in place
> Rack-side pockets for cables provide highly efficient cable routing
Shared dual domain power supply with hot dock ports so planars dock into power connector
Tool-less server and chassis
changes done easily with
innovative server latch locks
High Efficiency shared 80mm fans provide superior cooling at a low wattage draw and low noise levels
Flex Node Technology
Innovative design so planar trays are independent & swappable for multiple configurations
Asset Tags - Confirm Asset I/Ds
Chassis Guides & Rail kits - Individual
Chassis Rails for reliable fit & safe
servicing2U Flex Chassis
Designed for Data Center Serviceability
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
iDataPlex Rack Design
23.6”
47.2””
AIR FLOW
AIR FLOW
19” 19”
Top View
Energy efficiency> Optimizes airflow for cooling efficiency with half-depth rack > Reduces pressure drop to improve chilled air efficiency
Leadership density> Dual column / Half-depth rack > Standard two-floor tile rack footprint> Up to 168 physical nodes in 8 square feet
Flexibility> Matches US & European data center floor tile standards> Compatible with standard forced air environments
Ease of use> All service and cabling from the front
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
Topic 4 - Course Agenda
> Introducing IBM iDataPlex
> Rack Unit
> *iDataPlex Nodes Overview*
> iDataPlex Management
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
Current iDataPlex Server Offerings
Processor: Quad Core Intel Xeon 5500Quick Path Interconnect up to 6.4 GT/sMemory:16 DIMM DDR3 - 128 GB maxMemory Speed: up to 1333 MHzPCIe: x16 electrical/ x16 mechanicalChipset: Tylersburg-36D
iDataPlex dx360 M2High-performance Dual-Socket
Storage: 12 3.5” HDD up to 24 TB per node / 672TB per rackProc: 6 or 4 Core Intel Xeon 5600Memory: 16 DIMM / 128 GB maxChipset: Westmere
iDataPlex 3U Storage RichFile Intense Dual-Socket
Processor: 6 & 4 Core Intel Xeon 5600Quick Path Interconnect up to 6.4 GT/sMemory:16 DIMM DDR3 - 128 GB maxMemory Speed: up to 1333 MHzPCIe: x16 electrical/ x16 mechanicalChipset: Westmere 12 MB cache
iDataPlex dx360 M3High-performance Dual-Socket
Processor: 6 & 4 Core Intel Xeon 56002 NVIDIA M1060, M2050,
M2070, M2070QQuick Path Interconnect up to 6.4 GT/sMemory:16 DIMM DDR3 - 192 GB maxMemory Speed: up to 1333 MHzPCIe: x16 electrical/ x16 mechanicalChipset: Westmere 12 MB cache
iDataPlex dx360 M3 RefreshExa-scale Hybrid CPU + GPU
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Key Features Benefits
42 GPU servers in a standard rack footprint
• 10X Increased compute performance saving 65% less acquisition costs for 4X the density
• 3.7X increase in Flops/Watt offers an power and cooling efficiency of 72% lower power consumption
Support for up to two NVIDIA GPUs
• Expanded I/O capabilities fits 49 Teraflops of performance in a rack with 61% more density than outboard solutions
• Flexibility to configure I/O intense configurations with networking and storage along with compute CPU intense service without compromising density
Storage Performance Options
• Higher capacity/higher performance SAS controller
Memory capacity up to 192 GB per server
• Expanded memory options with 16GB DDR-3 1333MHz memory
Fast, Cool, Dense, Flexible. TCO without compromise!Accelerate performance without compromising density through maximum flexibility.
