239-9986

Data Sheet

Data Pack D Issued March 1997

Allen-Bradley SLC 500programmable logic controllers

The RS Allen-Bradley SLC 500™ productlineThe SLC 500 family of small logic controllers surpass simplemachine control. A powerful instruction set, advancedprogramming tools, and expanded product capabilities giveyou all of the right reasons to apply the SLC 500 solution toyour next control application.The SLC 500 product line is a growing family of smallprogrammable controllers built around two hardwareoptions; a fixed controller with an option to expand using a 2-slot chassis, or a modular I/O controller. The programmingtools and most I/O modules are compatible between the twohardware options, so you can cost effectively solve a broadrange of applications. The SLC 500 product line offers a variety of discrete I/Omodules that enable you to cost-effectively configure yourcontrol system. All of the discrete I/O modules are UL andCSA certified for industrial applications and the majority areapproved for Class I, Division 2 hazardous environments.

Section index1. When to choose fixed vs modular?2. System overview3. Performance specification comparison of fixed

and modular systems4. Overview

4.1 System configuration4.2 Programming

5. System selection guide5.1 Configuring a fixed system

5.1.1 Tabular method5.1.2 Charting method

5.2 Configuring a modular system6. Typical SLC™ system7. Technical specifications

7.1 Processors7.2 Power supply modules7.3 Input modules7.4 Output modules7.5 Specialty modules

7.5.1 Analogue modules7.5.2 High-speed counter module7.5.3 DH-485/RS-232C interface module

7.6 Programmers and operator interface7.6.1 APS7.6.2 HHT7.6.3 DTAM

7.7 Chassis and cables7.7.1 Chassis7.7.2 Cable

7.8 Memory modules and accessories7.8.1 Memory modules for fixed SLC 5/01 and

SLC 5/027.8.2 Card slot filler7.8.3 Battery

8. SLC application examples8.1 Application: High-speed position sensing8.2 Application: Remote dial-up of an SLC8.3 Application: PID temperature control

9. General installation requirements9.1 Loading and installation

9.1.1 Considerations for safety9.1.2 Considerations for power

9.2 Installation environment9.3 Calculation of heat9.4 Mounting instructions

9.4.1 Mounting the fixed style9.4.2 Mounting the modular style

9.5 Wiring instructions9.5.1 Wiring of power supply9.5.2 Wiring of I/O equipment9.5.3 Grounding

10. Dimensions10.1 Fixed controller10.2 Expansion chassis10.3 Modular controller (with power supply)

11. Programming11.1 Basics11.2 Ladder logic representation11.3 SLC memory organisation

12. Programming instructions12.1 Bit instructions12.2 Comparison instructions12.3 Timer and counter instructions12.4 Communication instructions12.5 I/O and interrupt instructions12.6 File copy and file fill instructions12.7 Math instructions12.8 Proportional integral derivative instructions12.9 Move and logical instructions12.10 Bit shift, FIFO and LIFO instructions12.11Sequencer instructions12.12Control instructions12.13ASCII instructions (applies to SLC 5/03

OS301 processors only)13. List of instructions

™ SLC, SLC 500, SLC 5/01, SLC 5/02, SLC 5/03 and DTAMare trademarks of Allen-Bradley Company, Inc.

1. When to choose fixed vs modular?There are two hardware styles to choose from - the fixedhardware style and the modular hardware style.

Fixed hardware styleThe SLC 500 fixed style includes a processor with 1Kinstruction capacity, a power supply and a fixed number ofI/O in one complete package. The 20, 30, and 40 I/Oversions accept a 2-slot expansion chassis. All fixed I/O unitsare panel mountable. The fixed hardware style isexpandable to 72 I/O points.

Modular Hardware StyleFor applications requiring more flexibility, the modular styleoffers a wide variety of I/O options. Modular style chassisare available in 4, 7, and 10-slot versions. The chassis can beconnected together to form a system of up to 30 slots.Choose from 3 power supplies, 3 processors, and a dozenI/O cards to tailor a system exactly for the application. Themodular hardware style is expandable to 480 I/O points.

SLC 5/01™Modular I/O systems that include an SLC 5/01 processor canbe configured with a maximum of three chassis (30 totalslots) from 4 I/O points to a maximum of 256 I/O points. TwoSLC 5/01 processors (CPUs) are available for the modularI/O system. 1K instruction capacity version with capacitor-backed

RAM memory. An optional battery can be used to retainRAM memory contents for a longer period of time whenpower is removed from the processor.

4K instruction capacity version with battery-backedRAM as standard.Optional EEPROM and UVPROM memory modules areavailable for use with the 5/01 processor.

SLC 5/02™The SLC 5/02 processor provides enhancedcommunications, faster scan times, advanced instructions,and extensive diagnostics that allow it to work in morecomplex applications. It has 4K instruction capacity, withbattery-backed RAM included. Modular I/O systems, whichinclude an SLC 5/02 processor, can be configured with amaximum of 3 chassis (30 total slots) from 4 I/O points to amaximum of 480 I/O points. Optional EEPROM and UVPROMmemory modules are available for use with the SLC 5/02processor.

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SLC 5/03™The SLC 5/03 processor introduces 32-bit technology. It hasa 3-position key switch on the front panel of the module thatallows you to select the mode of operation. It also providesbuilt-in RS-232 and DH-485 communications for SCADA anddirect programming as well as on-line program editing andimproved system throughput. The SLC 5/03 has battery-backed RAM included and accommodates real-timeapplications. The SLC 5/03 has 12K instruction capacity.

SLC 5/04™The SLC 5/04 processors incorporate all of the functionalityof the SLC 5/03 processor and add increasedcommunications capabilities, more memory, and fasterthroughput. The standard DH-485 port has been placed witha DH+ port, providing high-speed SLC 5/04-to-SLC 5/04communications and direct connection to PLC-5®S. Theavailable memory options are 12K, 28K, or 60K userinstructions, all with 4K additional data words.Modular I/O systems that include an SLC 5/03 or SLC 5/04processor can be configured with a maximum of threechassis (30 total slots) from 4 I/O points to a maximum of 960local I/O points. I/O capacity is expandable via Remote I/Oand DeviceNet.An optional memory module is available for use with SLC5/03 or SLC 5/04 processor. It provides UVPROM andEEPROM functionality.SLC 500 I/O modules are available with 4, 8, 16, or 32 points.Combination modules with 2 inputs / 2 outputs, 4 inputs / 4outputs, and 6 inputs / 6 outputs are also available.A wide variety of I/O voltages (including ac, dc, and TTL),analog I/O and speciality modules are available to help youcreate a close fit for your application.

Output Terminals

Input Terminals

Power Supply

Processor (CPU)

slot 0

SLC 500 Fixed Controller

Power SupplyProcessor Input Modules

Output Module

slot 0 1 2 3

SLC 500 Modular Controller

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2. System overview

Product RS stock no. Allen-Bradley no. Description and features

817-886 1747-L20C 20 I/O Fixed Hardware Style — (12) dc sink in w/HSC & (8) relay out, ac line power

817-892 1747-L30C 30 I/O Fixed Hardware Style — (18) dc sink in w/HSC & (12) relay out, ac line power

817-909 1747-L40C 40 I/O Fixed Hardware Style — (24) dc sink in w/HSC & (16) relay out, ac line power

Processor 817-634 1747-L511 SLC 5/01 Central Processor Unit (processor)Program memory - 1K instructions

817-640 1747-L514 SLC 5/01 Central Processor Unit (processor)Program memory - 4K instructions

817-656 1747-L524 SLC 5/02 Central Processor Unit (processor)Program memory - 4K instructions

157-5173 1747-L532 SLC 5/03 Central Processor Unit (processor)Program memory - 12K words

216-2469 1747-L541 SLC 5/04 Central Processor Unit (processor)Program memory - 12K words

817-690 1746-P1 Power Supply — chassis mount (120/240Vac –2 Amps with user power)

Power 817-707 1746-P2 Power Supply — chassis mount (120/240Vac –5 Amps withsupply user power)

817-713 1746-P3 Power Supply — chassis mount (240Vdc –3.6 Amps with user power)

817-741 1746-IA16 ac Input Module (16) inputs — 100/120Vac

Input 817-729 1746-IB16 dc Input Module (16) inputs — sink 24Vdc

module 817-735 1746-IV16 dc Input Module (16) inputs — source 24Vdc

157-5230 1746-IB32 dc Input Module (32) inputs — sink 24Vdc

817-763 1746-OA16 ac Output Module (16) triac — 120/240Vac

Output 817-757 1746-OB16 dc Output Module (16) transistor source — 10-50Vdc

module 817-779 1746-OW16 Relay Output Module (16) outputs — 10-250 Vac/10-125Vdc

157-5202 1746-OX8 Relay Output Module (8) outputs — 5-265Vac/5-125Vac

216-2447 1746-OB32 dc Output Module (32) transistor source — 10-50Vdc

817-785 1746-NI4 (4) Analogue Inputs, each selectable to accept either current or voltage

Analogue817-791 1746-NO4I Analogue Module (4) current outputs, 0–20mA

module 817-808 1746-NO4V Analogue Module (4) voltage outputs — 10Vdc to + 10Vac

157-5218 1746-NIO4I (2) Analogue Inputs, each selectable to accept either current or voltage(2) current outputs - 0–20mA

216-2453 1746-NIO4V (2) High Resolution Analogue Inputs, each selectable to accept either current or voltage

(2) Analogue Voltage outputs

216-2532 1746-NT4 Thermocouple/mV input module

216-2548 1746-NR4 RTD/Resistance input module

817-814 1746-HSCE High-Speed Counter Encoder Module

Specialty 817-820 1747-KE DH-485/RS-232C Interface Modulemodule

817-937 1747-PIC Converter RS-232/DH-485

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Product RS stock no. Allen-Bradley no. Description and features

817-921 1747-PA2E Advanced Programming Software — English

- 1747-PA2F Advanced Programming Software — French

- 1747-PA2G Advanced Programming Software — German

- 1747-PA2I Advanced Programming Software — Italian

Program-- 1747-PA2J Advanced Programming Software — Japanese

ming 817-959 1747-PTA1E Memory Pak — Englishsoftware

- 1747-PTA1F Memory Pak — French

- 1747-PTA1G Memory Pak — German

- 1747-PTA1I Memory Pak — Italian

Hand-Held Terminal817-943 1747-PT1 Note: Does not include battery or Memory Pak. (A

Memory Pak must be ordered with each Hand-HeldTerminal.)

Operator 817-836 1747-DTAM-E Data Table Access Module with English Users’interface Manual

817-965 1746-A4 4-slot Chassis — Modular Hardware Style

817-662 1746-A7 7-slot Chassis — Modular Hardware Style

Chassis 817-678 1746-A10 10-slot Chassis — Modular Hardware Style

216-2431 1746-A13 13 slot Chassis — Modular Hardware Style

817-915 1746-A2 2-slot Expansion Chassis for Fixed Hardware Style

817-684 1746-C9 36-inch Chassis Interconnect Cable

Cable 157-5195 1747-CP3 SLC 5/03 RS-232 Program Cable

216-2510 1784-CP13 Programming cable I784-KTX to SLC 5/04

Memory

817-842 1747-M1 EEPROM with 1K User Instructions (SLC 5/01 & 5/02)

module 817-858 1747-M2 EEPROM with 4K User Instructions (SLC 5/01 & 5/02)

216-2481 1747-M11 EEPROM with 20K Words (SLC 5/03 & 5/04)

817-864 1746-N2 Modular Card Slot Fillers — Orders must be for two fillers or multiples of two.

Accessory 817-870 1747-BA Battery (For RAM memory retention)

157-5189 1747-AIC Isolated Link Coupler for DH-485 Connection

- D1746-6.4 Analogue User's Manual

- D1746-6.5 High-Speed Counter Encoder User’s Manual

- D1747-ND013 DTAM User’s Manual

- D1747-NI001 Fixed Hardware Style Installation and OperationManual

845-948 D1747-6.2 Modular Hardware Style Installation and OperationManual

845-932 D1747-6.3 APS Getting Started Guide

- 9399-APSUM APS User Manual

- 9339-APSIE APS Import/Export User’s Manual

- D1747-NM009 HHT Getting Started Guide

- D1747-NP002 HHT User Manual

845-926 D1747-6.15 APS Reference Manual

- D1747-6.12 DH-485/RS-232C Module Manual (for 1747-KE)

Manual

(shipped

with product

and

available

separately)

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3. Performance specification comparisonof fixed and modular systems

The following table describes the general specifications forthe SLC fixed, SLC 5/01 and the SLC 5/02 processors.

➀ Fixed style and the 1K version SLC 5/01 only – Thecapacitor back-up is rated at 35°C (95°F).

➁ Lithium battery is optional for the fixed style and the 1Kversion SLC 5/01; standard for the 4K version SLC 5/01.

➂ The scan times are typical for a 1K ladder logic programconsisting of simple ladder logic and communicationservicing. Actual scan times depend on your programsize, instructions used, and communication to theprogramming device.

* The SLC 5/03 and 5/04 flash EPROM memory modulecannot be erased with UV light. It must bereprogrammed or erased with a Prom Programmerusing the Memory Module Adaptor.

Specification Fixed SLC 5/01 SLC 5/02 SLC 5/03 SLC 5/04

Program memory 1K instructions 1K or 4K instructions 4K instructions 12K words 12K words

Additional data storage 0 0 0 up to 4K words up to 4K words

I/O capacity 72 Discrete 256 Discrete 480 Discrete 960 Discrete 960 Discrete

Max. chassis/ I/O slots 2-slot chassis 3 chassis, 30 slots 3 chassis, 30 slots 3 chassis, 30 slots 3 chassis, 30 slots

Standard RAM Capacitor -2 weeks Capacitor -2 weeks➀ Lithium Battery - Lithium Battery - Lithium Battery -

Lithium Battery Lithium Battery 2 years 2 years 2 years

-5 years➁ -2 years➁

Memory back-up EEPROM or UVPROM EEPROM or UVPROM EEPROM or UVPROM EEPROM or UVPROM EEPROM or UVPROM

options

LED indicators RUN, CPU FAULT, RUN, FAULT, RUN, FAULT, RUN, FAULT, RUN, FAULT,

FORCED I/O, FORCED I/O, FORCED I/O, FORCED I/O, FORCED I/O,

BATTERY LOW BATTERY LOW BATTERY LOW, COMM. BATTERY LOW, BATTERY LOW,

DH-485, RS-232 DH-485, RS-232

Programming APS or HHT APS or HHT APS or HHT APS APS

Processor instruction 52 52 71 71 71

set

Typical scan time➂ 8 ms/K 8 ms/K 4.8 ms/K 1ms/K 0.9ms/K

Bit execution (XIC) 4 microseconds 4 microseconds 2.4 microseconds 0.4 microseconds 0.37ms

Certification UL listed/CSA UL listed/CSA UL listed/CSA UL listed/CSA UL listed/CSA

approved approved approved approved approved

Class 1, Groups A, B, Class 1, Groups A, B, Class 1, Groups A, B, Class 1, Groups A, B, Class 1, Groups A, B,

C or D, Division 2 C or D, Division 2 C or D, Division 2 C or D, Division 2 C or D, Division 2

CE marked for all CE marked for all CE marked for all CE marked for all CE marked for all

application application application application applicationdirectives directives directives directives directives

4. Overview

4.1 System configurationThe basic fixed controller consists of a processor with 1,024(1K) instruction capacity, a power supply, and a fixednumber of I/O contained in a single package.

