gld-cal and mppc based on talks by t. takeshita and h. matsunaga @snowmass2005 k. kawagoe / kobe-u...
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GLD-CAL and MPPC
Based on talks by T. Takeshita and H. Matsunaga @Snowmass2005
K. Kawagoe / Kobe-U2005-Sep-16MPPC mini-workshop@Kyoto-U
GLD “concept”To identify and measure particles in jets
The largest detector concept for ILC
Large super conducting magnet
ECAL/HCAL inside coil (3.5m radius)
Large TPC (Tracker : 2m radius)
GLD-Calorimeterfar from IP ~ separate particles in a jet
minimum geometrical overlap
1 cm granularity : PFA
Large <=> cost = number of channels
flexibility in the component size
reliability in large area
small dead space
GLD-Calorimeterdetector modelScintillator strip CAL.
flexible in length (WLS Fiber R/O)
effective segmentation 1 x 1 cm2
small photon sensor
1cm
GLD-Calorimeterglobal design
sandwich of absorber and active material
IP
GDL-CAL layers at 90deg.
ECAL : R = 2.1 ~ 2.3 m (0.2m) :
6 mm/layer ( 3 + 2 + 1)mm
33 layers 28X0
HCAL : R = 2.3 ~ 3.5 m (1.2m) :
26 mm/layer ( 20 + 5 + 1)mm
46 layers 5.5 int
GLD-CAL layerECAL HCALEM-Scintillator-layer model
TT 10Aug05
particles
T-Layer
X-Layer
Z-Layer
4cmx4cmx2mm
1cmx4cmx2mm
1cmx4cmx2mm
MPC R/O with WLSF
MPC R/O with WLSF
MPC R/O with WLSF
absorber plate
HCAL-Scintillator-layer model
TT 11Aug05
particles
T-Layer
X-Layer
Z-Layer
4cmx4cmx2mm
1cmx20cmx2mm
1cmx20cmx2mm
MPC R/O with WLSF
MPC R/O with WLSF
MPC R/O with WLSF
absorber plate
GLD-CAL layerEM-Scintillator-layer model
Cross section
R/O chip
MPC
X-Layer
Z-Layer
Tungsten3mm
2mm
1mm
3mm
WLSFscintillator
Flex-sheet
Tungsten
Tungsten
Tile-
Layer
particle
2mm
1mm
3mm
2mm
1mm
1cm
4cm
4cm
MPC
MPC
HCAL-Scintillator-layer model
Cross section
R/O chip
MPC
X-Layer
Z-Layer
20mm
5mm
1mm
20mmMPC
WLSFscintillator
Flex-sheet
Lead
Tile-
Layer
particle
5mm
1mm
20mm
5mm
1mm
1cm
4cm
4cm
Lead
Lead
MPCHCAL cross
ECAL cross
GLD-CAL parameters
absorber
activematerial
Layersbarrel/ec
striplength
N. R/O
ECALW
3mmscintillator
2mm33/33
4cm?~6Mch
HCALPb
20mmscintillator
5mm46/48
20cm?~30M
ch
GLD-CAL R/D’s ECAL test with MAPMT
GLD-CAL R/D’s cont’dA typical event
L1
L2
L3
L4
L5
L6
Integrated lateral shower profile
GLD-photon sensor MPPC R/D
laser beam spot
single photon eq.MPPC10
0
GLD-CAL R&D’s cont’dPhoton sensor R&D
MPPC of Hamamatsu100 pixels
1,2,3,4,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,60pixels
GM at each pixel
GLD-CAL R&D’s cont’dBeam Test at Fermilab
2007
R&D needed for R/O electronics of MPPC
Scinti. 2mm W 3mm
MPC R/O33layers
1cm
2mm
to verify this ideaand PFA
GLD-CAL collaborators
Kyongpook (D.Kim) : Scintillator
JINR (P.Evtoukhovitch): SiPM
Kobe (K.Kawagoe) : MPPC
Niigata (H.Miyata) : MPPC pixel
Tsukuba (S.H.Kim, H.Matsunaga) : Sim.
KEK (A.Miyamoto, K.Fujii) : Sim.