Target Workloads:Workloads: Risk Analytics, Seismic/Petro Exploration, Medical Imaging, Digital Content Creation, Online GamingIndustries: FSS (Financial, Insurance), Public (Life Science, Education, Government) Industrial (Petro, Auto, Comm (M&E, DCC)Customers: looking for value hardware to perform massive parallel computing in data center with space, power & cooling constraints
How to Beat HP/Dell:
1. Better flexibility and density in power and cooling constrained data centers
2. Energy Efficiency – maximizes power & cooling efficiency for GPU servers
3. Ultimate space and OPEX savings with the Rear Door Heat Exchanger
How to Beat HP/Dell:
1. Better flexibility and density in power and cooling constrained data centers
2. Energy Efficiency – maximizes power & cooling efficiency for GPU servers
3. Ultimate space and OPEX savings with the Rear Door Heat Exchanger
iDataPlex dx360 M3
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
4- 2.5” SS SAS 6Gbps(or SATA, or 3.5”, or SSD…)
InfiniBand DDR(or QDR, or 10GbE…)
NVIDIA Tesla M2050 #1(or NVIDIA Tesla M1060,or FX3800, or Fusion IO, or)
NVIDIA Tesla M2050 #2(or NVIDIA Quadro FX3800, or Fusion IO, or…)
Server level value
>Each server is individually serviceable
>Each GPU is individually replaceable
>6Gbps SAS drives and controller for maximum performance
>Service and support for server and GPU from IBM
dx360 M3 Server GPU I/O Tray - Front View
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
Why GPU’s
> Applications run faster because it is using the high-performance of parallel cores on the GPU
> Many codes and algorithms in HPC and other applications are parallel floating point math problems
> GPU’s do general purpose scientific and engineering computing
> GPGPU = General Purpose Graphics Processing Unit
Visualization – Method of representing large amounts of complex
data in ways that are easier to understand, analyze and support decision making.
Acceleration– Augment or supplement the server CPU’s to
achieve greater overall performance and/or efficiency by leveraging massive parallelism and the superior floating point capability and on card memory
x86 Intel CPU + GPU work together in heterogeneous computing model
–The sequential part of the application runs on the CPU
–The computationally-intensive part runs on the GPU
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
Do More with Maximum Performance Density
49 Teraflops of Sustained performance
4X increased performance per rack
10X increased performance per node
65% Less acquisition costs
3.7X increase in Flops/Watt
dx360 M3
Xeon X56702.93GHz / 6C / 95W
1008Cores
672Cores
Xeon X5570
2.93GHz / 4C / 95W
dx360 M238,136
Cores
Xeon X56702.93GHz / 6C / 95W
Fermi M2050448C / 225W
dx360 M3 Refresh
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16x PCI-E Riser card slot
Virtual Media Key
Mini PCI-E SAS Card Slot
JP1Clear CMOS
Hard drive carrier
16 max.(8x per) DDR3 DIMMs(2GB, 4GB, & 8GB) 1.5V and 1.35V
DIMM Bank 1
DIMM Bank 2
CPU 1-Supports DIMM Bank 0(Intel Westmere EP / Nehalem EP)
CPU 0-Supports DIMM Bank 1(Intel Westmere EP)
SATA ports 6x
JP2 Boot Block Enable
Battery
8X RAID Rise Card slot
Ethernet Ports & Management
dx360 M3 1U Flex Node (MT 6391) Interior View
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
System x iDataPlex dx360 M3Tailored for Your Business Needs
iDataPlex flexibility with better performance, efficiency and more options!
