progress towards a long shaping-time readout for silicon strips

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Progress towards a Long Shaping-Time Readout for Silicon Strips. Bruce Schumm SCIPP & UC Santa Cruz Cornell LC Workshop July 13-16, 2003. The SD Tracker. Tracker Performance. SD Detector burdened by material in five tracking layers (1.5% X 0 per layer) at low and intermediate mo-mentum. - PowerPoint PPT Presentation

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Progress towards a Long Shaping-Time Readout for

Silicon Strips

Bruce SchummSCIPP & UC Santa CruzCornell LC Workshop

July 13-16, 2003

The SD Tracker

Tracker Performance

SD Detector burdened by material in five tracking layers (1.5% X0 per layer) at low and intermediate mo-mentum

Code: http://www.slac.stanford.edu/~schumm/lcdtrk.tar.gz

Idea: Noise vs. Shaping Time

Min-i for 300m Si is about 24,000 electrons

Shaping (s) Length (cm) Noise (e-)

1 100 2200

1 200 3950

3 100 1250

3 200 2200

10 100 1000

10 200 1850

Agilent 0.5 m CMOS process (qualified by GLAST)

The Gossamer TrackerIdeas:• Long ladders substantially limit electronics readout and associated support• Thin inner detector layers• Exploit duty cycle eliminate need for active cooling Competitive with gaseous

track-ing over full range of momentaAlso: forward region…

TPC Material Burden

Pursuing the Long-Shaping Idea

LOCAL GROUP

SCIPP/UCSC• Optimization of readout & sensors• Design & production of prototype ASIC• Development of prototype ladder; testing

Supported by 2-year, $95K grant from DOE Advanced Detector R&D Program

PRC MeetingDESY, Hamburg, May 7 and 8,

2003

SilC: an International R&D Collaboration to develop Si-

tracking technologies for the LC

Aurore Savoy-Navarro, LPNHE-Universités de Paris 6&7/IN2P3-CNRS, France

on behalf of the SiLC Collaboration

The SiLC CollaborationThe SiLC Collaboration

Brookhaven

Ann Arbor Wayne

Santa Cruz

Helsinki

Obninsk Karlsruhe

Paris

Prague Wien Geneve

Torino

Pisa

RomeBarcelonaValencia

Korean Universities

Seoul&Taegu

Tokyo

EuropeUSA

ASIASo far: 18 Institutes gathering over 90 people from Asia, Europe & USAMost of these teams are and/or have been collaborating.

The SCIPP/UCSC Effort

Faculty/Senior

Alex GrilloHartmut Sadrozinski

Bruce SchummAbe Seiden

Post-Doc

Gavin Nesom

(half-time LC postdoc from

1999 program)

Student

Christian Flacco

(will do BaBar thesis)

Engineer: Ned Spencer (on SCIPP base program)

SCIPP/UCSC Development Work

Characterize GLAST `cut-out’ detectors (8 channels with pitch of ~200 m) for prototype ladder

Detailed simulation of pulse development, electronics, and readout chain for optimization and to guide ASIC development (most of work so far)…

Pulse Development Simulation

Long Shaping-Time Limit: strip sees signal if and only if hole is col- lected onto strip (no electrostatic coupling to neighboring strips)Charge Deposition: Landau distribution (SSSimSide; Gerry Lynch LBNL) in ~20 independent layers through thickness of deviceGeometry: Variable strip pitch, sensor thickness, orientation (2 dimen-sions) and track impact parameter

Uncorrelated Sampling Check

Carrier Diffusion

)(21

exp),(0

2

ttDr

trPq

Hole diffusion distribution given by

Offest t0 reflects instantaneous expansion of hole clouddue to space-charge repulsion. Diffusion constant given by

hq qkT

D

Reference: E. Belau et al., NIM 214, p253 (1983)

sec65.00 nt

h = hole mobility

Other ConsiderationsLorentz Angle:

18 mrad per Tesla (holes)

Detector Noise:

From SPICE simulation, normalized to bench tests with GLAST electronics

Can Detector Operate with 167cm, 300 m thick Ladders?

• Pushing signal-to-noise limits• Large B-field spreads charge between strips• But no ballistic deficit (infinite shaping time)

Result: S/N for 167cm Ladder

At shaping time of 3s; 0.5 m process qualified by GLAST

Result: S/N for 132cm Ladder

At shaping time of 3s; 0.5 m process qualified by GLAST

132cm Ladder 300m Thick

Not Yet Considered

• Inter-Strip Capacitance (under study; typically ~5% pulse sharing between neighboring channels)

• Leakage Current (small for low-radiation environment)

• Threshold Variation (typically want some headroom for this!) But overall, 3 s operating point seems quite feasible proceed to ASIC design!

Analog Readout Scheme: Time-Over Threshold

(TOT)

i-min

thresh

e

e

nn

i-min

pulse

e

e

nn

r

TO

T/

/r

/te

etr

TOT given by differencebetween two solutions to

(RC-CR shaper)

Digitize with granularity /ndig

Why Time-Over-Threshold?

4

2

6

10

8

TO

T/

101 1000100

Signal/Threshold = (/r)-1

100 x min-i

With TOT analog readout:

Live-time for 100x dynamic range is about 9

With = 3 s, this leads to a live-time of about 30 s, and a duty cycle of about 1/250

Sufficient for power-cycling!

Single-Hit Resolution

Design performance assumes 7m single-hit resolution. What can we really expect?

• Implement nearest-neighbor clustering algorithm

• Digitize time-over-threshold response (0.1* more than adequate to avoid degradation)

• Explore use of second `readout threshold’ that is set lower than `triggering threshold’; major design implication

RMS

Gaussian Fit

RMS

Gaussian Fit

Readout Threshold (Fraction of min-i)

Trigger Threshold167cm Ladder

132cm Ladder

Resolution With and Without Second (Readout)

Threshold

Lifestyle Choices

Based on simulation results, ASIC design will incorporate:

• 3 s shaping-time for preamplifier

• Time-over-threshold analog treatment

• Dual-discriminator architecture

The design of this ASIC is now underway.

But Can It Track Charged Particles?

1 100.1

Energy (MeV)

z (cm)

Photon Distributions at R = 25 cmSee Upcoming Talks!

Current Activity

ASIC architecture established with pulse sim…

• ASIC design underway (chips in hand 1/1/04?)

• Further pulse sim studies (x-talk, leakage current, angled tracks, etc.

• Developing test stand (long ladder, readout, etc.)

Where Next?

We’ve just begun the process of fleshing out the design of this `Gossamer Tracker’

In the 3-year R&D window, SCIPP needs to:

• Design and submit prototype ASIC (chips in hand 1/1/04?)• Demonstrate ability to read out long ladders • Demonstrate resolution and dynamic range • Demonstrate passive cooling (data transmission is an issue!)• Mount testbeam effort to verify simulation studies, refine chip• Probably second submission and second round of testing

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