add-vision pe summitt 2010

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  • 8/8/2019 Add-Vision PE Summitt 2010

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    PrintedElectronicsSummit

    J.DevinMacKenzie.

    ChiefTechnologyOfficer

    AddVision,

    Inc.

    ScottsValley,CaliforniaUSA95066

    FLEXIBLEOLEDS:PRINTBASEDMANUFACTURING,

    DEVICESAND

    APPLICATIONS

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    2AVI - Ma c Kenzie 2010

    MOTIVATIONS:WHYPRINTEDORGANICELECTRONICS?

    FunctionalityAND Cost

    OLEDS:Thin,light,powerefficient,colorful,fastdisplays andlighting

    Siisnotanefficientlightemitter

    Efficientorganic

    luminescence

    possible

    across

    the

    spectrum

    LCD,PDP,andothersareinherentlyinefficient,highvoltageand/ordifficulttointegrate

    LCDandplasmatechnologyarebasedonrigidglassanddimensionalstabilityisimportant

    toopticalproperties.

    OLEDSolidStateLighting:>100lm/Wpossiblebutweneedtoclosetheprocesscost/

    areagap

    CDTSony AVI

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    THEFLEXIBLEPRINTEDPOLEDAPPROACH

    Lifetime : > 50K hrsCost : ~$1.00/ in2

    CapEx: >>> $100 MillionCo mpetition: LCD, Plasma

    Printed Low Informa tion Co ntent

    Flexible Disp lays & Bac klights

    Formed Oc t 2001

    15 Employees

    >$2M Revenue

    Corpo rate and Private

    Ownership

    High ResolutionPrinting and Display

    Proc essing

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    4AVI - Ma c Kenzie 2010

    Stab le Ca thode

    Air proc ess, red uc ed enc apsula tionUtilizes Existing Print Tools Low CAPEX

    Less sensitive to non-uniformity Yield for print o n flex

    OLED on plastic High volume sheet/ web

    Air Stable

    Flexible

    Add-Vision Printed P-OLED

    Printable

    Barrier Plastic Substrate

    &

    Doped Light-Emitting Polym er

    PrintedCathodeGlass

    HTL

    EBL

    Emitter

    HBLEIL

    Reactive Cathode

    Unstab le materials:- Slow va c uum p roc esses

    Nanoscale m ultilayers:

    - Sensitivity to p roc ess a nd sub strate

    Sensitive to non-uniformities:

    - Poo rer yield for print on flex

    Conventiona l OLED

    - High c ost / value

    Conventional OLED

    AVIDOPEDOLEDSTRUCTURECOMPARISON

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    5AVI - Ma c Kenzie 2010

    Materials Cost Breakdown for Backlight Displays

    9up Design, White LEP 350nm, 1M/Month

    $0.76, 26%

    $1.18, 42%

    $0.05, 2%

    $0.12, 4%

    $0.21, 7%

    $0.54, 19% ITO barrier $/display

    LEP$/display

    Cathode Ink $/display

    Getter $/display

    Adhesive $/display

    PET encap $/display

    MATERIALSCOSTBREAKDOWN$/DISPLAY:

    LightEmitting

    PolymerInk

    ITOBarrier

    Substrate

    KeytoLowCost

    PrintManufacturingforOrganic

    ElectronicsTechnologies:

    Maximizeutilization/minimizewaste

    ofhighvaluematerials

    Beabletodothisforlargescaleand

    smallscale(nearterm)manufacturing

    Combinethemosteffectivesheet

    andwebtechniquesintoascalable

    processwithlowstartupcapitalcosts

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    CONVENTIONALINLINEOLEDPROCESSFOROLEDPANELS

    9Ultra

    High

    Vacuum

    steps,

    ,

    $30M

    $150Min

    Capital

    Equipment*

    Typicalestimatesof30nm/minarealreadyslow(~3mintacttime fora100nmlayer)

    Depositionratesforkeycathode/EILlayersistypicallymuchslowerduetoorganic

    layerdamageconstraints.

    *

    *DOESSLR&DManufacturingRoadmap Sept2009,page39

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    7

    AVIROLLPRINTINGANDWEBPROCESSINGDRIVERS

    Materialsefficiency

    AVI

    has

    co

    developed

    an

    A4

    roll

    print

    system

    now

    running

    in

    pilot

    lab.

    Highestinkefficiencyforlargeandsmallscalemanufacturing

    Reducingwasteofemitterisbiggestopportunityformaterialscostsavings

    Throughput

    1m/secprintspeedsandrapiddryingreducedepreciationcost

    Web

    integration

    of

    AVI

    process

    demonstratedEncapsulation

    Rollerlaminationbasedencapsulation

    OLEDcompatibility,easeofmaterialshandling,webcompatibility

    RollTool Oven#2

    Oven#1Roll/SheetPrinter#1

    RollPrinter#1

    Clean,UVOzone

    Laminator UVCureSubstratePrep LEPPrint CathodePrint

    EncapPrep PumpOut

    PumpOut

    Sheetand webroll too ls

    Ambientprinting ofcathode/int

    erconnect

    RollLaminationEncapsulation

    ProcessTechnology

    A4RollPrinted

    OLEDApril2010

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    OVERVIEWOFTECHNIQUESFORFLEXIBLEOLEDMANUFACTURING

    Digital PrintingSpin Coating Roll Printing

    + Lowcostequipment+ Highthroughput,thick+ Low$designchange

    +Sheetor

    web

    + Scalableto>1m

    - Resolution>100m- Contactdefect- Uniformity

    - High

    /

    special

    inks

    + Gooduniformity+ Intermediateink

    - PoorEfficiency- Nopatterning- Substratesize>1m+ Highestthroughput+ Highinkefficiency