The basic modular controller consists of a chassis, powersupply, processor module (CPU), Input/Output (I/Omodules), and an operator interface device for programmingand monitoring.

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Fixed Hardware Components Fixed Controller with 2-slot Expansion Chassis

Fixed Hardware ControllerInput Module Output Module

Operator Interface 2-Slot Expansion Chassis for I/O Modules

Power Supply Processor Module

Input Module Output Module Specialty I/O Module

Operator Interface Chassis

Modular Hardware Components Modular Controller

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4.2 ProgrammingThe SLC product line can be programmed using twodifferent methods, one by using the Hand-Held Terminal(HHT) and the other using the Advanced ProgrammingSoftware (APS), which operates on an IBM-AT/XT orcompatible personal computer. Both methods have extensive diagnostics, expanded laddereditors, and are available in several languages. As a result,either method can be used to configure the SLC processors,enter or modify an application program, monitor theexecution of the application in real-time, or troubleshoot anapplication program. The HHT can be used to configure the SLC 500 Fixed, SLC5/01 and SLC 5/02 processors. It accepts programs with amaximum data table size of 6K. Each rung may contain up to127 instructions.APS, on the other hand, has a maximum data table size of 16Kand each rung can contain 128 instructions. It can be used toconfigure all SLC 500 family processors.The instructions include: Bit instructions Timer and counter instructions Math instructions Control instructions Comparison instructions Sequencer instructions Bit shift, FIFO, and LIFO instructions Move and logical instructions File instructions Special instructions for the SLC 5/02 and above only such

as PID (Proportional, Integral, Derivative).

5. System selection guide5.1 Configuring a fixed systemYou can use either of two methods to determine whether the2-slot, fixed I/O expansion chassis will support a specificcombination of modules. Tabular method Charting method.The table below represents combinations of modules andindicates whether or not each combination is valid. The chartthat follows represents the region of operating current thatthe fixed I/O expansion chassis supports.

5.1.1 Tabular methodUsing the table below, locate both of the modules you plan touse in the fixed I/O expansion chassis. Follow the top rowacross until you find one of the modules. Then follow theright column down until you find the other module. Thesymbol shown in the table cell that marks their intersectiongives you information you must know before installing themodules.

A dot indicates a valid combination.

No symbol indicates an invalid combination.

A triangle indicates an external 24Vdc power supplymay be required.

♦

♦ ♦

♦

♦

♦ ♦

♦ ♦

♦ ♦

♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦

♦ ♦ ♦ ♦ ♦ ♦

IA16

OA

16

IB16

IV16

OW

16

NI4

HS

CE

OB

16

NO

4I

NO

4V

KE

NI0

4I

IB32

OX

8

NI0

4V

NT

4

NR

4

OB

32

IA16

OA16

IB16

IV16

OW16

NI4

HSCE

OB16

NO4I

NO4V

KE

NI04I

IB32

OX8

NI04V

NT4

NR4

OB32

♦

•

5.1.2 Charting methodThe following chart depicts the range of currentcombinations supported by the fixed I/O expansion chassis.To use it, you must first determine the backplane currentdraw and operating voltage for both of the modules you planto use in the chassis. You can get these specifications fromthe table alongside the chart. Next, plot each of the currentson the chart below. If the point of intersection falls within theoperating region, your combination is valid. If not, yourcombination cannot be used in a 2-slot, fixed I/O chassis.

1. Add current draws of both modules.2. Plot this point on the chart above.3. Plot current draw.4. Note the point of intersection.

Important: The NO4I and NO4V analogue output modulesmay require an external power supply. Refer tothe analogue user manual.

5Vdc Amps 24Vdc Amps1A16 0.085 -OA16 0.370 -IB16 0.085 -IV16 0.085 -OW16 0.170 0.180N14 0.025 0.085HS 0.300 -OB16 0.280 -NO41 0.055 0.195NO4V 0.055 0.145KE 0.150 0.040NIO4I 0.055 0.145IB32 0.104 -OX8 0.085 0.090OB32 0.452 -NI04V 0.055 0.115NR4 0.050 0.050NT4 0.060 0.040

450

350

400

300

250

200

150

100

50

20015010050

5 V dc Current (mA)

24 V dc Current (mA)

Valid Operating Region

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5.2 Configuring a modular system1. Estimate the total amount of memory this system

requires:a) Add up the number of discrete I/O points and place it

in (a).b) Add up the number of analogue I/O points and place

it in (b).c) Add up the number of specialty I/O modules and

place it in (c).d) Multiply a, b, and c by the number indicated.e) Total those numbers to give you a memory estimate.

2. Select a processor:

Place your choice into slot 0 of chassis 1 on the worksheet.

3. Select the I/O:a) If multiple chassis system, make copies for each

chassis.b) Write in the chassis number.c) Write in the appropriate slot numbers.d) Select your discrete I/O.e) Select your specialty and analogue I/O.f) Using the worksheet, list each I/O module in the slot

you desire.g) List the power consumption of each module in the

esignated columns. Be sure to account for future expansion.

h) When the chassis is complete, add up each power consumption column.

4. Select the correct power supply:a) Compare the Power Consumption totals with each

power supply.b) Choose the smallest power supply that provides

sufficient power.Note: The current shown is rated at 55°C.

5. Select the chassis:a) Add up the number of slots used.b) Select the smallest chassis which can hold your I/O.

Be sure to account for future expansion.

6. Select the miscellaneous devices:To complete your system, include devices such as: cables, communication interfaces, operator interfacedevices, and memory modules.

Required memory Required I/O Processor0 to 1K Less than 256 SLC 5/01

1K to 4K Less than 256 SLC 5/011K to 4K Greater than 256 SLC 5/02

Greater than 4K Greater than 256 SLC 5/03-5/04

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SLC 500 Chassis configuration worksheet1. To estimate your memory requirements, count the number of discrete and analogue I/O points, plus the number of

specialty I/O.a) discrete I/O points a) _____ 3 10 = ______ Instruction Wordsb) analog input and output points b) _____ 3 25 = ______ Instruction Wordsc) specialty I/O points c) _____ 3 100 = ______ Instruction WordsEstimated Total Memory Required ______ Instruction Words

2. Select the ProcessorCatalogue Number 1747-L511 SLC 5/01 1K InstructionsCatalogue Number 1747-L514 SLC 5/01 4K InstructionsCatalogue Number 1747-L524 SLC 5/02 4K InstructionsCatalogue Number 1747-L532 SLC 5/03 12K WordsCatalogue Number I747-L541 SLC 5/04 12K Words

3. Select I/OChassis Number ___ Catalogue Number Power Consumption Price

5V 24VSlot ______ ______ ____________ ______ (Slot 0 ReservedSlot ______ ______ ____________ ______ or processor in Slot ______ ______ ____________ ______ chassis)Slot ______ ______ ____________ ______Slot ______ ______ ____________ ______Slot ______ ______ ____________ ______Slot ______ ______ ____________ ______Slot ______ ______ ____________ ______Slot ______ ______ ____________ ______Slot ______ ______ ____________ ______Slot ______ ______ ____________ ______Slot ______ ______ ____________ ______Slot ______ ______ ____________ ______

Total Current ____________

4. Select the Power Supply (55°C rating)Catalogue Number 1746-P1 2A 46A ______Catalogue Number 1746-P2 5A 96A ______Catalogue Number 1746-P3 3.6A 87A ______

5. Select the ChassisCatalogue Number 1746-A4 4 slots ______Catalogue Number 1746-A7 7 slots ______Catalogue Number 1746-A10 10 slots ______Catalogue Number I746-A13 13 slots ______

6. Select Miscellaneous Devices__________ ________________ ________________ ________________ ______

Total System Cost ______

➀ Includes power requirements for the DTAM, PIC, and the HHT.

Power Consumption (Amps)➀

5Vdc 24Vdc

0.35 0.105

0.35 0.105

0.35 0.105

0.50 0.175

1.00 0.2

6. Typical SLC™ systemThe figure below consists of some components that make upa typical installation.

7. Technical specifications7.1 ProcessorsThe SLC 500 processor product line offers a fixed processorand two types of chassis-based processors.The SLC fixed controller is a pre-packaged systemconsisting of a processor, power supply, network port, andI/O points. The fixed controller offers you a comprehensiveladder logic instruction set including math, compare, move,and sequencing instructions.The SLC 5/01 processor offers the instruction set of the SLC500 fixed controller in a modular hardware configuration.The SLC 5/01 processor provides: Two choices of program memory size – 1K or 4K

instructions Optional battery back-up for the -L511; standard for the

-L514 Addressing of up to 256 I/O Powerful ladder logic programming instruction set Subroutines. Built-in DH-485 communication channel (peer-to-peer

communication response to message commands only).The SLC 5/02 processor expands beyond the SLC 5/01processor capabilities by offering additional instructions andincreased diagnostics. The SLC 5/02 processor provides: Program memory size of 4K instructions Ability to handle 32-bit signed math functions Addressing of up to 480 I/O User fault routines Interrupt capability PID – used to provide closed loop control Indexed addressing Built-in DH-485 communication channel (initiation of

peer-to-peer communication).

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Main features Supports I/O configurations of up to 3 chassis (30 slots)

of I/O. Provides you with the flexibility to expand I/Ocapacity as required.

Supports a variety of input and output modules. Provides user selectable program security. The wide

range of system protection capabilities allow you tosecure user data and program files from changes.

Provides superior system throughput. SLC 500 modularprocessors deliver fast overall system throughput timesin addition to fast program scan times.

Supports user memory sizes from 1 to 12K. By offeringa wide range of user memory, SLC 500 modularprocessors can be used in a realm of applications.

The SLC 5/03 processor significantly increases performanceby supplying system throughput times less than 1ms for atypical 1K user program. Now applications such as high-speed packaging, sorting, and material handling becomemore affordable. With the addition of on-line editing, the SLC5/03 processor presents a positive solution for yourcontinuous process application. The SLC 5/03 processorprovides: Program memory size of 12K, plus 4K additional data

space Addressing of up to 960 I/O On-line programming (includes runtime editing) Built-in RS-232 channel supporting:- DFI Full-Duplex for remote or point-to-point

communication, or direct connection to IBM compatibleprogramming devices

- DFI-Half-Duplex Slave for remote communication to amaster device

- DH-485 (serves as a second DH-485 channel using a1747-PLC or direct connection to IBM compatibleprogramming devices)

- ASCII for connection to other ASCII devices, such asbarcode readers, printers and weigh scales

Built-in DH-485 channel Built-in real-time clock/calendar 1ms Selectable Timed Interrupt (STI) 0.50ms Discrete Input Interrupt (DII) Advanced math features - PID and floating point

IEC or NEMA rated enclosure suitable for yourapplication andenvironment that shields your controller from electrical

Disconnect, to remove power from the system

Fused isolation transformer or a constant voltagetransformer, as your application requires

Master control relay/emergency-stop circuit

Terminal blocks or wiring ducts

Suppression devices for limiting EMI (electromagneticinterference) generation

1

2

3

4

5

6

1

4

3

2

6

5

MCR

Disconnect

IsolationTransformer

SLC 500 Controller

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Flash PROM provides firmware upgrades withoutphysically changing EPROMs

Keyswitch - RUN, REMote, PROGram (clear faults).The SLC 5/04 processor provides the baseline funcionality ofthe SLC 5/03 processor plus DH+ communication.Communication via DH+ takes place three times faster thanDH-485 communication, providing you with increasedperformance levels. In addition, the SLC 5/04 processor runsapproximately 15% faster than the SLC 5/03 processor,yielding system thru-put times of 0.90ms for a typical 1K userprogram.

The SLC 5/04 processor provides : program memory sizes of 12K, plus 4K additional data

space high-speed performance - 0.90ms/K typical control of up to 960 local I/O, expandable via Remote I/O

and DeviceNet online programming (includes runtime editing) built-in DH+ channel, supporting :

- high-speed SLC 5/04 to SLC 5/04 communication- mesaging capability between PLCs® and SLCs™- monitoring capabilities to PLC-2®, PLC-3®,

PLC-5® and PLC-5/250™ processors built-in RS-232 channel, supporting:

- DF1 Full-Duplex for remote or point-to-pointcommunication, or direct connection to IBMcompatible programming devices

- DF1 Half-Duplex Master/Slave for SCADA typecommunication

- DH-485 (serves as a second DH-485 channel usinga 1747-PIC or direct connection to IBM compatibleprogramming devices)

- ASCII for connection to other ASCII devices, such as bar code readers, printers and weigh scales

passthru capability to panelView™ 550 and PanelView™900

remote I/O passthru built-in real-time clock/calander 1ms Selectable Timed Interrupt (STI) 0.50ms Discrete Input Interrupt (DII) advanced math features - PID and floating point flash PROM provides firmware upgrades without

physically changing EPROMS keyswitch - RUN, REMote, PROGram (clear faults).

➀ Fixed style and the 1K version SLC 5/01 only – the capacitor back-up is rated at 35°C (95°F). ➁ Lithium battery is optional for the fixed style.➂ The scan times are typical for a 1K ladder logic program consisting of simple ladder logic and communication servicing.

Actual scan times depend on your program size, instructions used, and communication to the programming device.

Specification Fixed

Program memory 1K Instruction

Additional data storage 0

I/O capacity 72 Discrete

Max. chassis/ I/O slots 2-slot chassis

Standard RAM Capacitor–2 weeks➀ Lithium Battery–5 years➁

Memory back-up options EEPROM or UVPROM

LED indicators RUN, CPU FAULT, FORCED I/O, BATTERY LOW

Programming APS or HHT

Typical scan time ➂ 8 ms/K

Processor instruction set 52

Bit execution (XIC) 4 microseconds

Packaged shipping weights 1747-L20 2.40 Kg (5 lb 6 ozs)1747-L30 2.80 Kg (6 lb 4 ozs)1747-L40 3.08 Kg (6 lb 14 ozs)

Noise immunity NEMA Standard ICS 2-230

Ambient temperature rating Operating: 0°C to +60°C (+32°F to +140°F)Storage:–40°C to +85°C (–40°F to +185°F)

Humidity 5 to 95% without condensation

Vibration Displacement: .015 inch, peak-to-peak @ 5-57HzAcceleration: 2.5 Gs @ 57-2000HzDuration: 1hr per axis (x, y, z)

Certification UL listed, CSA approved

PC RUN

CPU FAULT

FORCED I/O

BATTERY LOW

POWER

➀ Fixed style and the 1K version SLC 5/01 only – The capacitor back-up is rated at 35°C (95°F). ➁ Lithium battery is optional for the fixed style and the 1K version SLC 5/01; standard for the 4K version SLC 5/01.➂ The scan times are typical for a 1K ladder logic program consisting of simple ladder logic and communication servicing.

