CNRS-INPG-UJF

Sponsored by

Chair: B. Courtois, TIMA Labs, Grenoble, France Co-Chair: K. Markus, Zeus Strategies, LLC, Durham, USA

CAD, Design and TestChair: S. Blanton, Carnegie Mellon Univ., Pittsburgh, USA

Co-Chair: J-M. Karam, MEMSCAP, Bernin, France

Microfabrication, Integration and PackagingChair: A. Bosseboeuf, IEF, Paris-Orsay, France

Co-Chair: V. Kempe, SensorDynamics AG, Austria

IncludingSpecial sessions on Micro Power Generators

IEEE Components,Packaging andManufacturing

Technology Society

Co-locating with:Workshop on Design for Reliability and Manufacturability in MNT â 25 April 2006

C O N F E R E N C E S

D e s i g n , Te s t , I n te g ra t i o n a n d Pa c k a g i n g of M E M S/ M O E M S

Sy m p o s i u m o n

St r e s a , L a g o M a g g i o r e , I ta l y

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Deadline of reservation: 10th March 2006. After this date reservation accommodation will be confirmed only uponHotel availability.Please use BLOCK CAPITALS

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SINGLE ROOM 107,80 Euros

DOUBLE or TWIN ROOM 151,80 Euros

REGINA PALACE HOTELSTRESSA – ITALYFax: +39 03 23 936 666E-mail:sales@regina-palace.it

Note: In case of special requirements,please call The REGINA PALACE HOTEL:+39 0323 936 936

REGINA PALACE STRESA - RESERVATION FORM

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2 6 -2 8 A p r i l 20 0 6

This Symposium will be a follow-up to the very successful issues held in 1999 and 2000 in Parisand in 2001, 2002 and 2003 in Mandelieu-La Napoule, and in 2004 and 2005 in Montreux,Switzerland. This series of Symposia is a unique single-meeting event expressly planned to bring

together participants interested in manufacturing microstructures and participants interested in designtools to facilitate the conception of these microstructures. Again, a special emphasis will be put onthe very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposiumis to provide a forum for in-depth investigations and interdisciplinary discussions involving design,modeling, testing, micromachining, microfabrication, integration and packaging of structures, devicesand systems. About 90 submissions were received from 20 countries.We look forward to welcoming you to Stresa.

B. Courtois, TIMA Labs, Grenoble, France K. Markus, Zeus Strategies, LLC, Durham, USA

The Symposium will be held at the Regina Palace Hotel in Stresa, in Italy, www.regina-palace.itRegina Palace Hotel is situated in beautiful gardens, and is located in downtown Stresa, overlooking the shore of Lake Maggiore.Since opening its doors in 1908 the hotel hasserved as a welcome retreat for Europe’selite, playing host to King Umberto II of Italy, Maria Jose of Belgium, George Bernard Shawand President Berlusconi. The façade and furniture still evoke neoclassic fin de sièclecharms, although thoughtful renovation hasbeen made in order to equip the environment with the newest technology and improve its functionality.

Regina Palace Stresa28838 Stresa, ItalyTel.: +39 0323 936936Fax: +39 0323 936 666Email: sales@regina-palace.it

Stresa: This international tourist resort situated in acentral but also panoramic and pictoresque positionalong the lakeside roadway, stands just in front of the Borromee isles. Since the second half of nineteenth century up to the first decades of the twentieth, when the first English touritsts arrived, Stresa, whose hotels and villas built in Libertystyle make it unique, assumed its peculiar, elegant look.http://www.stresa.net/

V E N U E Acce ss

By air: 35 km from Milano Malpensa 110 km from Milano Linate

• Malpensa information-Tel. +39 02 74852200• Malpensa news for the travellers-Tel. +39 02 26800613• For information link to: www.malpensairport.com > Transfers: A team of expert drivers provide not onlytransfers to and from the airports, but also useful personalassistance on arrival or departure, and remain at your servicefor any transport requirement (taxi, etc.)

http://www.stresa.net/limousine/By train: FFSS Milano - Domodossola

Station of Stresa• For information link to: www.fs-on-line.comBy car: highway A26 exit Carpugnino – Stresa

