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3.155J/6.152J Lecture 1: Introduction Prof. Martin A. Schmidt Massachusetts Institute of Technology 9/3/2003 1

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Page 1: 3.155J/6.152J Lecture 1: Introductiondspace.mit.edu/bitstream/handle/1721.1/36872/6-152JFall... · 2019-09-12 · Day Date Topic Lab Assignments Due . MAS Overview Safety/Lab assignment

3.155J/6.152J Lecture 1: Introduction

Prof. Martin A. SchmidtMassachusetts Institute of Technology

9/3/2003

1

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Outline

� Introductions � Staff � You

� Motivation � Course Organization

� Handout

� Lab Assignments � Safety

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Tiny Technologies

� A definition which captures two extremes: � Miniaturization

� Making things smaller, often using Integrated Circuit process technologies

� Atom-level Manipulation/Assembly/Growth � Often to achieve a unique material property

� e.g. Carbon Nanotubes

� We will focus on the former

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The Driver: Microelectronics

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Engineering Challenges of the 20th Century:INCREASING SCALE

Brooklyn Bridge Space V rocket

Hoover Dam Boeing 747-400

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Engineering Challenges of the 21st Century: DECREASING SCALE

� Portable, Distributed Systems � Manipulation of Small Things

� Drugs � Biological Cells � Biological Matter

� DNA � Proteins

� Atoms

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M.A. Schmidt 3.155J/6.152J – Lecture 1 FA03 8

MIT Tiny Technologies

mmmm PPmm nmnm

Microengines

MicrochemicalPlants(Jensen)

Low Power DSP(Chandrakasan)

Transistors(delAlamo)

Connectors(Slocum)

Biosensors(Manalis)

cc_rchakr
Text Box
(Courtesy of Anantha Chandrakasan.)
cc_rchakr
Text Box
(Courtesy of Prof. Jesus Del Alamo, Electrical Engineering at M.I.T.; Used with Permission)
cc_rchakr
Text Box
(Courtesy of Felice Frankel.)
cc_rchakr
Text Box
(Courtesy of Professor Alex Slocum.)
cc_rchakr
Text Box
(Courtesy of Scott Manalis.)
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Organization

� Pre-Req � Total overhaul since last year

� Spring ’03 was trial run

� Three lab modules � IC � MEMS � Microfluidics

� Lecture alignment with labs

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Laboratory

� Each session is 4 hours (9-1 or 1-5) � Tuesday, Thursday, Friday � Groups A,B,C,D,E,F

� Each lab is 3 sessions � 2 for processing, 1 for testing

� Three labs � IC : MOS Capacitor � MEMS : Silicon Nitride Microcantilever � Fluids : Micromixer

� Lab report for each lab

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Lectures

� 12 Topical Lectures � Vacuum, CVD, Oxidation, Diffusion/Implantation,

Lithography, Etching, Sputtering, Evaporation, Interconnect

� 3 Lab Overview Lectures � Given in first week of lab

� 3 Lab Report Lectures � Given in last week of lab

� 5 Advanced Topic Lectures � Advanced Si Devices, Crystal Growth, Reliability,

Nanobio, Nanolithography

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Grading

� Quiz #1 and #2 (15% each) � Each Covers 6 Topical Lectures � Quiz #2 includes 3 advanced topic lectures

� Take Home (15%) � Design Problem � Integrates Lectures

� Lab Reports (10% each + 5% writing) � IC Lab – Satisfies CIM Requirements

� Homework (10%) � Lab Participation (10%)

� Lab instructor evaluations

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Policy for Academic Conduct

� Homework� Collaboration OK, everyone must contribute � Contributors must be identified

� Take-Home and Quizzes � No collaboration

� Lab Reports � Each group shares the same data, but… � Data reduction, analysis, discussion MUST be

done individually

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Books, References

� Lecturer will handout notes � Copies of chapters when appropriate � Recommended book:

� Plummer

� Other references

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st Half Lecturer

W /

M W RCOH

M RCOH W RCOH )

M 9/ W )

M RCOH W

M /6 W )

M / W

M W )

M ( ) W ( )

Schedule – 1

9/3

9/8

9/9/

22 9/

9/10/1

(

10/20

Day Date Topic Lab Assignments Due

MAS Overview Safety/Lab assignment

MAS IC Lab - Overview IC-1: Gate oxide/poly 9/10 Vacuum System No Assignment

15 CVD IC-2: Photolith/Etch 17 Oxidation HW1 (Vac/CVD

Student Holiday IC-3: Test 24 MAS IC Lab: Testing HW2 (CVD/Oxidation

29 Diffusion No Lab RCOH Diffusion/Implantation IC Lab Report

10 MAS MEMS Lab: Overview MEMS-1: Backside 10/8 MAS Lithography HW3 Diffusion/Implant

10 13 Columbus Day-Holiday MEMS-2: KOH etch 10/15 MAS Lithography, Soft Lithography HW4 (Litho)

MAS MEMS Lab: Testing MEMS-3: Test 10/22 Staff Quiz#1 (up to Lithography Quiz#1

10/27 MAS Etching wet No Lab 10/29 MAS Etching dry MEMS Lab Report

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nd Half M / W

M W )

M ( ) W ( )

M W )

M W

M W ( e

M W RCOH

M W

M W

Schedule – 2

10/20

(

11/10

11/19

/

12/3

12/8 12/10

10 13 Columbus Day-Holiday MEMS-2: KOH etch 10/15 MAS Lithography, Soft Lithography HW4 (Litho)

MAS MEMS Lab: Testing MEMS-3: Test 10/22 Staff Quiz#1 (up to Lithography Quiz#1

10/27 MAS Etching wet No Lab 10/29 MAS Etching dry MEMS Lab Report

11/3 MAS Fluids Lab: Overview Fluids-1: Photolith 11/5 RCOH Sputtering HW5 etching

Veterans Day-Holiday No Lab 11/12 RCOH Evaporation Take Home

11/17 RCOH Interconnect Fluids-2: Molding MAS Advanced Si Devices HW6 Sputtering,Evap,Int

11/24 RCOH Crystal Growth No Lab 11 26 Reliability IC Lab Resubmit

12/1 MAS Fluids Lab: Testing Fluids-3: Test Staff Quiz#2: Soft Lith-Interconnect + 11/19,24,26 Lectures Quiz#2

Guest Special topic: Nanobio No Lab RCOH Special topic: Nanolithography Fluids Lab Report

M.A. Schmidt 3.155J/6.152J – Lecture 1 FA03 16

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Safety

� Sleep� Better safe than sorry

� Be responsible � Ask questions � Respect but don’t fear

� No injuries in the history of the class

M.A. Schmidt 3.155J/6.152J – Lecture 1 FA03 18