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APPENDICES

Appendix 1 ____ _ Summary of Quantum Number Characteristics

The energy states of electrons are characterized by four quan­tum numbers. The main quantum number, n, determines the overall energy of the electrons, i.e., essentially the radius of the electron distribution. It can have any integral value. For exam­pIe, the electron of a hydrogen atom in its ground state has n=1.

The quantum number, I, is a measure of the angular momen­turn L of the electrons and is determined by ILI = YIU + l)h, where 1 can assurne any integral value between ° and n - 1.

It is common to specify a given energy state by a symbol which utilizes the n- and l-values. States with 1 = 0 are called s-states; with 1 = 1, p-states; and with 1= 2, d-states, etc. A 4d-state, for example, is one with n = 4 and 1 = 2.

The possible orientations of the angular momentum vector with respect to an external magnetic field are again quantized and are given by the magnetic quantum number m. Only m val­ues between +1 and -I are permitted.

The electrons of an atom fill the available states starting with the lowest state and obeying the Pauli principle which requires that each state can be filled onIy with two electrons having op­posite spin <Isl = ±+). Because of the just-mentioned multiplicity, the maximal number of electrons in the s-states is 2, in the p­states 6, in the d-states 10, and in the f-states 14.

The electron bands in solids are named by using the same nomenclature as above, i.e., a 3d-level in the atomic state widens to a 3d-band in asolid. The eIectron configurations of some iso­Iated atoms are listed on the next page.

384 Appendix I • Summary of Quantum Number Characteristics

K L M N 0 Z Element 15 252p 35 3p 3d 45 4p 4d 4f 55 5p 5d 5f

1 H 1 2 He 2

3 Li 2 1 4 Be 2 2 5 B 2 2 1 6 C 2 22 7 N 2 23 8 0 2 24 9 F 2 25

10 Ne 2 26

11 Na 2 26 1 12 Mg 2 26 2 13 Al 2 26 2 1 14 Si 2 26 22 15 P 2 26 23 16 S 2 26 24 17 Cl 2 26 25 18 Ar 2 26 26

19 K 2 26 26 1 20 Ca 2 26 26 2 21 Sc 2 26 26 1 2 22 Ti 2 26 26 2 2 23 V 2 26 26 3 2 24 Cr 2 26 26 5 1 25 Mn 2 26 26 5 2 26 Fe 2 26 26 6 2 27 Co 2 26 26 7 2 28 Ni 2 26 26 8 2 29 Cu 2 26 2610 1 30 Zn 2 26 2610 2 31 Ga 2 26 26 10 2 1 32 Ge 2 26 2610 22 33 As 2 26 26 10 23 34 Se 2 26 2610 24 35 Br 2 26 2610 25 36 Kr 2 26 2610 26

37 Rb 2 26 2610 26 38 Sr 2 26 2610 26 2 39 Y 2 26 2610 261 2 40 Zr 2 26 2610 262 2 41 Nb 2 26 26 10 264 1 42 Mo 2 26 2610 265 1 43 Tc 2 26 2610 265 2

Appendix 11 ____ _

Tables of Physical Constants

The International System of Units (SI or mksA System)

In the SI unit system, essentially four base units, the meter, the kilogram (for the mass), the second, and the ampere are defined. Further base units are the Kelvin, the mole (for the amount of substance), and the candela (forthe luminous intensity). All other units are derived units as shown in the table below. Even though the use of the SI unit system is highly recommended, other unit systems are still widely used.

Expression in terms of

Quantity Name Symbol Other SI units SI base units

Force Newton N kg. rn/s2 Energy, work Joule J N·m=V·A·s kg· m 2/s2 Pressure Pascal Pa N/m2 kglm' s2 EI. charge Coulomb C JN A· s Power Watt W J/s kg· m 2/s3 EI. potential Volt V W/A kg· m 2/A' s3 EI. resistance Ohm 0 VIA kg . m 2/A2 . S3 EI. conductance Siemens S AN A2 . s3/kg . m2 Magn. flux Weber Wb V'S kg· m 2/A' S2 Magn. induction Tesla T Wb/m2 kglA' s2 Inductance Henry H Wb/A kg . m 2/A2 . S2 Capacitance Farad F CN A2 . s4/kg . m2

386 Appendix 11 • Tables of Physical Constants

Physical Constants (cgs and SI units)

Mass of electron (free electron mass; rest mass)

Charge of electron

Velocity of light in vac. Planck constant

Avogadro constant Boltzmann constant

Bohr magneton

Gas constant Permittivity of empty space Permeability of empty space Faraday constant

Useful Conversions

mo = 9.109 X 10-28 (g) = 9.109 X 10-31 (kg) e = 1.602 X 10-19 (C)

= 4.803 X 10-10 (statcoul) == (cm3/2 . g1l2/S) == (erg/statV) = 1.602 X 10-20 (abcoul) ==. (g1l2 . cm1l2)

c = 2.998 X 1010 (cmls) = 2.998 X 108 (mls) h = 6.626 X 10-27 (g . cm2/s) = 4.136 X 10-15 (eV· s)

= 6.626 X 10-34 (J. s) h = 1.054 X 10-27 (g . cm2/s) = 6.582 X 10-16 (eV . s)

= 1.054 X 10-34 (J. s) No = 6.022 X 1023 (atoms/mol) k B = 1.381 X 10-16 (erglK) = 8.616 X 10-5 (eVIK)

= 1.381 X 10-23 (JIK) /LB = 9.274 X 10-21 (erg/Oe) == (Oe· cm3) == (g1l2 cm5/2/s)

= 9.274 X 10-24 (JIT) R = 8.314 (J/mol . K) = 1.986 (cal/mol . K) €o = l/f.LOC2 = 8.854 X 10- 12 (F/m) == (A . sN· m) == (N/A2)

/Lo = 4'lT X 10-7 = 1.257 X 10-6 (H/m) == (V . s/A . m) F = 9.648 X 104 (C/mol)

1 (eV) = 1.602 X 10-12 (g . cm2/s2) = 1.602 X 10-19 (kg . m2/s2) = 1.602 X 10-19 (J) = 3.829 X 10-20 (cal) = 23.04 (Kcallmol)

1 (J) = 1 (kg . m2/s2) = 107 (erg) = 107 (g . cm2/s2) = 2.39 X 10-1 (cal) 1 (Rydberg) = 13.6 (eV) 1 (l/Dcm) = 9 X 1011 (1/s) 1 WDm) = 9 X 109 (1/s) 1 (C) = 1 (A . s) = 1 (JN) 1 (A) = 10- 10 (m) 1 (torr) == 1 (mm Hg) = 133.3 (N/m2) == 133.3 (Pa) 1 (bar) = 105 (N/m2) == 105 (Pa) 1 (Pa) = 1 (N/m2) = 1.45 X 10-4 (psi) 1 (psi) = 6.895 X 103 (Pa) 1 (cal) = 2.6118 X 1019 (eV)

1 (mm) (milli) = 10-3 (m) 1 (/Lm) (miero) = 10-6 (m) 1 (nm) (nano) = 10-9 (m) 1 (pm) (pieo) = 10-12 (m) 1 (fm) (femto) = 10- 15 (m) 1 (am) (atto) = 10- 18 (m)

1 km (Kilo) = 103 m 1 Mm (Mega) = 106 m 1 Gm (Giga) = 109 m 1 Tm (Tera) = 1012 m 1 Pm (Peta) = 1015 m 1 Ern (Exa) = 1018 m

Appendix 11 • Table of Physical Constants 387

Electronic Properties of Some Metals Number of free

Fermi electrons, Neff Work function Resistivity energy [ele~ons] (photoelectric ) P [/LO cm]

Material EF [eV] tfJ [eV] at 200 C

Ag 5.5 6.1 X 1028 4.7 1.59 Al 11.8 16.7 X 1028 4.1 2.65 Au 5.5 5.65 X 1028 4.8 2.35 Be 12.0 3.9 4.0

Ca 3.0 2.7 3.91 Cs 1.6 1.9 20.0 Cu 7.0 6.3 X 1028 4.5 1.67 Fe 4.7 9.71

K 1.9 2.2 6.15 Li 4.7 2.3 8.55 Na 3.2 2.3 4.20 Ni 5.0 6.84

Zn 11.0 3 X 1028 4.3 5.91

Electronic Properties of Some Semiconductors

Gap Mobility Mobility of of Work energy

Conductivity electrons holes function Eg [eV]

a[o~m] JLe [ ;2S] JLh [;2S] (photoelectric) Material OK 300 K tfJ [eV]

