1 micromegas tpc r&d p. colas. 2 r&d in progress and to be planned for r&d in progress...
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Micromegas TPC R&DMicromegas TPC R&D
P. ColasP. Colas
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R&D in progress and to be planned R&D in progress and to be planned forfor
Present collaborations NIKHEF, CERN Present collaborations NIKHEF, CERN workshop, CERN electronics, workshop, CERN electronics, Carleton, etc…Carleton, etc…
Existing and planned infrastructuresExisting and planned infrastructures(viewed from Saclay)
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The contextThe context 3 out of 4 ILC detector concepts feature a 3 out of 4 ILC detector concepts feature a
TPCTPC All worldwide R&D for ILC TPC is carried out All worldwide R&D for ILC TPC is carried out
in the framework of LC-TPC (41 institutes, in the framework of LC-TPC (41 institutes, 120 physicists)120 physicists)
LC-TPC carries out in parallel R&D and LC-TPC carries out in parallel R&D and common realization of a large prototype common realization of a large prototype
Mainly GEM and Micromegas technologies Mainly GEM and Micromegas technologies are consideredare considered
A large Micromegas TPC is being built for the A large Micromegas TPC is being built for the T2K experiment : fully engineered project to T2K experiment : fully engineered project to be delivered in 2009be delivered in 2009
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HistoryHistory1992 Garmich-Partenkirchen proposition of a TPC for the LC (R. Settles)
1996-97 Conceptual Design Report of TESLA. Proposition of Micromegas and GEM readout
1999-2004 TPC Berkeley-Orsay-Saclay
June 2005: MP-TPC in a KEK beam
2006 development of the theory of the resolution in a Micropattern detector ; T2K builds a large mM TPC
2002-2005: development of the ‘resistive foil’ at Carleton U.
October 2005 : 50 micron at small drift distance in a KEK beam
Nov. 2006 : Record resolution: 50 microns at all distances in a 5T field at DESY
2007 towards a collab. for a resistive bulk
January-April 2004 : principle demo of gas+pixel (digital TPC)
July 2005 : first InGrids (grid on silicon)
January 2006 : EUDET start
October 2007 first TimePix operational
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1999-2004 : construction of a large TPC (50cm, 1000 chanels) in a 2T magnet NIM A 535 (2004) 181
Gas studies NIM A (2002), resolution studies
Ion backflow suppression NIM A 535 (2004) 226
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Beam tests at KEK in June and October 2005, cosmic tests in 2006
384 ‘pads partout’ TPC
Multi-Prototype TPC (wires, GEM and Micromegas)
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Mesure de résolution à B=0.5 et 1TMesure de résolution à B=0.5 et 1T
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Analytical theory of the Analytical theory of the resolutionresolution
The resolution of a MPGD is limited by ionisation statistics, gain fluctuations and finite pad size effects
Given the lack of charge sharing between neighbouring pads, the resolution is, at best, 10% of the pad width
1/√12
1/√(12.Neff)
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Extrapolation to ILC TPCExtrapolation to ILC TPC
Conclusion: even with 1mm pads, a standard pad Micromegas would not reach the 130 m resolution goal.
However with a resistive foil and 2.3 mm pads, this goal is fulfilled (red curve).
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Resistive foilResistive foilA resistive foil glued on the anode A resistive foil glued on the anode turns it into a Resistance and turns it into a Resistance and Capacity network which spreads the Capacity network which spreads the charge charge
Proc. of LCWS 2005
A A 50 microns50 microns resolution is obtained resolution is obtained at small driftat small drift
(and at all drifts for B large enough)(and at all drifts for B large enough)
Test beam at KEK B=1T
Micromegas with res.foil
Q
ns
Cosmiques en champ magnétique
To appear in NIM A
See talk by A. Bellerive
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Resistive bulkResistive bulk The ‘Bulk’ technology The ‘Bulk’ technology NIM A 560 (2006) 405NIM A 560 (2006) 405
yields high robustness with no dead area yields high robustness with no dead area (no frame) (no frame) (See R. De Oliveira, I. Giomataris and (See R. De Oliveira, I. Giomataris and A. Delbart’s talks)A. Delbart’s talks)
Next step: combine it with the resistive foil Next step: combine it with the resistive foil technologytechnology
Lab tests : resistive bulk manufacturing, Lab tests : resistive bulk manufacturing, resistivity, measurements, uniformity, etc…resistivity, measurements, uniformity, etc…
Beam or cosmic tests at CERN and/or Beam or cosmic tests at CERN and/or TRIUMF or FermilabTRIUMF or Fermilab
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200 m
MESHESMESHES
ElectroformedChemically
etched Wowen
PILLARSPILLARS
Deposited by vaporization
Laser etching, Plasma etching…
Many different technologies have been developped for making meshes (Back-buymers, CERN, 3M-Purdue, Gantois, Twente…)
Exist in many metals: nickel, copper, stainless steel, Al,… also gold, titanium, nanocristalline copper are possible.
