A New Definition forHigh Speed and Accuracy

AD898Automatic Die Bonder

A New Definition forHigh Speed and Accuracy

Bonding System

◆ High speed - 320ms system cycle time

◆ XYZ bondhead with decoupled YZ motion

◆ Capable of handling die sizesbetween 10 x 10 - 1000 x 1000 mil(0.25 x 0.25 - 25.4 x 25.4 mm)

◆ Capable of handling multi-placement/matrix leadframes and leadframeswith downset

Wafer Handling System◆ Automatic wafer handling system with

wafer cassette elevator for up to 8"(200 mm) wafer

◆ Motorized wafer expander withprogrammable expansion

◆ Ejector system with programmableejector height

Workholder System◆ Universal workholder with block

design concept

◆ Linear motor indexer with flexibleindexing clamp

◆ Motorized downset adjustment onworkholder

Epoxy Writer System◆ Real time position alignment

◆ 2-in-1 epoxy writing system withsyringe dispensing capability

◆ Standard epoxy patterns providedwith flexibility to generate customizedpattern

Material Handling System◆ Stack loader with interleaf paper

separator

◆ Leadframe box handling capability

Vision System◆ Multi-grey levels PR system

◆ CCD targeting systems with zoomlenses

◆ Automatic bad unit, pre-bond & post-bond inspection

◆ Advanced defect detection at waferstage

Control System◆ PC based control system

◆ Interactive menu driven control anddata logging capability

◆ Process recipe storage on hard diskand/or floppy disk

◆ SECS I & II Communication

◆ Bar code reader for wafer mapping

Options◆ Small die kit (10 x 10 mil - 200 x 200 mil)

◆ Stacked die kit including heaterassembly

◆ BGA handling kit

◆ Boat handling kit (for SBGA)

◆ Waffle pack handling kit

◆ Rotary collet bond arm

◆ Wafer mapping protocol

◆ Strip marker with characters

◆ Air ionizer system

◆ Intelligent epoxy dispensing controller

◆ Multiple die attach process for MCMusing cascade linkage concept

◆ In-line capability

◆ Multiple magazine input system

AD898 Features

Advanced Wafer Inspection

Standard 2 in 1 Epoxy Writer

Wafer Handling System

Bond Arm

Bonding SystemBonding System

Bad UnitRejection

EpoxyAlignment

Stacked DieAlignment

Advanced Wafer Inspection◆ Detect all possible defects/features at wafer stage

Standard 2 in 1 Epoxy Writer◆ Real time PRS

◆ Dispensing area

• Maximum 3" for Y

Wafer Handling System◆ Programmable wafer expander

◆ 5 minutes conversion

◆ Optional wafer ring and waffle pack holders

Bond Arm◆ Decoupled YZ axis

◆ Large vertical clearance for premoldedpackage

Y motor

Z motor

Light weightbond arm

Wafer Expanders

Edge Die Scratched Die

Broken DieRotated Die Broken DieRotated Die Die withWashed Ink

Edge Die Scratched Die

Die withWashed Ink

Device withMinimal Pattern

Device withMinimal Pattern

Waffle PackHolder

For 6" and 8"Film Frame

For 6" ODWafer Ring

Configuration forSubstrate Sensitive to Scratche.g. FlexBGA, Pre-molded LF

Configuration forAdhesive Tape Bonding e.g.

Modular Track Design

Workholder System wWorkholder System w

Configuration forSubstrate Sensitive to Scratche.g. FlexBGA, Pre-molded LF

Configuration forAdhesive Tape Bonding e.g.

