axel-x evaluation board hardware manual - fujitsu · 5.3.2 axel-x bottom view of evaluation...
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AXEL-X Evaluation Board Hardware Manual
REVISION 1.1
This document contains confidential information which shall not be reproduced or transferred to other documents or disclosed to others or used for manufacturing or any other purpose without prior written permission from FUJITSU Ltd. All information contained in this document is subject to change without notice. While the information contained herein is believed to be accurate, such information is preliminary, and should not be relied upon for accuracy or completeness.
Copyright © 2006 FUJITSU LTD. All rights reserved. - 2 -
Table of Contents1.0 ABOUT THIS MANUAL.......................................................................................... 3
1.1 DOCUMENT OVERVIEW ............................................................................................. 3 1.2 ACRONYMS ............................................................................................................... 3
2.0 HARDWARE OVERVIEW...................................................................................... 4 2.1 EVALUATION BOARD BLOCK DIAGRAM.................................................................... 5 2.2 POWER DIAGRAM...................................................................................................... 6 2.3 POWER MONITOR DIAGRAM...................................................................................... 6 2.4 CLOCK DIAGRAM ...................................................................................................... 7 2.5 RESET DIAGRAM ....................................................................................................... 7
3.0 AXEL-X CONNECTIONS ....................................................................................... 8 3.1 AXEL-X TO XFP CONNECTION ................................................................................ 8 3.2 AXEL-X TO CX4 CONNECTION................................................................................ 9 3.3 AXEL-X TO GMII/MII CONNECTION..................................................................... 10 3.4 AXEL-X TO CONFIGURATION DIP SWITCHES, STATUS AND IRQ........................... 10
4.0 AXEL-X EVALUATION BOARD SETTINGS.................................................... 11 4.1 AXEL-X EVALUATION BOARD HEADERS............................................................... 11 4.2 AXEL-X EVALUATION BOARD JUMPERS................................................................ 13 4.3 AXEL-X EVALUATION BOARD DIP SWITCHES ....................................................... 14
5.0 PHYSICAL OVERVIEW ....................................................................................... 19 5.1 HSIO INTERFACE .................................................................................................... 19 5.2 LAYER STACK-UP ................................................................................................... 20 5.3 AXEL-X PHYSICAL BOARD VIEW .......................................................................... 21
5.3.1 AXEL-X Top View of Evaluation Board ........................................................ 21 5.3.2 AXEL-X Bottom View of Evaluation Board................................................... 22
This document contains confidential information which shall not be reproduced or transferred to other documents or disclosed to others or used for manufacturing or any other purpose without prior written permission from FUJITSU Ltd. All information contained in this document is subject to change without notice. While the information contained herein is believed to be accurate, such information is preliminary, and should not be relied upon for accuracy or completeness.
Copyright © 2006 FUJITSU LTD. All rights reserved. - 3 -
1.0 About This Manual This document describes the Fujitsu AXEL-X 10 Gigabit Ethernet evaluation board.
1.1 Document Overview The documents includes a description of the following:
• Hardware Block Diagram • Hardware References • Signal Timing • Register Description • Board Layout
1.2 Acronyms GBE Gigabit Ethernet GMII Gigabit Medium Independent Interface HSIO High Speed Input/Output LVDS Low Voltage Differential Signal MDIO Management Data Input/Output MDII Medium Independent Interface PHY Physical Layer Device XAUI 10 Gigabit Attachment Unit Interface XGP 10 Gigabit Ethernet Pluggable Transceiver
This document contains confidential information which shall not be reproduced or transferred to other documents or disclosed to others or used for manufacturing or any other purpose without prior written permission from FUJITSU Ltd. All information contained in this document is subject to change without notice. While the information contained herein is believed to be accurate, such information is preliminary, and should not be relied upon for accuracy or completeness.
