alice si-fmd,t0,v0 25/03 2003jens jørgen gaardhøje, nbi, [email protected] forward detector...

25/03 2003

Jens Jørgen Gaardhøje, NBI, [email protected] 1

ALICE Si-FMD,T0,V0Forward detector overview

Si-FMD (Forward Multiplicity Detector) NBI+INRo Si-strip Ring counters (5) with >50.000 channels o -5.1< < -1.7; 1.7< < 3.4o Precise off-line charged particle multiplicity for A+A, p+p o Fluctuations event-by-event, flow analysis

V0 (Centrality and collision vertex) Lyon+Mexicoo 2 arrays of plastic scintillator tiles w. fiber+PMTo -5.1< < -2.5; 1.7< < 3.8o Main LVL0 MinBias for p+p and A+A and centrality trigger A+Ao Background rejection

T0 (Beam-Beam Detector) Jyvæskyla + MEPhI, INR, Budker, Kurchatov (presented by W. Trzaska)

o 2 arrays of 12 Cerenkov radiators + PM tubeso -5< < -4.5; 2.9< < 3.3o Fast timing LVL0 signal (=50ps), online vertex determinationo Main time reference and backup for MinBias trigger

25/03 2003


ALICE Si-FMD,T0,V0Forward detectors

T0R 2.9 < || < 3.3

T0 for the TOF (< 50 ps time res.) Two arrays of 12 quartz counters. Also backup to V0

SI-FMD Multiplicity and dn/d 1.7 < < 3.4 and -5.1 < < -1.7 Silicon strip detector disks (slow readout)

V0 1.7 < |< 3.8 and –5.1 < | | < -2.5

Interaction trigger, centrality trigger and beam-gas rejection. Two arrays of 72 scintillator tiles readout via fibers

T0L

PMD pre-shower det.

25/03 2003


ALICE Si-FMD,T0,V0Summary of Progress since Compr. Review

2002 Integration

o Vacuum chamber dim. settled, Be-pipe.o Overall placement and mounting scheme decided near IPo Left side detectors grouped with PMD, details to be

settled.o ITS services and cables a problem (background)

Si-FMDo Geometry, segmentation, FEE+BEE->DAQ scheme

proposed o Mechanical prototyping, FEE prototyping ongoing

T0o Realistic T0 model constructed, Rad+PM decidedo Electronics prototype development ongoing (CFD, T0).

V0o Baseline design and layout settledo Light collection tests ongoing

TDRo Strategy decided; aim at TDR after summer 2003.

25/03 2003


ALICE Si-FMD,T0,V0Integration in ALICE

Si-1Si-2

Si-3

V0-R

T0-R

25/03 2003


ALICE Si-FMD,T0,V0CERN Maquette 1:1

Si1 (inner)Si1(outer)

V0-R T0-R

Absorber

ITS-pixels

25/03 2003


ALICE Si-FMD,T0,V0Si-FMD

5 Si-strip rings segmented into 50.000 channels

Rapidity coverage from ITS (1.7) to 5.1.

Segmentation sufficient for ‘Poisson’ analysis

• Main Off-line charged particle multiplicity studies

• Average multiplicity (entropy, stopping)

• Fluctuations (phase transitions)

• Flow (termalisation, hydrodynamics)

Si3 Si2Si1

25/03 2003


ALICE Si-FMD,T0,V0Mechanical Installation

25/03 2003


ALICE Si-FMD,T0,V0Si1 mechanics model 1:1

Si detectors

Support plate

Digitizer card

Beam pipe support ringOuter ring still missing

25/03 2003


ALICE Si-FMD,T0,V0Left Side: Si2 & Si3

Details of mounting to be finalized

25/03 2003


ALICE Si-FMD,T0,V0Si rings

manufactured of 6” wafers

512

Inner:

Rin=4.2 cm

Rout=17.2 cm

Outer:

Rin=15.4 cm

Rout=28.4 cm

10x2x512=10240

20x2x256=10240

256

Possible suppliers:

Micron, UK

Hamamatsu, JP

25/03 2003


ALICE Si-FMD,T0,V0Coverage in pseudorapidity

Constraints:

Vacuum tube outer envelope: 42 mm,

Outer radius, ITS, Absorber, cables

Background from secondaries(small angles)

Design criteria:

Largest possible coverage

Largest symmetry left and right

Overlap between systems

Si1:

Out: 1.70< <2.29 In: 2.01< <3.40

Si2:

Out: -2.29<<-1.7 In: -3.68< <-2.28

Si3:

In: -5.09< <-3.68

Vertex shift (10cm): |d| 0.1

25/03 2003


ALICE Si-FMD,T0,V0Charged particle

occupancy including secondaries

20 sectors

512 strips each

10240 channels

20 sectors

512 strips each

10240 channels

40 sectors

256 strips each

10240 channelsHave increased number of strips by factor of 2 using ’128 ch VA-prime’