1U Drive Tray
1U Compute Node
3U Storage ChassisMaximize Storage Density
3U, 1 Node Slot & Triple Drive TrayHDD: 12 (3.5” Drives) up to 24TB
I/O: PCIe for networking + PCIe for RAID
Compute + StorageBalanced Storage and Processing
2U, 1 Node Slot & Drive TrayHDD: up to 5 (3.5”)
Compute IntensiveMaximum Processing2U, 2 Compute Nodes
750W N+N Redundant
Power Supply
900W Power Supply
1U GPU I/O Tray
550W Power Supply
Acceleration Compute + I/OMaximum Component Flexibility
2U, 1 Node SlotI/O: up to 2 PCIe, HDD up to 8 (2.5”)
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
dx360 M3 Front View
Two Ethernet ports
Power-connector button
Power-on LED
Hard disk drive activity LED
Locator LED
System-error LED
Serial Video USB ports
System-management Ethernet
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Intel® 5520 Chipset
PCI Express* 2.0
ICH 9/10 Intel® 82599 10GbE Controller
Intel® Data Center Manager
Intel® Node Manager Technology
New Processor,Proven Platform
Intel® Xeon® 5600Intel® Xeon® 5600
Intel® Xeon® 5600Intel® Xeon® 5600
> Intel® Xeon® 5600 Processor Series
32nm Technology with 2nd Generation High-k Process
> Intel 5520 (Tylersburg) Chipset
IOH (Northbridge) + ICH10 (Southbridge)
Up to 6.4 GT/sec speeds
Dual x16 Gen2 or Quad x8 PCI Express 2.0graphics card support
> Integrated DDR3 three-channel memory controller
2nd CPU required to use all 16 DIMMs
> Two Intel QuickPath interconnect (Intel QPI) links per components
High Speed Serial link between CPUs/chipset
Up to 25.6 GB/sec bandwidth per link
> Single die four or six core
> Three cache levels:
32 KB data / 32 KB instruction L1 cache per core
256 KB L2 memory cache per core
Shared 8MB L3 cache (12MB max.)
dx360 M3 Processor Subsystem
QPI
Up to 25.6 GB/secbandwidth per link
Up to 16 slotsDDR3 Memory
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
dx360 M3 Refresh - Westmere-EP SKU
Server / Workstation2S
X56702.93 GHz 6C
X56602.80 GHz 6C
X56502.66 GHz 6C
E56402.66 GHz 4C
E56302.53 GHz 4C
E56202.40 GHz 4C
L56402.26 GHz 6C
L5630 2.13 GHz 4C
95W95W
95W95W
95W95W
80W80W
80W80W
80W80W
60W60W
40W40W
Sta
nd
ard
Ad
van
ced
Bas
ic
E5507
2.26 GHz 4C
E55062.13 GHz 4C
E55032.00 GHz 2C
80W80W
80W80W
80W80W
•5.86 GT/s QPI
•12MB L3 Cache
•Turbo/HT enabled
•DDR3-1066
•Turbo 4C: NA/NA/1/1/2/2
•Nehalem-EP remains for Value SKUs.
• 4.8 GT/s QPI
•4MB L3 Cache on 4C
•DDR3-800
Freq Optimized
X56673.06 GHz 4C 95W95W
X56773.46 GHz 4C
X56803.33 GHz 6C
130W130W 130W130W
LV• up to 5.86 GT/s QPI and 12MB cache
•60W Turbo 2/2/3/3/4/4
•40W Turbo NA/NA/1/1/2/2
•Turbo/HT disabled on 1.6 GHz
•6.4 GT/s QPI
•12MB L3 Cache
•Turbo/HT enabled
•DDR3 -1333
•130W Turbo
6C: 1/1/2/2/3/3 4C: NA/NA/1/1/2/2
•95W Turbo
6C: 2/2/3/3/4/4
4C: NA/NA/2/2/3/3
L5609 1.86 GHz 4C <=40W<=40W
Support for 130 W not cost efficient for iDataPlex dx360 M3
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
Intel®
Xeon® 5600Intel®
Xeon® 5600Intel®
Xeon® 5600Intel®
Xeon® 5600
95W
80W
60W
40W
Better performance/WattLower power consumption
Lower Power CPUs
Up to 10% reduction in memory power†
Intelligent PowerTechnology
Integrated Power Gates and Automated Low Power States with Six Cores
Lower PowerDDR3 Memory
Nehalem Micro-architecture + 32nm CPU + Enhanced Power Mgt= Greater Energy EfficiencyNehalem Micro-architecture + 32nm CPU + Enhanced Power Mgt= Greater Energy Efficiency
CPU Power Management
Optimized power consumption through more efficient Turbo Boost and memory power management
Building on Xeon® 5500 Leadership Capabilities
CTO
Westmere-EP Energy Efficiency
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
dx360 M3 Planar Building Block Diagram
Tylersburg36D
SAS LSI 1064 Opt.