Actual scan times depend on your program size, instructions used, and communication to the programming device.* The SLC 5/03 & 5/04 flash EPROM memory module cannot be erased with UV light. It must be reprogrammed or erased

with a PROM programmer using the memory module adaptor.

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PC RUN

CPU FAULT

FORCED I/O

BATTERY LOW

SLC 5/01 CPU

RUN COMM

CPU FAULT

FORCED I/O

BATTERY LOW

SLC 5/02 CPU

RUN

FLT

BATT

SLC 5/03 CPU

OR ORFORCE

DH485

RS232

RUN REM PROG

Slot 0

Specification SLC 5/01 SLC 5/02 SLC 5/03 SLC 5/04

Program memory 1K or 4K instructions 4K instructions 12K words 12K words

Additional data storage 0 0 Up to 4K words Up to 4K words

I/O capacity 256 Discrete 480 Discrete 960 Discrete 960 Discrete

Max. chassis/ I/O slots 3 chassis, 30 slots 3 chassis, 30 slots 3 chassis, 30 slots 3 chassis, 30 slots

Standard RAM Capacitor–2 weeks➀ Lithium Battery–2 years Lithium Battery - 2 years Lithium Battery - 2 years

Lithium Battery–2 years➁

Memory back-up options EEPROM or UVPROM EEPROM or UVPROM EEPROM or UVPROM* EEPROM or UVPROM*

LED indicators RUN, FAULT, FORCED I/O, RUN, FAULT, FORCED I/O, RUN, FAULT, FORCED I/O, RUN, FAULT, FORCED I/O,BATTERY LOW BATTERY LOW, COMM. BATTERY LOW, DH-485, BATTERY LOW, DH-485,

RS-232 RS-232

Programming APS or HHT APS or HHT APS APS

Processor instruction set 52 71 71 71

Typical scan time➂ 8 ms/K 4.8 ms/K 1 ms/K 1 ms/K

Bit execution (XIC) 4 microseconds 2.4 microseconds 0.4 microseconds 0.37 microseconds

Noise immunity NEMA Standard ICS 2-230

Ambient temperature rating Operating: 0°C to +60°C (+32°F to +140°F)

Storage: –40°C to +85°C (–40°F to +185°F)

Humidity 5 to 95% without condensation

Vibration Displacement: .015 inch, peak-to-peak @ 5–57Hz

Acceleration: 2.5 Gs @ 57-2000Hz

Certification UL listed/CSA approvedClass 1, Groups A, B, C or D, Division 2CE marked for all applicable directives

SLC 5/04 CPU

FORCE

DH+

RS232BATT

FLT

RUN

RUN REM PR OG

OR

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Selecting chasisThe chassis houses the processor and I/O modules. Thepower supply mounts on the left side of the chassis. Allcomponents easily slide into the chassis along guides formedin the chassis. No tools are required to insert or remove theprocessor or I/O modules. A maximum of three chassis (30I/O slots) may be connected in an SLC system.There are four sizes of chassis that you can choose; 4-slot; 7-slot; 10-slot and 13-slot.

Selecting modular processorsThe processor always occupies the first slot of the firstchassis (slot 0). The SLC 5/01™ processor is available with amemory range of 1K or 4K of user instructions. The SLC5/02™ is available with 4K of user instructions. The SLC5/03™ processor is available with 12K of user instructionsand 4K of additional data words. The SLC 5/04™ processor isavailable with 20K of user instructions and 4K of additionaldata words. These processors operate in an environment upto +60°C (+140°F).The 1K processor is supplied with a 2-week capacitor back-up as standard and an optional 5-year battery back-up in theevent of power interuption. The 4K, 12K and 20K processorsare supplied with 2-year battery back-up as standard.Optional memory modules are also available for the SLC5/01, 5/02, 5/03 and 5/04 processors. For more details onmemory modules, see pages 1-12.

We designed the SLC 500 processors to operate in anindustrial environment, To keep the processor running asreliably as possible, install all processors in a manner thatprovides protection from various corrosive agents such asdirt, grease, and falling debris, particularly electrically

conducting material.

7.2 Power supply modulesAllen-Bradley offers three different power supplies, two acand one 24Vdc. The ac supplies can be configured tooperate using 120 or 240Vac.

Features All power supplies have an LED that indicates proper

supply power. Supplies have a hold-up time (the time the system is

operational during a brief power loss) typically between 20 milliseconds and 3 seconds.

On ac power supplies, you can select either 120V or 240Voperation by setting a jumper.

ac supplies have an external 24Vdc terminal that can beused to power I/O devices.

100/120 Volts 200/240 Volts

Fuse

POWER

1746-P1 and -P2 1746-P3

Fuse

POWER

Specification 1746-P1 1746-P2 1746-P3

Line voltage 85-132/170-265Vac 85-132/170-265Vac 19.2-28.8Vdc47/63Hz 47/63Hz

Typical line power 135VA 180VA 90VArequirement

Backplane current 2.0A at 5Vdc 5.0A at 5Vdc 3.6A at 5Vdccapacity (derated by 0.46A at 24Vdc 0.96A at 24Vdc 0.87A at 24Vdc5% at +60°C)

24Vdc user power 200mA 200mA NAoutput current

Hold-up time 20 ms to 3000 ms 20 ms to 3000 ms 20 ms to 3000 ms(load dependent)

Fuse protection 3.0A 3.0A 5.0A

Inrush current 20.0A (max.)

Temperature range 0° to +60°C (+32° to + 140°F)

Wiring Two #14 AWG wires per terminal (max.)

7.3 Input modulesThe 1746 I/O platform is a modular hardware design thatuses a cost and space effective means to add I/O modules toyour control system. I/O modules can interface to ac and dc.

Features LEDs indicate the status of each I/O point. Assisting you in

troubleshooting, LEDs illuminate when the proper signalis received at an input terminal, or when the processorcommands an output channel to turn on.

Select I/O modules to exactly match your application. Expand the I/O capacity of your fixed controller system.

Two discrete I/O modules can be added to the fixedcontroller’s 2-slot expansion chassis increasing theflexibility of the system.

Digital and field circuits are isolated. All modules featureoptical isolation between digital and field circuits resultingin increased noise immunity, and limited damage to yoursystem due to an electrical malfunction of the fieldwiring.

Self-lifting field-wire pressure plates cut installation time.Wiring terminals have self-lifting pressure plates tosecure two #14 AWG field wires.

Removable terminal blocks help ease the wiring task.Removable terminal blocks allow you to replace themodule without rewiring it.

Removable terminal blocks are colour coded for quickidentification. A matching colour band is also provided onthe front of the module to assist in matching the terminalblock to the module.

Barrier type terminal blocks provided on all modules.Each terminal block features a barrier on three sides ofeach terminal to help prevent accidental shorting of fieldwiring.

Self-locking tabs secure the module in the chassis. Notools are necessary to install or remove a module from thechassis. To install a module, you slide it into the chassisuntil it latches in place.

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Backplanecurrent Off–state

Voltage Operating No. of Points per Catalogue draw (A) Signal delay currentcategory voltage inputs common number 5V 24V (ms. max.) (max.)

100/120Vac 85-132 16 16 1746-IA16 0.085 0 on = 35 2mAoff = 45

10-30 sink 16 16 1746-IB16 0.085 0 on = 8 1mA

12/24Vdcoff = 8

10-30 source 16 16 1746-IV16 0.085 0 on = 8 1mAoff = 8

24Vdc 18-30 at 50°C 32 8 1746-IB32 0.106 0 on = 3 1mA18-26.4 at 60°C off = 3

sink

Terminal Identification Diagrams on Each Module

LEDs indicate the status of each I/O point

INPUT

IN 0

IN 1

IN 2

IN 3

IN 4

IN 5

IN 6

IN 7

IN 8

IN 9

IN 10

IN 11

IN 12

IN 13

IN 14

IN 15

AC COM

AC COM

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7.4 Output modulesac/dc relay, ac triac, and dc transistor output modules areavailable.

Features LEDs indicate the status of each I/O point. Assisting you in

troubleshooting, LEDs illuminate when the proper signalis received at an input terminal, or when the processorcommands an output channel to turn on.

All relay contacts are Silver Cadmium with Gold overlay.Cold plating resists oxidation and tarnishing resultingfrom non-use. Silver Cadmium acts as an excellentconductor.

Select I/O modules to exactly match your application. Expand the I/O capacity of your fixed controller system.

Two discrete I/O modules can be added to the fixedcontroller’s 2-slot expansion chassis increasing theflexibility of the system.

Digital and field circuits are isolated. All modules featureoptical isolation between digital and field circuitsresulting in increased noise immunity, and limiteddamage to your system due to an electrical malfunction of the field wiring.

Self-lifting field-wire pressure plates cut installation time.Wiring terminals have self-lifting pressure plates tosecure two #14 AWG field wires.

Removable terminal blocks help ease the wiring task.Removable terminal blocks allow you to replace themodule without rewiring it.

Removable terminal blocks are colour coded for quickidentification. A matching colour band is also provided onthe front of the module to assist in matching the terminalblock to the module.

Barrier type terminal blocks provided on all modules.Each terminal block features a barrier on three sides ofeach terminal to help prevent accidental shorting of fieldwiring.

Self-locking tabs secure the module in the chassis. Notools are necessary to install or remove a module fromthe chassis. To install a module, you slide it into thechassis until it latches in place.

Signal SurgeBackplane delay Continuous Continuous On-state current

Points current (max.) Off-state Load current per current per voltage perVoltage No. of per draw (resistive leakage current point module drop point

category outputs common Catalogue 5V 24V load) (max.)➁ (min.) (max.)➂ (max.) (max.) (max.)➀

24Vdc 16 16 1746-OB16 0.280 0.0A on = 0.10ms 1mA 1mA 0.50A at 30°C 8A at 30°C 1.20V at 3.0A for(operating A off = 1.0ms 0.25A at 60°C 4A at 60°C 0.50A 10ms

voltage10-50Vdc)

120-240Vac 16 8 1746-OA16 0.370 0.0A on = 0.10ms 2mA➂ 10mA 0.50A at 30°C 8A at 30° C 1.50V at 10.0A (operating A off = 11.0ms 0.25A at 60°C 4A at 60° C 0.50A for

Voltage 25ms85-265Vac)

ac/dc 16 8 1746-OW16 0.170 0.180 on = 10.0ms 0mA 10mA See the chart 16.0A ac Not See the Relay A A off = 10.0ms that follows 8.0A applicable chart

(operating common thatvoltage follows

5-265Vac5-125Vdc)

ac/dc 8 Individually 1746-OX8 0.085 0.090 on = 10.0ms ØmA 1ØmA See the chart Must be Not See the Relay isolated (removable A A off = 10.0ms that follows limited so applicable chart

(operating terminal the module that voltage block) power does follows

5-265Vac not exceed5-125Vdc) 1440Vac

24Vdc 32 16 1746-OB32 0.452 0.0A on = 0.1ms 1mA 1mA 0.1A at 60°C 3.2A at 60°C 1.2V at 1A for(operating A off = 1ms 0.1A 10ms

voltage5-50V dc)

Terminal Identification Diagrams on Each Module

LEDs indicate the status of each I/O point.

OUTPUT

IN 0

IN 1

IN 2

IN 3

IN 4

IN 5

IN 6

IN 7

IN 8

IN 9

IN 10

IN 11

IN 12

IN 13

IN 14

IN 15

AC COM

AC COM

➀ Frequency = 47 to 63Hz➁ Triac outputs turn on at any point in the ac line cycle and turn off at ac line zero cross. Recommended surge suppression

for triac outputs when switching 120Vac inductive loads is Harris MOV part number V220 MA2A or equivalent.➂ To limit the effects of leakage current through triac outputs, a loading resistor can be connected in parallel with your load.

For typical 120Vac applications, use a 15KW, 2 Watt resistor, for typical 240Vac applications, use a 15KW, 5 Watt resistor.

Repeatability is once every 1 second at 30°C. Repeatability is once every 2 seconds at 60°C.

7.5 Specialty modules

7.5.1 Analogue modulesThe SLC 500 family offers these I/O analogue modules foryour control applications. NI4 input module NIO4I & NIO4V analogue I/O combination module NO4I output module NO4V output module NR4 RTD/resistance input module NT4 thermocouple/mV input module.

Features High resolution 16-bit input and 14-bit output converters

provide accurate control capabilities. Outputs are backplane powered – no external power

supply required, reducing system cost. User selectable inputs that are configured per channel

for current or voltage inputs. Input channel filtering rejects high-frequency noise that

couples into an analogue input signal. Image maps directly into the SLC image, saving

memory usage and time.

Important: All analogue modules are isolated from eachother and from the backplane. If the NO4I or theNO4V is externally powered, the 24Vdcbackplane current draw is 0mA.

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SpecificationSLC communication format ________________ 16-bit two’s

complement binaryField wiring to backplane isolation ______________ 500VdcConversion time ________ 512µs for all channels in parallelCurrent/voltage ranges

NI4 ____ ±10Vdc or ±20mA (current and voltage input)NO4I ____________________ 0 to 21mA (current output)NO4V ______________________ ±10V (voltage output)

Step responseInput ________________________________ 60ms at 95%Output ______________________________ 2.5ms at 95%

Maximum wire size ________________________ #14AWGTerminal block ____________________________ removableNoise immunity______________ NEMA Standard ICS 2-230Environmental conditions

Operating temperature __________________ 0 to +60°C(+32° to +140°F)

Storage temperature ________________ -40°C to +85°C(-40° to +185°F)

Humidity rating __________ 5 to 95% (non-condensing)Recommended cable____________________ Belden #8761Certification ______ UL 508 listed, CSA 22.2 142 approvedHazardous Environment Classification __________ Class I,

Division 2 Hazardous Environment

Maximum Amperes➀ Amperes Voltamperes

Relay Contact Ratings Volts Make Break Continuous➂ Make Break

For OW16 240Vac 7.5A 0.75A2.5A 1800VA 180VA

120Vac 15A 1.5A

125Vdc➁ 0.22A➀ 1.0A 28VA

24Vdc➁ 1.2A➀ 2.0A 28VA

For OX8 240Vac 15A 1.5A5.0A 3600VA 360VA

120Vac 30A 3.0A

125Vdc➁ 0.22A➀ 1.0A 28VA

24Vdc➁ 1.2A➀ 2.0A 28VA

➀ Connecting surge suppressors across your external load will extend the life of SLC 500 relay contacts. For recommendedsurge suppressors when switching ac inductive loads, consult the SLC 500 Installation and Operation User’s Manual(Catalogue Number 1747-N1002). Recommended surge suppression for switching 24Vdc inductive loads is a 1N4004diode that is reverse wired across the load.

