thermal considerations in package stacking and advanced
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www.staktek.com
Thermal Considerations in PackageStacking and Advanced Module Technology
February 16, 2006
Ulrich Hansen, Director of Marketing, Staktek
2 www.staktek.com
• Continued drive to increase sub-system density, functionality andperformance– Desire to differentiate systems and derive time-to-market advantages
• System-level power consumption increases– Cooling challenges– Dedicated low-power devices emerging
• Mobile systems volumes increasing– Form factor constraints increase the need for utilizing 3rd dimension
• Supply Chain complexities– New supplier entrants, capacity planning challenges, forecasting accuracy
limitations
Thermal concerns are usually on top of the list when designing high-densitysub-systems
Trends in Electronics Sub-Systems
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The DRAM market continues to go through rapid technology change–increasing the thermal and signal integrity complexities with each transition
Today’s Example: High-Density DIMM
• DRAM speeds to DDR2-667 in mid-2006,followed by DDR2-800 and DDR3
• Module capacity moving to 2GB and 4GB• Transition to Fully-Buffered DIMMs in 2006• FB-DIMM adds ~6W AMB device to each
DIMM and adds thickness / reduces airflow– Max AMB case temperature of 110C– Max DRAM case temperature of 85C
• DRAM speed and module capacityincreases drive module power consumption
• Increasing airflow drives acousticschallenge (e.g. workstations)
• High-density SO-DIMM, Mini SO-DIMM formobile applications are emerging
• DRAM prices continue to fluctuate as fabcapacity and demand change
• Timing of market introductions uncertain asoften coupled to chipset launches
• Continued drive to increasesub-system functionality andperformance
• System-level powerconsumption increases
• Mobile systems increasing
• Supply Chain complexities
4 www.staktek.com
Today, Staktek’s Stakpak® is a market leading high-density DRAM technology
Staktek’s Core Technology: Device Stacking
• Solves problem of high-device density infixed DIMM form factor
• Great supply chain flexibility• Same, standard device used in both high-
density and standard DIMMs• Mature and cost effective
• Uses mature DRAM devices• High-volume manufacturing (>175M Staktek
stacks shipped)
Well suited for current and future high-densityDIMMs, but is there a better solution forthermally challenged systems?
FBGA Stacking
TSOP Stacking
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High-Density Technology Options
PoP Package
DeviceStacking
Dual-DiePackage
Advanced packaging by itself does not address the thermal challenges and introducesadditional technical and economical challenges
Remaining Questions
DIMM Sub-System Design
OptimizationNeeded …
• ThermalPerformance?
• Thickness?
• ThermalPerformance?
• High-SpeedSignal Integrity?
• Thickness?
• Direct Cost (e.g.non-standardmanufacturingprocesses, singlesource)
• Supply ChainCost (e.g.obsolescence,opportunity cost)
• Time-to-Market
• ThermalPerformance
• Direct Cost (e.g.single source)
• Supply ChainCost (e.g.obsolescence,opportunity cost)
• TechnologyMaturity
• Time-to-Market?
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ArctiCore™ Module Technology
The ArctiCore DIMM is a module technology that utilizes a double-sided, flexiblecircuit with an integrated edge connector folded around a rigid thermal core
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The ArctiCore modules deliver a number of significant, system-level benefits
ArctiCore Benefits
• Double Surface Area α High-Density
• Thinner Profile α Less motherboard space while meetingthermal requirements
• Thermally Enhanced α Less Cooling (less Costly, Quieter)
• Improved Electrical α Better High-Speed Margins
• Highly Durable α Improved Reliability and Handling Yield
• JEDEC / RoHS Compliant α Standards Compliant,Sourcing Flexibility
• Next-Gen Module Technology α Future Proof
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ArctiCore’s thinness contributes to better thermal performance for the sameDIMM socket pitch
ArctiCore Thinness
• ArctiCore FBDIMMs are thinner than conventional FBDIMMs• ArctiCore enables narrower DIMM connector pitch while maintaining airflow
– FBDIMM up to 48% thinner – RDIMM up to 20% thinner
10 .16 mm .
6.2 mm .7.65 mm .8 .2 mm .8.8 mm .
JEDEC MAX
2-RankStack
1 Rank FBDIMM
2-Rank 2-Rank Planar
2 -Rank Planar
Conventional FBDIMMs ArctiCore
2-Rank Planar
2-Rank
4.5 mm .6.2 mm . 4.5 mm .
