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    SFH 4550

    IR-Lumineszenzdiode (850 nm) mit hoher AusgangsleistungHigh Power Infrared Emitter (850 nm)Lead (Pb) Free Product - RoHS Compliant

    2009-05-14 1

    Wesentliche Merkmale

    Infrarot LED mit hoher Ausgangsleistung

    Enger Abstrahlwinkel 3

    Sehr hohe Strahlstrke

    Kurze Schaltzeiten

    Anwendungen

    Infrarotbeleuchtung fr CMOS Kameras

    Sensorik

    Datenbertragung

    Sicherheitshinweise

    Je nach Betriebsart emittieren diese Bauteilehochkonzentrierte, nicht sichtbare Infrarot-

    Strahlung, die gefhrlich fr das menschliche

    Auge sein kann. Produkte, die diese Bauteile

    enthalten, mssen gem den Sicherheits-

    richtlinien der IEC-Normen 60825-1 und 62471

    behandelt werden.

    Typ

    Type

    Bestellnummer

    Ordering Code

    Strahlstrkegruppierung1)(IF = 100 mA,tp = 20 ms)

    Radiant Intensity Grouping1)

    Ie (mW/sr)

    SFH 4550 Q65110A1772 400 (typ. 700)

    1) gemessen bei einem Raumwinkel = 0.001 sr / measured at a solid angle of = 0.001 sr

    Features

    High Power Infrared LED

    Narrow emission angle 3

    Very high radiant intensity Short switching times

    Applications

    Infrared Illumination for CMOS cameras

    Sensor technology

    Data transmission

    Safety Advices

    Depending on the mode of operation, these

    devices emit highly concentrated non visible

    infrared light which can be hazardous to the

    human eye. Products which incorporate these

    devices have to follow the safety precautions

    given in IEC 60825-1 and IEC 62471.

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    2009-05-14 2

    SFH 4550

    Grenzwerte (TA = 25 C)

    Maximum Ratings

    Bezeichnung

    Parameter

    Symbol

    Symbol

    Wert

    Value

    Einheit

    Unit

    Betriebs- und LagertemperaturOperating and storage temperature range

    Top , Tstg 40 + 100 C

    Sperrspannung

    Reverse voltage

    VR 5 V

    Vorwrtsgleichstrom

    Forward current

    IF 100 mA

    Stostrom, tp= 10 s,D = 0

    Surge current

    IFSM 1.5 A

    Verlustleistung

    Power dissipation

    Ptot 180 mW

    Wrmewiderstand Sperrschicht - Umgebung bei

    Montage auf FR4 Platine, Padgre je 16 mm2

    Thermal resistance junction - ambient mounted

    on PC-board (FR4), padsize 16 mm2 each

    RthJA 450 K/W

    Kennwerte (TA = 25 C)

    Characteristics

    Bezeichnung

    Parameter

    Symbol

    Symbol

    Wert

    Value

    Einheit

    UnitWellenlnge der Strahlung

    Wavelength at peak emission

    IF = 100 mA

    peak 860 nm

    Centroid-Wellenlnge der Strahlung

    Centroid wavelength

    IF = 100 mA

    centroid 850 nm

    Spektrale Bandbreite bei 50% vonImaxSpectral bandwidth at 50% of Imax

    IF= 100 mA

    42 nm

    Abstrahlwinkel

    Half angle

    3 Grad

    deg.

    Aktive Chipflche

    Active chip areaA 0.09 mm2

    Abmessungen der aktiven Chipflche

    Dimension of the active chip area

    LBLW

    0.3 0.3 mm

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    SFH 4550

    2009-05-14 3

    Schaltzeiten, Ie von 10% auf 90% und von 90%auf 10%, beiIF = 100 mA,RL = 50

    Switching times, e from 10% to 90% and from

    90% to 10%,IF = 100 mA,RL = 50

    tr, tf 12 ns

    Durchlassspannung

    Forward voltage

    IF = 100 mA, tp = 20 ms

    IF = 1 A, tp = 100 s

    VFVF

    1.5 (< 1.8)

    2.4 (< 3.0)

    V

    V

    Sperrstrom

    Reverse current

    IR not designed for

    reverse

    operation

    A

    Gesamtstrahlungsfluss

    Total radiant flux

    IF = 100 mA, tp = 20 ms

    e typ 50 mW

    Temperaturkoeffizient von Ie bzw. e,

    IF = 100 mA

    Temperature coefficient of Ie or e,IF = 100 mA

    TCI 0.5 %/K

    Temperaturkoeffizient von VF,IF = 100 mA

    Temperature coefficient of VF,IF = 100 mA

    TCV 0.7 mV/K

    Temperaturkoeffizient von ,IF = 100 mA

    Temperature coefficient of ,IF = 100 mA

    TC + 0.3 nm/K

    Kennwerte (TA = 25 C)

    Characteristics (contd)