PA chip at practically same cost => average occupancy <1 for most strips!

x 2 x 2x 2

25/03 2003


ALICE Si-FMD,T0,V0Multiplicity resolution

25/03 2003


ALICE Si-FMD,T0,V0Primaries/(Prim+Second)

Si3

Si2in

Si2-out Si1-in

Si1-out

25/03 2003


ALICE Si-FMD,T0,V0Reconstructed

multiplicity.Average and width

Background Subtracted

All hits reconstructed

1.7

3.4

25/03 2003


ALICE Si-FMD,T0,V0Simulations of background from ITS services, cables

etc..

Under investigation.

Will contribute with additional. Background.

25/03 2003


ALICE Si-FMD,T0,V0Hybrid with Viking PA chips

VA preamp+shaper: 128 ch

Connector(s) forpower, control, read-out

Other components

Other components

Hybrid cards contain: FE–Preampl. chips Bias voltages distribution Gate/strobe distribution Read-out clock distribution Detector bias connection

Si detector

25/03 2003


ALICE Si-FMD,T0,V0Front end electronics

REQUIREMENTS: Adapted for 5-25pF

capacitance(300m Si, 0.5 cm2: 25pF,

1MIP: 22.400 e-)Dynamic range: 0-20 MIPSRadiation hardness:

>200kRadPeaking time: 1-2 sLow noise (good S/N)High integrationSample/hold and serial read-

out, 10 MHz clockModerate power consumptionSimple slow controls and

power reg.Affordable cost

VA1 prime 2 (Viking-IDEAS):Input capacitance: < 30 pF

0-20 MIPs>1MRad (0.35 m tech.)1-3 s475 e- at 25 pF => S/N 20:112810 Mhz clock

1.3 mW/chTest system available

OK

25/03 2003


ALICE Si-FMD,T0,V0FMD RO strategy

FMD Segment

ON DETECTOR

Digital serial links

(15-20 m)

Digital serial links

(15-20 m)

Trigger & Slow Ctrl

Trigger & Slow Ctrl

IN CAVERN INCOUNTING

ROOM

Slow control& Trigger

Slow control& Trigger

Detector Data Link(50-60 m)

Detector Data Link(50-60 m)

FMD RCU

VA

1 ring: 10/20 segments 2 Digitizers 1 RCU per side 1 DDL per sideFull FMD: 70 segments 10 Digitizers 2 RCU’s 2 DDL’s

FMD Read-Out and Control Electronics

Analog serial link(10 MHz) 0.5 m

Analog serial link(10 MHz) 0.5 m

VA read-outcontrol

VA read-outcontrol

Loc

al

Con

trol

ler

DD

L - IN

TSlow

-Control

Interface

TTC-RX

BOARDCTRL

Datareceiver

FMD Digitizer

ALTROALTRO

ALTROALTRO

ALTROALTRO

CTRLCTRL

Read-out CTRLRead-out CTRL

CTRLCTRL

CTRLCTRL

BSN, 21 Nov 2002

25/03 2003


ALICE Si-FMD,T0,V0FMD FEE test setup

BSN, 21 Nov 2002

FMD FEE test

CTRLCTRL

PowerBiasesPowerBiases

Clock10 MHzClock10 MHz

Trig in

ALTRO tester

ALTROALTRO

CTRLCTRL

Ext clock

Ext trigger

Sidetector

VA

Labview

DAQ

25/03 2003


ALICE Si-FMD,T0,V0Si-PA-Dig proto tests

ALTRO tester

Si-strip detector+ VA’’ preamp

VA’’ read-out controller

25/03 2003


ALICE Si-FMD,T0,V0Si-FMD electronics overview

SI-FMD channel count

Note: We have increased the number of strips, but use more integrated FE chips – red values are changed.

Segments (wafers)

Phi sectors

Radial strips

FE channelsVA chips

(128 ch/chip)

ALTRO chips

FMD

Digitizers

FMD

RCU

Si1 inner 10 20 512 10,240 80 6 2 1

Si1 outer 20 40 256 10,240 80 6 2

Si2 inner 10 20 512 10,240 80 6 2

Si2 outer 20 40 256 10,240 80 6 2 1

Si3 10 20 512 10,240 80 6 2

Total system

70 140 51,200 400 30 10 2

25/03 2003


ALICE Si-FMD,T0,V0Slow ControlsFollow main strategy

DCS

Detector

CAEN ?

PVSS II PVSS II

Preamps

CAEN ?