INVITATION TO PARTICIPATE

25 April 2006, Stresa, Lago Maggiore, Italy (in conjunction with DTIP, 26-28 April 2006)

Co-organised by the EC-funded Network of Excellence "Design for Micro & Nano Manufacture" (PATENT-DfMM)and the NEXUS Methodology Working Groups "Reliability & Test" and "Design Modelling Simulation". PATENT-DfMM was launched in 2004 and aims to establish a collaborative team to provide European industry with supportin the field of "Design for Micro and Nano Manufacture (DfMM)" to ensure that problems affecting the manufacturing and reliability of products based on micro nano technologies (MNT) can be addressed beforeprototyping and production. More information: www.patent-dfmm.org

PATENT-DfMM co-operates worldwide to coordinate research and services in DfMM related topics. The network issupported by an educational programme addressing DfMM topics in industry and academia. This combines trainingcourses and educational initiatives that already exist for DfMM, but also develops new ones that are needed to lower the barriers to commercialisation for the next generation of MNT based products.

Objective of this workshopThis workshop builds on industry experience in microsystems manufacturing as discussed recently within theMEMS Industry Group METRIC workshops and NEXUS Methodology Working Group meetings. Main emphasis willbe on reliability and test problems, where design methodologies can lead to significant improvements. Industry’sdesign and reliability needs will be discussed and latest research results and new approaches will be proposed by the research community.

Workshop programme - outlineâ Morning session (9:00 – 12:00):

Industry needs and current research in Reliability and Test for MNTâ How do industrial microsystems manufacturers deal with reliability and test?â What is specific for reliability and test in high volume production?â What are the main challenges for research?â Presentation of current research initiatives and projects in reliability and test

â Afternoon session (14:00 – 17:30): Building Reliability and Test into the MNT design flowâ How are reliability and test issues currently built into an industrial design flow?â What do Design, Modelling and Simulation Tools offer to support reliability and test?â How can methodologies, tools and databases be combined?â Presentation of current research initiatives and projects to build reliability and test issues into toolsâ How can researchers help industry (especially SMEs) to optimise reliability and test?

Attendance and registration feeAttendance to the workshop will be open, but the number of participants will be limited. The registration fee is 120 euros (including the coffee breaks and the lunch on 25 April). It is necessary to register using the DTIP electronic registration form (HTTP://TIMA.IMAG.FR/CONFERENCES/DTIP/).

WORKSHOP ON DESIGN FOR RELIABILITY AND MANUFACTURABILITY IN MNT

â The Special Issue of the Journal of Microsystem Technologies will focus on microfabrication,integration and packaging of MEMS and MOEMS.

Papers should not normally exceed 6000 word equivalents (20 double-spaced typed pages including figures and tables). For more details, please follow the Journal of MicrosystemTechnologies submission guidelines as available from the

http://link.springer.de/link/service/journals/00542/instr.htm.

â The Special Issue of ALOG the Journal of Analog Integrated Circuits and SignalProcessing will focus on design and test aspects of MEMS and MOEMS.

Papers should include an informative title and an abstract of 100 to 250 words at the head of the manuscript. The abstract should be a carefully worded description of the problem addressed, the key ideas introduced, and the results. Abstracts will be printed with the article.Detailed specifications for the submissions may be found in any issue of the Journal.

http://www.wkap.nl/prod/j/0925-1030

The deadline to submit to either of the Special Issues is 30 June 2006. Authors should indicate the Journal they submit to. They will be notified about their papers by 15 October 2006.

Submission will be electronically only, through the Web page http://tima.imag.fr/conferences/DTIP (click on "Submit a Paper for Special Issues"). Fill in

the questionnaire and attach your PDF file where appropriate. Don't submit multiple files for asingle paper. Once your submission has been checked (viewing and printing quality), you willreceive an acknowledgement by e-mail. You should first prepare a file in PDF format. Please notethat uncompressed unencapsulated postscript is the single alternative format and should be usedonly when absolutely necessary. Use the contact author's last name as file name; add numeralsin the case of multiple submissions (e.g., lo1, lo2).

In case you experience any problems with the submission procedure, please contact theGeneral Chair.

Two Special Issues or Special Sections of leading Journals will follow up the Symposium: Journal of Microsystem Technologies and Analog Integrated Circuitsand Signal Processing.

SPECIAL ISSUES OF THE JOURNAL OF MICROSYSTEM TECHNOLOGIES AND OF THE JOURNAL OF ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING

While the Symposium organisation makes every effort in order to ensure the safety and well being of all the Symposium participants and associates, the Symposium cannot take responsibility for anyaccident or damage that may occur during the Symposium.

