Barry Industries, Inc.

Your Ceramic Solutions Provider

www.barryind.com

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www.semiconductorenclosures.com

Capabilities:Custom ResistorsCustom Thick Film CircuitsHTCCCustom MaterialsPartners

Medical ElectronicsSemiconductor PackagesMicrowave ModulesOptical PackagesPower Resistors

Applications:

Custom ResistorsüTerminations, Attenuators and Resistors üAny Value (0.1 Ohm to 200 Gigohm) üAvailable in BeO, Alumina, Aluminum Nitride üDown to 0201 Chip Size üCustom Designs üEpoxy Mount, Wire Bondable, and Solderable Finishes ü100% Manufactured in the USA üUp to 40 GHz

Solder Mount

Surface Mount , Full Wrap Chip Surface Mount, Flip Chip

Wirebond

Surface Mount , 1/4 WrapChip

Custom Thick Film CircuitsStandard Design Capabilities:Number of Metal Layers 1 – 8Thru Hole Metallization 1.5:1 Aspect RatioEdge Metallization 80% - 100%Selective Plating Gold and NickelSelective Soldering Sn 62, 63,96, Au/Ge, Au/Sn, Pb/InResistance Tolerance 1%, 2%, 5% and 10%Resistance Range 1 Ohm to 100 GigohmMinimum Via Diameter .008”Selective Edge Metallization .050”/.050” PitchLine Width/Spacing .005”/.005”CAD Capability Advanced Design Capabilities:Number of Metal Layers 8 - 12Thru Hole Metallization 4.0:1 Aspect RatioMinimum Via Diameter Down to .002” with Advanced ProcessingSelective Edge Metallization .030”/.030” PitchLine Width/Spacing .002”/.002”

HTCC High Temperature Co-FiredCeramic Custom Materials Customizable Thick Film Paste Solutions

•94% White Alumina•92% Opaque Alumina (Alumina Properties)

•Specialty Ceramic Materials•Refractory Conductors (W, MoMn)•Thick Film Dielectrics•Custom Thick Film Conductors

Al2O3 Material PropertiesPhysical Color: White BlackComposition: 94% minimum Al203 92% minimum Al203Bulk Density: 3.65g/cc 3.65g/ccWater Absorption: None NoneSurface Finish: 20-40 µinches 20-40 µinchesMicrostructure: 8 µm avg. 8 µm avg.Hermeticity: 1x10-8 ATM cc/s 1x10-8 ATM cc/s

Electrical Dielectric Constant: 9.4 (1 MHz at 25C) 10.0 (1 MHz at 25C)Dielectric Loss: 3x10-4 (1 MHz) 13x10-4 (1 MHz)Dielectric Strength: 10 (KV/mm) 10 (KV/mm)Loss Factor: 28.5x10-4 130x10-4Volume Resistivity: 1x1014 Ωcm 1x1014 ΩcmDissipation Factor: 0.001 (1 MHz at 25C)

Thermal CTE (40C-400C): 7.0 ppm/C 7.0 ppm/CConductivity: 20 W/mK 18 W/mKSpecific Heat: 0.19 Cal/gC 0.20 Cal/gCMechanical Color: White BlackHardness: 3000 (Knoop) 3000 (Knoop)Flexural Strength: 50,000 psi 40,000 psiCompressive: 380,000 psi 280,000 psiTensile Strength: 28,000 psi 23,000 psiTensile Modulus: 65x106 psi 37x106 psiImpact Strength 7 ft.lb. 7 ft.lb.

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Tungsten Metallization

Physical Modulus: 50x106 @ 25C 35x106 @ 1000CModulus of Rigidity: 20x106 @ 25C 10x106 @ 727C Melting Point: 3410C +/- 30CBoiling Point: 5500CAdhesion: 4.3Kg/mm2 (6000psi)Solder Leach 10 cycles – No Degradation 30 Second dipping/cycle in 60/40 @ 230C (Ni over Tungsten Metal).Thermal Conductivity: 150-160 W/mk

Electrical Electrical Resistivity: 5.5x10-6 Ω-cmSheet Resistance: 15mΩ/SQ

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PartnersNow Barry can take your product from the Design &Development stage, to the manufacture of customcomponents and then to finished Assemblies, all as ONEPROJECT.

Barry has partnered with three well-renowned companiesserving both the military and commercial markets toprovide design to the assembly of your finished product.

Barry will be instrumental in working with you to take yourproject from start to finish. Please visit our Partner Companies for more details:

Design Assembly Assembly

Medical ElectronicsResistors available in BeO, Alumina, AluminumNitride Any Value (0.1 Ohm to 200 Gigohm) üEpoxy Mount, Wire Bondable, and SolderableFinishes Custom Designs 100% Manufactured in the USA IS0 9001 Certified

Semiconductor Packages

Microwave Diodes/VaractorsGaAs FET and MMICVCSELMEMSLight SensorsBond Wire SupportsFeed ThroughsLaser Diodes

üLEDs, PhotodiodesüPower SemiconductorsüRF Bipolar TransistorsüLDMOS TransistorsüJumper ChipsüTO Header SubstratesüCeramic Lids

Optical Packages

High Power Terminations,Resistors and Attenuators

Flanged, Leaded and Chip ConfigurationsBrazed Assembly AvailableUp to 1500 Watts Power HandlingFrequencies to 40 GHz +Resistance Ranges from 0.5 to 20k OhmsLow VSWRMaterials: Aluminum Nitride, BeO, Alumina

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