Modular Track Design

◆ Block by block conversion concept for universalconfigurations

• anvil blocks

• window clamps

• press rollers

• heater blocks

Press Rollers

Stacked CSPFlexBGA Leadframe Premolded Leadframe

Motorized TopClamp

Workholderwithout CentralSupportingBlocks

PremoldedLeadframe

Tape

Rear Track

Front Track

Stacked CSPConfiguration forSingulated Unit e.g. CLCC

Flexible Anvil Block Assembly

with Built-in Flexibilitywith Built-in Flexibility

Stacked CSPConfiguration forSingulated Unit e.g. CLCC

Flexible Anvil Block Assembly

◆ Optional pre-installed heater plate assembly

• Good heat distribution control

• Anvil block conversion only

• Quick plug-in design

Anvil Blockfor ElevatedTemperature

Bonding

NormalSubstrate

Anvil Block

Heater plateassembly fixedon track

Carrier for CLCCCLCC Device

Motorized Up/DownAnvil Block

Workholderwithout CentralSupportingBlocks

MotorizedTop Clamp

Anvil Blockwith HeatingPlate

Bonded Sample

Requirement :High UPH

Die HandlingRequirements

Thick

ThinLong

SmallLarge

Die Handling Capabilities

Flexible Package ApplicationsRequirement :Control of die tilt

Requirement :Control of placementaccuracy

Requirement :Control of epoxybleeding

Die Handling Capabilities

Flexible Package ApplicationsRequirement :Control of die tilt

Requirement :Control of placementaccuracy

Requirement :Control of epoxybleeding

358 mil x 21 mil (1:17)

Die thickness:44 mil

Die thickness: 3 mil

800 mil x 800 mil 10 mil x 10 mil

Die HandlingRequirements

Thick

ThinLong

SmallLarge

Requirement :High UPH

Manufacturing AutomationManufacturing Automation

Wafer Map Strip Map

Post Bond Inspectionwith Real Time Data One Pass Multi-die

Application

TCP / IP and / or RS232

CELL CONTROL MODULES* Connection Management* Job (or Lot) Management* Auto WIP Tracking* Strip Map Management* Equipment Management* Statistical Data Collection* Recipe & Wafer Management* Alarm Management

Cell ControllerCell Controller

GUI Design

Database

Equipment Drivers

TCP / IP

○ ○ ○ ○ ○ ○ ○ ○ ○ ○

MESMES

Customer CIM System

For further information, please contact our regional offices

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CC2

* Technical details are subject to change without prior notice

Die size 10 x 10 mil - 1000 x 1000 mil(0.25 x 0.25 mm - 25.4 x 25.4 mm)

Package handled Leadframe, BGA

Ejector height 0" - 0.2" (0 - 5 mm) linearprogrammable

Leadframe sizeLength 6.0" - 11.4" (150 - 290 mm)Width 0.6" - 3.15" (15 - 80 mm)

3" (76.2 mm) Y-axis bond areaThickness 4 - 79 mil (0.1 - 2 mm)

> 0.75mm : require conversionMagazine size

Length 6.0" - 11.4" (150 - 290 mm)Width 0.6" - 3.35" (15 - 85 mm)Height 2.7" - 6.0" (70 - 153 mm)

Speed

Cycle Time 320ms

Wafer Stage

Wafer size Max. 8" (200 mm)XY table travel 9.5" x 9.5" (237.5 x 237.5 mm)Conversion 5 mins (Device only)Conversion 15 mins (Full conversion)

Epoxy Writer

XY travel 2" x 3" (50.8 x 76.2 mm)Resolution

XY 0.02 mil (0.5 µm)Z 0.15 mil (3.81 µm)

SpecificationsBondhead

Bond force 30 - 2000 g

Pattern Recognition System

PRS model Multi-grey levels PRSCamera resolution 512 pixels x 512 pixelsGrey scale 256 grey levelsPosition accuracy ± 1/4 pixelAngle accuracy ± 0.1˚

System Accuracy

XY placement ± 1 mil (± 25.4 µm) @ 3σθ rotation ± 0.5˚ @ 3σ

Facilities Required

Voltage 110/220 VAC (pre-set at factory)Frequency 50/60 Hz (pre-set at factory)Compressed air 87 PSI

Power consumption Approx. 1800 W

Dimensions & Weight

L x W x Hw/o input mag. 50.0" x 43.3" x 68.9"

(1270 x 1100 x 1750 mm)w/ input mag. 58.7" x 43.3" x 68.9"

(1490 x 1100 x 1750 mm)

Net weight 2772 lb (1260 kg)

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