PROCEEDINGSProceedings of this symposium will be available at the meeting as part of the registration fee. If you cannot attend, you may still order Proceedings at the price of 35€ (order form available on the conference web site, the sending of the Proceedings package will be done after the Symposium,and if the payment is received).

DTIP is happy to acknowledge the services of SuviSoft Oy Ltd for the technical management of the Symposium.

SPECIFIC EVENTS SPONSORINGIf you wish to sponsor an event like a reception, a lunch, or any specific event during the Symposium,please contact the Symposium Chair.

POSTERSAll posters will be introduced by one slide in 5 minutes each. They will be presented in 2 plenary sessions on Wednesday 26 April 2006 from 15:20 to 16:20 and from 17:10 to 18:05. They will bemounted during the first break or during the lunch time. Authors are expected to be at their postersduring the posters viewing session on Wednesday 26 April 2006 from 18:10 to 19:30. The posters will be removed at the end of the symposium.

Bernard Courtois TIMA Labs Tel.: +33 4 76 57 46 15 Fax: +33 4 76 47 38 14 E-mail:Bernard.Courtois@imag.fr

Shaw BlantonCarnegie Mellon Univ.Tel.: +412.268.2987Fax: +412.268.2987E-mail: blanton@ece.cmu.edu

Alain BosseboeufInstitut d'Electronique FondamentaleTel.: +33 1 69 15 78 35Fax: +33 1 69 15 40 00E-mail: alain.bosseboeuf@ief.u-psud.fr

Karen Markus Zeus Strategies Tel : +1 919 806 4682 Fax : +1 919 806 4990 E-mail: Karen@ZeusStrategies.com

Jean-Michel KaramMEMSCAP Tel.: +33 4 76 92 85 00 Fax: +33 4 76 92 85 10 E-mail: Jean-Michel.Karam@memscap.com

Volker KempeSensorDynamics AGTel.: +43 318 240 160 12Fax: +43 318 240 160 70E-mail: vk@sensordynamics.cc

CONTACTS

INSURANCE

MICROSYSTEM DEVELOPMENTâ Marc A. Polosky, Sandia National Laboratories, Albuquerque, USA

Development entails the maturation of all the processes needed to successfully produce a product.As MEMS fabrication and packaging processes mature, the next challenge is MEMS development.Details of the development of a MEMS based switch will be presented.

MEMSCAP RECOVERY: THE STORYâ Jean-Michel Karam, MEMSCAP, Bernin, France

Founded in November 1997, MEMSCAP went public in March 2001, supported by major deals andorders in the optical communications industry. The company raised 101 M€ with a market capitalization of 430 M€. After the optical communications industry collapse, the company diversified its business through acquisitions, ran drastic cost reduction plans in parallel to buildingnew high growth, short-term profitable business. In 2005, MEMSCAP recovered healthy fundamentalsand initiated new momentum. The talk will detail the recovery story of MEMSCAP.

INDUSTRIAL WAFER LEVEL VACUUM ENCAPSULATION OF RESONATING MEMS DEVICES â Wolfgang Reinert, Fraunhofer Institute for Silicon Technology, Itzehoe, Germany

Vacuum wafer bonding technology provides a number of very effective techniques to producelow-cost, hermetic sealed packages for micromachined sensors and actuators. Beside the protectionof the device from outside environmental stresses, the package must also provide an interior environment compatible with the device performance and reliability. The presentation reviews thecharacteristics of existing wafer bond technologies with special focus on AuSi-eutectic bondingand the process integration of thin film getter to stabilize the damping atmosphere over a demandeddevice lifetime of 15 years. A new ultra-fine leak test will also be presented that has the potentialto be used for in-line critical leak rate testing on wafer level.

Industrial microsystems manufacturers will present how they deal with reliability and test issuescurrently and what their main challenges are. Recent research results will be discussed and directions given for future research from an industry perspective. This includes reliability and testissues and their implementation into an industrial design methodology.Organised by the PATENT-DfMM project (www.patent-dfmm.org).