Ethernet

Database(s)

OPCclient

DIMclient

14070

1 1

High Voltage

Preamps

User interface

PVSS II

HV LV

FMD

Co

ntr

ol

roo

m (

AC

R)

[FSM?]

Crate Control

PCI-CAN?CAEN OPCserver

PVSS IIOPS client

PCI-CAN?CAEN OPCserver

PVSS IIOPC client

DIMserver

Digitizers

FMD Digitizers

PCI-CAN??

PVSS IIOPC client

C2

28/02/03

E E

FMD-RCU(PCI? VME?)

20LV

P

2

DD

L

PCI-Profibus

Ethernet is considered

as alternative

P?

10

300?

10

LVL0

trig

TTC

Countin

g ro

om

Cavern

In m

agnet

25/03 2003


ALICE Si-FMD,T0,V0Heat dissipation

Heat dissipated by FE electronics of one Si detector ring:

VA1’’ preamp chip (128 channels): 235 mW 80 chips = 19 W / ring

Read-out electronics and power distribution: 5 W/ring

Cooling: air flow between Si detector and support plate

radiation from VA chips to support plate active (water) cooling of support plate?

Detailed cooling studies (simulations of heat profile) need to be done.

25/03 2003


ALICE Si-FMD,T0,V0Si-FMD timetable (1)

A FRONT END (FE) READ OUT ELECTRONICS Completed

1 Demonstrate functionality of conceptual layout of FEE(Viking PA chip, control system, interface to ALTRO test board)

April 1 2003

2 Final choice of VA pre-ampl. chip. RO test June 1, 2003

3 Test FEE system coupled to sample Si detector. Source and electron beam tests.

June 1, 2003

4 Design, construction and test of prototype FMD digitizer card (FMDD), RO test with ’mini’ FMD-RCU

October 1, 2003

5 Full Si detector element + electronics chain RO with realistic RCU and DDL link to DAQ.

June 1 , 2004

B MECHANICS AND INTEGRATION Completed

1 Full scale model manufactured (Si1) February 1, 2003

2 Cabling and Cooling issues resolved June 1, 2003

3 Full integration sequence decided June 1, 2003

25/03 2003


ALICE Si-FMD,T0,V0Si-FMD timetable (2)

C. SILICON DETECTOR Completed by

1 Complete market survey May 1, 2003

2 Define final specs June 1, 2003

3 Place order for prototype with industry July 1 , 2003

4 Delivery Si-wafer prototype September 1, 2003

5 Start production of Si-hybrid FEE card June 1, 2003

6 Delivery prototype hybrid September 1, 2003

7 Si prototype test with FEE and BEE test RO setup December 1, 2003

8 Place final order for Si with industry August 1, 2004

Pre-assembly test July-Nov 2004

Construction, assembly , test at RHIC 2005

Installation June-Sept 2006

25/03 2003


ALICE Si-FMD,T0,V0V0 detector

Two segmented scintillator hodoscopes on either side of IP

• Minimum bias trigger: p-p and Pb-Pb

• Main on-line LVL0 centrality trigger: Pb-Pb

• Background filter for the dimuon spectrometer

• Two arm for beam-gas rejection

• Luminosity control• Multiplicity

measurement (high occupancy)

V0-R

Absorber

25/03 2003


ALICE Si-FMD,T0,V0Two options for VO tiles

From the MIP through several V0 elements

Fast scintillator from BICRON (BC408)

• 425 nm maximum emission, 2.1 ns decay constant

Shifting fibers (Y11 from Kuraray) directly on PM XP2020

• 430 nm maximum absorption, 476 nm maximum emission

Light yield as a function of:• glue or no glue for fixing the fibers

(BC600) (-35% difference)• Al/Teflon envelope on scintillator

(factor 2 gain compared to TiO2 paint)

• no reflector on fiber ends (-30% loss compared to Al or Teflon)

Time resolution with threshold discriminator:

• as a function of elements• as a function of the collected light

Mexico

Megatiles

Lyon

Indiv. tiles

25/03 2003


ALICE Si-FMD,T0,V0V0 Segmentation

V0-L and V0-R: 5 rings each

Rings 1-4: 30° sectors (12) Ring 5: 15° sectors (24)

Rings 1-3 are in the dimuon arm acceptance

Ring

V0L V0R

ηmax/ηmin max/min ηmax/ηmin max/min

1-5.1/-4.6

-0.7/-1.2

3.8/3.4 2.6/3.8

2 -4.6/4.2-1.2/-1.7

3.4/2.9 3.8/6.3

3-4.2/-3.7

-1.7/-2.8

2.9/2.5 6.3/9.4

4-3.7/-3.2

-2.8/-4.7

2.5/2.1 9.4/14.0

5-3.2/-2.8

-4.7/-7.0

2.1/1.7 14.0/20.7

25/03 2003


ALICE Si-FMD,T0,V0V0 Ligth collection test

For 1 MIP: Setup A: light yield: 14 p.e. ; time resolution (): 1.6 ns Setup B Light yield: 34 p.e.; time resolution(): 1.2 ns