RAID Mini-SlotPCI-E x4 Gen1
CSI
16 x DDR3 800/1066/1333MHz
VRD11.1VRD11.1
CSI
LGA 1366
6.4 GT/sCSI
VRD11.1VRD11.1
Intel Xeon5600
LGA 1366
6.4 GT/s
6.4 GT/sDDR3
DDR3
DDR3
8 DIMMs
DDR3
DDR3
DDR3
8 DIMMs
LPC
PCI-E x16 slotPCI-E x16 Gen2
PCI-E x1
ICH10
6 SATA 3 USB
CL
INK
ES
I
Video
Maxim
VSC452
COM
RJ45RJ45
10/1003000MB/s 480Mb/s
2GB/s
8GB/s
IMM
PCI-E x8 Gen2
RAID PCI-E x8 slot
4GB/s
PCI-E x4IntelZoar
IntelZoarRJ45RJ45
GbERJ45RJ45 GbE
Intel NIC
Intel Xeon5600
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dx360 M3 Processor Installation
Intel Xeon Processor
Align Tabs/notches
> Intel Xeon Processors
Same clock rate, cache size/type, and identical in the core frequencies
> LGA 1366 socket (Socket B)
Pads of bare gold-plated copper
− (No pins on CPU)
Load plate with locking lever
Align notches to ensure proper installation
Attention: Follow the instructions carefully to install the CPU. Do not use any tools or sharp objects to lift the locking lever on the CPU socket. Do not press CPU into the socket. Make sure that the CPU is oriented and aligned correctly in the socket before closing the CPU retainer.
Attention: Follow the instructions carefully to install the CPU. Do not use any tools or sharp objects to lift the locking lever on the CPU socket. Do not press CPU into the socket. Make sure that the CPU is oriented and aligned correctly in the socket before closing the CPU retainer.
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
dx360 M3 Heatsink Requirements
Dust Cover Heat Sink Filler
Heat Sink
P/N # Heatsink ASM for CPU #1 and #2
46M5518 dx360 M3 Processor Heat sink
Plus
Attention: Do not set the heat sink once removed from the plastic cover. Do not touch thermal material on the bottom of the heat or CPU. Touching thermal material will contaminate it.
Attention: Do not set the heat sink once removed from the plastic cover. Do not touch thermal material on the bottom of the heat or CPU. Touching thermal material will contaminate it.
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
dx360 M3 Memory Subsystem
> Supports registered DDR3 LP ECC memory
Active Memory features, including advanced Chipkill memory protection
– 16x better error correction thank standard ECC memory
Choice of standard 1.5v or 1.35v consumes 10% less energy
Sixteen DIMM slots
DIMM sizes:
– 2 GB, 4 GB, 8 GB or 16 GBRDIMM sizes:
Maximum capacity
– 256 GB (max. x16GB DIMMs)
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
DIMM 1
DIMM 2
DIMM 4
DIMM 5
DIMM 7
DIMM 8
Example of Memory Bank 1 and CPU 1
Ch 2DIMMs
Ch 1DIMMs
Ch 0DIMMs
DIMM 9
DIMM 6
DIMM 3
dx360 M3 Memory Installation
CPU must be populated for access
to it’s DIMMS
Intel® Xeon® processor
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
> Standard with onboard ICH10 SATA II controller
Support 5 drives (depending on the configuration) internal simple-swap (SS) SATA II drives, or 4 SS SSDs. Hot-swap SAS or SATA HDDs, or simple-swap SAS HDDs, require an optional adapter
> ServeRAID-BR10il v2 controller
Support (no cache) for up 3Gbps7 (x4 PCIe)
> RAID-0/1/1E to 4 HDDs or SSDs.