SPECIAL SESSIONS ON MICRO POWER GENERATORSThe demand for micro power sources is expected to increase significantly with the widespread andgrowing use of compact information and communication devices with many advanced features.Emerging applications such as wireless sensing, wearable computing, autonomous microrobots, andother systems that are yet to hit the marketplace, will require even more efficient power sources todeliver new functionality and convenience. The objective of these special sessions on Micro PowerGenerators is to catalyze innovation in microtechnology for power generation and energy conversionapplications by providing researchers with a forum for discussing latest research results. The specialsessions have been organized by Skandar Basrour and Agnès Bonvilain from TIMA Labs.

PANEL > DESIGN FOR RELIABILITY AND TEST

INVITED TALKS

CAD, Design and Test Conference

Chair: S. Blanton, Carnegie Mellon Univ., Pittsburgh, USACo-Chair: J-M. Karam, MEMSCAP, Bernin, France

Programme Committee: S. Marco, Univ. Barcelona, SpainM. Rencz, BUTE, Budapest, HungaryM. Ismail, Ohio State Univ., Columbus, USAR. Rudd, Lawrence Livermore National Lab. Livermore, USAY-C. Liang, National Univ. of SingaporeJ. Samitier, Univ. of Barcelona, SpainM-A. Maher, SoftMEMS, Los Gatos, USAT. Veijola, Helsinki Univ. of Technology, FinlandO. Slattery, NMRC, Cork, IrelandP. Salomon, 4M2C PATRIC SALOMON, Berlin, GermanyG. Wachutka, Munich Univ. of Technology, GermanyI. Balk, The Ramzay Technologies Inc, Brighton, USAA. Richardson, Lancaster Univ., UKB. Charlot, TIMA Labs, Grenoble, France & LIMMS, Tokyo, JapanJ. Zhu, Nanjing Electronic Devices Institute, ChinaA. Wild, Freescale Semiconductor, Grenoble, FranceT. Mukherjee, Carnegie Mellon Univ., Pittsburgh, USAR. Laur, Univ. of Bremen, GermanyZ. Cui, RAL, Didcot, UKF. Pressecq, CNES, Toulouse, FranceK. Chakrabarty, Duke Univ., Durham, USAB. Romanowicz, NSTI, Cambridge, USA

This Conference will bring together researchers, engineers and practitioners involved in the developmentof CAD tools and design methodologies for MEMSand MOEMS. The participants will also have theopportunity to interact with the other Conference by the means of plenary talks.

The topics for this Conference include:â Technology CAD in generalâ Modeling and simulation of fabrication

processesâ Devices and components (sensors, actuators,…)â MEMS/MOEMS libraries and IPâ Signal processingâ Integrated CAD toolsâ Numerical simulationâ Yield estimationâ Failure mechanismsâ Fault modelingâ Fault simulation and test pattern generationâ Mechanical simulationâ Thermal evaluationâ Interoperability of CAD/CAE toolsâ Multiphysics simulationâ Structured design methodologiesâ Languages for interchange data among

designs and toolsâ Model order reduction

This Conference will bring together researchers, engineers and practitioners involved in the developmentof integration technologies and packaging for MEMSand MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary talks.

The topics for this Conference include:â Integrated processes (micromachining,

micromolding, …)â Process integration between MEMS

and electronicsâ Microlithography issues unique to MEMS/MOEMSâ Manufacturingâ Materialsâ Assembly technologiesâ Packaging for harsh environmentsâ MOEMS packagingâ RF and microwave packagingâ Test structuresâ Devices and components (sensors, actuators, …)â Dimensional measurementsâ Physical measurementsâ Failure analysisâ Reliabilityâ Characterizationâ Process monitoringâ Non destructive evaluation

Microfabrication, Integration and Packaging Conference

Chair: A. Bosseboeuf, IEF, Paris-Orsay, FranceCo-Chair: V. Kempe, SensorDynamics AG, Austria