➁ For dc voltage applications, the make/break ampere rating for relay contacts can be determined by dividing 28VA by theapplied dc voltage.For example, 28VA/48Vdc = 0.58A.For dc voltage applications less than 48V, the make/break ratings for relay contacts cannot exceed 2A. For dc voltage applications greater than 48V, the make/break ratings for relay contacts cannot exceed 1A.

➂ The continuous current per module must be limited so the module power does not exceed 1440VA.

Specification 1746-NI4 1746-NIO4I 1746-NO4I 1746-NO4V 1746-NIO4

Input channels 4 differential, voltage 2 differential, voltage Not applicable Not applicable 2 differential

per module or current selectable or current selectable voltage or

per channel not per channel current

individually isolated selectable

per channel

Output channels Not applicable 2 current outputs, not 4 current outputs, not 4 voltage outputs, not 2 current outputs, not

per module individually isolated individually isolated individually isolated individually isolated

Backplane current 25mA at 5Vdc 55mA at 5Vdc 55mA at 5Vdc 55mA at 5Vdc 55mA at 5Vdc

draw 88mA at 24Vdc 145mA at 24Vdc 195mA at 24Vdc 145mA at 24Vdc 115mA at 24Vdc

External 24Vdc Not applicable Not applicable 24 ±10% at 195mA 24 ±10% at 145mA -

power supply (21.6 to 26.4Vdc) (21.6 to 26.4Vdc)

tolerance

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1746-NT4 Thermocouple /mV moduleThe thermocouple/mV module receives and stores digitallyconverted thermocouple and/or dc millivolt (mV) analogdata into its image table for retrieval by all fixed and modularSLC 500 processors.

The 1746-NT4 module converts input signals from thefollowing input types.

Features

Cold-junctioncompensation and linearization

Four selectable filters

Individual channel configuration

Benefits

Provides accurate processdigital temperaturereadings

Allows you to tailor systemresponse to yourenvironment

Allows you to mix millivoltand thermopcouple types

Thermocouple temperature ranges

dc millivolt input ranges

Millivolt Range Accuracyinput type (Max. error at 25°C/77°F)

±50mV -50mVdc to +50mVdc 50µV

±100mV -100mV to +100mVdc 50µV

Type of °C Temperature °F Temperature Accuracythermocouple range range (Max. error atinput 25°C/77°F)

Type J -210°C to 760°C -346°F to 1400°F ±1.06°C

Type K -270°C to 1370°C -454°F to 2489°F ±1.72°C

Type T -270°C to 400°C -454°F to 752°F ±1.43°C

Type E -210°C to 1000°C -454°F to 1832°F ±0.72°C

Type N 0°C to 1300°C 32°F to 2372°F ±1.39°C

Type R 0°C to 1768°C 32°F to 3214°F ±3.59°C

Type S 0°C to 1768°C 32°F to 3214°F ±3.61°C

Type B 300°C to 1820°C 572°F to 3308°F ±3.12°C

(0) IN 0+

(1) IN 0-

(2) ANL COM

(3) IN 1+

(4) IN 1-

(5) ANL COM

(6) IN 2+

(7) IN 2-

(8) ANL COM

(9) IN 3+

(10) IN 3-

(11) ANL COM

INPUT

POWER

ANALOG

(0) IN 0+

(1) IN 0-

(2) ANL COM

(3) IN 1+

(4) IN 1-

(5) ANL COM

(6) NOT USED

(7) OUT 0

(8) ANL COM

(9) NOT USED

(10) OUT 1

(11) ANL COM

OUTPUT INPUT

POWER

ANALOG

(0) +24Vdc

(1) DC COM

(0) IN 1+

(1) IN 1-

(2) ANL COM

(3) NOT USED

(4) OUT 0

(5) ANL COM

(6) NOT USED

(7) OUT 1

OUTPUT

POWER

ANALOG

INPUT

CHANNELSTATUS 1 3

0 2

CJC A+DO NOTREMOVE

CJC A-DO NOTREMOVE

SHIELD

SHIELD

SHIELD

SHIELD

SHIELD

CJC B-DO NOTREMOVE

CJC B+DO NOTREMOVE

CHLD+

CHLD-

CHLD1+

CHLD1-

CHLD2+

CHLD2-

CHLD3+

CHLD3-

ANALOGCOM

CJC A+DO NOTREMOVE

INPUT

CHANNELSTATUS 1 3

0 2

CJC A+DO NOTREMOVE

CHL 0RTD

SHIELD

SHIELD

CHL 0SENSE

CHL 0RETRN

CHL 2RTD

CHL 2SENSE

CHL 2RETRN

SHIELD

CHL 1RTD

SHIELD

SHIELD

CHL 1SENSE

CHL 1RETRN

CHL 3RTD

CHL 3SENSE

CHL 3RETRN

SHIELD

1746-NI4 1746-NIO4I 1746-NO4I-NO4V 1746-NT4 1746-NR4

Thermocouple specifications

Specification Description

Backplane current draw5Vdc 60mA24Vdc 40mA

Temperature scale resolution(selectable)

°C of °F and 0.1°C or 0.1°F

Millivolt scale resolution(selectable)

0.1 millivolt and 0.01 millivolt (mV)

Open circuit method Upscale

Input step response 300ms at 10Hz60ms at 50Hz50ms at 60Hz12ms at 250Hz

Thermocouple linearization IPTS-68 standard, NBS MN-125,NBS MN-161

Maximum cable impedance 25Ohms max. loop impedance for <1LSB error

Calibration Autocalibration at power-up and when a channel is enabled

Isolation 500Vdc continuous between inputs and chassis ground, and between inputs and backplane

Isolation between channels None

Maximum channel-to-channel 2V amximum between any twocommon-mode seperation channels (series B) 1 «

Recommended cable

for thermocouple inputs Appropriate shielded thermocouple extension wire 2 «

for mV inputs Belden #8761 or equivalent(shielded twisted pair)

Maximum wire size Two 14 AWG wires per terminal

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1 « Allows use with a single or multiple grounded thermocouples as long asthe grounds are withim 2V of each other. Series A modules offer zerovolts separation and can be used with a single grounded thermocouple.Both series A or B can be used with multiple ungrounded themselves.

2 « Refer to the thermocouple manufacturer for the correct extension wire.

1746-NR4 RTD/resistance input moduleThe RTD/resistance input module enhances the presenttemperature control capabilities of your SLC 500 fixed ormodular system by providing the capability to interface with12 different RTDs and 4 different direct resistance ranges.RTDs are known for their accuracy, repeatability, linearity,and long-term stability.

Features

Module interfacecapability with a numberof different RTDs

Two selectable excitationcurrent levels (0.5 and2mA)

Four selectable filters

Individual channelconfiguration

Benefits

Allows you to choose thebest RTD for yourtemperature application

Provides capability to limitRTD self heating and toprovide greatertemperature accuracy

Allows you to tailor systemresponse to yourenvironment

Allows you to mix RTD andresistance device types

RTD temperature ranges, resolution and repeatability

1 « The temperature range for the 1000Ω RTD is dependant on the excitation current.2 « The digits following the RTD type represent the temperature coefficient of resistance (α), which is defined as the resistance change per Ohm per ˚C. For

instance, platinum 385 refers to a platinum RTD with α = 0.00385 Ohms/Ohm =˚C or simply 0.00385/˚C.3 « Actual value at 0˚C (32˚F) is 19.042Ω per SAMA standard RC21-4-19664 « To maximise the relatively small RTD signal, only 2mA excitation current is allowed.5 « Actual value at 0˚C (32˚F) is 100Ω per DIN standard.6 « Minco Type ‘NA’ and Minco Type ‘FA’ (Nickle-Iron).

RTD Type Temp. Range Temp.Range Resolution Repeatability

(0.5mA Excitation) 1 « (2.0mA Excitation) 1 «

100Ω-200˚C to +850˚C -200˚C to +850˚C 0.1˚C ±0.2˚C(-328˚F to +1562˚F) (-328˚F to +1562˚F) (0.2˚F) (±0.4˚F)

200Ω-200˚C to +850˚C -200˚C to +850˚C 0.1˚C ±0.2˚C(-328˚F to +1562˚F) (-328˚F to +1562˚F) (0.2˚F) (±0.4˚F)

Platinum (385) ➁

500Ω-200˚C to +850˚C -200˚C to +850˚C 0.1˚C ±0.2˚C(-328˚F to +1562˚F) (-328˚F to +1562˚F) (0.2˚F) (±0.4˚F)

1000Ω-200˚C to +850˚C -200˚C to +240˚C 0.1˚C ±0.2˚C(-328˚F to +1562˚F) (-328˚F to +464˚F) (0.2˚F) (±0.4˚F)

100Ω-200˚C to +630˚C -200˚C to +630˚C 0.1˚C ±0.2˚C(-328˚F to +1166˚F) (-328˚F to +1166˚F) (0.2˚F) (±0.4˚F)

200Ω-200˚C to +630˚C -200˚C to +630˚C 0.1˚C ±0.2˚C(-328˚F to +1166˚F) (-328˚F to +1166˚F) (0.2˚F) (±0.4˚F)

Platinum (3916)➁

500Ω-200˚C to +630˚C -200˚C to +630˚C 0.1˚C ±0.2˚C(-328˚F to +1166˚F) (-328˚F to +1166˚F) (0.2˚F) (±0.4˚F)

1000Ω-200˚C to +630˚C -200˚C to +630˚C 0.1˚C ±0.2˚C(-328˚F to +1166˚F) (-328˚F to +1166˚F) (0.2˚F) (±0.4˚F)

Copper (426) ➁ ➂ 10Ω Not allowed ➃ -100˚C to +260˚C 0.1˚C ±0.2˚C(-148˚F to +500˚F) (0.2˚F) (±0.4˚F)

Nickel (618)➁ ➄ 120Ω-100˚C to +260˚C -100˚C to +260˚C 0.1˚C ±0.1˚C(-148˚F to +500˚F) (-148˚F to +500˚F) (0.2˚F) (±0.2˚F)

Nickel (672) ➁ ➅ 120Ω-80˚C to +260˚C -80˚C to +260˚C 0.1˚C ±0.1˚C

(-112˚F to +500˚F) (-112˚F to +500˚F) (0.2˚F) (±0.2˚F)

Nickel Iron (518)➁ ➅ 604Ω-100˚C to +200˚C -100˚C to +200˚C 0.1˚C ±0.1˚C(-148˚F to +392˚F) (-148˚F to +392˚F) (0.2˚F) (±0.2˚F)

18

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RTD accuracy and temperature drift specifications

1 « The accuracy values assume that the module was calibrated within the specified temperature range of 0˚C to 60˚C (32˚F to 140˚F).2 « The temperature drift specifications apply to a module that has not been calibrated.3 « Module accuracy, using 100Ω or 200Ω platinum RTDs with 0.5mA excitation current, depends on the following criteria:

(a) Module accuracy is ±0.6˚C after you apply power to the module or perform an autocalibration at 25˚C (77˚F) ambient with module operating temperaturebetween 0˚C to 60˚C (32˚F to 140˚F).

(b)Module accuracy is ± (0.6˚C + ∆T X 0.034˚C/˚C) after you apply power to the module or perform an autocalibration at 25˚C (77˚F) ambient with themodule operating temperature between 0˚C to 60˚C (32˚F to 140˚F).

- where ∆T is the temperature difference between the actual operating temperature of the module and 25˚C (77˚F) and 0.034˚C/˚C is the temperature driftshown in the table above for 100Ω or 200Ω platinum RTDs.

(c) Module accuracy is ±1.0˚C after you apply power to the module or perform an autocalibration at 60˚C (140˚F) ambient with module operatingtemperature at 60 ˚C.

4 « The digits following the RTD type represent the temperature coefficient of resistance (α), which is defined as the resistance change per Ohm per ˚C. Forinstance, Platinum 385 refers to a platinum RTD with α + 0.00385 Ohms/Ohm - ˚C or simply 0.00385 / ˚C.

5 « Actual value at 0˚C (32˚F) is 9.042Ω per SAMA standard RC21-4-1966.6 « To maximise the relatively small RTD signal, only 2mA excitation current is allowed.7 « Actual value at 0˚C (32˚F) is 100Ω per DIN standard.

Resistance input specifications

1 « The accuracy values assume that the module was calibrated within the specified temperature range of 0˚C to 60˚C (32˚F to 140˚F).2 « The accuracy for 150Ω is dependant on the excitation current: ±0.2Ω at 0.5mA, ±0.15Ω at 2.0mA.3 « The temperature drift for 150Ω is dependant on the excitation current: ±0.006Ω/˚C at 0.5mA, ±0.004Ω at 2.0mA.

