CONFERENCE ;"\

AESF/EPA Conference for EnvironmentalExcellenceJanuary 29-February 2, The Rosen Centre, Orlando, Fla.

W hat 's happening withMP&M? Nickel? Chro­mium? What's a "green

factory?" Does your shop qualifyas one? Learn how to save moneythrough E2 (energy efficiency, thenewest industry buzzword).

These topics and more will bediscussed in depth by the most in­formed sources at the conferencethat has been jointly sponsored bythe U.S. EPA and the AESF formore than 20 years. This confer­ence has remained popular with in­dustry practitioners because itchanges its focus with the times tobe responsive to finishers' needs.

For more information contactthe American Electroplaters andSurface Finishers Society, 12644Research Parkway, Orlando, FL32826; phone, 407/281-6441; fax,407/281-6446; E-mail, education@aesf.org.

TECHNICALPROGRAMMONDAY.,JANUARY t7

9 a.m.-7 p.m,

Opening Session APlenary Session9 a.m.-Welcome & Introductions

Moderator: B.J. Mason, LombardTechnologies (Mid-Atlantic Finish­ing), Capitol Heights, MD

9:15 a.m., A-I-The RegulatoryFramework: Trends, Challenges& Opportunities in the NewMillennium

Presenters: Christian Richter and AlCollins, Government Relations,Washington

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9:45 a.m., A-2-Strategic GoalsAccomplishments: CollaborationWins

Presenter: Robert Benson, U.S. EPAOffice of Policy, Washington

10:30 a.m., A-3-The Crystal Ball:The Future of Innovation is inthe States

Presenters: Peter Wise, Associate Di­rector, Illinois EPA; Terry Fabian,Deputy Director, Pennsylvania DEP;Linda Wiese, Director, Bureau of Co­operative Environmental Assistance,Wisconsin DNR

11:30 a.m., A-4-Keynote AddressChuck Fox has had to cancel.Replacement speaker to beannounced on site.

Noon-2 p.m.-Lunch on your own

Session BThe New Millennium &Environmental Policy:Challenges for IndustryModerator: John Lindstedt, ArtisticPlating, Milwaukee

2 p.m., B-I-In the Trenches ofStrategic Goals: Making it Workat the Local Level

David Jacobs, Northwestern Plating,Chicago; John Chamalian, GuildPlaters, Long Island City, N.Y.; RichSustich, Chicago Water District; PhilHeckler, New York City DEP

3 p.m., B-2-Surface FinishingEnvironmental BenchmarkingStudy: Trends & Implications

Presenters: George Cushnie, CAl,Oakton, Va.; Edie Wiarda, MichiganManufacturing Technology Center,Ann Arbor, Mich.

3:30 p.m., B-3-ISO 14000 &Environmental ManagementSystems: The Future?

4 p.m., B-4-EnvironmentalTechnology Verification forMetal FinishingAlva Daniels, U.S. EnvironmentalProtection Agency (EPA), Cincinnati;James E. Voytko and Donn Brown,Concurrent Technologies Corporation(CTC), Largo, Fla.

4:30-5:30 p.m.-Panel Discussion

Session CUnderstanding RiskSession Chairman: Matt Lorber, U.S.EPA

2 p.m., C-I-EPA's MetalFinishing Facility RiskScreening Tool (MFFRST): Part1, Status & Update

Matthew Lorber and Paul Shapiro, Of­fice of Research & Development, U.S.EPA, Washington; Greg Schweer, Ste­phen Schwartz, Charles Peck, andDavid Bottimore, Versar Inc., Spring­field, Va.