Programme Committee:F. Tay, National Univ. of SingaporeJ. Dual, ETH Zentrum, Zürich, SwitzerlandM. Heckele, FZK, Karlsruhe, GermanyR. Maeda, AIST, Tsukuba, JapanG.S. Kuo, National Chengchi Univ., Taipei, TaiwanA. Tay, National Univ. of SingaporeC. Khan Malek, Lab. FEMTO-ST/LPMO, Besançon, FranceZ. Wang, SIMTech, SingaporeY. Wang, SIMIT, Shanghai, ChinaPh. Renaud, EPFL, Lausanne, SwitzerlandB. Michel, IZM, Berlin, GermanyE. Jung, IZM, Berlin, GermanyD. Allen, Cranfield Univ., Bedford, UKS. Basrour, TIMA Labs, Grenoble, FranceV. Bright, Univ. of Colorado, Boulder, USAY-A. Peter, EPM, Montréal, CanadaP. Nicole, Thales Group, FranceL. Buchaillot, IEMN/ISEN, Villeneuve d’Ascq, FranceG-J. Wang, National Chun-Hsing Univ. , TaiwanD. Tolfree, Technopreneur Ltd, Warrington, UKH. Yang, National Chung Hsing Univ., TaiwanH. Camon, LAAS, Toulouse, FranceK. Baert, IMEC, BelgiumP. French, TU Delft, The NetherlandsT. Bourouina, ESIEE, Noisy le Grand, FranceA. Ionescu, EPFL, Lausanne, Switzerland

10:50 - 12:10 Session 1: PACKAGING AND ASSEMBLYâ Chair: Karen Markus, Zeus Strategies, LLC, Durham, USA10:50 3D INTEGRATION FOR HYBRID INTEGRATION OF INTEGRATED CIRCUITS

Erik Jung, Fraunhofer IZM, GermanyLuca Magagni, Univ. of Bologna, Italy

11 :10 ANALYSIS OF PACKAGING EFFECTS ON THE PERFORMANCE OF THE MICROFLOWN

Joost van Honschoten, MESA+ Institute, Univ. of Twente, Netherlands

11 :30 ULTRA FINE PITCH FLAT PANEL DISPLAY PACKAGING USING µM CONDUCTIVE PARTICLES

Gou-Jen Wang, National Chung-Hsing Univ., TaiwanYi-Chin Lin, Gwo-Sen Lin, Wintek Inc., Taiwan

11 :50 PARASITIC EFFECTS REDUCTION FOR WAFER-LEVEL PACKAGING OF RF-MEMSJacopo Iannacci, HiTeC-DIMES / ARCES-DEIS, NetherlandsJason Tian, Saoer Sinaga, Marian Bartek, HiTeC-DIMES, NetherlandsAntonio Gnudi, Roberto Gaddi, ARCES-DEIS, Italy

10:50 - 12:10 Session 2: DESIGN, ANALYSIS AND FABRICATION OF MEMS COMPONENTSâ Chair: Jean-Michel Karam, MEMSCAP, Bernin, France10:50 MODELING OF THE FABRICATION AND OPERATION OF 3-D SELF ASSEMBLED SOI MEMS

C. Méndez, Open Engineering, Belgium11 :10 ANALYTIC MODEL FOR PERFORATED SQUEEZED-FILM DAMPERS

Timo Veijola, Helsinki Univ. of Technology, Finland11 :30 ANALYSIS OF THE INFLUENCE OF THE FEEDBACK FILTER ON THE RESPONSE OF THE PULSED DIGITAL OSCILLATOR

Manuel Dominguez, Joan Pons, Jordi Ricart, TU of Catalonia, SpainJerome Juillard, Eric Collinet, SUPELEC, France

11 :50 DESIGN OF BOSSED SILICON MEMBRANES FOR HIGH SENSITIVITY MICROPHONE APPLICATIONS

Paolo Martins, Christophe Malhaire, LPM, FranceSébastien Beclin, Sebastiano Brida, Sandrine Metivet, Olivier Stojanovic, Auxitrol, France

WEDNESDAY 26 APRIL 2006

PROGRAMMETECHNICAL

12:10 - 13:30 â LUNCH

8:00 - 8:50 Registration8:50 - 9:00 Opening sessionâ Bernard Courtois, TIMA Labs, Grenoble, France â Karen Markus, Zeus Strategies, LLC, Durham, USA9:00 - 9:40 Invited talk 1 : MICROSYSTEM DEVELOPMENTMarc A. Polosky, Sandia National Laboratories, Albuquerque, USA â Chair: Shawn Blanton, Carnegie Mellon Univ., Pittsburgh, USA9:40 - 10:20 Invited talk 2 : MEMSCAP RECOVERY: THE STORYJean-Michel Karam, MEMSCAP, Bernin, France â Chair: Volker Kempe, SensorDynamics AG, Austria10:20 - 10:50 â BREAK