Copyright © 2006 FUJITSU LTD. All rights reserved. - 4 -
2.0 Hardware Overview The AXEL-X chip contains the following:
1. Power Supply • 1.2V • 2.5V
2. Reference Clock • 156.25 MHz LVDS • 6 Clock Inputs
3. Package • FCBGPA1156 (1 mm, 35mm x 35mm)
4. Total Power Consumption • 15W to 20W Typical
5. Interface • 20 HSIO Interfaces • 2 GMII Interfaces • 2 I2C Interfaces • 2 MDIO Interface
2.1 Evaluation Board Block Diagram The evaluation board consists of the following blocks:
• 2 GMII/MII PHYs • Headers and Test Points • AXEL-X Reset Switch • I2C Interface • I2C Switch • 156.25 Crystal Oscillator • AXEL-X Ethernet Switch • EEPROM • 16 CX4 Interfaces • 4 XFP Interfaces
AXEL-X
CX4PORT
1
CX4PORT
3
XFPPORT
1
CX4PORT
16
CX4PORT
2
16 XAUI
4 X 10GBE
SERIALLANES
XFPPORT
2
XFPPORT
3
XFPPORT
4
I2C Switch
I2C
EEPROM
I2C
CLOCK BUFFER
156.25 MHz
x 6CLOCKS
GBEPHY
GBEPHY
RESET
HEADER
0.80V 1.2V 2.5VVOLTAGEMONITOR
This document contains confidential information which shall not be reproduced or transferred to other documents or disclosed to others or used for manufacturing or any other purpose without prior written permission from FUJITSU Ltd. All information contained in this document is subject to change without notice. While the information contained herein is believed to be accurate, such information is preliminary, and should not be relied upon for accuracy or completeness.
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2.2 Power Diagram
DC to DCConverter
DC to DCConverter
DC to DCConverter
12 Volts
VoltageRegulator
5V_INT
VoltageRegulator
VoltageRegulator
VoltageRegulator
VoltageRegulator
3.3V
1.2V
2.5V_VDE
1.8V
2.5V_VDP
2.5V
VoltageRegulator
1.2V_VDD
1.2V_VDN
5V
1.2V_AVD
1V_REF
2.3 Power Monitor Diagram
1V_REF
1V_REF
1V_REF
1V_REF
2.5V_VDE
2.5V_VDP
1.2V_VDD
1.2V_VDN
POWER GOOD MONITOR
This document contains confidential information which shall not be reproduced or transferred to other documents or disclosed to others or used for manufacturing or any other purpose without prior written permission from FUJITSU Ltd. All information contained in this document is subject to change without notice. While the information contained herein is believed to be accurate, such information is preliminary, and should not be relied upon for accuracy or completeness.
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2.4 Clock Diagram
2.5V
CLOCK LVDSREPEATER
6 LVDS 156.25MHz Signals that
go to AXEL156.25 MHzSignals
2.5 Reset Diagram
2.5V
POWER GOOD MONITOR
LOW PASS FILTERWITH 100us delay
RESET AXEL PLL
RESET AXEL
RESET I2C SWITCH
RESET GBE PHY
This document contains confidential information which shall not be reproduced or transferred to other documents or disclosed to others or used for manufacturing or any other purpose without prior written permission from FUJITSU Ltd. All information contained in this document is subject to change without notice. While the information contained herein is believed to be accurate, such information is preliminary, and should not be relied upon for accuracy or completeness.
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3.0 AXEL-X Connections This sections describes the AXEL-X connections to the following:
• AXEL-X connections to XFP modules • AXEL-X connections to CX4 connectors • AXEL-X connections to GMII/MII PHYs.
3.1 AXEL-X to XFP Connection
AXEL-X
VCC5
5V
VCC5 VCC3VCC3 VCC2VCC2
XO_Pnn_TXx[0]
XO_Pnn_TXx[3]
XO_Pnn_TXx[0]
XO_Pnn_TXx[3]
XI_Pnn_TXx[0]
XI_Pnn_TXx[0]
5V_XFP
3.3V 3.3V_XFP
1.8V_XFP 1.8V
XFPTD+
TD-
REFCLK+
REFCLK-
RD+
RD-
P_DOWN/RST
TX_DIS
MOD_DESEL
INTERRUPT
RX_LOS
MOD_NR
MOD_ABS
SCL
SDA
DIP SW (GND)
DIP SW (GND)
DIP SW (GND)
RED (L) LED (3.3V PULL UP)
RED (H) LED (3.3V PULL UP)
RED (H) LED (3.3V PULL UP)
RED (H) LED (3.3V PULL UP)
I2C SWITCH (3.3V PULL UP)
I2C SWITCH (3.3V PULL UP)
Polarity can be swapped. 161 MHz reference can go on any layer
This document contains confidential information which shall not be reproduced or transferred to other documents or disclosed to others or used for manufacturing or any other purpose without prior written permission from FUJITSU Ltd. All information contained in this document is subject to change without notice. While the information contained herein is believed to be accurate, such information is preliminary, and should not be relied upon for accuracy or completeness.