C (diamond) 5.48 5.47 10- 12 0.18 0.12 4.8

Ge 0.74 0.66 2.2 0.39 0.19 4.6 Element

Si 1.17 1.12 9 X 10-4 0.15 0.045 3.6

Sn (gray) 0.08 106 0.14 0.12 4.4

GaAs 1.52 1.42 10-6 0.85 0.04 InAs 0.42 0.36 104 3.30 0.046

I1I-V InSb 0.23 0.17 8.00 0.125 GaP 2.34 2.26 0.01 0.007

IV-IV a-SiC 3.03 2.99 0.04 0.005

ZnO 3.42 3.35 0.02 0.018 li-VI CdSe 1.85 1.70 0.08

388 Appendix 11 • Tables of Physical Constants

Magnetic Units

Name Symbol em-cgs units mks (SI) units Conversions

Magnetic H Oe== g1l2

field cm1l2 . s A m

strength

Magnetic B G== g1l2

induction cm1l2 . s

1 T = 104 G

Magnetization M Maxwell g1l2

cm2 -cm1l2 . s

A

m 1 A = 47T Maxwells

m 103 cm2

Magnetic flux

cp Maxwell == cm3/2 . g1l2

s Wb = kg· m2 = V . s 1 Wb = 108 Maxwells

s· C

Susceptibility X Unitless Unitless

(Relative) /L Unitless Unitless permeability

Energy product BH MGOe

Conversions from the SI Unit System into the Gaussian Unit System

mks cgs Quantity (SI) (Gaussian)

Magnetic induction B B/c Magnetic flux <PB <PB/c Magnetic field strength H cH/47T Magnetization M cM Magnetic dipole moment /Lm C/Lm Permittivity constant EO 1I47T Permeability constant /Lo 47T/c2

Electric displacement D D/47T

Note: The equations given in this book can be converted from the SI (mks) system into the cgs (Gaussian) unit system and vice versa by re­placing the symbols in the respective equations with the symbols listed in the following table. Symbols which are not listed here remain un­changed. It is imperative that consistent sets of units are utilized. /Lo = 47T X 10-7 = 1.257 X 10-6 (V· s/A· m) == (Kg . m/C2) == (Hirn). EO = 8.854 X 10- 12 (A· sN· m) == (Firn).

Xmks = 47TXcgs

Same value

Ap

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of th

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=

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[Ar]3d 84s 2

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{Ar]3d '04s 2p2 [A

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[Ar13d104s2p5 [Ar]3d '04s 2p6

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calcium

S

candium

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C

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M

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Cobalt

Nickel

Copper

line G

allium

Germ

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Arsetlic

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rypton

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R

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1.22 1.33

1.6 2.16

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1.93 1.69

1.78 1.96

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6.108 7.416

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677 1<11'":1

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1.55

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Id 7.435

n ..... ;.,...;. .. 1\IPd,

[Arj3d

5 4s2

_ .. 1JIIhIIC

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Manganese

pra

pn

d

-' ~=-

""'I ;:.,1:1 :N

I ;uun':I :J9 ~;: . .:'f

tJU :=.~Ii:'1

Öl ~: . .H

) az ;,.lftIO

t;;i ~;I:..::t 64 ~:.92534 65 ~~.50

66 ~~;93032 67 ~:.26 68 ~

:~ 69 ~.3.04

70 ~=.967 71

_ ~_

~_

,_

,_

u

_

u_

'=

~_

,_

,_

,_

u_

u

_

~:~ Ce ~:~

Pr ~:~

Nd ~:~

[D)11ih1 ~:~ Sm

~44 Eu ~:: G

d ~:~ Tb ~:~1

Dy ~~

Ho ~::

Er ~;~ Tm ~~ Vb ~:~

Lu -

--

-~~-

--

--

-~

~

~

~

!Xej4f15d'6s2

[Xe)04f36s2 IX

e)4f46s2 [X

e]4f56s2 [X

e)4f66s2 \X

e)4f16s2 [X

e)4fl5d16s2 jXeJ4f96s2

[Xej4f106s2

[Xej4f116s2

[Xej4f'26s2

[Xe)4f136s2 [X

ej4f146s2 IX

ej4j145d'6s

2

Cerium

P

raseodymlum

N

eodymium

P

romethium

S

amarium

E

uropium

Gadolinium

Terbium

D

ysprosium

Holm

ium

Erbium

Thulium

Y

tterbium

Lututium

.. 1:'381 90 ::';03588 91:;:.l128li

92 :::'.0482) 93 ::.116421 94 ~::""., 95 :;0103) 96 ::.D103) 97 :"1116) 98:'083) 99 ::"'"')100 :"10) 101 :"

0091102 ::") 1031 :~,

Tb' ;,y p

" ::'::o.,~ "U";"" [)[]''''' ~:'. CD"'''::' ffiDDD~'" ;,,, ©

';.n

W~": @

0':rn

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[ill "': [1 ,

1.3 1.5

a 1.38

1.36 rQ

ll.28

D

DO 1.3

A

1.3 l1ih1

1.3 D

1.3

1.3 ~

'.3 rl11I'l

1.3 0

1.3 ®

-r?

6.08 5.89

6.05 6,19

lJ-' 5.8

5.9:13 6.02

UU

U

6.23 6.:11

6.42 ~

6.50 U

UU

6.58

6.65 -

U

[RnJ6d27s2

[Rn]5f26dI7s2

[Rnj5f36dI7s2

[Rn)5f46d17s2

[Rn)5f67s2

[Rn)5f17s2

[Rn)5f76d'7s2

[Rn]5f97s2

[Rn)5f107s2

[Rnj5j117s2

[Rn)5fT27s2

{Rnj5f137s2

[Rnj5!147s2

[Rnj5f I46d'7s 2

Thorium

Protactinium

U

ranium

Neptunium

ptutonlum

A

mericium

C

urium

Berketium

californium

E

insteinium

Fermium

M

endelevium

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rencium

PA

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Appendix IV ____ _ Solutions to Selected Problems

Chapter 2

Chapter 3

2.1. 0.77 rn 2.2. 75% 2.3. 0.114 ern (Not 0.1195 ern!) 2.4. 1.26 x 104 (N) 2.5. 36% 2.6. 703.1 (MPa) 2.7. 0.233 2.8. av = 0

2.10. ET = 10.26% E = 10.8% (J'T = 105.8 (MPa) (J' = 95.49 (MPa)

2.11. 3.998 (ern) 2.12. 1 = 1.502 (rn)

(J' = 254.6 MPa «300 MPa) 2.13. 0.292 2.14. 0.5

3.1. (220) 3.2. Countercloekwise sequenee starting with the front plane:

(1010); (0110); (1100); (1010); (0110); (1100) 3.3. (a) a = 60° (equilateral triangles!); ß = 120°

(b) a = 109.47° 3.4. 2 (not 6!) 3.5. 1/3, 2/3, 1/2 3.6. Hint: Draw two triangles, one vertically between the A and

B planes and the other within the B plane. 3.7. {l00)(100)

Chapter 5

Appendix IV • Solutions to Selected Problems 391

3.8. [111] direetion (dose paeked) lies in (110) plane (not dose paeked)

3.9. CsCI (a) = 8; (b) one Cs and one Cl ion (e) ao = 2(r + R)/V3 NaCI (a) = 6; (b) 4 Cl ions and 4 Na ions (e) ao = 2(r + R)

3.10. (a) Eaeh Zn ion has four nearest S ions. (b) Four Zn ions and four S ions, that is, eight ions. (e) ao = 4(r + R)/v3

3.11. 0.34 3.12. (a) 0.707; (b) 0.866 3.13. (a) 0.340; (b) 0.907 3.14. 8.933 (g/em3 )

3.15. [1100] V2

3.16. a 2

5.1. Liquid: 54.5% Solid: 45.5%

5.2. Periteetic at 799°C: a + L ~ ß Periteetic at 756°C: ß + L ~ l' Periteetoid at 640°C: l' + E ~ ? Euteetic at 640°C: l' ~ E + L Periteetoid at 590°C: l' + ? ~ 8 Euteetoid at 586°C: ß ~ a + l' Euteetoid at 582°C: ? ~ l' + E

Euteetoid at 520°C: l' ~ a + 8 Periteetie at 415°C: E + L ~ TJ Eutectoid at 350°C: 8 ~ a + E

Euteetic at 227°C: L ~ TJ + ß-Sn Periteetoid at 189°C: E + TJ ~ TJ' Euteetoid at 186°C: TJ ~ TJ' + ß-Sn Nonstoichiometric phase E forms at 676°C Allotropie transformation from ß-Sn ~ a-Sn at 13.2°C Note: Some transformations are hardly diseernible in Fig­ure 5.17.

5.3. (a) 8.8 mass % Cu in Ag at 780°C (b) 8.0 mass % Ag in Cu at 780°C

5.4. negligible 5.5. a + f)

Ca = 1.5 mass % Cu Co = 52 mass % Cu

5.6. About 860°C 5.7. No 5.8. (a) 780°C

(b) Ag-28.1 mass % Cu (e) About 830°C (d) About 6 mass % Cu

392 Appendix IV • Solutions to Selected Problems

Chapter 6

Chapter 8

Chapter 9

Chapter 11

6.1. X = - 00 ~ Cx = 2Ci - Co x= O~Cx = Ci X = +00 ~ Cx = Co

6.2. t ~ 00 ~ Cx = Ci t ~ 0 (x positive) ~ Cx = Co t ~ 0 (x negative) ~ Cx = 2Ci - Co

6.3. i: = 82.9

6.4. (a) D = 1.44 X lO-21 em2/s; No (b) nv = 1.19 X 1018 vaeancies/em3

nv/ns = 1.97 X lO-5 vaeaneies per lattice site (e) nv = 3.57 X 1017 vaeancies/em3

nJns = 5.92 X lO-6 vaeaneies per lattice site (d) Dvo = 8.3 X lO-10 em2/s; Yes (e) D beeomes smaller

6.5. t = 3.47 hr

8.1. y (austenite) 52%; Fe3C (eementite) 48% 8.2.2% C 8.3. Pearlite: 84%

Primary a: 16% Pearlite eontains 0.77% C Primary a contains 0.0218% C

8.4. rint = 0.534 A; lattice will expand 8.5. rint = 0.361 A (tetrahedral); rint = 0.192 A (octahedral) 8.6. Interstitial site for y-iron is larger. Thus, higher solubility

of C in y-iron. See Figure 8.1.