> ServeRAID-M1015 SAS/SATA controller
6Gbps (x8 PCIe) RAID-0/1/10 (no cache) for up to 16 drives (limited by available bays)
> ServeRAID M1000 Series Advance Feature Key adds RAID-5 with SED support
> ServeRAID-M5014 SAS/SATA controller offers
6Gbps (x8 PCIe)
> Enhanced performance with 256MB of cache memory RAID-0/1/10/5/50 for up to 16 drives (limited by available bays).
> ServeRAID-M5015 SAS/SATA controller
6Gbps (x8 PCIe)
> enhanced performance with 512MB of cache memory and battery backup, and supports RAID-0/1/10/5/50 for up to 16 drives (limited by available bays).
> ServeRAID M5000 Series Advance Feature Key adds RAID-6/60 with SED support to the M5014 and M5015
> ServeRAID M5000 Series Battery Key adds battery backup support to the M5014.
Support either SAS or SATA, hot-swap or simple-swap, 3.5-inch or 2.5-inch drives. Drives cannot be intermixed.
dx360 M3 Disk Controller
Simple-swap drive
Hot-swap drive
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dx360 M3 Hard Drive Flexible Configurations2U Chassis with 2 1U Server trays
2 3.5-inch SS SATA HDDs (1 per server)—using the onboard controller
2 3.5-inch SS SAS HDDs (1 per server)—requires ServeRAID-BR10il v2
4 2.5-inch SS SAS HDDs (2 per server)—requires ServeRAID-BR10il v2 or M1015
4 2.5-inch SS SATA HDDs (2 per server)—using the onboard controller, ServeRAID-BR10il v2
4 2.5-inch SS SATA SSDs (2 per server)—using the onboard controller, ServeRAID-BR10il v2, or IBM 6GB SSD HBA Card
2U Chassis with 1 Server and one 1U Storage tray
5 3.5-inch SS SATA HDDs (1 per server, 4 per tray)—5 using the onboard controller
4 3.5-inch SS SAS HDDs (0 per server, 4 per tray)—requires ServeRAID-BR10il v2, M1015 or M5015
4 3.5-inch SS SATA HDDs (4 per tray)—requires ServeRAID-BR10il v2, M1015 or M5015
8 2.5-inch SS SAS HDDs (0 per server, 8 per tray)—requires ServeRAID-M1015 or M5015
8 2.5-inch SS SATA HDDs (0 per server, 8 per tray)—requires ServeRAID-M1015 or M5015
8 2.5-inch SS SATA SSDs (0 per server, 8 per tray)—requires ServeRAID-M1015, M5015, or IBM 6GB SSD HBA Card
2U Chassis with 1 Server and one 1U I/O tray
2 3.5-inch SS SATA HDDs (1 per server, 1 per tray)—using the onboard controller or ServeRAID-BR10il v2
2 3.5-inch SS SAS HDDs (1 per server, 1 per tray)—requires ServeRAID-BR10il v2, or M1015
4 2.5-inch SS SAS/SATA HDDs (2 per server, 2 per tray)—requires ServeRAID-M1015
4 2.5-inch SS SSDs (2 per server, 2 per tray)—requires ServeRAID-M1015 or IBM 6GB SSD HBA Card
3U Chassis with 1 Server and one 2U Storage tray
12 3.5-inch HS SATA HDDs (0 per server, 12 per tray)—requires ServeRAID-M1015, or M5015
12 3.5-inch HS SAS HDDs (0 per server, 12 per tray)—requires ServeRAID-M1015, or M501534
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NVIDIA Graphic Adapters Options
iDataPlex Server Platform
NVIDIA Tesla M1060 1 GT200 GPU4 GB Memory190 Watt Double Wide / Dual SlotPassive CoolingFRU PN 43V5909
NVIDIA Quadro FX3800 1 GB Memory107 WattSingle Wide / Single Slot FRU PN 43V5925
NVIDIA Tesla M20501 Fermi GPU3 GB Memory225 Watt Double Wide / Dual SlotPassive CoolingFRU PN 43V5894
NVIDIA Tesla M2070/M2070Q1 Fermi GPU6 GB Memory225 Watt Double Wide / Dual SlotPassive CoolingCuda, OpenCL, OpenGLFRU PN 43V5935 M2070 43V5943 M2070Q
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Tesla T10: The Processor Inside
Double Precision
Special Function Unit (SFU)
TP Array Shared Memory
> 8 TP per TPA (240 Total)
> Full scalar processor with integer and floating point units
> 16K of RAM for Shared Memory
Thread Processor (TP)
FP Integer
Multi-banked Register File
SpcOpsALUs
Thread Processor Array (TPA)
30 TPAs = 240 Processors
Double Precision
Special Function Unit (SFU)
TP Array Shared Memory
Double Precision
Special Function Unit (SFU)
TP Array Shared Memory
Double Precision
Special Function Unit (SFU)
TP Array Shared Memory
Double Precision
Special Function Unit (SFU)
TP Array Shared Memory
Double Precision
Special Function Unit (SFU)
TP Array Shared Memory
Double Precision
Special Function Unit (SFU)
TP Array Shared Memory
Double Precision
Special Function Unit (SFU)
TP Array Shared Memory
Double Precision
Special Function Unit (SFU)
TP Array Shared Memory
Double Precision
Special Function Unit (SFU)
TP Array Shared Memory
Double Precision
Special Function Unit (SFU)
TP Array Shared Memory
