04 epoxies
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Epoxies
Second most widely used family of thermosets(after polyesters)
Large portion of uses are non-reinforced
(adhesives, paints, etc.) Circuit boards are the largest reinforced
application (low conductivity, low volatiles)
Advanced composites use epoxies because of
± Thermal stability ± Adhesion
± Mechanical properties
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Epoxy Structure
C C
Epoxy ring
OC C
O( )n
Polymer portion
Epoxy ring
Number of repeat units
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Epoxy í specific molecules
CCC
O
CCC
O
NC C C
O
C C C
O
N C
C
C
C
C
O
C
C
C
C
C
O
C
C
C
C
O
C
a) Diglycidyl Ether of Bisphenol A (DGEBPA)
b) Tetraglycidylmethylenedianiline
(TGMDA)
c) Epoxidized phenolic resin
(Epoxy Novalac)
CO C
O
C
C
C
OCCCO
OH
COCCC
O c
cn
( )n
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Properties í chain length (n)
Number of repeat
units (n)
Heat Distortion Temperature
(HDT) (°F/°C)
Physical state
2 105/40 Semi-solid
4 160/70 Solid
9 265/130 Solid
12 300/150 Solid
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Epoxy í specialty molecules
O
O
CCOCCOCCC
OH
C O C C C
OH
O C C O C C C
OH
NC
C
C
NH2
C C C
OH
O C C O C C C
O
Toughened Epoxy Resin
O
CC
ON
C
O
O
CCCOC
C C C
O
OC
O
CC
ON
C
O
O
C C C O C
CCC
O
O C
C
High Temperature Epoxy Resins
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Epoxies í HDT and structure
Resin Type
(predominate)
Heat Distortion Temp (HDT)
(°F/°C)
Aliphatic
(straight chain)
255-270/125-132
Aliphatic
(cyclical)
230-300/110-150
Aromatic(cyclical)
290-350/145-175
Aromatic
(straight chain)
265-290/130-145
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Curing Epoxies
Epoxies use hardeners instead of initiators
for curing
Hardeners can be almost any moleculethat will react with (open) the epoxy ring
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Epoxy Crosslink Mechanism
H
HN
C
C...
C
O
C C...
N
C
C...
C C C...
O
C C
H H
Hardener
Epoxy
The other end can also react.
Cured Polymer
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Curing
C C
Epoxy ring
OC
O
()n
Epoxy ring
N
N
HH
HH
N
N
HH
HH
C
Hardener molecules have two
reactive ends, so they can each
react with two epoxy molecules.
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Effects of various hardenersHardeners Advantages Disadvantages
Aliphatic amines Convenience, low cost, roomtemp cure, low viscosity
Skin irritant, critical mixratios, blushes
Aromatic amines Moderate heat resistance,
chemical resistance
Solids at room temp,
long and elevated cures
Polyamides Room temp cure, flexibility,
toughness, low toxicity
High cost, high
viscosity, low HDT
Amidoamines Toughness Poor HDT
Dicyandiamide Good HDT, good electrical Long, elevated cures
Anhydrides Heat and chem resistance Long, elevated cures
Polysulfide Moisture insensitive, quick set Odor, poor HDT
Catalytic Long pot life, high HDT Long, elevated cures,poor moisture
Melamine/form. Hardness, flexibility Elevated temp cure
Urea/form. Adhesion, stability, color Elevated temp cure
Phenol/form. HDT, chem resistance,
hardness
Solid, weatherability
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Epoxy and Polyester ComparisonComparisons Polyester Epoxy
Active site C=C
Crosslinking reaction Addition/free radical Ring opening
Crosslinking agent Initiator (peroxide) Hardener
Amount of x-link agent 1-2% of resin 1:1 with resin
Solvent/viscosity Styrene (active)/low Infrequent/high
Volatiles High Low
Inhibitors, accelerators Frequent Infrequent
Reactant toxicity Low Moderate
Cure conditions Room temp or heated Heated (some room)
Shrinkage High Low
Post cure Rare Common
O
C C
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Polyester and Epoxy í Properties
Property Polyester EpoxyAdhesion Good Excellent
Shear strength Good Excellent
Fatigue resistance Moderate Excellent
Strength/stiffness Good Excellent
Creep resistance Moderate Moderate to good
Toughness Poor Poor to good
Thermal stability Moderate Good
Electrical resistance Moderate Excellent
Water absorption resist Poor to moderate Moderate
Solvent resistance Poor to moderate Good
UV resistance Poor to moderate Poor to moderate
Flammability resistance Poor to moderate Poor to moderate
Smoke Moderately dense Moderately dense
Cost Low Moderate