9.1. 0.05917 (note differenee between In and log!) 9.2. E = 0.68 (V) 9.3. Cion = 0.0453 M

m = 2.829 (g) 9.4. P-B-ratio = 1.75 (hetween 1 and 2 ~ eontinuous and

adherent) 9.5. P-B-ratio = 1.58 (stahle oxide) 9.6. W = 2.96 (g) 9.7. t = 756.3 (s) = 12.6 (min)

11.1. 0.1 (V)

11.2. 2.73 X lO22 (electr~ns) or 1.07 (eleetronS) em atom

11.3. 1.948 X 1047 (el;e:~nS) == 3.12 X 1028 (el:~t:~S)

Chapter 12

Chapter 13

Chapter 14

Appendix IV • Solutions to Selected Problems 393

11.4. 5.9 X 1022 (ele~:~ns)

11.5. 9.77 X 109 (ele~~~ns) 11.6. T= 19,781 (K) 11.7. 0.396 (eV)

11.8. 3.12 X 103 (n~) 11.9.0.11 (A) 11.10. 9.44 (m2N· s)

12.1. 2 X 104 (Alm); 251.3 (Oe) 12.2. 694 (K) 12.3. /L = 1.001 (in mks units) 12.4. /LB = 9.272 X 10-24 (J/T) or 9.27 X 10-21 (erg/Oe) 12.5. FeO' Fe203; /Lm = 4 /LB

CoO . Fe203; /Lm = 3 /LB 12.6. Yes, it ean be easily done! 12.7. B = 0.1 (T)

13.1. W = 27.8 (nm) 13.2. RAg = 98.88%; Rglass = 5.19% 13.3. Z = 7.81 (nm) 13.4. T2 = 94.3% 13.5. (Vl)K = 1.03 X 1015 (S-I)

(vlki = 1.92 X 1015 (S-I) 13.6. Nf = 5.49 X 1022 (eleetrons/cm3);

Na = 5.86 X 1022 (atoms/em3); Nf/Na = 0.94 (eleetrons/atom)

14.1. Average 5.26% 14.2. T = 1,142 (K) = 869 (OC) 14.3. -IQ: Glass: 3.2 X 103 (J/S . m 2)

Al: 4.0 X 105 (J/s . m2)

Wood: 1.6 X 102 (J/s . m2) 14.4. I = 374 (A) 14.5. aL = 4.9 (mm)

Index

Abaca, 316, 325 Abbe, E., 299 Aboriginal people, 10 ABS,356 Absorbance, 244 Absorption, 243

of light, 246-253 Absorption band, 248 Acceptor impurity, 195 Acceptor level, 195 Acoustic materials, 378 Acrylics, 346 Activation energy, 104, 105, 120 Active stainless steel, 161 Adama, 281 Addition polymerization, 338 Additives to polymers, 348 Adobe, 283 Afterglow, 253 Age hardening, 88, 89-95, 115 Aging,89 Agricola, G., 129 Agrieulture, 128 Akkadian tongue, 124 Al-Cu, 90 Al-Cu-Mg, 94 Alchemy, 130, 351 Alcohol, 362 Alkali halides, 27 Alkaline batteries, 159 Allophane, 292 Allotropie materials, 37 Allotropie transformation, 37,

138, 291 Alloyed steels, 146 Alloys, 64, 74-101

conduction in, 188-189 Alluvial deposits, 68

Alnico alloys, 235 Alnieo magnets, 234 Alpaca, 317 a-phase,76 a-quartz, 291 Altemate-use applications, 365 Alumel,206 Alumina, 290, 311 Aluminum, see Al entries Aluminum recycling, 364 Amber, 4, 71, 320 Amber electrieity, 170 Amorphous ferromagnets, 233 Amorphous polymers, 346-347 Amorphous state, 301 Amorphous structure, 25 Amp-turns per meter, 218 Ampere, A. 174 Anatolia, 5, 6, '8, 70, 124, 284 Anemia,135 Angle of refraction, 241 Angora rabbit, 317 Angular frequency, 241 Animal fiber, 316, 321-323, 325 Animal guts, 320 Animal skin, 3 Anisotropy, 43 Annealing, 51,117,141 Annealing point, 307 Annealing twins, 37 Anode, 154 Antiferromagnetie materials, 227 Antiferromagnetism, 217, 227,

228 Antistatie agent, 348 Aqua regia, 353 Aristotle, 125 Armor, 311

Arrhenius diagram, 108 Arrhenius equation, 102, 107,

205 Arrow, 124 Arrow tips, 4, Plate 1.1 Arsenie, 64, 67 Arsenie-pentafluoride, 201 Artificial ivory, 334 Artificial silk, 316, 334 Asbestos, 317-318 Asphalt, 283 Assyria, 70, 124, 285 Atom flow, 109 Atom flux, 109 Atomic bonding, 27 Atomic structure

of condensed matter, 24-26 of polymers, 43

Atomization, 116 Atoms, 24

arrangement of, 31-46 binding forces between, 26-31 in motion, 102-121

Attapulsite clay, 296 Attenuation, 244 Austenite, 138, 139 Austenitizing treatment, 141 Ax, 67, 71

BabyIon, 124,283 Backbone, 337 Baekeland, L. H., 335 Bainite, 138, 142 Baked clay, 7 Bakelite, 335 Ball clay, 287 Balsa wood, 329 Baltie Sea, 126

396 Index

Bamboo structure, 121 Ban Chiang, 68 Band structure, 185, 186, 192,

195,203 Band gap, 196 Band overlapping, 187 Barium titanate, 213, 214 Bark,320 Barrier region, 197 Basal plane, 40 Basal slip, 52 Basalte, 286 Base, 198 Basic oxygen process (BOP), 131 Bast fiber, 316, 324, 325, 326 BaTi03, 213, 214 Battery, 202, 378 Bauxite, 358, 364 Bave, 323 Beads (glass), 285 Beating, 331 Beer equation, 245 Bell Beaker Folk, 9 Bell metal, 87 Bellows, 6, 127 Bend test, 12, 13 Bentonite, 296 Benzene ring, 337 Bessemer converter, 132 Bessemer steel. 132 ß-cristobalite, 46, 291 ß-phase,81 ß-quartz, 291 ß-tin, 38 ß-tridymite, 291 Bias voltage, 199 Bifunctional system, 338 BilIiard balls, 334 Binary phase diagrams, 76-87 Binding energy, 27 Binding forces between atoms,

26-31,48 Biodiversity, 359 Biological glass, 300 Biologically generated materials,

376-377 Biosensor, 202 Bipolar transistor, 198 Biringuccio, V., 130 Bismuth,67 Bisqueware, 286 Bivalent metal, 187 Black ironwood, 329 Black Sea, 126

Blast furnace, 127, 131, 147 Bloch wall, 227 Bloom, 123, 127, 131 Blow tube, 6, 298 Body-centered cubic (BCC) crys-

tal structure, 32 Body painting, 7, 282 Bohr magneton, 224 Boltzmann constant, 103,269 Bombyx mori, 315 Bonding mechanism, 27 Bone, 3, 4 Bone china, 287 Boron carbide, 311 Boron nitride, 292 Böttger, J.F., 286, 287 Box bellows, 127 Bragg, W., 24 Branched polymers, 43 Brass, 70, 75 Bravais, A., 24 Bravais lattice, 32, 33 Breaking strength, 15 Bricks, 282 Bridging oxygens, 306 Brinell hardness number, 21 Brin, 323 Brittle materials, 12, 16 Brittleness, 10, 125 Bronze, 64, 67, 75, 94, 124 Bronze Age, 3, 64-72, 97 Brush fiber, 316 Bubbles (gas), 98 Building material, 282 Buna, 320 Burden, 131 Burgers vector, 50, 56 Burnishing, 289

da ratio, 32, 53 Calcination, 310 Caloric, 172 Cambium, 329 Camel hair, 317 Campfire,7 Caoutchouc, 318 Capacitance, 209 Capacitor, 213 Capacity, 177 Carbohydrate, 316 Carbon, 125 Carbon fourteen dating, 289 Carbonizing, 127

Cardboard, 367 Case hardened iron, 125 Cashmere wool, 317 Cassiterite, 70 Cast iron, 127, 147-149 Casting, 97-99, 127 Catal Hüyük, 8, 284 Cathode, 154 Cathode rays, 178 Cathodic protection, 159, 160 Cathodoluminescence, 254 Cave of the Treasure, 67 Cavity, 98, 255 CD player, 257 Celluloid, 334, 335 Cellulose, 316, 324-325, 328, 333 Cellulose nitrate, 333, 334, 335 Celtic tribes, 126 Cement, 309-310 Cementation, 353 Cementite, 138, 139 Ceramic magnets, 235 Ceramics, 16, 45, 281-284, 311,