    Bezeichnung

    Parameter

    Symbol

    Symbol

    Wert

    Value

    Einheit

    Unit

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    2009-05-14 4

    SFH 4550

    Abstrahlcharakteristik

    Radiation CharacteristicsIrel =f()

    Strahlstrke Ie in Achsrichtung1)

    gemessen bei einem Raumwinkel = 0.001 sr

    Radiant Intensity Ie in Axial Direction

    at a solid angle of = 0.001 sr

    BezeichnungParameter

    Symbol WerteValues

    EinheitUnit

    SFH 4550-DW SFH 4550-EW SFH 4550-FW

    Strahlstrke

    Radiant intensity

    IF = 100 mA, tp = 20 ms

    Ie min

    Ie max

    400

    800

    630

    1250

    1000

    2000

    mW/sr

    mW/sr

    Strahlstrke

    Radiant intensity

    IF = 1 A, tp = 100 s

    Ie typ 5000 7000 9000 mW/sr

    1) Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) /Only one group in one packing unit (variation lower 2:1)

    0

    0.2

    0.4

    1.0

    0.8

    0.6

    1.0 0.8 0.6 0.4

    0102040 30 OHL01718

    50

    60

    70

    80

    90

    1000 20 40 60 80 100 120

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    SFH 4550

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    Relative Spectral EmissionIrel =f()

    Forward CurrentIF =f(VF)Single pulse, tp = 20 s

    7000

    nm

    %

    OHF04135

    20

    40

    60

    80

    100

    950750 800 850

    Irel

    OHL01713

    FI

    10-4

    0.5 1 1.5 2 2.5 V 3

    100

    A

    0

    FV

    -110

    5

    5

    10-2

    -3

    5

    10

    Radiant Intensity

    Single pulse, tp = 20 s

    Permissible Pulse HandlingCapability IF =f(), TA = 25 C,duty cycleD = parameter

    Ie

    Ie 100 mA=f(IF)

    OHL01715

    10 -3mA

    101

    010

    5

    5

    10 -1

    -2

    5

    10

    e

    e (100 mA)

    I

    I

    IF

    010 110 210 3105 5

    0.05

    210-1-2-3-4-5 1010 1010 10tp

    10 10s100

    0.1

    0.005

    0.020.01

    D =

    T

    tAIF D = IP

    T

    F

    Pt

    OHF02505

    0.20.51

    0.2

    0.4

    0.6

    0.8

    1.0

    1.2

    1.4

    1.6

    0.033

    Max. Permissible Forward CurrentIF =f(TA),RthJA = 450 K/W

    T

    OHR00880

    0

    F

    0 20 40 60 80 100C

    mA

    25

    50

    75

    100

    125

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    SFH 4550

    Mazeichnung

    Package Outlines

    Mae in mm (inch) / Dimensions in mm (inch).

    Empfohlenes Ltpaddesign Wellenlten TTW

    Recommended Solder Pad Design TTW Soldering

    Mae in mm (inch) / Dimensions in mm (inch).

    5.7 (0.224)

    5.1 (0.201)

    1.8 (0.071)

    1.2 (0.047)

    Chip positionGEXY6271

    Cathode

    5.9 (0.232)

    5.5 (0.217)

    0.6 (0.024)

    0.4 (0.016)

    0.6 (0.024)

    0.4 (0.016)

    spacing

    2.

    54(

    0.1

    00)

    0.8

    (0.0

    31)

    0.5

    (0.

    020)

    29 (1.142)

    27 (1.063)

    9.0 (0.354)8.2 (0.323)

    7.5 (0.295)

    7.8 (0.307)

    Area not flat

    4.8

    (0.1

    89)

    5.1

    (0.2

    01)

    4 (0.157)

    OHLPY985

    4.

    8

    (0.

    189)

    Anode

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    SFH 4550

    2009-05-14 7

    Ltbedingungen

    Soldering Conditions

    Wellenlten (TTW) (nach CECC 00802)

    TTW Soldering (acc. to CECC 00802)

    Published byOSRAM Opto Semiconductors GmbHLeibnizstrae 4, D-93055 Regensburgwww.osram-os.com All Rights Reserved.The information describes the type of component and shall not be considered as assured characteristics.Terms of delivery and rights to change design reserved. Due to technical requirements components may containdangerous substances. For information on the types in question please contact our Sales Organization.PackingPlease use the recycling operators known to you. We can also help you get in touch with your nearest sales office.By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packingmaterial that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costsincurred.Components used in life-support devices or systems must be expressly authorized for such purpose! Criticalcomponents 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expectedto cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintainand sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.

    OHLY0598

    0

    0

    50 100 150 200 250

    50

    100

    150

    200

    250

    300

    T

    t

    C

    s

    235 C

    10 s

    C... 260

    1. Welle1. wave

    2. Welle2. wave

    5 K/s 2 K/sca 200 K/s

    C C... 130100

    2 K/sZwangskhlungforced cooling

    Normalkurvestandard curve

    Grenzkurvenlimit curves

    http://www.osram-os.com/http://www.osram-os.com/