    + Resolutionto

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    9AVI - Ma c Kenzie 20109

    PRINTEDLEPPROCESSANDINKDEVELOPMENT:SCALINGSCREENTOROLLPRINTING

    Roll PrintingEarly Screen ink -

    based formulation

    Screen PrintingSOP Ink Formulation

    Ra=98.5nm

    t=610nm

    EL

    Ra=50.66nmt=361nm

    EL

    Ra=17.94nmt=250nm

    EL

    Roll PrintingOptimized ink and print

    process

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    DRIVINGPROGRESSIN PRINTED WHITEOLEDS

    8

    Manipulate

    electronicstructureand

    physical

    properties

    RapidcycleofLEPmaterialdesign&synthesis,ink

    formulation,devicefabrication,testandanalysis

    AVIDopant&

    Formulations

    R&DNewLEP

    AVI

    Device

    Structuringand

    Encapsulation

    R&D

    02000

    4000

    6000

    8000

    10000

    12000

    May-08

    Jun-08

    Jul-0

    8

    Aug-08

    Sep-08

    Oct-0

    8

    Nov-08

    Dec-08

    Jan-09

    Feb-

    09

    Mar

    -09

    Apr-0

    9

    May-09

    L

    ifetimeinair

    [Hrs,

    100Cd/m2T50]

    Testingand

    Characterization

    PrintedWhitePOLEDPerformanceImprovement20082009

    R&D

    Cycle

    Significantimprovementsin

    efficiencyandlifetimeoverthe

    lastyearsdevelopmentcycle

    to>10KHoursforanair

    printedflex

    OLED

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    AVI - Ma c Kenzie 2010 11

    Consumer &

    Industrial

    Appliances

    $4,697 , 55%

    Smart Labels &

    Packaging$106, 1%

    Greeting Cards

    $132, 2%Gift Cards$177, 2%

    Electronic Signage

    $1,147 , 13%

    Vending & Gaming

    $538 , 6%

    Smart Cards

    $368, 4%

    Electronic Toys,

    $328 , 4%

    POP Displays,

    $1,082 , 13%

    TotalServiceableMarket:

    US$8.4billion

    MARKETOPPORTUNITY

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    2009LEDLIGHTINGMARKET

    DOESSLMYPPMarch2010,page36DOESSLMYPPMarch2010,page40AVIaddressing

    these

    marketsnow

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    AVI - Ma c Kenzie 2010 13

    NICHELIGHTINGAPPLICATIONSENERGYSAVINGSPOTENTIAL

    DOESSLMYPPMarch2010,page36

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    Fundamental IP& Materials

    Device,Materials and

    Process

    Technology

    ComponentManufacturers

    DisplayModule

    IntegratorsEnd Users

    Integrates P-OLEDcomponents into afinished display

    Fundamental IP

    Light-EmittingPolymers

    Encapsulation

    LEP Inks

    Cathode Inks

    Processing

    Encapsulation

    Device Structure

    P-OLED Manufacture

    Graphic Overlays

    Driver Module

    Power Supply

    IP Package End product

    Consumers

    VALUECHAIN

    Add-Vision Licensees

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    Device,Materials

    andProcess

    Technology

    LEPInks

    CathodeInks

    Encapsulation

    DeviceStructure

    IPPackage

    PRINTEDFLEXIBLEPOLEDTECHNOLOGYSCOPE

    PrintProcessfor

    SheetandWeb

    Barrier Plastic Substrate

    Doped Light-Emitting Polymer

    PrintedCathode

    e-

    h+

    Barrier Plastic Substrate

    Doped Light-Emitting Polymer

    PrintedCathode

    e-

    h+

    ScreenPrinting

    RollPrintingfor

    SheetandWeb

    FlexibleEncapsulation

    Prototypingand

    ProductDevelopment

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    PRODUCTDEVELOPMENTANDPROTOTYPING

    OLED

    Card

    Applications

    POPTypeDisplays

    NumericalDataandIconPanels

    Backlighting

    PassiveMatrixOLED+Solar=Plugless

    WirelessandBatteryDrivenCards

    Wearable

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    Commercialization

    Commissioningof

    pilot

    line

    manufacturing

    Productspecification,development,prototypingandscaleup.

    Closetechnicalsupportofour4licensees.

    Growingmaterialssupplychain:AVIinksandencapsulationmaterials

    Leverageadvantages

    in

    planar,

    thin,

    uniform

    and

    low

    voltage

    emission

    whichis patternable withdigitalinformationcontentatlowcost.

    R&D

    Optimizematerialsefficiencyinmanufacturing

    Introducenew,

    high

    throughput

    printing

    capability

    into

    the

    manufacturingprocess:sheetandweb

    Highpowerefficiency,lowvoltage,fast,uniformandthindevices

    Grantsand

    Support

    DepartmentofEnergy

    OfficeoftheSecretaryofDefense

    NationalScienceFoundation

    ADDVISIONNEARTERMOUTLOOK

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    Contact:

    devinm@add

    vision.com8314388192x218

    8314388194fax

    1600GreenHillsRoad,Suite100

    ScottsValley,CA95066

    T.Amato,J.J.Breeden,J.P.Chen,P.Galli,M.Griffo,D.

    Hardinger,P.Hinkle,E.Jones,D.MacKenzie,A.Menon,

    Y.Nakazawa,M.Wilkinson,andJ.Zhang.