add-vision pe summitt 2010
TRANSCRIPT
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PrintedElectronicsSummit
J.DevinMacKenzie.
ChiefTechnologyOfficer
AddVision,
Inc.
ScottsValley,CaliforniaUSA95066
FLEXIBLEOLEDS:PRINTBASEDMANUFACTURING,
DEVICESAND
APPLICATIONS
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MOTIVATIONS:WHYPRINTEDORGANICELECTRONICS?
FunctionalityAND Cost
OLEDS:Thin,light,powerefficient,colorful,fastdisplays andlighting
Siisnotanefficientlightemitter
Efficientorganic
luminescence
possible
across
the
spectrum
LCD,PDP,andothersareinherentlyinefficient,highvoltageand/ordifficulttointegrate
LCDandplasmatechnologyarebasedonrigidglassanddimensionalstabilityisimportant
toopticalproperties.
OLEDSolidStateLighting:>100lm/Wpossiblebutweneedtoclosetheprocesscost/
areagap
CDTSony AVI
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THEFLEXIBLEPRINTEDPOLEDAPPROACH
Lifetime : > 50K hrsCost : ~$1.00/ in2
CapEx: >>> $100 MillionCo mpetition: LCD, Plasma
Printed Low Informa tion Co ntent
Flexible Disp lays & Bac klights
Formed Oc t 2001
15 Employees
>$2M Revenue
Corpo rate and Private
Ownership
High ResolutionPrinting and Display
Proc essing
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Stab le Ca thode
Air proc ess, red uc ed enc apsula tionUtilizes Existing Print Tools Low CAPEX
Less sensitive to non-uniformity Yield for print o n flex
OLED on plastic High volume sheet/ web
Air Stable
Flexible
Add-Vision Printed P-OLED
Printable
Barrier Plastic Substrate
&
Doped Light-Emitting Polym er
PrintedCathodeGlass
HTL
EBL
Emitter
HBLEIL
Reactive Cathode
Unstab le materials:- Slow va c uum p roc esses
Nanoscale m ultilayers:
- Sensitivity to p roc ess a nd sub strate
Sensitive to non-uniformities:
- Poo rer yield for print on flex
Conventiona l OLED
- High c ost / value
Conventional OLED
AVIDOPEDOLEDSTRUCTURECOMPARISON
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Materials Cost Breakdown for Backlight Displays
9up Design, White LEP 350nm, 1M/Month
$0.76, 26%
$1.18, 42%
$0.05, 2%
$0.12, 4%
$0.21, 7%
$0.54, 19% ITO barrier $/display
LEP$/display
Cathode Ink $/display
Getter $/display
Adhesive $/display
PET encap $/display
MATERIALSCOSTBREAKDOWN$/DISPLAY:
LightEmitting
PolymerInk
ITOBarrier
Substrate
KeytoLowCost
PrintManufacturingforOrganic
ElectronicsTechnologies:
Maximizeutilization/minimizewaste
ofhighvaluematerials
Beabletodothisforlargescaleand
smallscale(nearterm)manufacturing
Combinethemosteffectivesheet
andwebtechniquesintoascalable
processwithlowstartupcapitalcosts
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CONVENTIONALINLINEOLEDPROCESSFOROLEDPANELS
9Ultra
High
Vacuum
steps,
,
$30M
$150Min
Capital
Equipment*
Typicalestimatesof30nm/minarealreadyslow(~3mintacttime fora100nmlayer)
Depositionratesforkeycathode/EILlayersistypicallymuchslowerduetoorganic
layerdamageconstraints.
*
*DOESSLR&DManufacturingRoadmap Sept2009,page39
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AVIROLLPRINTINGANDWEBPROCESSINGDRIVERS
Materialsefficiency
AVI
has
co
developed
an
A4
roll
print
system
now
running
in
pilot
lab.