Double Precision
Special Function Unit (SFU)
TP Array Shared Memory
Double Precision
Special Function Unit (SFU)
TP Array Shared Memory
Double Precision
Special Function Unit (SFU)
TP Array Shared Memory
Double Precision
Special Function Unit (SFU)
TP Array Shared Memory
Double Precision
Special Function Unit (SFU)
TP Array Shared Memory
Double Precision
Special Function Unit (SFU)
TP Array Shared Memory
Double Precision
Special Function Unit (SFU)
TP Array Shared Memory
Double Precision
Special Function Unit (SFU)
TP Array Shared Memory
Double Precision
Special Function Unit (SFU)
TP Array Shared Memory
Double Precision
Special Function Unit (SFU)
TP Array Shared Memory
Double Precision
Special Function Unit (SFU)
TP Array Shared Memory
Double Precision
Special Function Unit (SFU)
TP Array Shared Memory
Double Precision
Special Function Unit (SFU)
TP Array Shared Memory
Double Precision
Special Function Unit (SFU)
TP Array Shared Memory
Double Precision
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
NVIDIA Tesla M2050 and M2070/M2070Q
Tesla M2050 and Tesla M2070/M2070Q Computing Processor Module
9.75 inches
4.37 inches
vented bracket
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
2 PCIe x16(1 per side)
PCIE x8
GPU 1GPU 1GPU 2GPU 2
HBA
dx360 M3 – New 3-slot Riser and I/O Tray
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
New Innovations
> 448 CUDA Cores
> NVIDIA Parallel DataCache
> NVIDIA GigaThread
> ECC Support
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The Soul of a Supercomputer in the body of a GPU
Tesla T20 Series Architecture Structure (1 of 5)
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
448 CUDA Cores
> Optimized performance and accuracy with up to 8X faster double precision
> Compliant with industry standards for floating point arithmetic
> Versatile accelerators for a wide variety of applications
> Valued by HPC clients running linear algebra and numerical simulation applications
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Tesla T20 Series Architecture Structure (2 of 5)
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
NVIDIA Parallel DataCache
> First GPU architecture to support a true cache hierarchy in combination with one-chip shared memory
> Improves bandwidth and reduces latency through L1 cache’s configurable shared memory
> Fast, coherent data sharing across the GPU through unified L2 cache
> Clients running physics solvers, raid tracing or sparse matrix multiplication algorithms benefit greatly from this cache hierarchy
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Tesla T20 Series Architecture Structure (3 of 5)
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
Tesla T20 Series Architecture Structure (4 of 5)
NVIDIA GigaThread
> Increased efficiency with concurrent kernel execution
> Dedicated, bi-directional data transfer engines
> Intelligently manage tens of thousands of threads
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
Tesla T20 Series Architecture Structure (5 of 5)
ECC Support
> First GPU architecture to support ECC (error checking and correction)
> Detects and corrects errors before system is affected
> Protects register files, shared memories, L1 and L2 cache and DRAM
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
Tesla M2070 and Tesla M2070Q Board Configuration
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
Emulex PCI-e HBA
Brocade PCIe HBAs
dx360 M3 I/O Support
High IOPS SS Class SSD PCIe HBA
QLogic PCIe HBA
QLogic CNA
Brocade CNA
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> High-performance PCIe Host Bus Adapter (HBAs)
10Gb Ethernet, Fibre Channel, InfiniBand and GPU cards
> Up to 3 PCIe adapter slots per chassis
Five differ riser cards available:
– 1U single-slot (front) PCIe slot
♦ Supports all configurations
– 2U two-slot (front PCIe slot
♦ Supports any two adapters with max. one GPU/GPGPU adapter
– 2U three-slot (front PCIe slot
♦ Supports 2 GPU/GPGPU adapters and any other PCIe card
Third PCIe slot backside of riser card
♦ 2U I/O Rich configurations using PCIE tray
– 1 single-slot (rear) PCIe slot
♦ All 2U configurations
– 2U single-slot (rear) PCIe slot
♦ 3U configurations only
NVIDIA Tesla M2050/M2070/M2070Q
IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