2:30 p.m., C·2-EPA's MetalFinishing Facility RiskScreening Tool (MFFRST): Part2, Updates to Source EmissionCharacterization

Stephen Schwartz, Versar Inc.,Springfield, Va.; Matthew Lorber, Of­fice of Research & Development, U.S.EPA, Washington

3 p.m., C-3-Risk Screening ofChemicals in the Absence ofData

Ihab H. Farag and MelissaWaleryszak, Chemical EngineeringDepartment, University of NewHampshire, Durham, N.H.; WilliamT. Waugh and Maggie Wilson, U.S.EPA, Office of Pollution Prevention &Toxics (OPPT), Washington

Metal Finishing

3:30 p.m., C-4-Integrated PlantModel for Maximum WasteReduction in Cleaning & RinsingOperations

H,H. Lou and Yinlun Huang, Chem­ical Engineering & Materials Sci­ence, Wayne State University, De­troit

EXHIBIT RECEPTION

TUESDAY• .JANUARY

9 a.m.-5 p.m,

Session DRegulatory & ComplianceUpdate

9 a.m., D-I-Surface FinishingGovernment Relations Update &Regulatory Overview

Christian Richter and AI Collins,Government Relations, Washington

9:30 a.m., D-2-ResourceConservation & Recovery Act:F006 Regulatory Update

Presenter: Kristina Meson, U.S.EPA Office of Solid Waste, Arling­ton, Va.

10:30 a.m., D-3-Clean Water Act:Metal Products & MachineryRule

Presenter: Shari Zuskin, U.S. EPAOffice of Water, Washington

11 a.m., D-4-Clean Water Act:Industrial PretreatmentStreamlining Rule

Presenter: Pat Bradley, U.S. EPA Of­fice of Water, Washington

11:30 a.m., D-5-Clean Air Act:Regulatory Update

Presenter: Laura McKelvey, U.S.EPA Office of Air & Radiation, Ra­leigh-Durham, N.C.

ExhibitLunch in Exhibit HallReception (3:30-5 p.m.)

January 2001

, ,~'

Session EWater & RinsewaterWorkshopSession Chairman: Fred Reinhard,CH2M Hill, Eagan, Minn.

Session FAlternative Processes I

9 a.m., F-I-Non-line-of-sightHard Chromium Alternatives

M. Hull, M. Klingenberg, M. Pavlik,D. Trunick, and D. Schario, Concur­rent Technologies Corp., Johnstown,Pa.

9:30 a.m., F-2-A New Ni-Fe-CoAlloy Substitute for ChromiumPlating

Wenhua Hui, Shining Surface Sys­tems Inc., Ewing, N.J.

10 a.m., F-3-A New Alternativefor Decorative HexavalentChromium Plating

Michael Flanigan and Blair Vandi­vier, Benchmark Products Inc., Indi­anapolis

10:30 a.m., F-4-Hard ChromeAlternatives Team Update­Improving Performance WhileReducing Cost

Keith Legg, Rowan TechnologyGroup, Chicago; Bruce Sartwell,Naval Research Laboratory, Wash­ington

11 a.m., F-5-MFASC-SCAQMDNickel Electroplating Emissions& Control Technology Study

M. Dean High, Pacific EnvironmentalServices Inc., Baldwin Park, Calif.

Session GFundamentalsSession Chairman: Derek Vachon,Canadian Finishing Systems Ltd.,Burlington, Ont.

9 a.m., G-I-Critical Options inAqueous Cleaning Systems

Harish A. Bhatt, Visteon, Ypsilanti,Mich.

9:30 a.m., G-2-Case Study:Integrated Water RecyclingSystem for SemiconductorManufacturer ReducesConsumption by 15.8 MillionGallonslYr

George Sendrey, Kinetico EngineeredSystems Div., Newbury, Ohio

10 a.m., G-3-EstimatingChemical Air Emissions fromProcess Tanks at a PlatingJobshop Using a Timely &Inexpensive Method

James Tobin, DAV-TECH PlatingInc., Marlboro, Mass.

10:30 a.m., G-4-IPC's Health &Safety Audit Form

Joan Girard, Electrotek Corp., OakCreek, Wis.

11 a.m., G-5-Rinsewater RecycleDesign & Operations

Gregory R Allan, Advanced ChemicalTechnologies, Redmond, Wash.;Charles M. Babb, Hytek Finishes Co.,Kent, Wash.

