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Thermal Considerations in PackageStacking and Advanced Module Technology

February 16, 2006

Ulrich Hansen, Director of Marketing, Staktek

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• Continued drive to increase sub-system density, functionality andperformance– Desire to differentiate systems and derive time-to-market advantages

• System-level power consumption increases– Cooling challenges– Dedicated low-power devices emerging

• Mobile systems volumes increasing– Form factor constraints increase the need for utilizing 3rd dimension

• Supply Chain complexities– New supplier entrants, capacity planning challenges, forecasting accuracy

limitations

Thermal concerns are usually on top of the list when designing high-densitysub-systems

Trends in Electronics Sub-Systems

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The DRAM market continues to go through rapid technology change–increasing the thermal and signal integrity complexities with each transition

Today’s Example: High-Density DIMM

• DRAM speeds to DDR2-667 in mid-2006,followed by DDR2-800 and DDR3

• Module capacity moving to 2GB and 4GB• Transition to Fully-Buffered DIMMs in 2006• FB-DIMM adds ~6W AMB device to each

DIMM and adds thickness / reduces airflow– Max AMB case temperature of 110C– Max DRAM case temperature of 85C

• DRAM speed and module capacityincreases drive module power consumption

• Increasing airflow drives acousticschallenge (e.g. workstations)

• High-density SO-DIMM, Mini SO-DIMM formobile applications are emerging

• DRAM prices continue to fluctuate as fabcapacity and demand change

• Timing of market introductions uncertain asoften coupled to chipset launches

• Continued drive to increasesub-system functionality andperformance

• System-level powerconsumption increases

• Mobile systems increasing

• Supply Chain complexities

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Today, Staktek’s Stakpak® is a market leading high-density DRAM technology

Staktek’s Core Technology: Device Stacking

• Solves problem of high-device density infixed DIMM form factor

• Great supply chain flexibility• Same, standard device used in both high-

density and standard DIMMs• Mature and cost effective

• Uses mature DRAM devices• High-volume manufacturing (>175M Staktek

stacks shipped)

Well suited for current and future high-densityDIMMs, but is there a better solution forthermally challenged systems?

FBGA Stacking

TSOP Stacking

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High-Density Technology Options

PoP Package

DeviceStacking

Dual-DiePackage

Advanced packaging by itself does not address the thermal challenges and introducesadditional technical and economical challenges

Remaining Questions

DIMM Sub-System Design

OptimizationNeeded …

• ThermalPerformance?

• Thickness?

• ThermalPerformance?

• High-SpeedSignal Integrity?

• Thickness?

• Direct Cost (e.g.non-standardmanufacturingprocesses, singlesource)

• Supply ChainCost (e.g.obsolescence,opportunity cost)

• Time-to-Market

• ThermalPerformance

• Direct Cost (e.g.single source)

• Supply ChainCost (e.g.obsolescence,opportunity cost)

• TechnologyMaturity

• Time-to-Market?

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ArctiCore™ Module Technology

The ArctiCore DIMM is a module technology that utilizes a double-sided, flexiblecircuit with an integrated edge connector folded around a rigid thermal core

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The ArctiCore modules deliver a number of significant, system-level benefits

ArctiCore Benefits

• Double Surface Area α High-Density

• Thinner Profile α Less motherboard space while meetingthermal requirements

• Thermally Enhanced α Less Cooling (less Costly, Quieter)

• Improved Electrical α Better High-Speed Margins

• Highly Durable α Improved Reliability and Handling Yield

• JEDEC / RoHS Compliant α Standards Compliant,Sourcing Flexibility

• Next-Gen Module Technology α Future Proof

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ArctiCore’s thinness contributes to better thermal performance for the sameDIMM socket pitch

ArctiCore Thinness

• ArctiCore FBDIMMs are thinner than conventional FBDIMMs• ArctiCore enables narrower DIMM connector pitch while maintaining airflow

– FBDIMM up to 48% thinner – RDIMM up to 20% thinner

10 .16 mm .

6.2 mm .7.65 mm .8 .2 mm .8.8 mm .

JEDEC MAX

2-RankStack

1 Rank FBDIMM

2-Rank 2-Rank Planar

2 -Rank Planar

Conventional FBDIMMs ArctiCore

2-Rank Planar

2-Rank

4.5 mm .6.2 mm . 4.5 mm .