> Flexibility to match power supply with workload 550W High Efficiency Non-redundant Power Support
− Maximum Efficiency for lower power requirements More efficiency by running higher on the power
curve 900W High Efficiency Power Supply available for non-
redundant higher power requirements
750W N+N Redundant Power Supply
− Optional at the chassis level to tailor rack-level applications that require redundant power in some or all nodes
− Power envelope fits most applications, oversubscription / throttling for extremes
Straightforward, cost-effective solution for both node and line-feed redundancy
Meets customer requirement for rack-level line feed redundancy
Meets requirement for node-level power protection for storage-rich, VM & Enterprise environments
> Maintains maximum floor space density with the iDataPlex rack
New power supplies in same form factor as existing for 2U & 3U chassis power supply
iDataPlex 2U/3U Power Supply Option900W HE
550W HE
750W N+N
AC 1
AC 2
PS 1 750W Max
PS 2 750W Max
C
A
B
750W Total in redundant mode
200-240V onlyRedundant supply block diagram
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
Fan unit comprised of four 80 mm fans (partially removed) Redundant power
supply cable
iDataPlex Efficiency in Power and Cooling
Direct Dock Power connector
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
Topic 4 - Course Agenda
> Introducing IBM iDataPlex
> Rack Unit
> iDataPlex Nodes Overview
> *iDataPlex Management *
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
The Total Systems Management Experience
Integrated Management Module (IMM)
• Standards-based hardware which combines diagnostic and remote control
UEFI—next generation BIOS
• Richer management experience and future-ready
Hardware and firmware advances which are standard across all new systems
ToolsCenter
• Consolidated, integrated suite of management tools
• Powerful bootable media creator
Redesigned system tool portfolio for single-system management and scripting
IBM Systems Director
• Platform management that is easy and efficient
• Management of physical and virtual resources across heterogeneous systems
IBM Systems platform solution for System x, BladeCenter, Power Systems, System z and storage
IBM TivoliUpward integration into Tivoli Service Management
End-to-end stack to deliver future-proof systems management today
*This slide contains animations that will launch with slide. 49
IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
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iDataPlex/Intelligent Cluster Partner Ecosystem
Technology Collaboration PartnersSolution Collaboration Partners
IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
An Affordable Fabric - Reliable Switches
Trusted Industry Switch Suppliers>1GbE, 10GbE and InfiniBand>Up to 384 Ethernet connections
Affordable Price-Performance >Highest throughput with lowest latency>Easy provisioning >Repurpose connections
Scalable & Interoperable>Interconnect with existing network>Manage server changes automatically>Interoperable with CISCO Management
*This slide contains animations that will launch with slide.51
IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
"Despicable Me represents a breakthrough in the emerging model of collaborative, geographically distributed digital movie making. Thanks to the capacity of IBM's rendering technology and the skills of our artists, we were able to bring our creative vision to life through the completion of a wonderfully entertaining film.” Chris Meledandri, founder of Illumination Entertainment
IBM System x iDataPlexIBM System x iDataPlex
Supported a 330 person global team
Created 142 terabytes of data
6500 processor cores
Cut data center floor space in half
Reduced energy consumption by 40%
The Real Star of ‘Despicable Me’ – System x iDataPlex
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
43 iDataPlex Systems43 iDataPlex Systems listed with Supercomputing Leadership in TOP 500TOP 500
November 2010Semiannual independent ranking of the top 500 supercomputers in the world. www.top500.org
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
2009 - 2010 iDataPlex Awards
IBM’s Largest IBM’s Largest Green Data CenterGreen Data Center
“Top Server Product of 2009”
SearchDataCenter.com"IBM is building what the customers are telling them to build."