375 creep in, 120-121 crystal structures of, 44-46 diffusion in, 113-115

Ceremonial vessel, 68 Cesium chloride crystal struc-

ture, 45-46 Chain armor, 126 Chain folding of polymers, 337 Chain reaction polymerization,

338 Chalcolithic Period, 3, 6-10, 66 Chalybes, 124 Characteristic penetration depth,

244 Characteristic X-rays, 260-261 Charcoal, 125 Charge density, 212 Chariot, 124 Chemical recycling, 366 ChilI zone, 97 China, 66, 127 Chinese teapots, 285 Chlorophyll, 135 Chromel, 206 Chrysotile, 317 Clay, 3, 62, 281, 282, 290, 291 Clay crucible, 68 Cliff-dwelling, 283 Climbing of dislocations, 118 Clock (electronic), 215

Cloisonne technique, 289 Close-packed plane, 35 Coa!, 358, 359 Coalescence, 120 Coating of metals, 162 Cobalt-samarium magnets, 234 Cobble creep, 119 Cocoon, 323 Coercive field, 213, 226 Coercive force, 230 Coercivity, 225, 233 Coherency strain field, 91 Coherent particles, 91 Coherent precipitates, 89 Coherent precipitation, 91, 92 Coherent scattering of electrons,

183 Coinage, 87, 354 Coir fiber, 316 Coke, 131 Cold working, 19, 117, 125 Collector, 198 Collimation, 255 Colloidal gold, 352 Colonies, 140 Coloring of glazes, 289 Columnar grain, 98 Columnar zone, 98 Compact disc (CD), 262 Compass, 171 Component,76 Composite material, 116, 283,

309, 328, 375 Composition cel!, 161 Composting, 370 Compound semiconductor, 196 Compounds, 74-101 Computer, 198 Computer revolution, 375 Concentration cell, 158 Concentration gradient, 109 Concrete, 27, 309-310, 357 Condensation polymerization,

340 Condensed matter, atomistic

structure of. 24-26 Conduction

in alloys, 188-189 in polymers, 200-204 thermal. 272-276

Conduction band, 192 Conductivity, 180, 182, 184, 187

of bivalent metals, 187 classical. 184

of monovalent metals, 187 quantum mechanical, 187

Conductors, 169, 180 ionic, 204-206

Congruent maximum, 87 Conjugated organic polymer, 201 Constantan, 206 Contact potential. 208 Continuous casting, 99 Conventional unit cell, 32 Cooling curve, 83, 84 Coordination number, 34 Copolymer, 348 Copper, 5, 67, 126 See also Cu entries Copper-arsenic, 67 Copper axe, 9 Copper ore, 6 Copper smelting, 123 Copper-Stone Age, 3, 6-10 Copper-tin, 67 Copper-tin phase diagram, 87 Copper-zinc,70 Cordage, 324, 326 Core-forming technique, glass,

297 Core loss, 230 Core material. 232 Coring, 78, 99, 109 Cork, 320, 329 Corrosion, 128, 151-155,351

in glass, 164-165 in low-alloy steel, 161 in martensitic stainless steel,

161 in polymers, 163-164

Corrosion pit, 158 Cortex, 329 Corundum, 311 Cosmic dust, 135 Cosmic iron, 135 Cotton, 315, 325 Covalent bond, 28-29 Cradle of civilization, 68 Creep, 75, 117-121,376

in ceramics, 120-121 in glass, 120 in polymers, 121

Creep constant, 119 Creep exponent, 119 Creep rate, 118 Creep strain, 118 Creep test, 22 Creep time, 118

Index 397

Crevice corrosion, 159 Cristobalite, 294, 301

crystal structure, 296 Critical resolved shear stress, 48,

60 for single crystals, 52

Croesus, 354 Cross-linking, 340 Cross-slipping, 57 Crown,67 Crown glass, 300 Crude cast iron, 127 Crude oil, 359 Crude steel, 133 Cryotron, 191 Crystal,24 Crystal glass, 300 Crystal structure, 24, 32

of ceramics, 44-46 of cristobalite, 295

Crystal systems, 33 Crystalline polymer, 343, 346 Crystallography, 31-46

of clay minerals, 292 Cu, see Copper entries Cu-Ag, 80 Cu-Ni,76 Cubic crystal. 33 Cullet, 300, 365 Cuneiform, 124 Curie Constant, 223 Curie temperature, 214, 226, 228 Curie-Weiss law, 223 Currency, 350 Current, 180 Current density, 181 Cutting tools, 311 CW laser, 257 Cyanide leaching, 353 Cyprus, 6, 70 Czochralski crucible pulling, 193

Dagger, 129 Damascus steel, 129 Damping constant, 242 Damping strength, 184,247 Davisson, C.J., 179 de Broglie, L., 179 De-inking, 368 De la pirotechnia, 130 De re metallica, 129 Dead Sea Scrolls, 67 Dealloying, 154

398 Index

Debye-Scherrer technique, 24 Debye temperature, 268, 269 Decibel, 244 Decolorant, 298 Decomposition temperature

(polymers), 347 Decorations, 289 Decortication, 324 Defect electron, 193 Defoliation, 359 Deformation twins, 37 Deglassing, 307 Degradation temperature, 347 Delft, 286 &-ferrite, 13 8 Dendritic growth, 79 Denier, 325 Density,35

of (electron) states, 186, 187 Dental alloys, 352 Depleted zone, 103 Devitrification, 307, 309 Dezincification, 154 Diamagnetic materials, 219, 220 Diamagnetism, 217, 221-222 Diameter of universe, 180 Diamond, 18,28,29 Diamond cubic structure, 46 Dica1cium silicate, 310 Dielectric constants of materials,

209,210,212 Dielectric displacement, 211 Dielectric loss, 213 Dielectric material, 208, 210 Dielectric polarization, 211 Dielectric properties, 208-212 Dielectrics, 177, 179,214 Diffusion, 78, 103-107

in amorphous solids, 114 in ceramics, 114-115 by interchange, 105 through polymers, 115

Diffusion coefficient, 109, 205 Diffusion constant, 109 Diffusion creep, 119 Diffusion depth, 122 Diffusion distance, 112 Diffusion jump distance, 110 Diffusivity, 109 Digital video disk (DVD), 263 Dinitrate of cellulose, 333 Diode, 196 Dipole, 30, 210 Dipole moment, 210, 212

Direct reduction process, 131 Directional diffusion, 108-109 Directionality, 28 Directions in unit cells, 40 Disko (Greenland), 135 Dislocation, 25, 47-55, 103 Dislocation core, 50, 58 Dislocation-core diffusion, 107 Dislocation creep, 118 Dislocation density, 57, 96, 117 Dislocation line, 49 Dislocation loop, 93 Dislocation multiplication, 57 Dislocation pinning, 56, 118 Dispersion, 242, 247 Dispersion strengthening, 95, 99,

139 Displacive transformation, 291 Disproportionation, 339 Domain, 214, 226 Domain wall, 227 Domestic waste, 368-371 Donor atom, 194 Donor electron, 194 Doping, 191, 194,201 Dragon's blood, 130 Drain, 199 Drift of atoms, 109 Driving force, 108 Drude, P., 184, 247 Drude theory, 248 Duality of electrons, 178 Ductile cast iron, 148 Ductile material, 12, 16 Ductile metals, 10 Ductility, 10, 16, 26, 116, 117,

125 of clay, 292

Dulong-Petit value, 268, 271 Dumbbell, 103 Duralumin, 89 Dynamic recovery, 58 Dynamo machine, 175

Earphone, 215 Earthenware, 284 Earthenware clay, 284 Earth's magnetic field, 171 Easy direction, 232 Easy glide, 58 Eddy current, 230 Eddy current loss, 230, 233 Edge dislocation, 48

Effective diffusion depth, 122 Efficient design, 372-373 Einstein, A., 265, 270 Einstein relation, 205 Elastic material, 10, 12 Elastic range, 14 Elastic strain energy, 103 Elastomeric polymers, 344 Elastomers, 335, 343, 345 Electric arc fumace, 132 Electric dipole, 30, 177,248 Electric displacement, 388 Electric field, 184 Electric field lines, 211 Electric field strength, 209, 211,

243 Electric force, 184 Electric fumace smelting, 131 Electric motor, 174,229 Electrical conduction in ionic

crystals, 204 Electrical conductivity, 117, 180,

184 Electrical insulator, 200 Electrical phenomena in materi­

als, 169-170 Electrical properties of materials,

180-215 Electrical steel, 229-230 Electricity, 170 Electrochemical cell, 154 Electrochemica1 corrosion, 155,

157 Electrochemical reactions, 154 Electrochromic display, 202 Electrode potential, 157 Electroluminescence, 254 Electrolysis, 176 Electromagnet, 218, 229 Electromagnetic cgs (emu) units,

221 Electromagnetic induction, 174 Electromagnetic materials, 376 Electromagnetic spectrum, 241 Electromigration, 109, 121 Electromotive force (emf), 156 Electron, 169 Electron band structure, 186,