A B

WLS

COF

25/03 2003


ALICE Si-FMD,T0,V0Electronics

CTP

digitization

MB trigger

scin

till a

tor

centrality triggers

CTP

25/03 2003


ALICE Si-FMD,T0,V0V0 Triggering

P + P at 7 TeV multiplicity distribution in 4

• white: Pythia without transport Events with at least 1 MIP • light grey: Pythia in vacuum• light and dark grey: Pythia in

AliRoot Production of secondaries

improves the triggering efficiency

effinel = 84% from V0L*V0R

25/03 2003


ALICE Si-FMD,T0,V0Multiplicity in p+p

Multiplicity from Pythia + AliRoot

• 1000 events• Signal in clear• Signal + background in dark Many secondaries due to the

setup• big effects in rings 1 left/right

25/03 2003


ALICE Si-FMD,T0,V0Multiplicity in Pb+Pb

Multiplicity from Hijing + AliRoot

• 30 events with b = 0-11.2 fm

Line = pure signal Points = signal +

background • circle: V0L• square: V0R Many secondaries due

to the setup• big effects in rings 1

left/right

25/03 2003


ALICE Si-FMD,T0,V0V0 Timetable

Construction in 2004/2005V0L by Mexico V0R by LyonElectronics by Lyon

Pre assembly test- July-Nov ’04

Final system Commissionning

→ middle 2005

Installation june-nov ‘06

August ’03: Beam test at CERN

Increase light output to 60 p.e

(thicker scintillator) to collect

20 p.e. on PM (thesh. At 10 p.e)

Test full quadrant

September ’03

Compare megatile and indiv tiles

=> choose unique design.

In depth work on electronics,

trigger and RO scheme.

25/03 2003


ALICE Si-FMD,T0,V0Si-FMD, TO,VOTDR time table.

Fair amount of written material exists already (T0 100 pgs, Si-FMD 50 pgs, V0 20 pgs)

April 15. Collect first detector chapters. June ’03. Editorial meeting. 1rst draft. Spring ’03 Si-FMD electronics chain test. June ’03 T0 test beam August ’03 V0 test beam

TDR

25/03 2003


ALICE Si-FMD,T0,V0Techical Design Report

Alice collab list. (5pgs)Summary of contents (2pgs)Table of contents. List of tables and figs. (4pgs)Color pictures of selected det. elements etc. (6pgs)1. Physics objectives and design considerations

T0, V0, Si-FMD trigger, timing, on-line mult, off-line mult, fluct, bgd rejection, overall performance, coverage etc ... (10

pgs) 2. Design objectives, mechanical structure, Integration

T0, V0, Si-FMD mounting, tolerances, clearances, inst. seq., cooling, cabling ... (10pgs)3. T0 (40 pgs)4. V0 (40 pgs)5. Si-FMD (40 pgs)6. Installation, slow control, DAQ, safety. (10 pgs)7. Organization (5 pgs) Group org., construction, installation, cost 8. References. (4pgs)9. Index (2 pgs) (approx. 180

pgs)

25/03 2003


ALICE Si-FMD,T0,V0Summary

FWD detectors will supply basic day 1 physics (LVL0 trigger, global reaction information)

Full RO chain defined Concrete prototyping and

industrial bids ongoing Projects on track TDR in 2003

Main open issues: materials budget (bgd), cooling, alignment, analysis chain

Si-FMDSi-FMD

T0T0

V0V0

25/03 2003


ALICE Si-FMD,T0,V0Extra’s

25/03 2003


ALICE Si-FMD,T0,V0Si-materials budget

Material type and thickness of one Si detector ring:

Layer Material ThicknessInteraction

lengthRadiation

length

Silicon detector

Si 0.3 mm 0.6 · 10-3 0.3 · 10-2

Hybrid Al2O3 0.5 mm 2.0 · 10-3 1.0 · 10-2

FE electronics

air + chips10 mm

(mostly air)

SupportCarbon fibre or

aluminium honeycomb

20.5 mm C or Al

+ 10 mm air

C: 2.6 · 10-3

Al: 2.5 · 10-3

C: 0.5 · 10-2 Al: 1.1 · 10-2

Total thickness of one Si ring: C: 5.2 · 10-3 I 1.8 · 10-2 X0 Al: 5.1 · 10-3 I 2.4 · 10-2 X0

alice si-fmd,t0,v0 25/03 2003jens jørgen gaardhøje, nbi, [email protected] forward detector...

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