Input type Resistance range Resistance range Accuracy 1 « Temperature drift Resolution Repeatability

(0.5mA Excitation) (2.0mA Excitation)

150Ω 0Ω to 150Ω 0Ω to 150Ω 2 « 3 « 0.01Ω ±0.04Ω

500Ω 0Ω to 500Ω 0Ω to 500Ω ±0.5Ω±0.014Ω/˚C 0.1Ω ±0.2Ω

(±0.025Ω/˚F)

Resistance1000Ω 0Ω to 1000Ω 0Ω to 1000Ω ±1.0Ω

±0.029Ω/˚C 0.1Ω ±0.2Ω(±0.52Ω/˚F)

3000Ω 0Ω to 3000Ω 0Ω to 1900Ω ±1.5Ω±0.043/˚C 0.1Ω ±0.2Ω

(±0.077Ω/˚F)

RTD Type Accuracy➀ Accuracy➀ Temperature drift➁ Temperature drift➁

(0.5mA Excitation) (2.0mA Excitation) (0.5mA Excitation) (2.0mA Excitation)

100Ω±1.0˚C➂ ±0.5˚C ±0.34˚C/˚C ±0.014˚C/˚C

(±2.0˚F) (±0.9˚F) (±0.061˚F/˚F) (±0.025˚F/˚F)

200Ω±1.0˚C➂ ±0.5˚C ±0.34˚C/˚C ±0.014˚C/˚C

(±2.0˚F) (±0.9˚F) (±0.061˚F/˚F) (±0.025˚F/˚F)Platinum (385) 2 «

500Ω±0.6˚C ±0.5˚C ±0.017˚C/˚C ±0.014˚C/˚C

(±1.1˚F) (±0.9˚F) (±0.031˚F/˚F) (±0.025˚F/˚F)

1000Ω±0.6˚C ±0.5˚C ±0.017˚C/˚C ±0.014˚C/˚C

(±1.1˚F) (±0.9˚F) (±0.031˚F/˚F) (±0.025˚F/˚F)

100Ω±1.0˚C➂ ±0.4˚C ±0.034˚C/˚C ±0.011˚C/˚C

(±2.0˚F) (±0.7˚F) (±0.061˚F/˚F) (±0.020˚F/˚F)

200Ω±1.0˚C➂ ±0.4˚C ±0.034˚C/˚C ±0.011˚C/˚C

(±2.0˚F) (±0.7˚F) (±0.061˚F/˚F) (±0.020˚F/˚F)Platinum (3916)

➃

500Ω±0.5˚C ±0.4˚C ±0.014˚C/˚C ±0.011˚C/˚C

(±0.9˚F) (±0.7˚F) (±0.025˚F/˚F) (±0.020˚F/˚F)

1000Ω±0.5˚C ±0.4˚C ±0.014˚C/˚C ±0.011˚C/˚C

(±0.9˚F) (±0.7˚F) (±0.025˚F/˚F) (±0.020˚F/˚F)

Copper (426)➃ ➄ 10Ω

Not allowed➅ ±0.6˚C

Not allowed➅ ±0.017˚C/˚C

(±1.1˚F) (±0.031˚F/˚F)

Nickel (618)➃ ➆

120Ω±0.2˚C ±0.2˚C ±0.008˚C/˚C ±0.005˚C/˚C

(±0.4˚F) (±0.4˚F) (±0.014˚F/˚F) (±0.014˚F/˚F)

Nickel (672)➃

120Ω±0.2˚C ±0.2˚C ±0.008˚C/˚C ±0.005˚C/˚C

(±0.4˚F) (±0.4˚F) (±0.014˚F/˚F) (±0.014˚F/˚F)

Nickel Iron (518)➃

604Ω±0.3˚C ±0.3˚C ±0.010˚C/˚C ±0.010˚C/˚C

(±0.5˚F) (±0.5˚F) (±0.018˚F/˚F) (±0.018˚F/˚F)

RTD SpecificationsBackplane current draw

5Vdc____________________________________ 50mA24Vdc __________________________________ 50mA

Temperature scale resolution(selectable)________________ 1˚C or 1˚F and 0.1˚C or 0.1˚FResistance scale resolution(selectable) __________ 1Ω or 0.1Ω for all resistance ranges

In addition, 0.01Ω for 150Ω rangeRTD excitation current____________ Two current values are

user-selectable (0.5mA and 2.0mA) 1 «

Open circuit or shortcircuit method ______________ Zero, upscale or downscaleInput step response:

________________________________ 300ms at 10Hz_________________________________ 60ms at 50Hz_________________________________ 50ms at 60Hz________________________________ 12ms at 250Hz

Cable impedance (max.) ________________ 25Ω maximumper 1000 feet

Wire size (max.) ________ Two 24 AWG wires per terminalCalibration ________________ Autocalibration at power-up

and when a channel is enabledIsolation between channels ______________________ NoneIsolation______________ 500Vdc continuous between inputs

and chassis ground, and betweeninputs and backplane

Common mode voltage seperation ______________ ±1 volt

1 « Refer to the current recommendations of the RTDmanufacturer to determine the best current source foryour application.

7.5.2 High-speed counter moduleThe high-speed counter module provides bidirectionalcounting of high-speed inputs from quadrature encoders andvarious high-speed switches. This single channel acceptsinput pulse frequencies of up to 50 kHz, allowing precisecontrol of fast motions. This module is compatible with theSLC 5/02 processor.In addition to providing an Accumulated Count, the moduleprovides the Rate Measurement indicating the pulsefrequency in Hertz (Hz). The Rate Measurement isdetermined by accumulating input pulses over a fixed periodof time. The dynamically configurable Rate Period rangesfrom 10 milliseconds to 2.55 seconds.

Input and Output Terminals

Hinged Wiring Terminal Door with Label

OUTPUT INPUT

VDC

OUT 0

OUT 1

OUT 2

OUT 3

DC COM

A+

B+

A-

B-

Z+

LS/24VDC

Z-

LS/12VDC

LS COM

LS/5VDC

FAULT

HSCE

Color-coded Removable Terminal Block

I/O Status Indicators

Terminal Block Release Screws

0123

4567

AB

ZLS

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Features Three modes of operation (Range, Rate, and Sequencer)

that allow you to select the best mode to fit yourapplication.

Four on-board open collector outputs that allow controlindependent of the SLC processor scan by the module.

SpecificationBackplane current draw

5Vdc __________________________________ 320mA24Vdc _________________________________ 0.0mA

Noise immunity ______________ NEMA Standard ICS 2-230Environmental conditions

Operating temp. ____ -0° to +60°C (+32° to +140°F) Storage temp. ______ -40° to +85°C (-40° to +185°F)Humidity rating________ 5 to 95% (non-condensing)

Max. input frequencySequencer and range ____________________ 50kHzRate ________________________________ 32.767kHz

7.5.3 DH-485/RS-232C interface moduleThe DH-485/RS-232C interface module provides a bridgebetween the DH-485 communication network and RS-232using DFI communication protocol. When used in a SLC 500chassis with a modem, you can: Remotely program and troubleshoot any single SLC 500

processor Remotely collect data directly from the data table of any

SLC 500 processor Use the SLC 500 as a remote terminal unit.

Features It can provide you with local or remote access to examine

ladder programs, monitor program operation, and makechanges if necessary

By providing a modem connection into your DH-485 network, it makes troubleshooting installationsover the telephone lines possible!

It is ideally suited for SCADA/RTU applications wherepoint-to-point communications is required

It has a configuration and a DFI serial port that eachaccommodate RS-232/423, RS-422, and RS-485communications

It is easily configured using either backplanecommunication or an ASCII terminal, and it installsdirectly into the SLC 500 chassis

It has a real time clock that can be used by the SLCprocessor in conjunction with normal operation

12

345

6789

12

345

6789

CONFIG

DF1

DH485

Configuration Port

DF1 Port

DH-485 Port

LEDsDH-485/RS-232C

Door Label

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It allows connection from a DH-485 network device to asingle DFI device.

SpecificationOperating temp. __________ -0° to +60°C (+32° to +140°F)Environmental conditions

Storage temp. ______ -40° to +85°C (-40° to +185°F)Relative humidity ______ 5 to 95% (non-condensing)

Power consumption ________ 5Vdc voltage requires .150A24Vdc voltage requires .040A

Important: The 1747-KE module requires both 5Vdc and24Vdc power from the SLC backplane. Thepower consumption of the module must be takeninto consideration when planning your SLC 500system. Refer to the documentation supplied withyour SLC 500 fixed or modular controller foradditional information on power supplies andcurrent requirements.

7.6 Programmers and operator interfaceThe following section describes two types of programmingoptions available for the SLC 500. The first is the AdvancedProgramming Software (APS) and the second is the Hand-Held Terminal (HHT).

7.6.1 APSThe Advanced Programming Software (APS) v5.01 and later,enables you to program the SLC 500 family processorsusing an IBM-AT/XT or compatible personal computer.Included in the APS software is the APS Import/Export Utility(APSIE). This software utility allows you to convert APSarchive files and program documentation into ASCII text filesand vice versa.

FeaturesFull-line processor support to program any SLC 500 fixed,SLC 5/01, SLC 5/02, SLC 5/03 and SLC504 modularprocessors Command line entry of instructions and parameters

provides time-saving key strokes On-line context-sensitive help provides quick access to

instructions and status file information Cut, copy, and paste editor permits ladder logic to be re-

used Search and replace allows quick modification of ladder

logic to match unforeseen hardware changes DH-485 and DFI support provides a variety of

communication options to meet your applicationrequirements

Runtime online editing allowing entry of programs anddata while online in Run mode when using a SLC 5/03 orlater processor

System autoconfiguration automatically reads systemconfiguration information (including I/O and chassisdata), saving you valuable save time.

SpecificationComputer ________________ 3.0Mbyte of hard drive spaceHardware 640Kbyte RAM, min. 550 Kbyte free at

execution. Extended or expandedmemory recommended,

but not requiredOperating system __________________ DOS 3.1 and higherPrinter interface ______________Parallel or serial 80, 132 or

255 columns

SLC-500 ADVANCED PROGRAMMING SOFTWARE RELEASE 3.00

Allen-Bradley Company, Copyright 1991

1747-PA2E

All Rights Reserved

This software is licensed to: Your name Your company name 000000000000

Display Area

MessagePrompt Press a function key

Data EntryStatus

Main FunctionsONLINE CONFIG

ONLINE OFFLINE CONFIG

WHO SYSTEM CONFIGR

FILE OPTIONS

PRINT REPORTS

SYSTEM UTILS

EXIT SYSTEM

OFFLINE PRG/DOC

F1 F2 F3 F4 F5 F6 F7 F8 F9 F10

Tue Jul 24, 1991 Current Offline File: 09 11:03:09 am

Terminal Address: 0 Current Device: 1747-PIC (DH-485) Proc Address:1

Example of software screen for APS Versiopn 3.00

Additional features for APS Version 6.00 640Kbytes of RAM (a minimum of 2Mb of extended

memory is required; 3Mb are required for programminga 1747-L543 processor.)

10Mb fixed-disk drive (APS requires 7.5Mb of free diskspace).

MS DOS version 3.3 or higher (INTERCHANGE™requires MS DOS version 5.0 or higher).

For operation using Microsoft® Windows™ : Windowsversion 3.1 or Windows for Workgroups version 3.11.

APS 6.0 is not supported on the following operating systems: Windows 95 1 «

Microsoft Windows NT™ 351 IBM OS/2 IBM OS/2 WARP

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1 « Rockwell Software does not recommend the use of APS 6.0 in theWindows 95 operating system. APS 6.0 was not designed for specificWindows 95 compatibility, nor has a complete set of tests within thisoperating system been completed at the time of the APS 6.0 release.However, if you still want to attempt to operate in the Windows 95operating system, there is some background information provided foryou in the APS ReadMe file.

The amount of free conventional RAM that APS requiresdepends on what communication drivers you want to load.If you want to load :

Only the stand alone communications drivers

300Kb

Microsoft Windows drivers(INTERCHANGE software)

369Kb

SLC-500 ADVANCED PROGRAMMING SOFTWARE RELEASE 6.00

Rockwell Software Incorporated, Copyright 1989-1995

9323-PA2E

All Rights Reserved

This software is licensed to: Your nameYour company name000000000000

Press a function key

ONLINECONFIG

ONLINE OFFLINECONFIG

WHO SYSTEMCONFIGR

FILEOPTIONS

PRINTREPORTS

SYSTEMUTILS

EXITSYSTEM

OFFLINEPRG/DOC

F1 F2 F3 F4 F5 F6 F7 F8 F9 F10

Fri Nov 24, 1995 Current Offline File: DEFAULT 11:03:09 am

Terminal Address: 0 Current Device: 1747-PIC (DH-485) Proc Address:1

Example of software screen for APS Version 3.00

Exiting the system : You can exit APS software snd return to Windows by accessing the APS

menu and pressing

EXIT

SYSTEM

If you want to load You need

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7.6.2 HHTThe Hand-Held Terminal (HHT) v2.03 is a powerful portableprogramming platform used to configure the SLC 500 fixed,SLC 5/01, and the SLC 5/02 processors, enter or modify anapplication program, monitor the execution of theapplication program in real-time, or troubleshoot anapplication program. The HHT accepts programs with amaximum data table size of 6K. Each rung may contain up to127 instructions. This differs from APS which has a maximumdata table size of 16K and each rung can contain 128instructions.The programming memory pack is interchangeable andavailable in four languages. Note that the HHT does notsupport nested branching or conditional output branches.

Features

Rugged construction designed for a variety of industrialenvironments

Menu-driven firmware displays step-by-step directions LCD display shows up to five rungs of ladder logic at one

time ZOOM function displays detailed instruction information Formatted display shows PID and MSG instructions.

SpecificationDisplay 8 line 3 40 character super-twist

nematic LCDKeyboard ____________________________________ 30 keysOperating power ______________ 0.105A (max.) at 24VdcEnvironmental conditions

Operating temp.__________ 0 to +40°C (+32 to +104°F)Storage temp. __________ -20° to +65°C (-4 to +149°F)Humidity range __________ 5 to 95% (non-condensing)

Display Area

Calculator-style, Color-coded Keyboard

7.6.3 DTAMThe Data Table Access Module (DTAM™) aids in accessinginformation and monitoring an SLC 500 control system at theplant floor level. Designed to mount in an enclosure door, theDTAM allows you to access data file information, changeoperating modes, monitor and clear processor faults, andtransfer memory from or to a EEPROM on any SLC 500, or SLC 5/01, SLC 5/02 or SLC 5/03 processor. Interactivemessaging is also supported between the DTAM and theSLC 5/02 or SLC 5/03 processor.

Features DH-485 network compatible communicating with up to 31

controllers, one at a time, up to 1219m (4000ft). Data monitor or modify permitting data values to be

changed in the Run or Program mode. Quick recall macros store frequently used address

locations, saving time and simplifying application set-upand modification.

Auto-attach mode automatically initiates communicationwith the last attached processor after a power cycle,saving costly down time and reducing key strokes.

On-board module configuration provides non-volatileEEPROM memory for easy on-site module set up.

Multilingual display provides selectable operatorprompting in any of six languages.

Backlit LCD display allows easy viewing in all lightingconditions.

MSG instructions response allows interaction between theoperator and the ladder program. The SLC 5/02, SLC 5/03or SLC 5/04 ladder program directs the dialog.

SpecificationDisplay ________________ 2 line 3 16 character super-twist

__________________nematic LCD with LED backlightingKeyboard ________________ 19 keys with tactile feedbackOperating power________________ 0.104A (max.) at 24VdcEnvironmental conditions

Operating temp. ________ 0 to +55°C (+32° to +131°F)Storage temp.____________ -20° to 65°C (-4° to +149°F)Humidity range __________ 5 to 95% (non-condensing)

Certification ___________________UL listed, CSA approved.Meets NEMA type 12 and 13

enclosure applications

Mode/Status Indicator

LCD Display

Keypad

7.7 Chassis and cables

7.7.1 ChassisImportant: The first slot of the first chassis in a modular

system is always reserved for the processormodule.