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3.2 AXEL-X to CX4 Connection
AXEL-X
RX0+
RX3-
RX3+
RX2-
RX2+
RX1-
RX1+
RX0-
CX4 Connector
S01
S07
S06
S05
S04
S03
S02
S08
TX0-
TX3+
TX2+
TX2-
TX1+
TX1-
TX0+
TX3-
S16
S15
S14
S13
S12
S11
S10
S09
Note: Both Tx and Rx polarity lanes can be swapped. Note: DC Blocking caps for RX lanes are required.
This document contains confidential information which shall not be reproduced or transferred to other documents or disclosed to others or used for manufacturing or any other purpose without prior written permission from FUJITSU Ltd. All information contained in this document is subject to change without notice. While the information contained herein is believed to be accurate, such information is preliminary, and should not be relied upon for accuracy or completeness.
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3.3 AXEL-X to GMII/MII Connection
PHY
3.3V 1.2V2.5V 1.2V_PHY
XO_GTK_CLK1
XO_TXD1[7:0]
XO_TX_EN1
XO_TX_ER1
XI_RX_CLK1
XI_RX_D1[7:0]
XI_RX_DV1
XI_RX_ER1
XI_TX_CLK1
XI_COL1
XI_CRS1CRS
COL
RXER
RXDV
RXD[0:7]
RXCLK
TXER
TXEN
TXD[0-7]
GTXCLK
TXCLK
RJ45CONNECTORTXVxx
CMODE[7:0]
RESET
TXDIS
USER SPECIFIED
NEED RESET SEQ
XTALK1/225 MHz
CLKOUTMICRO
MODDEF0
MODDEF1
MODDEF2
MDINT
EECLK
EEDAT
LED[4:0]
AXEL-X
PULL DOWN
NO CONNECT
PULL DOWN
HEADER
HEADER
2.5V PULL UP
DIP SW
LEDs
3.4 AXEL-X to Configuration DIP Switches, Status and IRQ
AXEL-X
DIP SWITCHESXI_CONFIG[7:0]
XO_IRQ_N[2:0]
2.5V_VDE
TO HEADERAND LEDs
XO_STS_OUT[8:0]CYCLE STATUSGENERATION
LOGICLEDs
HEADER
This document contains confidential information which shall not be reproduced or transferred to other documents or disclosed to others or used for manufacturing or any other purpose without prior written permission from FUJITSU Ltd. All information contained in this document is subject to change without notice. While the information contained herein is believed to be accurate, such information is preliminary, and should not be relied upon for accuracy or completeness.
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4.0 AXEL-X Evaluation Board Settings The AXEL-X evaluation boards is equipped with a number of different headers, jumpers, potentiometers and dip switches used to monitor, configure and vary different voltages. This section describes these components and their uses.
4.1 AXEL-X Evaluation Board Headers
This document contains confidential information which shall not be reproduced or transferred to other documents or disclosed to others or used for manufacturing or any other purpose without prior written permission from FUJITSU Ltd. All information contained in this document is subject to change without notice. While the information contained herein is believed to be accurate, such information is preliminary, and should not be relied upon for accuracy or completeness.
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This document contains confidential information which shall not be reproduced or transferred to other documents or disclosed to others or used for manufacturing or any other purpose without prior written permission from FUJITSU Ltd. All information contained in this document is subject to change without notice. While the information contained herein is believed to be accurate, such information is preliminary, and should not be relied upon for accuracy or completeness.
