ipc/eia j-std-001 by the numbers: understanding the key ... · pdf fileipc/eia j-std-001 by...

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IPC/EIA J-STD-001 by the Numbers:Understanding the Key SupportingDocuments

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IPC/EIA J-STD-001 bythe Numbers:Understanding theKey SupportingDocuments

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J-STD-001

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The Specs asMentionedJ-STD-001

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How 002 and 003 are mentioned inand used in J-STD-001

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What Are J-STD-002 and 003

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J-STD-002

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J-STD-002 Coating Durability

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IPC J-STD-003

1.5.1 Visual Acceptance Criteria Tests Test A – Edge Dip Test Test B – Rotary Dip Test Test C – Solder Float Test Test D – Wave Solder Test Test E – Surface Mount Simulation Test Test A1, B1, C1, D1 and E1 are for Lead-

free products

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IPC J-STD-003

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How 001 discusses 004

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IPC J-STD-004

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IPC J-STD-004, Flux Type

Fluxes shall also be classified accordingto the corrosive or conductive propertiesof the flux or flux residues as shown inthe following table

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IPC J-STD-004, Test Requirements

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IPC J-STD-004, Corrosion Testing

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How 001 discusses 005

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IPC J-STD-005, Requirements forSolder Paste

There are two (2) documents involvedwith solder paste. J-STD-005 Requirements for Solder Paste IPC-HDBK-005, Guide to Solder Paste

Assessment Each documents is helpful to provide the

correct information to qualify solderpaste.

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IPC J-STD-005, Requirements forSolder Paste

This standard provides information on: Characterizing solder paste Testing solder paste

It discusses: Solder powder Paste flux Powder shapes Etc.

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IPC J-STD-005, Requirements forSolder Paste

Section 3.3.2 Powder Size is shown intable form for Type 1 through Type 6

Each type is based upon the size of thepowder

Must be used in conjunction with the fluxspecification 004.

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How 001 discusses 006

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IPC J-STD-006, Requirements forSolder

This is the specification that replacedQQ-S-571, the military solder materialspecification.

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IPC J-STD-006, Requirements forSolder

Section 1.2.3 Solder Forms

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IPC J-STD-006, Requirements forSolder

Covers: Alloy composition Alloy impurities Solder forms

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IPC J-STD-006, Requirements forSolder

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IPC J-STD-006, Requirements forSolder

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IPC J-STD-006, Requirements forSolder

Composition and Temperature Characteristicsof Common Tin-Lead Alloys

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Conclusion

The specifications mentioned discussimportant information which needs to beunderstood

Let us know of your interest in havingsession covering these topics

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