Description – The chassis houses the processor and the I/Omodules. The power supply mounts on the left side of thechassis. Chassis do not include interconnect cables. Allcomponents easily slide into the slots along guides formed inthe chassis top and bottom. No tools are required to insert orremove the processors, I/O modules, or communicationmodules. The 2-slot expansion chassis is only used with afixed controller.2-Slot Expansion Chassis – The 20, 30 and 40 I/O fixedhardware style units accept a 2-slot expansion chassis. Theexpansion chassis mounts on the right side of the processorwithout mounting hardware.

Features

Modules easily slide into chassis slots. No tools arerequired for module installation.

Up to 3 chassis can be interconnected. Locally theprocessor can address up to 30 slots.

Three chassis sizes are available to choose from.Selection can be suited to your system I/O requirements.

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19527

7.7.2 CableThe cables are “keyed” for proper installation. The end ofthe cable that plugs into the right socket in the chassis has the“key” on the top of the connector. The opposite end of thecable has the “key” on the inside of the connector forinsertion into the expansion chassis.To remove the cable, move the tabs on the socket outwardand connector will pop out.

Features

914.4mm (36 inch) Chassis Interconnect Cable – Thiscable is used when linking modular hardware stylechassis from 152.4mm (6 inches) up to 914.4mm (36inches) apart in an enclosure.

ATTENTION: The expansion cable must alwaysexit the right end of the chassis with theprocessor. Refer to the following figures.

P S

C P U

P S

P S

C P U

P S

P S

C P U

P S

P S

C P U

P S

Chassis 1

Chassis 2 CORRECT INSTALLATION

Chassis 2 INCORRECT INSTALLATION

Chassis 2 INCORRECT INSTALLATION

Chassis 2 INCORRECT INSTALLATION

Chassis 1

Chassis 1

Chassis 1

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7.8 Memory modules and accessories

7.8.1 Memory modules for fixed SLC 5/01 & SLC 5/02

These optional memory modules provide a non-volatilememory in convenient modular form. The modules plug intoa socket on the processor. You can store (save) yourprogram in the EEPROM by inserting the module into theprocessor and using either the Hand-Held Terminal orAdvanced Programming Software. You can also load (read)a program from the EEPROM into the processor RAM.

Features

Use of the UVPROM provides you an extra degree ofprogram security.

The UVPROM is compatible with commercially availableUVPROM programming and erasing equipment.

Memory modules for SLC 5/03 & SLC 5/04

The memory module for the SLC 5/03 and SLC 5/04processors is called a flash EPROM (Flash ErasableProgrammable Read Only Memory). Flash EPROMscombine the programming versatility of EEPROMs with thesecurity precautions of UVPROMs. This means that you havethe option of leaving your EPROM programs write protectedor unprotected. Write protect the EPROM using either yoursoftware or a PROM programmer.The memory modules consist of a Flash EPROM mounted ona circuit board with a connector and plastic housing. Thereare 2 memory modules acailable that backup up to 32K or64K user memory.

Socket

7.8.2 Card slot fillerUse these fillers in empty chassis slots to protect equipmentfrom dust or debris.

7.8.3 BatteryIn the SLC fixed style and 1K version SLC 5/01, back-uppower for RAM is provided by a capacitor that will retain thecontents of the RAM for a period of 5 to 30 days. Forapplications requiring memory back-up for a longer periodof time an optional replaceable battery, Catalogue Number1747-BA, is required. The lithium battery provides back-upfor approximately five years. A red BATTERY LOW LED turnson when the battery voltage has fallen below a thresholdlevel.

In the SLC modular style (SLC 5/01 4K version, SLC 5/02, SLC5/03 and SLC 5/04), back-up power for RAM is provided bya replaceable battery. The lithium battery provides back-upfor approximately five years for the 1747-L511 and two yearsfor the 1747-L514, 1747-L524, 1747-L532 and 1747-L541.A red BATTERY LOW LED alerts you when the batteryvoltage has fallen below a threshold level.

LAS

ER

Lithium

White Lead

Red Lead

Battery Connector

Retainer Clips

CPU

Battery Connector

Red Lead

Retaining Clips

White Lead

8. SLC application examples8.1 Application: High-speed position sensing

Operation Incremental encoder/high-speed counter (HSCE) tracks

position of aspirin boxes on the conveyor line. When photo-switch senses box, high-speed counter starts

counting. A given number of counts later, when the box iscentred over the ink-jet printer, the HSCE triggers theprinter to print the date code onto the box.

Boxes are counted and stacked inside of the shrink-wrapmachine by the SLC. When the SLC has counted theproper number of boxes (via photo-switch inside of theshrink-wrap machine), it triggers the machine to wrap.

Product features HSCE runs its own control profile independent of the

program running in the SLC 5/02 processor – the onlyladder logic programming needed is to download thecontrol profile to the HSCE. The ink-jet printer is triggeredby output on board the HSCE card.

Discrete input and output cards provide an interface to awide variety of switches, sensors, and actuators.

System requirements RS stock no.1 1746-A4 chassis 817-9651 1746-P1 power supply 817-6901 1747-L524 SLC 5/02 CPU 817-6561 1746-HSCE high-speed counter module 817-8141 1746-IB16 16-point DC input card 817-7291 1746-OB16 16-point DC output card 817-757

Shrink-wrap Machine

Photo-switch Incremental Encoder

Ink-jet Printer Date Code

SLC 5/02

HSCEIB16

OB16

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8.2 Application: Remote dial-up of an SLCOperation The SLC 5/02 system controls the operation of a machine. The PC can dial into the processor to extract data about

the system. Also, if the PC is running APS software, it canmonitor or change the program in each of the SLCs in thesystem.

Product features The KE module allows remote dial-up capability to SLC

processors. Upload and download programs or monitor system

operations remotely using APS software. Monitor system over telephone lines using operator

interface software designed to communicate with the KE.

System requirements RS stock no.1 1746-A4 chassis 817-9651 1746-P1 power supply 817-6901 1747-L524 SLC 5/02 CPU 817-6561 1746-KE RS-232 communications card 817-8202 Hayes compatible auto-answer modems -

KE Interface Module

Machine

Modem

Modem

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8.3 Application: PID temperature control

Operation Operator enters bath temperature from DTAM. Temperature sensor converts bath temperature to 4-20

mA signal. PID instruction in SLC 5/02 monitors bath temperature and

controls variable heater (via 4-20 mA signal) to keep bathtemperature constant.

Product features SLC 5/02 processor has integral PID instruction – no need

for additional PID card. Analogue input card has 4 input channels that are

individually configurable for either voltage or current. DTAM operator interface enables operator to monitor and

change data values in any SLC processor.

System requirements RS stock no.1 1746-A4 chassis 817-9651 1746-P1 power supply 817-6901 1747-L524 SLC 5/02 CPU 817-6561 1746-NI4 analogue input module 817-7851 1746-NO4I analogue output module

– current output 817-7911 1747-DTAM operator interface 817-836

SLC 5/02

DTAM

Heater Amplifier

Variable Heater

Temperature Sensor

NI4

NO4I

9. General installation requirements9.1 Loading and installation9.1.1 Considerations for safetySafety considerations are an important element of propersystem installation. Actively thinking about the safety ofyourself and others, as well as the condition of yourequipment, is of primary importance. Several safety areasare discussed below.

Disconnecting main powerThe main power disconnect switch should be located whereoperators and maintenance personnel have quick and easyaccess to it. Ideally, the disconnect switch is mounted on theoutside of the enclosure, so that it can be accessed withoutopening the enclosure. In addition to disconnecting electricalpower, all other sources of power (pneumatic and hydraulic)should be de-energised before working on a machine orprocess controlled by an SLC controller.

Safety circuitsCircuits installed on the machine for safety reasons, likeovertravel limit switches, stop push buttons, and interlocks,should always be hard-wired directly to the master controlrelay. These devices must be wired in series so that whenany one device opens, the master control relay is de-energised thereby removing power to the machine. Neveralter these circuits to defeat their function. Serious injury ormachine damage could result.

Power distributionThere are some points about power distribution that youshould be aware of. First, the master control relay must beable to inhibit all machine motion by removing power to themachine I/O devices when the relay is de-energised.Second, if you are using a dc power supply, interrupt theload side rather than the ac line power. This avoids theadditional delay of power supply turn-on and turn-off. The dcpower supply should be powered directly from the fusedsecondary of the transformer. Power to the dc input andoutput circuits is connected through a set of master controlrelay contacts.

Periodic testing of a master control relay circuitAny part can fail, including the switches in a master controlrelay circuit. The failure of one of these switches would mostlikely cause an open circuit, which would be a safe power-offfailure. However, if one of these switches shorts out, it nolonger provides any safety protection. These switchesshould be tested periodically to assure they will stopmachine motion when needed.

Emergency-stop switchesAdhere to the following points concerning emergency-stopswitches: Do not program emergency-stop switches in the

controller program. Any emergency-stop switch shouldturn off all machine power by turning off the master controlrelay.

Observe all applicable local codes concerning theplacement and labelling of emergency-stop switches.

Install emergency-stop switches and the master controlrelay in your system. Make certain that relay contactshave a sufficient rating for your application. Emergency-stop switches must be easy to reach.

The figure below shows the master control relay (MCR)wired in a grounded system.

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Input states on power downThe power supply hold-up time as described above isgenerally longer than the turn-on and turn-off times of theinput modules. Because of this, the input state change from“On” to“Off” that occurs when power is removed may berecorded by the processor before the power supply shutsdown the system. Understanding this concept is important. The user programshould be written to take this effect into account. Forexample, hard wire power to one spare input. In the userprogram, check to be sure that one input is on; otherwise,jump to the end of the program and avoid scanning the logic.Use of a common power source as recommended in theprevious section is assumed.

9.2 Installation environmentThe SLC 500 processors are designed to operate in anindustrial environment. To keep the processor running asreliably as possible, install all processors in a manner thatprovides protection from various corrosive agents such asdirt, grease, and falling debris, particularly electricallyconducting material.The following figure depicts acceptable spacing layouts.Follow the recommended minimum spacing to allow forconvection cooling within the enclosure. Cooling air in theenclosure must be kept within a range of 0° to +60°C (32°Fto +140°F).Important: Be careful of metal chips when drilling

mounting holes for the controllers. Do not drillholes above a mounted SLC 500 controller.

L1 L2

230 V ac

Disconnect

Isolation Transformer

X1 X2115 V ac

Fuse StartStop

Overtravel Limit Switch

Emergency-Stop Push Button

Operation of either of these contacts will remove power from the controller external I/O circuits, stopping machine motion.

MCR

Suppr.MCR

MCR

230 V ac I/O Circuits

MCRFuse

115 V ac I/O Circuits

Suppressor

Master Control Relay (MCR)

MCR

24 V dc I/O Circuits

Incoming Line Terminals. Connect to 115 V ac terminals of Power Supply.

Incoming line terminals. Connect to 24 V dc terminals of Power Supply.

_ +

DC Power Supply. Use N.E.C. Class 2 for UL Listing.

(Lo) (Hi)

9.1.2 Considerations for powerWe strongly recommend that all chassis power supplieshave the same power source as the input and outputdevices. This helps reduce the chance of electricalinterference due to multiple sources and grounds as well ashelps maintain system integrity if power is interrupted.The processor detects the absence of power to any chassisin the system. If power to any chassis is lost (or not yetapplied), the CPU FAULT LED turns on and all controlleroutputs are de-energised.This fault detection makes it necessary that you apply powerto the expansion chassis before you apply power to thechassis containing the processor to avoid an unwanted fault.Of course, applying power in sequence is unnecessary if allchassis have a common power source.

Loss of power sourceThe chassis power supplies are designed to withstand briefpower losses without affecting the operation of the system.The time the system is operational during power loss iscalled “program scan hold-up time after loss of power.” Theduration of the power supply hold-up time depends on thenumber, type and state of the I/O modules, but is typicallybetween 20 mS and 3 seconds. When the duration of powerloss reaches a limit, the power supply signals the processorthat it can no longer provide adequate dc power to thesystem. This is referred to as a power supply shutdown. Thepower LED is turned off.In multi-chassis systems, power outages of 20 to 300milliseconds in duration can cause a remote power fail errorto occur. You can clear this error by cycling power to yoursystem or by using a programming device.

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Recommended SpacingA. 15.3 to 20 cm (6 to 8 inches) (When using the 1746-C9

cable)B. Greater than 10.2 cm (4 inches)C. Greater than 15.3 cm (6 inches)D. 7.7 to 10.2 cm (3 to 4 inches) (When using the 1746-C7

cable)

9.3 Calculation of heatTo calculate the heat dissipation of your SLC 500 controlleryou must consider two things: The maximum heat dissipated (with field power applied)

by the processor, all I/O and specialty modules, and anyperipheral devices for each chassis.

The maximum load on the power supply of theprocessor, each I/O and specialty module, peripheraldevice, and device drawing power directly off the powersupply via the “POWER OUT” terminals. Then equate thispower supply loading to power supply heat dissipation.

To determine the maximum heat dissipation, use one ofthese methods: Calculated Watts Total Watts.Use calculated Watts if you know exactly how many outputsand input on each card will be active at any given time. Thismethod will give you a lower, more accurate heat dissipation

SLC 500

SLC 500

SLC 500

A

A

B B

C

C

SLC 500

SLC 500

A

B B

D

C

C

SLC 500

calculation than the total Watts method. With this method,first, use the formula below for calculating the heatdissipation of each module. Then use these values in step 1of the worksheet that follows.

(points energised 3 Watts per point) + minimum Watts = heat dissipation of module

Use total Watts if you are not sure how many points on amodule will be energised at any time. Total Watts is the Wattsper point (with all points energised) plus the minimum Watts.

Once you have determined which way you will calculate theheat dissipation of your modules, see the ExampleWorksheet for Calculating Heat Dissipation. This worksheetshows you how to calculate the heat dissipation for theexample SLC control system opposite.

The following table details the total Watts dissipated by themodules and peripheral devices in the above SLC 500controller. The numbers were taken from the power supplyloading table.

① This output card uses 5.5 Watts because only 10 pointsare on at any one time. Using the calculated Watts formu-la–(number of points energised 3 Watts per point) + min-imum Watts = heat dissipation of module – the calculatedWatts for the 1746-OW16 module is 5.5W: (10 points X.033) + 5.17 = 5.5W.

Important: The user power on the 1746-P1 power supply forChassis 2 is being used to power a peripheral(100mA at 24Vdc).

Chassis 2

Slot No. Catalogue No. Min. Watts Max. Watts

Power supply 1746-P1 N/A 17.0

4 1746-IA16 .425 4.8

5 1746-IA16 .425 4.8

6 1746-OW16 5.17 5.5①

7 1746-OW16 5.17 5.7

N/A N/A N/A N/A

Chassis 1

Slot No. Catalogue No. Min. Watts Max. Watts

Power supply 1746-P1 N/A 16.0

0 1747-L511 N/A 1.75

1 1746-BAS 3.75 3.8

2 1746-IA8 .250 2.4

3 1746-OV8 .675 6.9

Periphera1 747-DTAM 2.5 2.5device

Peripheral Device

Slot 0 1 2 3 Slot 4 5 6 7

DTAM Chassis 1 Chassis 2

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Use the table below to calculate the power supply loading foreach chassis you have (step 1 of the worksheet).