192 Electron charge, 184 Electron colIisions, 183 Electron energy band structure,

185 Electron hole, 193

Electron microscopy, 24 Electron mobility, 193, 196 Electron-orbit paramagnetism,

223 Electron radius, 180 Electron scattering, 183 Electron sharing, 28 Electronegativity, 27-28 Electronic materials, 169-179 Electronic Materials Age, 169 Electronic polarization, 212 Electronic properties, 169-179 Electronic switch, 199 Electroplating, 156 Electrostriction, 215 Electrum, 354 Embryo, 96 emf (electromotive force), 156 Emission of light, 253-261 Emittel', 198 Empirical materials, 376 End group, 336, 339 Energy band, 185 Energy barrier, 205 Energy consumption to extract

raw materials, 372 Energy content of waste materi-

als, 371 Energy level, 185 Energy product, 388 Energy state, 186 Engineering strain, 20 Engineering stress, 19 Environmental considerations,

362-371 Environmental interaction, 151 Epidermis, 329 Epoxy, 335, 342 Equiaxed zone, 98 Erosion-corrosion, 163 Ethylene, 338 Euclid, 172 Eutectic composition, 81, 127 Eutectic microconstituent, 83 Eutectic phase diagram, 80-83 Eutectic point, 82 Eutectic reaction, 138 Eutectic temperature, 81 Eutectoid point, 84 Eutectoid reaction, 138 Eutectoid steel, 139 Eutectoid temperature, 146 Eutectoid transformation, 84 Excitation energy, 185

Exciton, 253 Exotic materials, 375 Expansion, thermal, 276-278 Expansion coefficients, 276

of glass, 308 Extractives, 325 Extrinsic semiconductor,

194-196 Extrinsic stacking fault, 37

Face-centered cubic (FCe) crys-tal structure, 32

Falence, 285 Farad, 177,209 Faraday, M., 173 Faraday cage, 177 Faraday constant, 160 Faradayeffect, 175 Faradayequation, 160 Fatigue test, 22 Fe, see lron entries Fe-Cr, 146 Fe-Fe3C phase diagram, 139 Feathers,3 Federsee, 71 Feldspar, 286, 291 Feit, 322 Felting, 314 Fermi energy, 186

of intrinsic semiconductors, 194

Fermi velocity, 187 Ferric iron, 137 Ferrimagnetism, 170, 217,

228-229 Ferrite, 138, 139 Ferrite magnets, 235 Ferrite start temperature, 144 Ferroelectric materials, 213 Ferroelectricity, 213-214 Ferroelectrics, 213 Ferromagnetics, 220 Ferromagnetism, 170, 217,

224-227 Ferrous iron, 137 Fertility charm, 282 Fibers,3

natural, 314 propenies of, 325

Fibrils, 324 Fibroin, 321 Fick's first law, 109 Fick's second law, 110

Index 399

Fictive temperature, 307 Field effect transistor, 199, 202 Filler, 348 Filling, 332 Fine bainite, 143 Firing of clay, 294 Fishing hooks, 4 Flame-resistant plastics, 373 Flame retardant, 348 Flat panel glass, 299 Flax, 4, 315, 316, 325-326 Fleece, 315 Flint glass, 300 Flint stone, 4 Flow stress, 17, 96 Fluorescence, 253 Fluorescent lamp, 254 Flux, 131, 303

atom, 109 Flux meter, 225 Fluxing agent, 6 Foam glass, 300 Folded chain model, 343 Folklore, 354 Fool's gold, 352 Forbidden band, 192 Fort Knox, 350 Forward bias, 198 Fourier Law, 273 Fracture toughness, 16 Frank-Read source, 57 Franklin, B., 170 Free electron, 29, 177, 182, 203,

247, 274 Free electron model, 184 Free electron theory, 248 Free energy, 115, 116

of formation, 153 Free radical, 338 Frenkel defects, 103, 114 Frequency selective element, 215 Friction force, 247 Frictional electricity, 170 Fritted glaze, 285 Fruit-hair fiber, 316 Fulcrum,77 Full annealing, 141 Functional materials, 376 Fused quartz, 300 Fused silica, 46

Galalith, 335 Galileo, G., 172

400 Index

Gallium arsenide, 196 Galvanic ceIl, 174 Galvanic corrosion, 157 Galvanic couple, 155, 156 Galvanic electricity, 170 Galvanic series, 157, 158 Galvanized steel, 163 Galvanometer, 174 'Y-rays, 259 Garbage, 368 Gas sensor, 202 Gate, 199 Gauss (unit), 221 Gaussian error function, 112 Generator, 229 Georgius Agricola, 129 Germanium, 29, 191 Germer, L.H., 179 Gibbs phase rule, 76 Gilding, 353 Glass, 16, 29, 46, 120

creep in, 120 recycling of, 301, 364-365

Glass beads, 71, 296 Glass-blowing, 298 Glass-ceramics, 309 Glass cutting, 308 Glass electricity, 170 Glass formers, 303 Glass-making

history of, 296-301 scientific aspects of, 301-309

Glass transformation range, 306

Glass transition range, 306 Glass transition temperature, 121

polymers, 347 Glass vessel, 297 Glass wool, 300 Glassy amorphous solid, 347 Glassy stage, 347 Glaze, 7, 284, 288 Glazed bricks, 283 Glazing, 285, 296 Goethe, I.W. von, 239 Gold, 5, 71, 350-354

properties of, 351 Gold panning, 352 Gold rush, 353 Gold standard, 351 Golden Age, 4 Gombroon, 287 Goodiron, 124, 125 Goodyear, C., 319

GP zones (Guinier-Preston zones), 93-94, 115

Grafting, 348 Grain boundary, 43, 96, 103 Grain boundary diffusion, 106,

121 Grain boundary energy, 116 Grain boundary pinning, 116 Grain boundary sliding, 120 Grain growth, 116, 117 Grain orientation, 232-233 Grain-oriented silicon iron, 231,

233 Grain refiner, 96, 141 Grain size strengthening, 96-97,

99 Grains, 41 Graphite, 147, 202, 292 Graphite fibers, 375 Gravity/electricity relationship,

175 Gray cast iron, 148 Greenhouse gas, 363 Greenstone, 4 Grocery bags, 367 Groundwood pulp, 331 Guinier, A., 24 Guinier-Preston zones (GP

zones), 93-94, 115 Gun cotton, 333 Gypsum, 310

H-coefficient, 143 Hagen-Rubens equation, 246,

248 Hair, 315 Hall-Petch relation, 59, 96 Halloysite, 292 Hammering, 5, 64, 67, 123, 125,

127 Han dynasty, 128, 285 Harappan people, 72 Hard magnetic materials, 226,

233 Hard rubber, 319 Hard wood, 327 Hardenability, 146 Hardening, 139

of glass, 308 by hammering, 5

Hardness, 10, 66, 124, 125 Hardness test, 21 Hardwood, 328

Harmonie oscillator, 249, 269 Harness buckle, 128 Haya people, 129 HDPE, 356, 366 Heartwood, 329 Heat, 172 Heat capacity, 266, 269

at constant pressure, 267 at constant volume, 267 per mole, 268

Heatconduction,265,272 in dielectric materials, 275

Heat eonductivity, interpretation of

classical, 274 quantum-mechanical, 275

Heat flux, 273 Heat shield, 351 Helmholtz, H., 173 Hematite, 135 Hemoglobin, 135 Hemp, 4, 315, 316, 325 Henequen, 316,325 Hertz, H., 240 Heterogeneous nucleation, 93,

96, 97 Hexagonal close-packed (HCP)

structure, 32, 34 Hexagonal crystal structure, 33 Hieroglyphies, 124 High-Performance Concrete, 310 High-tech ceramies, 311 Hittites, 124 Hoe,128 Hollander beater, 332 Homer, 72, 125 Homogeneous nucleation, 93 Homogenization, 109 Homogenization heat treatment,

80 Hooke's Law, 16 Horns, 320 Horseshoe, 126 Hot dip zine galvanizing, 163 Hot-rolling, 99 Hot shortness, 80 Hot working, 19,80 Hume-Rothery rule, 80 Hund's rule, 224, 229 Hydration, 310 Hydraulie cement, 309 Hydrogen reference ceIl, 156 Hydrous silicate, 290 Hydroxyl (OH2) ions, 294

Hypereutectie alloy, 83 Hypereutectoid steel, 141 Hypoeutectie alloy, 83 Hypoeutectoid steel, 139 Hysteresis loop, 211, 226, 230 Hysteresis loss, 228, 232

!ce crystals, 31 Ideal resistivity, 184 Iliad, 72 Imagination, 376 Impact tester, 22 Inca, 72 Incineration, 370 Incoherent scattering of elec-

trons, 183 Index of refraction, 242 India, 71-72 Indirect transition, 251 Indo-China, 68 Indus river, 71-72 Industry, 128 Inhibitor, 163 Initiator, 338 Innovative concepts, 376 Inoculant, 98 Inoculator, 96 Insulator, 169, 180, 186, 296 Integrated circuit, 196 Intensity of light, 243 Interatomie bonds, 26 Interatomie distance, 110 Interband transition, 250 Interdendritie segregation, 79 Interdendritie shrinkage, 98 Interdiffusion, 112 Intergranular cOITosion, 161 Intermediate phase, 86-87 Intermediates (glass), 303 Intermetallic compound, 86-87 Intermetallie phase, 95 Internal energy, 270 International system of units,

