advanced sensors and novel concepts for …...2012/10/08 · aerodays 2011 conference 31 march 2011...

Advanced Sensors and Novel Conceptsfor Intelligent and Reliable Processing

in Bonded Repairs– the SENARIOSENARIO project

presented byMr. David Hernández Rodero

SENER & SENARIO Consortium

the results of an EC funded research projectFramework 6 – Aeronautics & Space area

AeroDays 2011 Conference 31 March 2011 – Madrid

Project partnersGMI Aero

INASCO (coordinator)

Laser Zentrum Hannover

National Tech. Univ. Athens

Kharkiv Aviation Institute

Tel Aviv University

INASMET

SENER

Israel Aircraft Industries

Bombardier Aerospace


Facts and figures

Start date: 01/01/2007

Finish date: 30/06/2010

Total effort: 294 man-months

Total cost: €2.92 MillionWorkplan: 9 technical WPs

1 exploitation WP1 management WP

7 nations2 large companies2 SMEs1 engineering firm2 research institutes3 universities

The The SENARIOSENARIO projectproject

Project Thematic AreaProject Thematic Area

The main limitation of the existing technology in bonding repair of aerospace structures is the inability of the repair control systems to assess the actual material state and integrate the available tools (simulations, measurements, experience and knowledge) into an intelligent material-based control system.

The main limitation of the existing technology in bonding repair of aerospace structures is the inability of the repair control systems to assess the actual material state and integrate the available tools (simulations, measurements, experience and knowledge) into an intelligent material-based control system.

To circumvent these limitations, the SENARIO project proposes the development of a revolutionary sensing systems linked to intelligent process control equipment and reliable methodologies of aero-structures component maintenance.

To circumvent these limitations, the SENARIO project proposes the development of a revolutionary sensing systems linked to intelligent process control equipment and reliable methodologies of aero-structures component maintenance.


Technical SolutionTechnical Solution

The proposed system consists of: • portable curing process console with blanket mounted

dielectric sensors• wireless non-intrusive dielectric sensors for monitoring

adhesive cure• reliable laser technology for increased automation and

bonding performance• thermo-mechanical simulation and monitoring set-up• intelligent multi-zone process guidance system for the

repair control unit for co-curing• technique for bonded repairs with reliability, controlled

quality and certification potential

The proposed system consists of: • portable curing process console with blanket mounted

dielectric sensors• wireless non-intrusive dielectric sensors for monitoring

adhesive cure• reliable laser technology for increased automation and

bonding performance• thermo-mechanical simulation and monitoring set-up• intelligent multi-zone process guidance system for the

repair control unit for co-curing• technique for bonded repairs with reliability, controlled

quality and certification potential


Fields of activitiesFields of activities

nano-scale

HOT BONDER SENSORSIN BLANKET INTELLIGENT MULTI-ZONE REPAIR CENTRE+ =

CRACKED PART

T/C(n)Heater 1 Heater nT/C(2)T/C(1) Heater 2

HOT BONDERCURE MONITORING

PROCESS CONTROL

+=

dielectric sensors

Hot bonder + process monitoring: SENARIO technology allows the optimal and safe processing of adhesive patch where thermomechanical modelling and simulation tools support complex (multi-zone) controllable repair processes


Development of adhesive sensing system► Monitoring cure of patch and adhesive film for repair process optimisation

Sensors fabricated for repair process monitoring

Sensor type NiP on ceramic NiP on ceramic Cu on Kapton filmSpacing /channel 100μm / 100μm 100μm / 100μm 80μm / 80μm

Structure

Air capacitance (pF) 5.5 4.5 3.2Feature durable, high T durable, high T disposable, low cost

sensing mat embedded / bondlinein metal plate

SENARIOSENARIO technology development [1]technology development [1]


SENARIOSENARIO technology development [2]technology development [2]Development of portable cure processing system► Integration of hot bonder to monitoring system (concept, hardware, software, applications)

Experimental set-up at NTUA laboratory


Development of portable cure processing system (continued)► Integration of sensors in a special mat for monitoring cure of patch during repair process