Shinshu (T.Takeshita) : BT
GLD-CAL Open issues for ECAL
strip is sufficient enough for fine segmentation? <> PFA results which optimize the length of a strip
options
real 1cm x 1cm or smaller cell
if problem in photon finding
GLD-CAL
Open issues for HCAL
again strip length for hadronic interactions (neutral hadron)
PFA studies
neutron hits >>> delayed hits
electronics timing
GLD-HCAL a pion event digitized hits
GLD-CAL engineering issuessupport for HCAL by coil
support for ECAL by HCAL
cabling
installation
Summary:GLD-CAL
largest calorimeter
fine segmented & optimized for PFA
scintillator strip based
technique is proved
photon sensor R&D
electronics R&D
detailed design
Requirements for MPPC
To get 10 photons for MIP per ECAL strip (2mm-thick)
– PDE ~ 50%– Effective area suitable for 1.6mm fiber
Gain = 10^6 or more (no amplification needed) Dynamic range for ECAL
– At least 50xMIP signal (=500photons) => Number of pixels > 1000– More number of pixels is desired…
Good timing resolution for – Bunch ID (trivial?)– Detection/removal of slow neutron component– TOF at the innermost ECAL layer ?
Requirements for Readout
• Readout between bunch trains (199ms)–Assuming 1Gbit/sec transfer rate,
• ~25 Mbytes at maximum• 4 bytes/event x ~6k events/train is possible
–Zero suppression–Buffers
199ms
1ms
377ns (150?
) 2820b(5600?)
train
Bunch structure
Requirements for Readout (cont’d)
• Number of pixels: ~1000 -> 10~12 bit dynamic range
• Good timing resolution– Bunch ID– Slow neutron detection?– TOF at the innermost layer of ECAL ?
• Dark hit-rate: < 1MHz tolerable ?
• Low power consumption:– ~20mW/ch may be possible– Power loss in cable should be small
Some issues on sensors
• Operational voltage range is narrow–~0.1 V for MPC
• Accurate bias voltage control (and also modest temperature control) is necessary
• Power supply is also the key issue
• Probably, operational voltage of MPC varies from device to device–How to know the best voltage for huge number of
devices ?
–How to provide various bias voltages to them ?
Solution by CALICE group
• Talk by Felix Sefkow (DESY) in Calorimeter session
• This is just for testbeam; may need better method for production– Number of sensors: a few
thousands
– SiPMs with ~1000 pixels
– During testbeam, they will be monitoring sensor gain with LED, without temperature control
Bias voltage adjustment
• Bias voltages are determined at test bench in advance for all sensors– 15 SiPMs under
monitored LED source
– Adjust working point (bias voltage) to 15 pixels/MIP
– Up to 500 / week
LED
Fiber to PMT
SiPMs
WLS fibers
Voltage variation
• Two clusters for bias voltage setting:– 33~41V, 60~67V
• Sensors are grouped in modules according to bias voltage– 108 / half module– +- 2V / module
Front-end Electronics
• ILC-SiPM chip: 18ch Pre-amplifier, shaper, track and hold, mux –based on CALICE
SiW ECAL chip
100nF
10pF
Variable Gain Charge Preamplifier
Variable Shaper CR-RC²
12kΩ
4kΩ 24pF
12pF
3pF
in
8pF 4pF 2pF 1pF
40kΩ
8-bit DAC0-5V
ASIC
10kΩ 50Ω
100MΩ
2.4pF
1.2pF
0.6pF
0.3pF
0.1pF
0.2pF
0.4pF
0.8pF
6pF
SiPM bias adjustment ASIC
Our plan
• ECAL beamtest: ~2007 (FNAL / DESY) ?–Front-end electronics and DAQ
• DAQ system might be shared with other groups?
–Mass production and quality control
• Beyond testbeam–???
• Manpower:–Manobu Tanaka (KEK) : ASIC development–Patrick LeDu is interested …–Others?
Basic idea of FE board
• SQV: Synchronous Current Integrator for Q-to-V conversion
By M. Tanaka (KEK)
Photon sensor
Ethernet controller
SQV-TEG & Ethernet board
• Prototype boards already exist
• Bias voltage controller should be added
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