ArctiCoreThermally Enhanced
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ArctiCore RDIMM’s provide improved thermal mass, radiating area and thermalcoupling
ArctiCore Thermal Results
FR4 DIMM w/ Package Stacking
ArctiCore
• Thermal core pulls heat back along the DIMM• Less temperature spread between DRAMs: Coolest not as cool, hottest
not as hot
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ArctiCore FBDIMMs can be cooled with with lower Airflow
ArctiCore Thermal Results
ArctiCore vs. Conventional FBDIMM (JEDEC R/C E)
Note: * Full-Module Heat Spreaders can be applied to further lower the DRAM temperature
1 m/s 2 m/s 3 m/s 4 m/s 5 m/s 6 m/s
AMB
95
80
85
90
110
115
100
105
120
130
125
75
65
70
140
135
Case
Tem
pera
ture
ArctiCore38mm
ArctiCore
Dual Die w/ AMB HS
Planar w/ AMB HS
1 m/s 2 m/s 3 m/s 4 m/s 5 m/s 6 m/s
95
80
85
90
110
115
100
105
120
130
125
75
65
70
140
135
Max DRAM Temp *
Case
Tem
pera
ture
ArctiCore38mm
ArctiCoreDual Die w/
AMB HS
Planar w/ AMB HS
Power – 16.8W
DRAMs – 36 @ 300mW
Conditions:Inlet Air – 50C
Pitch – 10.16 mm
AMB – 6W
11 www.staktek.com
ArctiCore Electrical Results
• ArctiCore’s electrical properties are exceptional compared toconventional printed circuit boards.
• The interconnect environment of the flexible circuit, with its tightspacing and effective dielectrics, is tailored for high-speed signalpropagation at ultra-low crosstalk levels.
ArctiCore Conventional
Conditions: Post Register Address on JEDEC Raw Card-J RDIMM @ DDR2-533
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Sample Sub-Systems
• Processor (Micro, DSP) + DRAM• Processor + DRAM + FLASH• Processor + ASIC• ASIC + DRAM + FLASH• ASIC + Imager + DRAM• MP3 + FLASH• MP3 + GPS + FLASH• MP3 + Radio (Bluetooth, WiFi,
Cellular)
Advanced Module Technology –Additional Applications
Applications
• Computing• Medical• Telecommunication• Defense
Consumer Electronics:• MP3 Player• Cell Phone• GPS• Digital Camera• Digital Video
Most mobile devices represent form factor challenges as more and morefeatures move into the products
13 www.staktek.com
We apply our experience of >175M device stacks to develop and implementhighly standardized manufacturing processes
Example: Processor + DRAM
IllustrativeStandard SMT processes to assemble & test ‘flat’
Simple ‘fold’ step with adhesive utilizing a auto / semi-auto precision fold tool
‘Fold’ step with thermal core inserted
Processor
DRAM 1
DRAM 2
Thermal Core
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Advanced module technology provides time-to-market advantages for next-generation feature integration – often in conjunction with advanced packaging
Advanced Packaging
Feature A(e.g. MP3)
Feature B(e.g. GPS)
Feature C(e.g. Flash)
3D Packagingor
Chip-Integration (Single Die)
3D Packagingor
Chip-Integration (Single Die)
Feature C
Next-Generation Product
‘Planar’
Feature C
Package 2
Feature D
Package 3
FeaturesA + B+ +
+
FeaturesA + B + C
Package 1
FeaturesA + B
“Add Feature D”
FeaturesA + B + CPackage 1
Feature D
Package 2
+
3-Device System StakpakThinner,
2-Device System Stakpak
3-Device System StakpakThinner,
2-Device System Stakpak
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Staktek is a technology IP company providing solutions for sub-system formfactor optimization, including thermal optimization
Summary
• ArctiCore DIMMs have superior thermal performance and provideheadroom to scale into next-generation DRAM speeds
• ArctiCore DIMMs are a great example of Staktek’s sub-systemoptimization in a given, fixed form factor
• Sub-system optimization has many applications, e.g. in form-factorconstraint mobile devices
• Staktek’s System Stakpak is a flexible architecture to deliver sub-system optimization, including thermal solutions with integrated cores
• Meets form factor requirements• Low risk, low investment – standard manufacturing processes• Time-to-market advantage prior to package-level optimization• Accommodates regular or advanced packages
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