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Headers Description J34 CLK00_STS[5:0] J35 JTAG PHY1 J36 AXEL_STS[8:0] J37 CLK01_STS[5:0] J38 I2C #1 HEADER FOR DEBUG J39 I2C #2 HEADER FOR EEPROM J40 CLK10_STS[5:0] J41 MDIO #1 J42 MDIO #2 J43 JTAG PHY2 J44 CLK11_STS[5:0] J45 AXEL_TEST_HEADER J46 JTAG AXEL-X HEADER J47 AXEL INTERRUPT HEADER J49 1.2V_VDD J51 1.2V_VDD J53 GND J54 1.2V_VDN J55 1.2V_VDN J57 GND J71 3.3V AND 2.5V_VDE JX1 I2C #1 HEADER FOR DEBUG JX2 I2C #2 HEADER FOR EEPROM JY1 MDIO #1 JY2 MDIO #2
4.2 AXEL-X Evaluation Board Jumpers
Headers Description J5 If high (on) EEPROM write is disabled J8 SMA connector used for external clock input J9 If low (off) 156.25 MHz XTAL is disable J10 SMA connector used to measure clock J50 If low 1.2V_VDD is disabled J52 If low 5V_INT is disabled. J56 If low 1.2V_VDN is disabled. J58 Jumper for 0.80V_VDR J59 Jumper for 0.80V_VDR J63 Jumper for external 2.5V_VDE J64 Jumper for external 2.5V_VDE J65 If low 2.5V_VDE is disabled J66 Jumper for external 2.5V_VDP J67 Jumper for external 2.5V_VDP J68 If low 2.5V_VDP is disabled
This document contains confidential information which shall not be reproduced or transferred to other documents or disclosed to others or used for manufacturing or any other purpose without prior written permission from FUJITSU Ltd. All information contained in this document is subject to change without notice. While the information contained herein is believed to be accurate, such information is preliminary, and should not be relied upon for accuracy or completeness.
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4.3 AXEL-X Evaluation Board Dip Switches
This document contains confidential information which shall not be reproduced or transferred to other documents or disclosed to others or used for manufacturing or any other purpose without prior written permission from FUJITSU Ltd. All information contained in this document is subject to change without notice. While the information contained herein is believed to be accurate, such information is preliminary, and should not be relied upon for accuracy or completeness.
Copyright © 2006 FUJITSU LTD. All rights reserved. - 14 -
This document contains confidential information which shall not be reproduced or transferred to other documents or disclosed to others or used for manufacturing or any other purpose without prior written permission from FUJITSU Ltd. All information contained in this document is subject to change without notice. While the information contained herein is believed to be accurate, such information is preliminary, and should not be relied upon for accuracy or completeness.
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SW1
Dip
Switch Description
1 XI_CONFIG0 Reserverd
2 XI_CONFIG1 EEPROM Presence
1: EEPROM Present 0: EEPROM not present
3 XI_CONFIG2 I2C Bus Speed
1: 400KHz 0: 100KHz
4 XI_CONFIG3 Buffer Configuration 1: For Management
0: Default 5 6 7
XI_CONFIG[6:4] Lower 3 bits of slave address. Valid configuration 3’b001-3’b111
8 XI_CONFIG7
1: Disable Chatter Filter 0: Enable Chatter Filter
SW2
Dip
Switch Description
1 Power down XFP Port 1 2 Disable Tx XFP Port 1 3 MOD_DESEL XFP Port 1 6 Power down XFP Port 5 7 Disable Tx XFP Port 5 8 MOD_DESEL XFP Port 5
This document contains confidential information which shall not be reproduced or transferred to other documents or disclosed to others or used for manufacturing or any other purpose without prior written permission from FUJITSU Ltd. All information contained in this document is subject to change without notice. While the information contained herein is believed to be accurate, such information is preliminary, and should not be relied upon for accuracy or completeness.
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SW3
Dip Switch
Description
1 Power down XFP Port 6 2 Disable Tx XFP Port 6 3 MOD_DESEL XFP Port 6 6 Power down XFP Port 2 7 Disable Tx XFP Port 2 8 MOD_DESEL XFP Port 2
This document contains confidential information which shall not be reproduced or transferred to other documents or disclosed to others or used for manufacturing or any other purpose without prior written permission from FUJITSU Ltd. All information contained in this document is subject to change without notice. While the information contained herein is believed to be accurate, such information is preliminary, and should not be relied upon for accuracy or completeness.