2 sensors embedded in the sensing mat

aluminium substrateM20 pre-preg

sensing mat 21

heating blanket

vacuum bag

vacuum bag

perforated sheet

glass fibre breather

T/CT/Cwirewire

powerpower

controlT/C



SENARIOSENARIO technology development [4]technology development [4]Thermomechanical process monitoring and correlation of sensing► Interaction and correlation between dielectric and optical sensing in repair processes

Determination of the point where stresses start to build up


Development of laser technology for adhesive repair► Application of laser ablation/processing for altering or improving surface characteristics

of composite materials towards bonding optimisation

Selective removal of the cured

composite matrix

3D-Ablation of the cured composite

material

Deployed UV laser source


Laser Pre-Treatment


Development of adhesive sensing system► Monitoring cure of patch and adhesive film for repair process optimisation

0

20

40

60

80

100

120

140

5

5.5

6

6.5

7

7.5

8

8.5

9

9.5

150 200 250 300 350 400

Tem

pera

ture

log

[Z''m

ax(O

hm)]

Time (min)

Imaginary Impedance maximum

sensor 3

T/C 2

0

20

40

60

80

100

120

140

5

5.5

6

6.5

7

7.5

8

8.5

9

150 200 250 300 350 400

Tem

pera

ture

log

[Z''m

ax(O

hm)]

Time (min)

Imaginary Impedance maximum

sensor 1

T/C 2

Dielectric sensing [ion viscosity] (blue line) of thermoset

patch cure

Dielectric sensing [ion viscosity] (blue

line) of adhesive film cure

Lay-up for repair of composite materials

Sensing mat (grey) for monitoring

patch cure

Flat sensor for monitoring

adhesive film cure

Repair set-up in the instrumented autoclave (Shorts)



Repair process simulation and modelling tools► Modelling of cure process for real-time degree of cure measurements (material state

monitoring)► Simulation tool for integral thermal/mechanical/chemical assessment of thermoset cure in

repair processes (where temperature and stress variations are not desired)

Integration of parametric cure kinetics and shrinkage models

for paste adhesive resin


0 20 40 60 80 100 120 140 160

0.0

0.2

0.4

0.6

0.8

kinetic modelZ"max average values

t (min)

Con

vers

ion

6

8

10

Log Z"max

Determination of the degree of cure in real time through the translation of dielectric signal


TEMPERATURE

20

25

30

35

40

45

50

55

60

65

70

0 10 20 30 40 50 60

Time [min]

Tem

pera

ture

[ºC

]

TCT1T2T3T4T5T6T7T8T9

DEGREE OF CURE

0%

10%

20%

30%

40%

50%

60%

70%

80%

0 10 20 30 40 50 60

Time [min]

Degr

ee o

f Cur

e [%

]

TCT1T2T3T4T5T6T7T8T9

Prediction of temperature, conversion, strains, etc. at

several locations of the system


SENARIOSENARIO technology benefits and riskstechnology benefits and risksBenefits: All these can lead to optimised and improved repair processing,

enhanced understanding of the material processes in adhesive bonding (patch and adhesive resin cure), shorter repair cycles and fail-safe procedures.

Impact: The application potential is not only limited to aerospace structures. The experience from this project is of great interest also for other industrial innovations as in repair processes of naval and construction structural composites with modelling and sensing capability or even of compacted structures in space, and self-healing surfaces and coatings.

Risks: There is not clear risk assessment in the use of embedded thin films at the bondline for the monitoring of adhesive cure during bonding. The sensor size and the cost of sensor wireless communication may become an issue for the industrialisation of the novel technique as cost reduction is a strong driver in the transport sector.

Recommendation: Multi-disciplinary research groups offer the potential for targeted technological development and fast knowledge transfer of advanced processing and control to several industrial sectors. These activities should be encouraged and actively supported.


Many thanks Many thanks (from the (from the SENARIOSENARIO Consortium)Consortium)

to the organisers to the organisers for allowing for allowing SENARIOSENARIO output output

to be disseminated to be disseminated to the to the AeroDaysAeroDays forumforum

For further technical matters For further technical matters and followand follow--up actionsup actions

please contactplease contactINASCOINASCO HellasHellaswww.inasco.comwww.inasco.com

[email protected]@inasco.com

http://www.inasco.com/

advanced sensors and novel concepts for …...2012/10/08 · aerodays 2011 conference 31 march 2011...

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