30

Use the graphs below for determining the power supplydissipation in step 2 of the worksheet.

1746-P1 Power Supply Change in Power Dissipation due to Output Loading

18

16

14

12

10

8

6

4

2

00 5 10 15 20 25

Power Supply Loading (Watts)

Pow

er S

uppl

y D

issi

patio

n (W

atts

)

1746-P2 Power Supply Change in Power Dissipation due to Output Loading

18

16

14

12

10

8

6

4

2

00 10 20

Power Supply Loading (Watts)

Pow

er S

uppl

y D

issi

patio

n (W

atts

)

20

30 40 50

1746-P3 Power Supply Change in Power Dissipation due to Output Loading

5

00 5 10 15 20 25

Power Supply Loading (Watts)

Pow

er S

uppl

y D

issi

patio

n (W

atts

)

30 35 40

10

15

20

25

Hardware Catalogue Watts per Minimum Maximumcomponent Numbers Point Watts Watts

1747-L20C 0.20 17.4 21.0

1747-L30C 0.20 18.7 24.0

1747-L40C 0.20 19.9 27.0

Processors 1747-L511 N/A N/A 1.75

1747-L514 N/A N/A 1.75

1747-L524 N/A N/A 1.75

1747-L532 N/A 2.90 2.90

1747-L541 N/A 4.00 4.00

1746-IA16 .27 .425 4.80

Input 1746-IB16 .20 .425 3.60

modules 1746-IB32 .20 .530 6.90

1746-IV16 .20 .425 3.60

1746-OA16 .462 1.85 9.30

Output 1746-OB16 .338 1.40 7.60

modules 1746-OB32 0.078 2.26 4.80

1746-OW16 .033 5.17 5.70

1746-OX8 .825 2.59 8.60

1746-N14 N/A 2.17 2.2

Analogue 1746-NIO4I N/A 3.76 3.80

and 1746-NO4I N/A 4.96 5.0

speciality 1746-NO4V N/A 3.78 3.8

modules 1746-NI04V N/A 3.04 3.10

1746-NR4 N/A refer for details

1746-NT4 N/A refer for details

1746-HSCE N/A 1.6 1.6

1747-KE N/A 3.75 3.8

1747-DTAM N/A 2.5 2.5Peripheral

1747-PT1 N/A 2.5 2.5devices

1747-PIC N/A 2.0 2.0

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Example Worksheet for Calculating Heat Dissipation

Procedure: Chassis 1 Chassis 2 Chassis 3 Heat Dissipation1. Calculate the heat dissipation for each chassis without the power supply.

A. Write in the watts (calculated watts or maximum watts) dissipated by the processor, I/O and specialty modules, and any peripheral devices attached to the processor. Then, for each chassis, add these values together.

Chassis 1 Chassis 2 Chassis 3Cat. No. Ht. Dis. Cat. No. Ht. Dis. Cat. No. Ht. Dis.

peripheral devices:

peripheral devices:

Total:

B. Place the heat dissipation for each chassis into the appropriate columns.

2. Calculate the heat dissipation for each power supply.

A. Calculate the power supply loading for each chassis: write in the minimum watts for each device and then, for each chassis, add these values together.Important: If you have a device connected to user power, multiply 24V by thecurrent used. (4.8 W is the maximum watts.) Include user power in the totalpower supply loading.

Chassis 1 Chassis 2 Chassis 3Cat. No. Min.Ht. Dis. Cat. No. Min. Ht. Dis. Cat. No. Min. Ht. Dis.

user power:peripheral devices:peripheral devices:

Total:

B. Use the power supply loading for each chassis to determine the power supply dissipation. Place the power supply dissipations into the appropriate columns.

3.Add the chassis dissipation to the power supply dissipation.

4. Add across the columns for the total heat dissipation of your SLC 500 con-

troller.

5. Convert to BTUs/hr. Multiply the total heat dissipation of your SLC 500 con-

troller by 3.414.

Total heat dissipation of the SLC 500 controller: BTUs/hr

_________ _________ _________

_________+ ________+ _________= ___________W

3 3.414

________ ________ _________

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9.4 Mounting instructions

9.4.1 Mounting the fixed styleYou can mount the fixed hardware style units directly to theback panel of your enclosure using the mounting tabs and#10 and #12 screws. The torque requirement is 3.4 N-m (30in-lbs) maximum.The expansion chassis mounts on the right side of the fixedcontroller. The chassis has mounting tabs that are insertedinto slots in the fixed controller and slid forward. No tools arerequired.1. Insert the mounting tabs of the expansion chassis into the

mounting slots of the controller.2. Slide the expansion chassis forward until the back of the

expansion chassis is flush with the fixed controller and theconnector on the expansion circuit board is mated withthe connector in the controller.

Mounting Slots

Right Side of the Fixed Controller

9.4.2 Mounting the modular styleYou can mount the modular hardware style units directly tothe back panel of your enclosure using the mounting tabsand #10 and #12 screws. The torque requirement is 3.4 N-m(30 in-lbs) maximum.

9.5 Wiring instructions

9.5.1 Wiring of power supplyTo install the power supply, do the following:1. Align the circuit board with the card guide on the left side

of the chassis. Slide the power supply in until flush withthe chassis.

2. Fasten the power supply to the chassis with the twophilips head screws.

3. Place the jumper to match the input voltage. (This doesnot apply to 1746-P3, which does not have a jumper.)

ATTENTION: Make jumper selection before applying power. Hazardous voltage is presenton exposed pins when power is applied.

4. Remove the warning label from the top of the power supply.

5. Connect line power to the power supply.

POWER

100/120 Volts 200/240 Volts

Catalog Number 1746-P1 & P2

Catalog Number 1746-P3

PWR OUT + 24 V dc

PWR OUT COM

120/240 V ac

V ac NEUT

CHASSIS GROUND

NOT USED

NOT USED

+ 24 V dc

DC NEUT

CHASSIS GROUND

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33

ATTENTION: If you have a 1746-P3 powersupply, see the next page for specialgrounding considerations.

On the 1746-P1 and -P2 power supply, use the PWR OUT+24Vdc and PWR OUT COM terminals to power sensors.The terminals provide an isolated, non-fused, 200mA, 24Vdcpower supply.

9.5.2 Wiring of I/O equipmentCareful wire routing within the enclosure helps to cut downelectrical noise between I/O lines. Follow these rules forrouting your wires: Route incoming power to the controller by a separate

path from wiring to I/O devices. Where paths must cross,their intersection should be perpendicular.

Important: Do not run signal or communications wiring andpower wiring in the same conduit.

If wiring ducts are used, allow for at least two inchesbetween I/O wiring ducts and the controller. If theterminal strips are used for I/O wiring, allow for at leasttwo inches between the terminal strips and thecontroller.

Segregate I/O wiring by signal type. Bundle wiring withsimilar electrical characteristics together. Wires withdifferent signal characteristics should be routed into theenclosure by separate paths.

ATTENTION: If the controller is being installedwithin a potentially hazardous environment(that is, Class I, Division 2), all wiring mustcomply with the requirements stated in theNational Electrical Code 501-4 (b).

The following are general recommendations for wiring I/Odevices.

ATTENTION: Before you install and wire I/Odevices, disconnect power from the controllerand any other source to the I/O devices.

Use acceptable wire gauge — The I/O wiring terminals aredesigned to accept #14 or smaller AWG stranded wires, andtwo wires per terminal (maximum). Maximum torque .9 N-m(8 in-lb).

Label wires— Label wiring to I/O devices, power sources,and ground. Use tape, shrink-tubing, or other dependablemeans for labelling purposes. In addition to labelling, usecoloured insulation to identify wiring based on signalcharacteristics. For example, you may use blue for dc I/Owiring and red for ac I/O wiring.

Bundle wires — Bundle wiring for each similar I/O devicetogether. If you use ducts, allow at least 5 cm (2 in.) betweenthe ducts and the controller so there is sufficient room to wirethe devices.

Identify terminals — Terminal cover plates have a write-onarea for each terminal. Use this area to identify your I/Odevices. Label the Removable Terminal Block (RTB) if youhave not already.

ATTENTION: Calculate the maximumpossible current in each power and commonwire. Observe all local electrical codesdictating the maximum current allowable foreach wire size. Current above the maximumratings may cause wiring to overheat, whichcan cause damage.Capacitors on input modules have a storedcharge that can cause a non-lethal shock.Avoid mounting the controller in a positionwhere installation or service personnel wouldbe in danger from startle reaction.

9.5.3 GroundingIn solid-state control systems, grounding helps limit theeffects of noise due to electromagnetic interference (EMI).The grounding path for the controller and its enclosure isprovided by the equipment grounding conductor. The figurebelow shows you how to run ground connections from thechassis to the ground bus. The two methods shown forgrounding your modular controller are acceptable; however,the ground bus is preferred.

1 1

1

1746-P1, P2 or P3

SLC 500

SLC 500

Ground Bus

1746-P1, P2 or P3

Ground Bus

Earth Ground

#8 AWG Wire

#10 AWG Wire

1 Use 10 AWG wire; keep length as short as possible.

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Special grounding considerations for dc applicationsusing 1746-P3

ATTENTION: Any voltage applied to the1746-P3 DC NEUT terminal will be present atthe SLC logic ground and the processor DH-485 port. To prevent unwanted potentialsacross the logic ground of the controllerand/or damage to the SLC chassis, the DCNEUTRAL of the external dc power sourcemust be either isolated from the SLC chassisground, or connected to earth ground. Seethe figure below:

10. Dimensions

10.1 Fixed controller

CA

T

SE

RIA

L N

O.

20 (0.79)

30 and 40 I/O Fixed Style Hardware

20 I/O Fixed Style Hardware

millimeters (inches)

Front View Left Side View

105 (4.13)

11 Dia. (0.433)

158 (6.22) 140

(5.51)

5.5 Dia. (0.217)

20 (0.79)

14 (0.55)

1.0 (0.4)

171 (6.73)

12.5 (0.49)

145 (5.71)

105 (4.13)5.5

(0.217) 165 (6.0)

5.50 Dia. (0.217)

11 Dia. (0.433)

158 (6.22) 140

(5.51)

1.0 (0.04)

5.5 Dia. (0.217)

171 (6.73)

175 (6.89)

30 (1.18)

145 (5.71)5.50 Dia.

(0.217)

14 (0.55)

55 (0.217)

175 (6.89)

260 (10.24)

6.35 (0.25)

30 (1.18)

CA

T

SE

RIA

L N

O.

Front View Right Side View

SLC Logic Ground

Processor SLC 500 Chassis1746-P3

DoorExternal DC Power Source

DH-485 Port

+24 V dc

DC Neut

Chassis Ground

Chassis Ground

DC Neut

+24 V dc

Not Used

Not Used

A jumper wire is recommended between the DC NEUT and Chassis Ground of the external power source.

Earth Ground Earth Ground

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35

10.2 Expansion chassis

10.3 Modular controller (with power supply)

12

11 Dia. (0.433)

175 (6.89)

5.5 Dia. (0.217)

158 (6.22)

5.5 Dia. (0.217)

45 (1.77)

140 (5.51)

171 (6.73)

14 (0.55)

320 (12.60)

340 (13.39)

140 (5.51)

171 (6.73)

1.0 (0.04)

145 (5.71)

Front View Left Side View

Dimensions for power supply catalog number 1746-P1

Dimensions for power supply catalog number 1746-P2 & 1746-P3

2

1

7-Slot Modular Chassis

12

11 Dia. (0.433) 70

(2.76)

5.5 Dia. (0.217)

158 (6.22)

5.5 Dia. (0.217)

45 (1.77)

140 (5.51)

171 (6.73)

14 (0.55)

215 (8.46)

235 (9.25)

140 (5.51)

171 (6.73)

1.0 (0.04)

145 (5.71)

Front View Left Side View

millimeters (inches)

CA

T

SE

RIA

L N

O.

2-Slot Expansion Chassis

Front View

millimeters (inches)

Right Side View

80 (3.15)

40 (1.57)

40 (1.57) 5.5 Dia.

(0.217)

11 Dia. (0.433)

158 (6.22)

5.5 Dia. (0.217)

14 (0.55)

14 (0.55)

140 (5.51)

1.0 (0.04)

18.5 (0.728)

171 (6.73)

145 (5.71)

4.83 (0.190)

4-Slot Modular Chassis

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36

11. Programming

11.1 BasicsFamiliar ladder logic programming makes the SLC 500family easy to program. A ladder logic program consists of anumber of rungs, on which you place instructions. Both thefixed and modular controllers are programmed in the samemanner using either a hand-held terminal or a personalcomputer. The SLC 500 controllers provide a powerful set ofinstructions for control of complex systems.

11.2 Ladder logic representationA ladder logic program consists of a number of rungs, onwhich you place instructions. Instructions each have a dataaddress associated with them and based on the status ofthese instructions the rung is solved.The figure below shows a simple 1-rung ladder program.The rung includes two input instructions and an outputinstruction. Note, in the example below each instruction hasa name (Examine if Closed), a mnemonic (XIC), and anaddress (I:1/0).

True/False Status: The data file bits that these instructionsare addressed to will be either a logic 0 (Off) or a logic 1(ON). This determines whether the instruction is regarded as“true” or “false”:

]0

[ ] [ ( )

Input Instructions Output Instruction

XIC XIO OTE

XIC = Examine if ClosedXIO = Examine if OpenOTE = Output Energize

Address I:1/0Address I:1/1Address O:3/0

A simple rung, using bit instructions.

I:1.0 I:1.0 O:3.0

1 0

/

11 Dia. (0.433)

140 (5.51)

5.5 Dia. (0.217)

158 (6.22)

5.5 Dia. (0.217)

140 (5.51)

14 (0.55)

435 (17.13)455

(17.91)

171 (6.73)

1.0 (0.04)

145 (5.71)

Front View Left Side View

Dimensions for power supply catalog number 1746-P1

Dimensions for power supply catalog number 1746-P2 & 1746-P3

55 (.217)

140 (5.51)

10-Slot Modular Chassis

12

1

2

12

145(5.71)

55(2.17)

171(6.73)

140(5.51)

171(6.73)

14(0.55)

140(5.51)

105(4.13)

540(21.26)

560(22.05)

11 Dia.(0.433)

5.5 Dia.(0.217)

140(5.51)

5.5 Dia.(0.217)

158(6.22)

1.0(0.04)

The status of the instruction is

If the data file XIC XIO OTEbit is Examine if closed Examine if open Output energise

––––] [–––– ––––] / [–––– –––– ( ) ––––

Logic 0 False True False

Logic 1 True False True

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11.3 SLC memory organisationThe processor provides control through the use of aprogram you create. The program you create is called aprocessor file. This file contains other files that break your \

Program Files – provide storage and control of the mainprogram and subroutines.