11:30 a.m., G-6-A Review ofNickel Plating Bath LifeExtension, Nickel Recovery &Copper Recovery from NickelBaths

Diana R Bless, U.S. EPA, Cincinnati

Session HAlternative Processes II

1:30 p.m., H-I-Elimination ofChromates in Paint Preparation

Richard H. Buchi, TIELM. Hill AFB,Utah

2 p.m., H-2-Validation of aFunctional Trivalent ChromiumPlating Process

RP. Renz, P.O. Miller, E.J. Taylor,C.D. Zhou, Faraday Technology Inc.,Clayton, Ohio; RA. Richardson,Techmetals Inc., Dayton, Ohio

2:30 p.m., H-3-Machine CuttingFluids-Environmental Problemor Improvement Opportunity?

Thomas Schoonover, The Boeing Co.,Portland, Ore.

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3 p.m., H-4-CorrosionPerformance of EnvironmentallyAcceptable Alternatives toChromium Coatings

E.W. Brooman, D.A. Schario, M.L.Klingenberg, E.J. Onesto, Concur­rent Technologies Corp., Johnstown,Pa.

3:30 p.m., H-5-VacuumDeposition of Chromium as anAlternative to Hexavalent orTrivalent Chromium Plating

Brent Lee, Stephen M. Koelzer, Tech­nic Inc., Sunnyvale, Calif.

Session IWastewater Treatment &Recycling PanelSession Chairman: Thomas H. Mar­tin, Delta Chemicals & EquipmentInc., Indianapolis

Session JEnvironmental Management 1Session Chairman: John Lott, Du­Pont Electronics, Research TrianglePark, N.C.

1:30 p.m., J.1-Using InformationTechnology to BenchmarkEnvironmental Performance

Glenna Ford, GreenWare Environ­mental Systems Inc., Toronto

2 p.m., J-2-The Application ofMembrane Technology as anElement of Business CompetitiveAdvantage

James A. Bilgo, Eric D. Fessler, Ken­neth E. Kaszubowski, Robert F. Pe­schel, Sigma Environmental ServicesInc., Oak Creek, Wis.

2:30 p.m., J-3-The Ion ExchangeResource Recovery Business

Peter Meyers, Larry Gottlieb, Resin­Tech Inc., Cherry Hill, N.J.

3 p.m., J-4-Economics of Health& Safety

Philip A. Platcow, Secor InternationalInc., Chestnut Hill, Mass.

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3:30 p.m., J-5-Development &Implementation of an ISO 14001Environmental ManagementSystem: The Advantages ofBecoming ISO 14001 Certified

Jeffrey A. Hedges, World ResourcesCompany (WRC), Pottsville, Pa.

3:30-5 p.m., Exhibit ReceptionExhibit Open

WEDNESDAY• .JANUARY 1.

9:30 a.m.-4 p.m,

Session KDump, Bleed or Maintain?Session Chairman: Kevin Klink,CH2M Hillfralisman Partners, Cor­vallis, Ore.

9 a.m., K-1-Aqueous CleanerRecycling at Raytheon SystemsCompany

Paul Fecsik, Raytheon Systems Co.,Tucson, Ariz.

9:30 a.m., K-2-Purification ofSulfuric Anodizing Bath UsingPatented Ion ExchangeTechnology

Mohamed Abid, Eco-Tec Inc., Picker­ing,Ont.

10 a.m., K-3-Treatment &Disposal of Spent ElectrolessNickel Plating Solutions

David Crotty, MacDermid Inc., NewHudson, Mich.; Don Baudrand, con­sultant, Poulsbo, Wash.

10:30 a.m., K-4-A SulfamateNickel Ammonium RemovalSystem

Anthony D'Amato, Zero DischargeTechnologies Inc., Chicopee, Mass.