Highestinkefficiencyforlargeandsmallscalemanufacturing
Reducingwasteofemitterisbiggestopportunityformaterialscostsavings
Throughput
1m/secprintspeedsandrapiddryingreducedepreciationcost
Web
integration
of
AVI
process
demonstratedEncapsulation
Rollerlaminationbasedencapsulation
OLEDcompatibility,easeofmaterialshandling,webcompatibility
RollTool Oven#2
Oven#1Roll/SheetPrinter#1
RollPrinter#1
Clean,UVOzone
Laminator UVCureSubstratePrep LEPPrint CathodePrint
EncapPrep PumpOut
PumpOut
Sheetand webroll too ls
Ambientprinting ofcathode/int
erconnect
RollLaminationEncapsulation
ProcessTechnology
A4RollPrinted
OLEDApril2010
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OVERVIEWOFTECHNIQUESFORFLEXIBLEOLEDMANUFACTURING
Digital PrintingSpin Coating Roll Printing
+ Lowcostequipment+ Highthroughput,thick+ Low$designchange
+Sheetor
web
+ Scalableto>1m
- Resolution>100m- Contactdefect- Uniformity
- High
/
special
inks
+ Gooduniformity+ Intermediateink
- PoorEfficiency- Nopatterning- Substratesize>1m+ Highestthroughput+ Highinkefficiency
+ Resolutionto
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PRINTEDLEPPROCESSANDINKDEVELOPMENT:SCALINGSCREENTOROLLPRINTING
Roll PrintingEarly Screen ink -
based formulation
Screen PrintingSOP Ink Formulation
Ra=98.5nm
t=610nm
EL
Ra=50.66nmt=361nm
EL
Ra=17.94nmt=250nm
EL
Roll PrintingOptimized ink and print
process
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DRIVINGPROGRESSIN PRINTED WHITEOLEDS
8
Manipulate
electronicstructureand
physical
properties
RapidcycleofLEPmaterialdesign&synthesis,ink
formulation,devicefabrication,testandanalysis
AVIDopant&
Formulations
R&DNewLEP
AVI
Device
Structuringand
Encapsulation
R&D
02000
4000
6000
8000
10000
12000
May-08
Jun-08
Jul-0
8
Aug-08
Sep-08
Oct-0
8
Nov-08
Dec-08
Jan-09
Feb-
09
Mar
-09
Apr-0
9
May-09
L
ifetimeinair
[Hrs,
100Cd/m2T50]
Testingand
Characterization
PrintedWhitePOLEDPerformanceImprovement20082009
R&D
Cycle
Significantimprovementsin
efficiencyandlifetimeoverthe
lastyearsdevelopmentcycle
to>10KHoursforanair
printedflex
OLED
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Consumer &
Industrial
Appliances
$4,697 , 55%
Smart Labels &
Packaging$106, 1%
Greeting Cards
$132, 2%Gift Cards$177, 2%
Electronic Signage
$1,147 , 13%
Vending & Gaming
$538 , 6%
Smart Cards
$368, 4%
Electronic Toys,
$328 , 4%
POP Displays,
$1,082 , 13%
TotalServiceableMarket:
US$8.4billion
MARKETOPPORTUNITY
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2009LEDLIGHTINGMARKET
DOESSLMYPPMarch2010,page36DOESSLMYPPMarch2010,page40AVIaddressing
these
marketsnow
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NICHELIGHTINGAPPLICATIONSENERGYSAVINGSPOTENTIAL
DOESSLMYPPMarch2010,page36
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Fundamental IP& Materials
Device,Materials and
Process
Technology
ComponentManufacturers
DisplayModule
IntegratorsEnd Users
Integrates P-OLEDcomponents into afinished display
Fundamental IP
Light-EmittingPolymers
Encapsulation
LEP Inks
Cathode Inks
Processing
Encapsulation
Device Structure
P-OLED Manufacture
Graphic Overlays
Driver Module
Power Supply
IP Package End product
Consumers
VALUECHAIN
Add-Vision Licensees
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Device,Materials
andProcess
Technology
LEPInks
CathodeInks
Encapsulation
DeviceStructure
IPPackage
PRINTEDFLEXIBLEPOLEDTECHNOLOGYSCOPE
PrintProcessfor
SheetandWeb
Barrier Plastic Substrate
Doped Light-Emitting Polymer
PrintedCathode
e-
h+
Barrier Plastic Substrate
Doped Light-Emitting Polymer
PrintedCathode
e-
h+
ScreenPrinting
RollPrintingfor
SheetandWeb
FlexibleEncapsulation
Prototypingand
ProductDevelopment
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PRODUCTDEVELOPMENTANDPROTOTYPING
OLED
Card
Applications
POPTypeDisplays
NumericalDataandIconPanels
Backlighting
PassiveMatrixOLED+Solar=Plugless
WirelessandBatteryDrivenCards
Wearable
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Commercialization
Commissioningof
pilot
line
manufacturing
Productspecification,development,prototypingandscaleup.
Closetechnicalsupportofour4licensees.
Growingmaterialssupplychain:AVIinksandencapsulationmaterials
Leverageadvantages
in
planar,
thin,
uniform
and
low
voltage
emission
whichis patternable withdigitalinformationcontentatlowcost.
R&D
Optimizematerialsefficiencyinmanufacturing
Introducenew,
high
throughput
printing
capability
into
the
manufacturingprocess:sheetandweb
Highpowerefficiency,lowvoltage,fast,uniformandthindevices
Grantsand
Support
DepartmentofEnergy
OfficeoftheSecretaryofDefense
NationalScienceFoundation
ADDVISIONNEARTERMOUTLOOK
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Contact:
devinm@add
vision.com8314388192x218
8314388194fax
1600GreenHillsRoad,Suite100
ScottsValley,CA95066
T.Amato,J.J.Breeden,J.P.Chen,P.Galli,M.Griffo,D.
Hardinger,P.Hinkle,E.Jones,D.MacKenzie,A.Menon,
Y.Nakazawa,M.Wilkinson,andJ.Zhang.