Data Files – contains the status of inputs, outputs, theprocessor, timers, counter, and so on.

Processor Files: Each CPU can hold 1 processor file at atime. The processor file is made up of program files (up to256 per controller) and data files (up to 256 per controller).

Processor files are created in the off-line mode using APS.These files are then restored, also referred to asdownloaded, to the processor for on-line operation.

Program Files: Program files contain controller information,the main control program, and any subroutine programs.The first three program files are required for each processorfile. These are: File 0 This file stores the controller configuration and

other system information. File 1 This file is reserved for internal controller use.

Processor File

Program Files Data Files

File 2 This file stores the main control program.Files 3 – 255 These files are optional and used forsubroutine programs.

Most of your work with program files will be in file 2, the mainprogram file. This file contains your ladder logic programwhich you create to control your application.

Data Files: Data files contain the data associated with theprogram files. Each processor file can contain up to 256 datafiles. These files are organised by the type of data theycontain. Each piece of data in each of these files has anaddress associated with it that identifies it for use in theprogram file. For example, an input point has an address thatrepresents its location in the input data file. Likewise, a timerin the timer data file has an address associated with it thatallows you to represent it in the program file.The first 9 data files (0-8) have default types. You designatethe remainder of the files (9-255). The default types are: File 0 – Output Data This file stores the state of the output

terminals for the controller. File 1 – Input Data This file stores the status of the input

terminals for the controller. File 2 – Status Data This file stores controller operation

information. Files 3 – 7 These files are pre-defined as Bit, Timers,

Counters, Control and Integer data storage, respectively. File 8 - Floating Point. This file stores single precision non-

extended 32-bit numbers. Valid range is ±1.1754944e-38to ±3.40282347e-38. Only SLC 5/03 OS301 processorsuse this file.

File 9-255 – User Defined. These files are user-defined asBit, Timer, Counter, Control and Integer data storage. ForSLC 5/03 OS301 processors, floating point, string andASCII files are also supported. In addition, File 9 isspecifically available as a Communication Interface File.

Most of your work with data files will be in files 0 and 1, theoutput and input files.

12. Programming instructions

12.1 Bit instructions

Instruction mnemonic and name Function - conditional instructions input or output

XIC Examine if Closed Conditional instruction. True when bit is on (1).

XIO Examine if Open Conditional instruction. True when bit is off (0).

OSR One Shot Rising Conditional instruction. Makes rung true for one scan upon each false-to-true transition of conditions preceding it in the rung.

OTE Output Energise Output instruction. True (1) when conditions preceding it are true. False when conditions preceding it go false.

OTL Output Latch Output instruction. Addressed bit goes true (1) when conditions preceding the OTL instruction are true. When conditions go false, OTL remains true until the rung containing an OTU instruction with the same address goes true.

OTU Output Unlatch Output instruction. Addressed bit goes false (0) when conditions preceding the OTU instruction are true. Remains false until the rung containing an OTL instruction with the same address goes true.

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12.2 Comparison instructions

12.3 Timer and counter instructions

12.4 Communication instructions

Instruction mnemonic and name Function - Output instructions

TON Timer On-Delay Counts time intervals when conditions preceding it in the rung are true. Produces an output when accumulated value (count) reaches the preset value.

TOF Timer Off-Delay Counts time intervals when conditions preceding it in the rung are false. Produces an output when accumulated value (count) reaches the preset value.

RTO Retentive Timer This is an On-Delay timer that retains its accumulated value when:– Rung conditions go false.– The mode changes to program from run or test.– The processor loses power.– A fault occurs.

CTU Count Up Count up for each false-true transition of conditions preceding it in the rung. Produces an output when accumulated value (count) reaches the preset value.

CTD Count Down Count down for each false-true transition of conditions preceding it in the rung. Produces an output when accumulated value (count) reaches the preset value.

HSC High-Speed Counter Applies to 24Vdc fixed I/O controllers only. Counts high-speed pulses from a high-speed input. Maximum pulse rate of 8kHz.

RES Reset Used with timers and counters. When conditions preceding it in the rung are true, the RES instruction resets the accumulated value and control bits of the timer or counter.

Instruction mnemonic and name Function - Output instructions

MSG Message Read/Write This instruction transfers data from one node to another on the communication network. When the instruction is enabled, message transfer is pending. Actual data transfer takes place at the end of the scan.

SVC Service Communications When conditions preceding it in the rung are true, the SVC instruction interrupts the program scan to execute the service communication portion of the operating cycle.

Instruction mnemonic and name Function - (Input) instructions

EQU Equal Instruction is true when source A = source B.

NEQ Not Equal Instruction is true when source A ≠ source B.

LESS Less Than Instruction is true when source A < source B.

LEQ Less Than or Equal Instruction is true when source A ≤ source B.

GRT Greater Than Instruction is true when source A > source B.

GEQ Greater Than or Equal Instruction is true when source A ≥ source B.

MEQ Masked Comparison for Equal Compares 16-bit data of a source address to 16-bit data at a reference address through a mask. If the values match, the instruction is true.

LIM Limit Test True/false status of the instruction depends on how a test value compares to specified low and high limits.

12.5 I/O and Interrupt instructions

12.6 File Copy and File Fill instructions

12.7 Math instructions

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Instruction mnemonic and name Function - Output instructions

COP File Copy When rung conditions are true, the COP instruction copies a user-defined sourcefile to the destination file.

FLL File Fill When rung conditions are true, the FLL instruction loads a source value into a specified number of elements in a user-defined file.

Instruction mnemonic and name Function - Output instructions

ADD Add When rung conditions are true, the ADD instruction adds source A to source B and stores the result in the destination.

SUB Subtract When rung conditions are true, the SUB instruction subtracts source B from source A and stores the result in the destination.

MUL Multiply When rung conditions are true, the MUL instruction multiplies source A by source B and stores the result in the destination.

DIV Divide When rung conditions are true, the DIV instruction divides source A by source B and stores the result in the destination and the math register.

DDV Double Divide When rung conditions are true, the DDV instruction divides the contents of the math register by the source and stores the result in the destination and the math register.

NEG Negate When rung conditions are true, the NEG instruction changes the sign of the source and places it in the destination.

CLR Clear When rung conditions are true, the CLR instruction clears the destination to zero.

TOD Convert to BCD When rung conditions are true, the TOD instruction converts the source value to BCD and stores it in the math register or the destination.

FRD Convert from BCD When rung conditions are true, the FRD instruction converts a BCD value in the math register or the source to an integer and stores it in the destination.

DCD Decode When rung conditions are true, the DCD instruction decodes 4-bit value (0 to 16), turning on the corresponding bit in 16-bit destination.

SQR Square Root When rung conditions are true, the SQR instruction calculates the square root of the source and places the integer result in the destination.

SCL Scale When rung conditions are true, the SCL instruction multiplies the source by a specified rate. The result is added to an offset value and placed in the destination.

Instruction Mnemonic and Name Function - Output instructions

IIM Immediate Input with Mask When conditions preceding it in the rung are true, the IIM instruction is enabled and interrupts the program scan to write a word of masked external input data to the input data file.

IOM Immediate Output with Mask When conditions preceding it in the rung are true, the IOM instruction is enabled and interrupts the program scan to read a word of data from the output data file and transfer the data through a mask to the corresponding external outputs.

IIE I/O Interrupt Enable The IIE, IID, and RPI instructions are used with specialty I/O modules capable of IID I/O Interrupt Disable generating an I/O interrupt.RPI Reset Pending

I/O Interrupt

REF I/O Refresh When conditions preceding it in the rung are true, the REF instruction interrupts the program scan to execute the I/O scan (write outputs-service comms-read inputs). The program scan then resumes.

STD Selectable Timed Disable Associated with the Selectable Timed Interrupt function. STD and STE are used toprevent an STI from occurring during a portion of the program; STS initiates an

STE Selectable Timed Enable STI.

STS Selectable Timed Start

INT Interrupt Subroutine Associated with STI interrupts and I/O event-driven interrupts.

12.8 Proportional Integral Derivative Instruction

12.9 Move and Logical instructions

12.10 Bit Shift, FIFO, and LIFO instructions

12.11 Sequencer instructions

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Instruction mnemonic and name Function - Output instructions

MOV Move When rung conditions are true, the MOV instruction moves a copy of the source to the destination.

MVM Masked Move When rung conditions are true, the MVM instruction moves a copy of the source through a mask to the destination.

AND And When rung conditions are true, sources A and B of the AND instruction are ANDed bit by bit and stored in the destination.

OR Inclusive Or When rung conditions are true, sources A and B of the OR instruction are ORed bit by bit and stored in the destination.

XOR Exclusive Or When rung conditions are true, sources A and B of the XOR instruction are Exclusive ORed bit by bit and stored in the destination.

NOT Not When rung conditions are true, the source of the NOT instruction is NOTed bitby bit and stored in the destination.

Instruction mnemonic and name Function - Output instructions

BSL Bit Shift Left On each false-to-true transition, these instructions load a bit of data into a bit BSR Bit Shift Right array, shift the pattern of data through the array, and unload the end bit of data.

The BSL shifts data to the left and the BSR shifts data to the right.

First In First Out (FIFO) The FFL instruction loads a word into an FIFO stack on successive false-to-true FFL Load (FFL) transitions. The FFU unloads a word from the stack on successive false-true tranFFU Unload (FFU) sitions. The first word loaded is the first to be unloaded.

Last In First Out (LIFO) The LFL instruction loads a word into an LIFO stack on successive false-to-true LFL Load (LFL) transitions. The LFU unloads a word from the stack on successive false-to-true LFU Unload (LFU) transitions. The last word loaded is the first to be unloaded.

Instruction mnemonic and name Function - Output instructions

SQO Sequencer Output On successive false-to-true transitions, the SQO moves a step through the pro-grammed sequencer file, transferring step data through a mask to a destina tion word.

SQC Sequencer Compare On successive false-to-true transitions, the SQC moves a step through the programmed sequencer file, comparing the data through a mask to a source word or file for equality.

SQL Sequencer Load On successive false-to-true transitions, the SQL moves a step through the sequencer file, loading a word of source data into the current element of the sequencer file.

Instruction mnemonic and name Function - Output instructions

PID Proportional Integral This instruction is used to control physical properties such as temperature, Derivative pressure, liquid level, or flow rate of process loops.

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12.12 Control instruction

12.13 ASCII instructions (applies to SLC 5/03 OS301 processors only)

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Instruction mnemonic and name Function - Conditional or output instructions

JMP Jump to Label Output instruction. When rung conditions are true, the JMP instruction causes the program scan to jump forward or backward to the corresponding LBL instruction.

LBL Label This is the target of the correspondingly numbered JMP instruction.

JSR Jump to Subroutine Output instruction. When rung conditions are true, the JSR instruction causes the processor to jump to the targeted subroutine file.

SBR Subroutine Placed as first instruction in a subroutine file. Identifies the subroutine file.

RET Return from Subroutine Output instruction, placed in subroutine. When rung conditions are true, the RET instruction causes the processor to resume program execution in the main program file or the previous subroutine file.

MCR Master Control Reset Output instruction. Used in pairs to inhibit or enable a zone within a ladder program.

TND Temporary End Output instruction. When rung conditions are true, the TND instruction stops the program scan, updates I/O, and resumes scanning at rung 0 of the main programfile.

SUS Suspend Output instruction, used for troubleshooting. When rung conditions are true, the SUS instruction places the controller in the Suspend Idle mode. The suspend ID number is place in word S:7 and the program file number is placed in S:8.

Instruction mnemonic and name Function - Output instructions

ABL Test Buffer for Line Determines the number of characters in the buffer, up to and including the end-of-line characters (termination).

ACB No. of Characters in Buffer Determines the total characters in the buffer.

ACI ASCII String to Integer Converts an ASCII string to an integer value.

ACL ASCII Clear Receive and/or Clears the ASCII buffer.Transmit Buffer

ACN ASCII String Concatenate Combines two strings using ASCII strings as operands.

AEX ASCII String Extract Creates a new string by taking a portion of an existing string and linking it to a new string.

AHL ASCII Handshake Lines Sets or resets the RS-232 Data Terminal Ready and Request to Sender handshakecontrol lines for the modem.

AIC ASCII Integer to String Converts an integer value to an ASCII string.

ARD ASCII Read Characters Reads characters from the buffer and stores them in a string.

ARL ASCII Read Line Reads characters from the buffer up to and including the end-of-line characters and stores them in a string.

ASC ASCII String Search Searches an existing string for an occurrence of the source string.

ASR ASCII String Compare Compares two ASCII strings.

AWA ASCII Write with Append Adds the two appended characters set from the ASCII configuration menu.

AWT ASCII Write Writes characters from a source string to a display device.

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13. List of instructionsUse the following instructions with the AdvancedProgramming Software (APS) or the Hand-Held Terminal(HHT).

BitInstructionsExamine If ClosedExamine If OpenOne-Shot RisingOutput EnergiseOutput LatchOutput Unlatch

Timer and Counter InstructionsTimer On/Timer Off-DelayRetentive On-Delay TimerCount Up/Count DownHigh-Speed CounterReset

I/O and Interrupt InstructionsImmediate Input/Output With MaskI/O Interrupt Enable/Disable*Reset Pending I/O Interrupt*I/O Refresh*Selectable Timed Interrupt Enable/Disable*Selectable Timed Interrupt Start*Interrupt Subroutine*

Comparison InstructionsEqualNot EqualLess ThanGreater ThanLess Than or EqualGreater Than or EqualMasked Comparison for EqualLimit Test*

Move and Logical InstructionsMoveMasked MoveAndOrExclusive OrNot

I/O Message InstructionsService Communications*Message*

Math InstructionsAdd/SubtractMultiply/DivideDouble DivideClearNegateDecodeSquare Root*Scale*

Control InstructionsLabelJumpJump to SubroutineReturn from SubroutineMaster Control ResetTemporary EndSuspendSubroutine

Sequencer InstructionsSequencer OutputSequencer CompareSequencer Load*

Bit Shift, FIFO, and LIFO InstructionsBit Shift Right/LeftLoad/Unload, First In First Out*Load/Unload Last In First Out*

File InstructionsCopy FileFill File

Special InstructionProportional, Integral, Derivative** SLC 5/02 and SLC 5/03 processors only.

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RS Components, PO Box 99, Corby, Northants, NN17 9RS Telephone: 01536 201234An Electrocomponents Company © RS Components 1997