11 a.m., K-5-Use of MembraneTechnologies for SourceReduction & Waste Minimizationin the Metal Finishing Process

Ken Martins, CH2M Hill EngineeredSystems, Santa Ana, Calif.

Session LEnvironmental Management 2Session Chairman: John Sharp, Tera­dyne Inc., Nashua, N.H.

9 a.m., L-1-A Practical Guide forScoring Environmental Aspectsto Determine Their Impact onthe Environment

Robert L. Iuliucci, Sequa Corp., Hack­ensack, N.J.

9:30 a.m., L-2-How to Use a LifeCycle Assessment to Its Fullest:The Fundamentals

Wayne E. Bates, Rizzo Associates,Natick, Mass.

10 a.m., L-3-ISO 14001Implementation Tips

Andrea L. Clemencio, Patrick R. Cur­ran, Dana-Long Mfg., Oakville, Onto

10:30 a.m., L-4-EnvironmentalPreparedness

Terry Begnoche, consultant, Farm­ington Hills, Mich.; John S. Vargo,consultant, Wixom, Mich.

11 a.m., L-5-EMS Template forMetal Finishers: EMSImplementation at SeveralSouthern California Facilities

Laura Bloch, D. Env., U.S. Environ­mental Protection Agency, Region 9,San Francisco; Michael Keefe,Patrick Wooliever, Tetra Tech EMInc., San Francisco

11:30 a.m., L-6-SegregatedWastewater Treatment forEnvironmental Excellence &Cost Effectiveness

Paul Eckerson, Molex Inc., Lincoln,Neb.

Session MWastewater Treatment &RecyclingSession Chairman: Lyle Kirman, Ki­netico Engineered Systems, New­bury, Ohio

1:30 p.m., M-1-WastewaterTreatment of CombinedElectroplating, Powder Coating& E-coat Process OperationsThat Are All Routed Through aConventional Flow-throughTreatment System

Mark E. Andrus, Taskem, Inc.,Brooklyn Heights, Ohio

Metal Finishing

2 p.m; M-2-0rganoclays ReduceP&T Costs

George R. Alther, Biomin Inc., Fern­dale, Mich.

2:30 p.m., M-S-The Use ofBromine Chemistry for SandFilter Disinfection

Frederick W. Lehmann, TASKEMInc., Brooklyn, Ohio

3 p.m., M-4-CeramicMicrofiltration for MetalFinishing Wastewater Treatment

David R. Stewart, BASX SystemsLLC, Fort Collins, Colo.

3:30 p.m., M-5-ln-processPurification of Plating Baths

R.P. Renz, P.O. Miller, E.J. Taylor,C.D. Zhou, Faraday Technology Inc.,Clayton, Ohio

Session NEmerging Technologies

Session Chairman: Dr. Fred Rein­hard, CH2M Hill, Eagan, Minn.

1:30 p.m., N-l-3-D ElectrolyticCell Provides New Option forWastewater Recycle & WasteMinimization

B. George Kniazewycz, Charles E.Lemon, Renovare International Inc.,Walnut Creek, Calif.

2 p.m., N-2-Removal of Chrome& Creation of a Zero DischargeSystem Using Electronic WaterPurification

Robert Atlas, Sabrex of Texas Inc.,San Antonio

2:30 p.m., N-S-An Environmental& Economic Comparison of IonExchange & RecentlyCommercialized ElectrochemicalTechnologies for the Recovery ofRinsewater in a Bright NickelPlating Facility

Dave Szlag, Chris Dillhoff, U.S. EPA,National Risk Management ResearchLaboratory (NRMRLl, Cincinnati

3 p.m., N-4-The Effectiveness ofElectrocoagulation as an Aid inWastewater Treatment

Jerry C. Brown, Illinois Waste Man­agement & Research Center (lW­MRC), Oak Brook, Ill.

3:30 p.m., N-5-Bioremediation inMetal Cleaning Applications

Barry Williams Atotech USA Inc.,Rock Hill, S.C. MF

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