385-386 Interplanar spacing, 40--41 Interstitial, 25, 103 Interstitial diffusion, 104-105 Interstitialcy, 25, 103 Interstitialcy mechanism, 105 Intraband transition, 251 Intrinsic conduction, 194 Intrinsie semiconductor,

192-194

Intrinsie stacking fault, 37 Invariant point, 82 Inverse spinel structure, 229 Investment casting, 97 Ion, 26 Ion implantation, 103 lonie bond, 26-28 lonie conductors, 204-206 lonie crystals, 204 lonie dipole moment, 214 lonie polarization, 212 lonization energy, 196 lron, 123, 138, 358

see also Fe entries Iran Age, 3, 123-129 lron belt, 134 lron carbide, 138 lron-carbon alloy, 125 lron-carbon phase diagram, 139 lron casting, 127 lron deposits, 134 lron-graphite phase diagram,

148 lron Mountain, 135 Iron-neodymium-boron mag-

nets, 234 lron ore, 123, 126, 135 lron oxide, 123, 152,282 lron pillar, 128 lron recycling, 364 Isomorphous binary phase dia-

gram, 76-80 Isopleth plot, 88 Isothermal plot, 88 Isotropie materials, 43 Istle, 316, 325 Ivory, 320, 334

Jade, 4 Jewelry, 71, 353 Jomon ware, 289 Joule, J.P., 173 Jump frequency of atoms, 107,

109 Jute, 316, 325

K-shell,26 Kalevala, 13 7 Kaolin, 293 Kaolin clay, 287, 332 Kaolinite, 292, 296 Karat, 353 Keramos, 311

Index 401

Keratin, 321 Kiln, 7, 284 Kirkendall shift, 113 Knitting needle, 71 Knoop mierohardness technique,

21 Kraft process, 331

L-shell, 26 Lake Vietoria, 129 Lamellar mierostructure, 82 Laminated glass, 373 Landfill, 363, 370 Lapis lazuli, 296 Large-angle grain boundaries, 43 Laser, 196, 254, 255, 375 Laser materials, 256 Laser printer, 257 Latent heat of fusion, 82 Latex, 318, 329 Lattiee, 32 Lattiee constant, 32 Lattiee defects, 102-103 Lattiee distortions, 91 Lattiee parameter, 32 Lattiee vibration, 266 Lattiee vibration quanta, 251 Laue, M. von, 24 LDPE, Oow-density polyethylene)

366 Leaching, 153 Lead, 5 Lead glaze, 285 Leaf fiber, 316, 324, 325, 326 Leathery stage, 347 Lens, 172 Lenz law, 222 Lever rule, 77 Levitation effect, 222 Light

absorption of, 246-253 emission of, 253-261

Light-emitting diode (LED), 196, 259

Light quantum, 240 Lightning, 170 Lignin, 324, 328 Lime, 300 Limestone, 131, 296, 300 Limonite, 135 Line-defects, 48 Line fibers, 324 Linear hardening region, 58

402 Index

Linear packing fraction, 35 Linear polymer, 336, 342 Lining, 132 Liquidus line, 76 Liquidus plot, 87 Llama, 317 Lodestone, 137, 171 Long line current, 159 Lorentz, H.A., 249 Lost wax method, 97 Lower bainite, 142 Lower yield point, 17 Lucite, 346 Lüders bands, 19 Lumen, 324, 329 Luminescence, 253 Luster decoration, 289

Mace head, 67 Machinability, 141 Mackintoshes, 319 Macromolecule, 43, 336 Magnesia, 170, 290 Magnesium, see Mg entries Magnetic anisotropy, 232 Magnetic compass, 137 Magnetic dipole moment, 388 Magnetic disk, 237 Magnetic domain, 226, 236 Magnetic electricity, 170 Magnetic field parameters, 220 Magnetic field strength, 218,

221, 388 Magnetic flux, 221, 388 Magnetic flux density, 218-219,

221 Magnetic induction, 218, 388 Magnetic materials, 169,217 Magnetic properties of materials,

217-237 Magnetic recording, 236-237 Magnetic Resonance Imaging

system, 235 Magnetic sensor, 233 Magnetic tape, 217, 237 Magnetic units, 388 Magnetism, 170,217 Magnetite, 135 Magnetization, 220, 388 Magnetorestrictive transducer,

233 Magnifying glass, 172 Maiolica, 285

Majority carrier, 197 Malachite, 6, 71, 123,285 Malleable iron, 149 Martensite, 137, 143 Martensitic transformations in

nonferrous alloys, 144 Marver, 298 Mass-average molar mass, 338 Mastication, 319 Materials

electrical properties of, 180-215

fundamental mechanical prop­erties of, 12-22

magnetic properties of, 217-237

optical properties of, 239-263 price of, 355-357 production volumes of, 357 strength of, 46-61 thermal properties oE. 265-278 world reserves of, 358-362

Materials science, 4 Matrix, 74 Matthiessen rule, 184, 188 Maximum energy product, 233 Maxwell, J.C., 175 Maxwell equations, 217 Mayer, L.L., 173 Mechanical properties, 12-22

of polymers, 340-345 of steel, 141

Mechanical recycling, 365 Mehrgarh (Pakistan), 72 Meißen Porcelain, 285, 286 Meissner effect, 222 Melting temperature (point),

of glasses, 307 of metals and alloys, 76, 126 for polymers, 347

Memory, 200 Mer, 336 Mercury,5 Merino sheep, 315 Mesolithic phase, 3 Mesopotamia, 70, 124, 285 Metallic bond, 29 Metallic glass, 301 Metals

electronic properties of, 387 prices oE. 356 resistivity of, 182-184

Metalworking, 9 Metastyrene, 335, 336

Meteoric iron, 123 Metglas, 301 Methyl rubber, 320 Mg-partially stabilized zirconia,

95 Mg2Zn,94 Mica, 291 Microcomputer, 200 Microconstituent, 83 Microminiaturization, 152 Microphone, 215 Microprobe, 113 Middle East, 67 Milk glass, 287 Millefiori glass, 297 Miller-Bravais indices, 40 Miller indices, 38-40 Mineral fiber, 317 Mining,8 Minting, 354 Mirror, 172 Miscibility gap, 85 Mixed bonding, 31 Mixed dislocation, 55 mksA system of units, 385-386 Mobility, 193

of electrons, 193 ofions, 205

Modifiers, 121. 303 Modulus of elasticity, 16

wood,330 Mohair, 316-317 Mohenjo-daro, 72 Molar heat capacity, 266, 268 Molar mass, 336 Molecular currents, 221 Molecular polarization, 212 Molecular weight, see Molar

mass Monochromatic light, 255 Monochromatic X-rays, 260 Monoclinic crystal, 33 Monomer, 43, 336, 338 Monotectic reaction, 85-86 Monotectoid reaction, 85-86 Monovalent metal, 187 Mosaic glass, 297 MOSFET,199 Mud,282 Mud brick, 7 Mulberry silkworm, 315 Mullite, 87, 293, 294 Mumetal, 231, 233 Municipal solid waste, 368

Murano glass, 299 Mythology, 137, 354

n-p-n transistor, 199 n-type semiconductor, 194 Nabarro-Herring creep, 119 Nanostructure, 376 Native gold, 352 Native metals, 5 Natural aging, 90 Natural fibers, properties of,

321-333 Nature of electrons, 177 Near close-packed slip systems,

54 Necking, 15,20, 119 Neel temperature, 227 Neodymium-boron-iron, 235 Neolithic phase, 3 Neomagnets, 235 Neoprene, 320 Nemst equation, 156 Network formers, 303 Network modifiers, 303 Network polymers, 340, 342 New Zealand flax, 316 Newton,!., 239 Newtons (unh), 14 Ni-Al,94 Nitrocellulose, 333 Noble gas configuration, 26 Nodular cast iron, 148 Nomads, 128 Nonbridging oxygen, 306 Noncoherent precipitates, 91, 92 Nonconductors, 180 Nonequilibrium solidus line, 78 Nonlinear elastic deformation

345 ' Nonporous oxide layer, 153 Nonsteady-state diffusion

110-111 ' Normalizing, 141 North pole, 171 Nubia, 352 Nuclear fission, 134 Nuclear fusion, 134 Nucleation and growth, 96 Nucleus,96 Number

of atoms per unit cell, 34 of free electrons, 184, 248 of ions, 205

Numher-average molar mass 339 '

Nylon, 316, 325

Obsidian, 4, 296 ODS alloys, 95 Odyssey, 125 Oersted (unit), 221 Oersted, H.C., 170, 173 Offset yield strength, 16 Ohm, G.S., 181 Ohm's law, 181 Oil,358

recycling of, 371 Olivine, 291 One-molar solution, 155 Opacifier, 246 Opaque substances, 169,246 Open-hearth process, 132 Operational amplifier, 200 Optical constants, 241-246 Optical disk, 262 Optical fiber, 252, 300 Optical glass, 300 Optical materials, 376 Optical phenomena, 171 Optical properties of materials

