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WITH:

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• Estimated sales price

Adesto CBRAM Memory

Title: Adesto CBRAM

Memory

Pages: 76

Date: May 2017

Format: PDF & Excel file

Price: Full report:

EUR 2,990

Ultra-low power, ultra-fast memory die designed for the Internet-of-Things and wearables

Conductive-Bridging Random Access Memory (CBRAM®) from AdestoTechnologies.

The memory die comes in Narrow Small Outline Integrated Circuit (SOIC)packaging. We have analyzed devices from 32 kbit to 512 kbit @1MHz speed,and found they all have, surprisingly, the same die size. Another interestingthing is the integration of one transistor, one resistor (1T1R), type memory withinnovative materials, leading to easy CMOS integration.

This report analyzes the complete component, from the package to the diedeveloped by Adesto Technologies and licensed by Infineon. The reportincludes a complete analysis of the resistive layer which forms the memorycells. We use cross-sections of the die and removal of the metal layers tounderstand the technology. We also provide a complete description of thememory cell process to explain the manufacturing.

Finally, the report includes a complete cost analysis and a selling priceestimation of the CBRAM components.

The Internet-of-Things and wearables arethe exciting new frontier for OriginalEquipment Manufacturers (O EMs) .Consequently, from smartwatches to GPStracking devices, low power consumptionand high speed have become the keychallenge for device designers. And thememory component can be key in reducingpower consumption. Electrically ErasableP ro g ra m m ab l e Re ad - O nl y M e m or y(EEPROM) needs a non-negligible current inwrite mode. Therefore, alternative Non-Volatile Memory (NVM) is needed, like the

TABLE OF CONTENTS

Overview / Introduction

Adesto Technologies Company Profile

Physical Analysis• Physical Analysis

Methodology

• Package

View and dimensions

Package opening

Package cross-section

• Memory Die

View, dimensions and markings

Cross-section: metal layers, memory switch, transistor

Die metal deprocessing

Die delayering, main block ID and process

• Die Process Characteristics

Author (Lab):VéroniqueLe Troadec

AUTHORS:

Consulting in 2011 to setup itslaboratory. He previouslyworked for 25 years atAtmel Nantes TechnologicalAnalysis Laboratory as fabsupport in physical analysis,and for three years at HirexEngineering in Toulouse, in adestructive physical analysislab.

Yvon Le Goff (Lab)

Yvon has joinedS y s t e m P l u s

StéphaneElisabeth

Stéphane has adeep knowledge

of materials characterizationsand electronics systems. Heholds an Engineering Degree inElectronics and NumericalTechnology, and a PhD inMaterials for Microelectronics.

Manufacturing Process Flow

• Wafer Fabrication Unit

• Resistive Switch Process Flow

• Final Assembly Unit

Cost Analysis• Cost Analysis Overview

• The Main Steps Used in the Economic Analysis

• Yield Hypotheses

• Die Cost

Front-end (FE) cost

Back-end: tests and dicing

Wafer and die cost

• Component

Packaging cost

Component cost

Estimated Price Analysis

System Plus Consulting offers

powerful costing tools to

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MEMS CoSim+

Cost simulation tool to

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IC Price+

The tool performs the

necessary cost simulation of

any Integrated Circuit: ASICs,

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memories, smartpower…

ANALYSIS PERFORMED WITH OUR COSTING TOOLS MEMS COSIM+ AND IC PRICE+

MEMS CoSim+

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3D TSV and 2.5D Business

Update – Market and

Technology Trends 2017

Emerging Non-Volatile Memory 2016

AMD World’s First HBM-Powered Product

SK Hynix 3D TSV High-Bandwidth Memory

3D integration, a leading-edgetechnology supporting high-performance applications - Fromimaging to artificial intelligence, anentire ecosystem in motion.

The new Storage-Class Memory(SCM) category will be the biggestemerging NVM market, withembedded MCU seeking emergingNVM for strategic differentiation.

The first ever 3D IC combining DRAMand GPU with TSV and siliconinterposer packaging analysis andreverse costing report.

Pages: 300+Date: May 2017Full report: EUR 6,490*

Pages: 275+Date: July 2016Full report: EUR 6,490*

Pages: 120Date: September 2015Full report: EUR 3,490*

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