Can be on the mesh (chemical etching) or on the anode (PCB technique with a photoimageable coverlay. Diameter 40 to 400 microns
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SiTPCSiTPC Alternative to the resistive foil solution for the problem of Alternative to the resistive foil solution for the problem of
the finite pad size: detect ionization electrons one by one the finite pad size: detect ionization electrons one by one on 55 micron pixelson 55 micron pixels
Demonstrated in 2004 with Medipix Demonstrated in 2004 with Medipix NIM A 540 (2005) 295NIM A 540 (2005) 295 Continuation with TimePix (time or TOT recording on each Continuation with TimePix (time or TOT recording on each
pixel) (see J. Timmermans’s talk)pixel) (see J. Timmermans’s talk)
He 20% iC4H10 Ar 20% iC4H10
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Medipix2/TimePix at CERNMedipix2/TimePix at CERN
14.8 mm
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55
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55μm
55μm
65000 pixels on 2cm2
14 bits counter
10 to 100 MHz clock
See M. Campbell’s talk
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TimePix detector being assembled for- gain fluctuations studies, Fano factor measurement
- Study of X-ray polarization
Also work in progress at NIKHEF
(see Jan Timmermans’s talk)
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NIKHEFTwente Univ.
InGrid : Integrated GridInGrid : Integrated Grid
(post-processing on silicon)
Avoids dead areas, allows manufacturing of perfect grids
Useful tool to study Micromegas: easy to produce various gaps, hole sizes and gaps,… Allows study of energy resolution, gain fluctuations, ion feedback… (See D. Attié’s talk)
NIM A 556 (2006)
Energy Resolution (55Fe) 5.0% r.m.s.
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The “Large The “Large Prototype”Prototype”
World-wide collaboration coordinated World-wide collaboration coordinated by LC-TPC by LC-TPC (see K. Dehmelt’s talk)(see K. Dehmelt’s talk)
Goal : almost full scale test of various Goal : almost full scale test of various technologies technologies
Field cage : DESYField cage : DESY Electronics : Lund+CERN, (+Saclay Electronics : Lund+CERN, (+Saclay
for Micromégas) for Micromégas) (See L. Musa and P. Baron’s (See L. Musa and P. Baron’s talks)talks)
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The “Large Prototype” The “Large Prototype” endplateendplate
Schedule
1st Micromegas panel with 1700 channels ready end of 2007
First cosmic tests in 2008
2020
The ideal TPC endplate…The ideal TPC endplate…
Detector side
Electronics side
Resistive bulk
1000 l.p.i. Nanocrystalline copper mesh, or gold mesh
Credit-card-like integrated electronics
Low-mass cooling
Each yellow item is a R&D topic
Res. foil grounding on the side
Optical link
Mechanical flatness
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CollaborationsCollaborations
All these R&Ds progressed in the past few years All these R&Ds progressed in the past few years thanks to collaborationsthanks to collaborations Berkeley-Orsay-Saclay : addressed space resolution Berkeley-Orsay-Saclay : addressed space resolution
issuesissues Ottawa-Orsay-Saclay : resistive foil effectivenessOttawa-Orsay-Saclay : resistive foil effectiveness NIKHEF-Twente-CERN-Saclay : CMOS pixel readout NIKHEF-Twente-CERN-Saclay : CMOS pixel readout
demonstrationdemonstration Japan-France-Germany-Canada collaboration: beam test Japan-France-Germany-Canada collaboration: beam test
and deep understanding of the resolutionand deep understanding of the resolution CERN-Saclay : Bulk technique(s)CERN-Saclay : Bulk technique(s)
Also T2K-TPC ND280 is a goal-oriented Also T2K-TPC ND280 is a goal-oriented collaboration which allowed progress, mainly on collaboration which allowed progress, mainly on large volume production and reliability issueslarge volume production and reliability issues
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InfrastructureInfrastructuress
may 2007
Class-1000 clean room
UNIGE Laminar flux
Many infrastructures are setting Many infrastructures are setting up:up:
-Class 10000/100000 Clean Class 10000/100000 Clean rooms at Saclayrooms at Saclay
-2 new R&D labs being equipped 2 new R&D labs being equipped for T2K and ILCfor T2K and ILC
-1 room equipped with X-ray gun 1 room equipped with X-ray gun and laserand laser
-Lab for gas analysis in Saclay Lab for gas analysis in Saclay (mass spectrometry, gas (mass spectrometry, gas chromatography, infrared chromatography, infrared absorption)absorption)
-Wafer probing facilities at CERN Wafer probing facilities at CERN and NIKHEFand NIKHEF
-Joint IFAE/Saclay/UNIGE Joint IFAE/Saclay/UNIGE assembly and testing facility at assembly and testing facility at CERNCERN
-……
Wafer probing at CERN
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ConclusionsConclusions
Many R&D collaborations and Many R&D collaborations and infrastructures exist for Micromegas infrastructures exist for Micromegas TPC TPC
Recognition by CERN is always Recognition by CERN is always welcomewelcome
Beam tests at CERN will be needed Beam tests at CERN will be needed