239-263 ' Optical pumping, 255 Optical storage devices, 261-263 Optical telecommunication, 257 Optics industry, 299 Opto-electronics, 196 Organic polymers, 44 Orientation polarization, 212 Ornaments, 5 Orowan mechanism, 93, 99 Orthorhombic crystal structure

33 ' Orthosilicate, 291 Oscillator, 183 Ötzi,9 Ovenware, 309 Overaging, 90 Oxidation, 152, 154 Oxidation rate, 153 Oxidation site, 154 Oxides, 27

p-electrons, 26 p-n-p transistor, 199 p-type semiconductor, 195 Packing factor, 34

Index 403

Paleolithic phase, 3 Palestine, 124 Palm-type fiber, 316 Palmyra, 316 Paper, 330-333, 359

recycling of, 366-370 Paper board, 359 Paper-making, 331 Papyrus, 330 Paramagnetic materials, 219 Paramagnetism, 217, 223-224 Parchment, 330-331 Parenchyma, 328 Particle board, 330 Pascal (unit), 14 Passivation, 161 Passive stainless steel, 161 Pauli principle, 224, 383 Pearlite, 138, 139 Pearlite finish time, 142 Pearlite start time, 142 Pectic substances, 324 Peierls stress, 49, 50 Peltier effect, 207 Penetration curve, 111 Percussion flaking, 4 Periderm, 328, 329 Periodic Table, 26, 389 Peritectic transformation, 84,

138 Peritectoid transformation, 85 Permalloy, 231, 233 Permanent magnets, 233, 235 Permeability, 218, 219, 388

of free space, 218 Permeability constant, 388 Permittivity constant, 388 Permittivity of empty space, 209 Perovskite crystal structure, 190 Perpetual motion, 174 Peru, 10,72 PETE (polyethylene terephtha-

late) , 356, 366 Petroleum, 359 Phase, 76 Phase-coherent light, 254 Phase diagrams, 75-88 Phenolic resin, 335 Phloem, 328 Phonograph pickup, 215 Phonon, 251,266,270-271,274 Phosphor, 254 Phosphorescence, 253 Photochromic glass, 300

404 Index

Photoelectric effect, 240 Photoluminescence, 254 Photon, 240 Photosynthesis, 135, 316, 378 Photovoltaie device, 198 Physieal constants, table of, 386 Piassava, 316 Piezoelectricity, 214-215 Pig iron, 127, BI, 132, 133, 147 Pigment, 7, 282 Pilling-Bedworth (P-B) ratio, 151 Pin, 71 Pipe diffusion, 107 Planar packing fraction, 35 Planar transistor, 196 Planck, M., 240 Planck constant, 240 Plant fiber, 315, 316

composition of, 326 Plasma frequency, 248 Piaster, 309 Plastie container codes, 366 Plastie deformation, 10,48, 103,

118 Plastie region, 14, 16 Plasticity, 47-62 Plasticizer, 348 Plastics, 333-342

recycling of, 365-366 Plate glass, 299 PlatinumIPt -13%Rh, 206 Plowshare, 71, 126, 128 Plywood, 330 Point contact transistor, 196 Poisson ratio, 13 Polarization, 210, 212, 213, 243 Pollution, 359, 370 Poly-sulfur nitride, 201 Polyaniline, 202 Polychrome vessels, 297 Polycrystallinity, 41, 42 Polycrystals, 43, 59-61

slip in, 57-58 Polyester, 325, 335 Polyethylene, 337 Polygonization, 117 Polymer chains, 31 Polymerization, 336, 338 Polymers, 43, 335

additives to, 348 atomic structure of, 43 conduction in, 200-204 creep in, 121 degradation of, 163-164

diffusion through, 115 his tory of, 341 mechanical properties of, 17,

18, 342-347 prices of, 356 properties of, 342-347

Polymethyl-methacrylate, 346 Polymorphie materials, 37 Polypyrrole, 202 Polystyrene, 336, 347, 356 Polyvinyl chloride, 346 Pontil,299 Population density, 187 Population inversion of elec-

trons, 254 Porcelain, 286, 287, 288 Porosity, 64, 67, 98, 99, 113, 116,

120 Porous film, 153 Portland cement, 310 Potter's wheel. 284, 288-289 Pottery, 3, 7, 29, 70, 282, 297 Pounds per square inch (psi), 14 Powder metallurgy, 95, 131 Power law creep, 119 PP, (polyproylene) 366 Pre-pottery era, 281 Precipitation hardening, 88,

89-95 Priee of materials, 355-357 Primary a, 83 Primary creep, 118 Prism planes, 41 Probability integral. 112 Production volumes of materials,

357 Proeutectie constituent, 83 Propagation (in polymerization),

338 Prosenchyma, 328 Protective layer, 152-153 Protein, 321 PS (polystyrene), 366 Ptolemaic theory, 172 Puddling, 128 Pulp, 367 Pulping, 331 Pulsed laser, 256 Pulverization, 116 Pumping (laser), 255 Pumping efficiency, 256 PVC resin, 356 Pyrex, 309 Pyrite, 135

Pyrrhotite, 137 Pythagoras, 172

Q-switching, 258 Quantum mechanies, 185

of absorption of light, 250 Quantum numbers, 383-384 Quantum theory, 187, 240 Quartz, 46, 214 Quartz crystal resonator, 215 Quartz sand, 296 Quatemary phase diagram, 88 Quench rate, 143 Quenching, 89, 103, 125, 127,

141,301 Qutub Minar tower (India), 128

Radiation damage, 103 Radio frequency signal. 215 Radioactive tracer element, 113 Radioactive waste, 378 Raffia fiber, 316 Ramie fiber, 316, 325, 326-327 Random access memory, 261 Rapeseed oil, 362 Rapid solidification, 80, 97, 98,

300 Rare-earth magnets, 235 Rate equation, 107 Rate of oxidation, 153 Rayon, 316 Read-only memory (ROM), 262 Rechargeable battery, 202 Recording head, 236-237 Recovery, 51,117,189 Recovery rate of municipal solid

waste, 368-369 RecrystaIlization, 51, 117 Recrystallization temperature, 19 Rectifier, 196 Recycling, 362-368

of bronze, 126 of glass, 300, 364 of lead, 371 of oil, 371 of paper, 331 of scrap steel, 132

Red stoneware, 285, 286 Reduction process, 154 Reed,320 Refining, 331 Reflection, 172 Reflectivity, 245, 351

Refraction, 172 Refractive power, 242

of glass, 300 Refractory materials, 296 Regenerated cellulose fibers, 316 Rekh-Mi-Re, 67 Relative abundance of iron, 134 Relative permeability, 219 Relative permittivity, 209 Relaxation time, 184 Relief ornaments, 289 Remalloy, 234 Remanence, 225, 233 Remanent magnetization, 225 Remanent polarization, 213 Repeat unit, 43, 44, 336 Reserves (oil), 361 Residual resistivity, 183, 184, 188 Resinous electricity, 170 Resistance, 180 Resistivity, 180

of metals, 182-184 of nickel-chromium alloys, 189 of ordered alloys, 188 in superconductors, 189 of two-phase alloys, 188

Resolved shear force, 59 Resonance frequency, 249, 252 Restoring force, 249 Retained austenite, 145 Retting, 324, 326 Reverse bias, 197 Rhombohedral crystal structure,

33 Rigveda, 129 Ring exchange, 105 Rinman, S., 125 Riser,99 Roasting,8 RockweIl hardness, 21 Röntgen, W.C., 259 Rotation axis symmetry, 38 Rubber, 318-320, 344 Rubber tree, 318 Rubbery stage, 121, 347 Rudna Glava, 8 Rupture lifetime, 119 Rust, 155 Rusting, 151 Rutherford, E., 179

s-electrons, 26 Sacrificial anode, 159, 160

Safety, 373 Safety pin, 71 Sah glaze, 286 Sand casting, 97 Sapwood, 329 Sarnath (India), 129 Saturation current, 198 Saturation magnetization, 225 Saturation polarization, 213 Scale, 152 Scattering of light, 246 Schmid factor, 60 Schmid's law, 60 Schönbein, C.F., 333 Schott, 0., 299 Schottky defect, 103, 114,205 Schrödinger, E., 179 Schrödinger equation, 185 Scrap paper market, 367 Screw dislocation, 54 Scutching, 326 Sea of Tranquility (moon), 133 Sea Peoples, 126 Secondary recrystallization, 233 Seebeck coefficient, 206 Seed fiber, 316, 325, 326 Segregation, 78, 99 Selective leaching, 154 Selective steeling, 125 Self-diffusion, 106 Self-healing mechanism, 378 Self-interstitial, 25, 103 Semi-infinite solid, 111 Semi-synthetic polymers, 335 Semiconductor devices, 196-200 Semiconductor laser, 257 Semiconductors, 169, 180, 186,

191-200 electronic properties of, 387

Semicrystalline polymer, 347 Semipermeable membrane, 155 Semiprecious stones, 296 Sequential storage, 262 Sericin, 321, 323 Sericuhure, 315 Setting time, 310 Shang dynasty, 68, 286 Shape anisotropy, 235 Shape memory effect, 144 Shaping, 123 Shear modulus, 16, 56 Shear strain, 16 Shear stress, 13, 16, 57 Sheet metal, 99