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SW4
Dip Switch
Description
1 HTMODE HSIO Test Mode Select
1: Test Mode 0: Normal
2 HTSCK HSIO Test Clock
3 HTXRST HSIO Test Register
Active Low 4 SCK
Auxiliary Clock Input for test mode. 5 PLLBP
PLL Bypass Mode Input 1: Bypass 0: Normal
6 VPD1 IDDQ test control input
1: Test mode 0: Normal
7 VPD2 IDDQ Test control input
1: Test mode 0: Normal
This document contains confidential information which shall not be reproduced or transferred to other documents or disclosed to others or used for manufacturing or any other purpose without prior written permission from FUJITSU Ltd. All information contained in this document is subject to change without notice. While the information contained herein is believed to be accurate, such information is preliminary, and should not be relied upon for accuracy or completeness.
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SW5
Dip
Switch Description
1 Stop RTC task for I2C Port-2 test. RTC can be restarted by hardware reset.
2 Disable host-port isolation upon Sync. (so that the eval board can be used as a private-LAN component)
3 Port-21 Mode. 0=1000BaseT FDX, 1=100/10BaseT FDX. (this bit is checked after reset)
4 Port-23 Mode. 0=1000BaseT FDX, 1=100/10BaseT FDX. (this bit is checked after reset)
5 Port-21 Isolation. 1=Port-21 is excluded from the default VLAN membership.
6 Port-23 Isolation. 1=Port-23 is excluded from the default VLAN membership.
7 Flow Control Enable. 1=PAUSE Flow Control enabled. (Note: this bit can be change at any time)
8 Port Initialization Control. 1=stop port initialization after reset. 1->0: restart port initialization
5.0 Physical Overview This section will describe the following:
• HSIO Interface • Trace Length • Layer Stack-up • Top and Bottom View of AXEL-X Evaluation Board
5.1 HSIO Interface The AXEL-X evaluation board is configured to use 16 CX4 interfaces and 4 XFP interfaces.
11
10
14
18
9
15
8
9
13
17
16
12
7 403
6 512
CX4 CX4
CX4
CX4
CX4
CX4
CX4CX4
CX4
CX4
CX4
CX4
CX4
CX4
CX4
CX4
XFP
XFP
XFP
XFP
AXEL TOPVIEW
This document contains confidential information which shall not be reproduced or transferred to other documents or disclosed to others or used for manufacturing or any other purpose without prior written permission from FUJITSU Ltd. All information contained in this document is subject to change without notice. While the information contained herein is believed to be accurate, such information is preliminary, and should not be relied upon for accuracy or completeness.
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This document contains confidential information which shall not be reproduced or transferred to other documents or disclosed to others or used for manufacturing or any other purpose without prior written permission from FUJITSU Ltd. All information contained in this document is subject to change without notice. While the information contained herein is believed to be accurate, such information is preliminary, and should not be relied upon for accuracy or completeness.
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5.2 Layer Stack-Up The evaluation board is 14 layers. The layer stack up is as follows:
Layers Type 1 Signal 2 Ground 3 Signal 4 Ground 5 Power 6 Ground 7 Power 8 Ground 9 Power 10 Power 11 Ground 12 Signal 13 Ground 14 Signal
5.3 AXEL-X Physical Board View This section shows the top and bottom view of the AXEL-X evaluation board. 5.3.1 AXEL-X Top View of Evaluation Board
This document contains confidential information which shall not be reproduced or transferred to other documents or disclosed to others or used for manufacturing or any other purpose without prior written permission from FUJITSU Ltd. All information contained in this document is subject to change without notice. While the information contained herein is believed to be accurate, such information is preliminary, and should not be relied upon for accuracy or completeness.
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5.3.2 AXEL-X Bottom View of Evaluation Board
This document contains confidential information which shall not be reproduced or transferred to other documents or disclosed to others or used for manufacturing or any other purpose without prior written permission from FUJITSU Ltd. All information contained in this document is subject to change without notice. While the information contained herein is believed to be accurate, such information is preliminary, and should not be relied upon for accuracy or completeness.
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