IBM TOP 5 Technologies for Corporate Environmental Innovation Program
16 of top 50 in Green 500
43 Places on TOP500 list
iDataPlex dx360 M3
2010 Readers' Choice:
“Best HPC Server Product or Technology”
Awarded at Super
Computing
2010
2010 Silicon Valley Leadership Group (SVLG) Chill Off 2 Competition
Results proved the IBM Rear Door Heat Exchanger had the “best energy efficiency.” Solution also considered “Lowest Facilities Energy Consumption” and “Most Economical.”
SVLG Chill Off competitors included: APC, LCP+, Knurr, Liebert, Sun and DirectTouch
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
Topic 4 - Course Summary
Having completed this topic you should be able to:
> List three emerging technologies for an iDataPlex solution
> List three goals that iDataPlex addressed
> Identify elements of the iDataPlex rack design
> Match the server offering to its characteristics
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
Glossary of Acronyms
Active Energy Manager
BIOS (Basic Input/Output System)
Compute
Compute Unified Device Architecture (CUDA)
Dynamic System Analysis (DSA)
Extreme Cluster Administration Toolkit (xCAT)
Flex Node Technology
Graphical Processing Unit (GPU)
InfiniBand
Integrated Management Module (IMM)
Nehalem EP (Efficient Performance)
Predictive Failure Analysis (PFA)
QPI (Quick Path Interconnect)
Reliability, Availability, and Serviceability (RAS)
Teraflops
Tesla M1060 and M2050
Thread Processing Array (TPA)
Thread Processing Cluster (TPC)
Thread Processing (TP)
UEFI (Unified Extensible Firmware Interface)
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IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
Additional ResourcesIBM STG SMART Zone for more education:
> Internal: http://lt.be.ibm.com/smartzone/modulartechnical
> BP: http://www.ibm.com/services/weblectures/dlv/partnerworld
IBM System x iDataPlex home page
> http://www-03.ibm.com/systems/x/hardware/idataplex/
Rear Door Heat eXchanger Installation and Maintenance Guide
> http://www.ibm.com/support/docview.wss?uid=psg1MIGR-5075220
IBM System x iDataPlex dx360 User's Guide
> http://www.ibm.com/support/docview.wss?uid=psg1MIGR-5077374
IBM System x iDataPlex dx360 Problem Determination and Service Guide
> http://www.ibm.com/support/docview.wss?uid=psg1MIGR-5077375
IBM PDU+ Installation and Maintenance Guide
> http://www.ibm.com/support/docview.wss?uid=psg1MIGR-5073026
IBM ServerProven
> http://www.ibm.com/servers/eserver/serverproven/compat/us/nos/ematrix.shtml57
IBM Systems & Technology Group Education & Sales Enablement © 2011 IBM Corporation
End of Presentation
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