ArctiCoreThermally Enhanced

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ArctiCore RDIMM’s provide improved thermal mass, radiating area and thermalcoupling

ArctiCore Thermal Results

FR4 DIMM w/ Package Stacking

ArctiCore

• Thermal core pulls heat back along the DIMM• Less temperature spread between DRAMs: Coolest not as cool, hottest

not as hot

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ArctiCore FBDIMMs can be cooled with with lower Airflow

ArctiCore Thermal Results

ArctiCore vs. Conventional FBDIMM (JEDEC R/C E)

Note: * Full-Module Heat Spreaders can be applied to further lower the DRAM temperature

1 m/s 2 m/s 3 m/s 4 m/s 5 m/s 6 m/s

AMB

95

80

85

90

110

115

100

105

120

130

125

75

65

70

140

135

Case

Tem

pera

ture

ArctiCore38mm

ArctiCore

Dual Die w/ AMB HS

Planar w/ AMB HS

1 m/s 2 m/s 3 m/s 4 m/s 5 m/s 6 m/s

95

80

85

90

110

115

100

105

120

130

125

75

65

70

140

135

Max DRAM Temp *

Case

Tem

pera

ture

ArctiCore38mm

ArctiCoreDual Die w/

AMB HS

Planar w/ AMB HS

Power – 16.8W

DRAMs – 36 @ 300mW

Conditions:Inlet Air – 50C

Pitch – 10.16 mm

AMB – 6W

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ArctiCore Electrical Results

• ArctiCore’s electrical properties are exceptional compared toconventional printed circuit boards.

• The interconnect environment of the flexible circuit, with its tightspacing and effective dielectrics, is tailored for high-speed signalpropagation at ultra-low crosstalk levels.

ArctiCore Conventional

Conditions: Post Register Address on JEDEC Raw Card-J RDIMM @ DDR2-533

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Sample Sub-Systems

• Processor (Micro, DSP) + DRAM• Processor + DRAM + FLASH• Processor + ASIC• ASIC + DRAM + FLASH• ASIC + Imager + DRAM• MP3 + FLASH• MP3 + GPS + FLASH• MP3 + Radio (Bluetooth, WiFi,

Cellular)

Advanced Module Technology –Additional Applications

Applications

• Computing• Medical• Telecommunication• Defense

Consumer Electronics:• MP3 Player• Cell Phone• GPS• Digital Camera• Digital Video

Most mobile devices represent form factor challenges as more and morefeatures move into the products

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We apply our experience of >175M device stacks to develop and implementhighly standardized manufacturing processes

Example: Processor + DRAM

IllustrativeStandard SMT processes to assemble & test ‘flat’

Simple ‘fold’ step with adhesive utilizing a auto / semi-auto precision fold tool

‘Fold’ step with thermal core inserted

Processor

DRAM 1

DRAM 2

Thermal Core

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Advanced module technology provides time-to-market advantages for next-generation feature integration – often in conjunction with advanced packaging

Advanced Packaging

Feature A(e.g. MP3)

Feature B(e.g. GPS)

Feature C(e.g. Flash)

3D Packagingor

Chip-Integration (Single Die)

3D Packagingor

Chip-Integration (Single Die)

Feature C

Next-Generation Product

‘Planar’

Feature C

Package 2

Feature D

Package 3

FeaturesA + B+ +

+

FeaturesA + B + C

Package 1

FeaturesA + B

“Add Feature D”

FeaturesA + B + CPackage 1

Feature D

Package 2

+

3-Device System StakpakThinner,

2-Device System Stakpak

3-Device System StakpakThinner,

2-Device System Stakpak

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Staktek is a technology IP company providing solutions for sub-system formfactor optimization, including thermal optimization

Summary

• ArctiCore DIMMs have superior thermal performance and provideheadroom to scale into next-generation DRAM speeds

• ArctiCore DIMMs are a great example of Staktek’s sub-systemoptimization in a given, fixed form factor

• Sub-system optimization has many applications, e.g. in form-factorconstraint mobile devices

• Staktek’s System Stakpak is a flexible architecture to deliver sub-system optimization, including thermal solutions with integrated cores

• Meets form factor requirements• Low risk, low investment – standard manufacturing processes• Time-to-market advantage prior to package-level optimization• Accommodates regular or advanced packages