Index 405

Shell, 3, 320 Shives, 326 Short line current, 159 Short-range order, 301 Shrinkage, 98, 295 SI unit system, 221, 385-386 Siderite, 135 Siemens, W., 182 Siemens-Martin process, 132 Silica, 46, 164,290,291,296,

301 Silicate ceramics, 29 Silicates, 291 Silicon, 28, 29, 191 Silicon carbide, 311 Silicon dioxide, see Si02 entries Silicon nitride, 311 Silk, 315, 317, 321, 322-323, 325 Silk gum, 321 Silkworm, 322 Silver, 5 Silver recycling, 365 Sinai peninsula, 6, 8 Sinan compass, 171 Single crystal, 41 Sintering, 95, 116 Si02, 46, 152,291 Si02-Al20 3 phase diagram, 294 Sisal fiber, 316, 325 Sizing, 332 Skin, 320, 348 Slag, 6, 123 Slime, 332 Slip

of dislocations, 48, 99, 118 in polycrystals, 59-61 for pottery, 289

Slip direction, 50, 53 Slip plane, 48, 49, 50, 54 Slip system, 51 Small-angle grain boundaries, 43 Smart materials, 376 Smectide, 292 Snell, W., 172 Snell's law, 242 Societal issues, 379 Socket tool, 66 Soda, 296, 300 Soda-lime-silica glass, 46, 300 Sodium chloride structure, 45 Soft magnetic materials, 226,

229 Soft-paste porcelain, 288 Soft porcelain, 287

406 Index

Softening point, 307 Softwood, 327, 328 Sol-gel technique, 252, 311 Solar cell, 198 Solenoid, 218 Solid solution strengthening,

74-75, 99, 139 Solidification, 98 Solidus line, 76 Soliton, 253 Solute atoms, 74 Solution heat-treatment, 89 Solvent, 74 Solvus line, 80 Sonar detector, 215 Source (in transistor), 199 Space charge region, 197 Spear, 4, 68, 124 Specific heat capacity, 266, 267 Specific volume, 346

of glass, 306 Spheroidizing, 141 Spherulites, 343 Spider drag line, 345, 346 Spin paramagnetism, 223 Spinning, 315 Sponge iron, 123, 129, 131 Sponges, 320 Spontaneous light emission, 254 Spring constant, 249 Stabilizer, 164, 348 Stack casting, 128 Stacking faults, 37 Stacking sequence, 35 Stainless steel, 146, 152, 161 Standard emf series, 157 Static electricity, 170 Statuary bronze, 87 Staudinger, H., 336 Steady-state creep, 118 Steady-state diffusion, 109-110 Steady-state flow, 110 Steatite, 285 Steel, 125, 138 Steel making, 131 Steel production data, 133-134 Step-growth reaction, 340 Stimulated emission, 254, 255 Stoichiometric intermetallic

compounds, 86-87 Stone,29 Stone Age, 3-5 Stoneware, 286 Stovetop, 309

Strain, 13 Strain field, 57 Strain gage, 215 Strain hardening, 20, 51, 58 Strain hardening coefficient, 19 Strain hardening exponent, 21 Strain point, 307 Straw, 319 Strength, of materials, 47-62,

116,117 Strength coefficient, 21 Strengthening, 19 Stress, 12, 119 Stress corrosion cracking, 161 Stress relief anneal, 117, 189 Stress-strain diagram, 14, 16, 19 Strontium titanate, 214 Structural materials, 376 Styrene, 335, 337 Substituting rare materials,

371-372 Substitutional solid solution, 74 Sunn fiber, 316 Superalloy, 94, 375 Superconductivity, 189-191 Superconductors, 180,220,222

1-2-3 compound, 190 high-Tc, 190 Type I, 190 Type 11, 190

Supercooled liquid, 307 SupermaIloy, 231, 233 Supermendur, 231 Supersaturated solid solution, 90 Surface charge density, 211 Surface diffusion, 106-107 Surface emitter, 259 Susceptibility, 218, 388 Swelling, 164 Switching device, 198 Sword, 124, 129 Synthetic fiber, 325 Synthetic polymer, 335 Synthetic rubber, 320

Tall,283 Tschirnhaus, E.W. von, 287 Technical saturation magnetiza-

tion, 226 Telescope, 172 Tell, 283 Temperature coefficient of resis­

tivity, 182

Temperature dependence of fer-romagnetism, 227

Tempered g!ass, 308, 373 Tempering, 125, 127, 141, 144 Tensile strength, 15

of glass, 308 Tensile stress, 13 Tensile tester, 12 Termination by combination,

339 Ternary phase diagrams, 87-88,

89 Terra cotta, 284 Tertiary creep region, 119 Tesla (unit), 219 Tetracalcium aluminoferrite, 310 Tetragonal crystal structure, 33 Tetrahedron, 28 Texture, 232 Thailand, 68 Thales of Miletus, 170 Thermal arrest, 82 Thermal conduction, 266,

272-276 Thermal conductivity, 265, 273 Thermal electricity, 170 Thermal emission, 254 Thermal energy, 103 Thermal expansion, 265, 276-278 Thermal expansion coefficient,

152 Thermal insulation, 265 Thermal properties of materials,

265-278 Thermalshock,299 Thermocouple, 206-207 Thermoelectric phenomena,

206-208 Thermoelectric power, 206 Thermoelectric power generator,

207 Thermoelectric refrigerator, 208 Thermoluminescence dating, 290 Thermomigration, 109 Thermoplastic polymer, 333,

340, 342, 345 Thermoplastics, 345 Thermosets, 335, 340, 344, 345 Thermosetting polymer, 340, 342 Thin magnetic films, 236 Thomson, G. P., 179 Thomson, J. J., 178 Threshold energy for photon ab­

sorption, 250

Tie line, 77 Timber, 357, 359 Time between collisions, 185 Timna Valley, 8, 10 Tin, 64, 67, 126 Tin glaze, 285 Tin plague, 38 Titanium diborate, 311 Toledo (Spain), 129 Tools, 281 Toughness, 22 Tow, 326 Transducer, 215 Transformer, 229 Transient creep, 118 Transistor, 196, 199 Translucent dielectric, 246 Transmissivity, 245 Transoidal polyacetylene, 201 Transparent matter, 169, 246 Tricalcium aluminate, 310 Tricalcium silicate, 310 Triclinic crystal structure, 33 Trinitrate of cellulose, 333 True strain, 19 True stress, 19 TTT diagram, 141, 142

for hypoeutectoid plain-car­bon-steel, 145

for noneutectoid steels, 144 Tungstate, 254 Tungsten carbide, 311 Turkey, 124 Turquoise, 296 Tutankhamen, 353 Tuyere, 6, 131 Twinning, 37, 53, 143 Two-phase region, 76, 81 Two-tone bell, 69-70

Ultimate tensile strength, 16 Ultimate tensile stress, 16 Ultra-large-scale integration

(ULSI), 196 Uneticians, 71

Unpaired electron, 338 Unsaturated bond, 338 Unvitrified ware, 284 Upper bainite, 142 Upper yield point, 17

Vacancy, 25, 102, 103 Vacancy concentration, 103 Valence angle, 29 Valence band, 192 Valence electron, 29, 177, 185 Van der Waals bond, 30-31 Vama, 353 Vegetable fiber, 316, 324-327 Vellum, 331 Venus of Vestonice, 7, 282, 283 Vermiculite, 292 Vibrations of lattice atoms, 251 Vicalloy, 234 Vickers hardness, 21 Virgin iron, 226 Viscoelastic region, 19 Viscose, 316 Viscosity, 120, 336 Viscosity-temperature diagram

(glass), 307 Viscous stage, 347 Vision, 172 Vitreous electricity, 170 Vitreous silica, 46 Vitrification, 286, 294 Vitrified ware, 284 Voltage, 180 Voltaic electricity, 170 Volume diffusion, 106 Von Stahel und Eysen, 130 Vortex state, 191 Vulcanization, 319, 344

Waste, 370-372 Waterline corrosion, 159 Wave-particle duality

of electrons, 178 of light, 241

Index 407

Wavelength of light, 241 Weapon, 71, 281 Weathering steel, 152 Weaving (linen), 315 Wedgwood, J., 285, 286 Wheels, 126 White cast iron, 148-149 White graphite, 292 White X-radiation, 260 Widmanstätten structure, 93 Wiedemann-Franz law, 265 Wieland, 131 Wilm, A., 89 Wood, 3, 327-330

mechanical properties of, 15, 17, 327

tensile strengths of, 330 Wood production, 359 Wool, 4, 314, 321-322, 325 Wootz steel, 129 Work hardening, 19,51,62,99,

122, 189 Working point, 307 Working range, 307 World reserves of materials,

358-362 Wrapping paper, 367 Wrought iron, 124, 127, 129

X-rays, 259 Xylem, 328

Yam, 324, 326 Yield of land, 362 Yield strength, 14, 74, 75 Young's modulus, 16

Zeiss, c., 299 Zheng-Zhou, 127 Zinc blende structure, 46 Zirconia, 311 ZnS, 254 Zone refining, 193 Zr02-MgO,94

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