brightener for zinc and zinc alloy electrolytes

2
containing alkyl polyglycoside surfactant mixtures. DEVICE FOR ELECTROLYTIC TREATMENT OF CIRCUIT BOARDS U.S. Patent 6,238,529. May 29, 2001 J. Geissler et al., assignors to Atotech Deutschland GmbH, Berlin, Germany An apparatus for electrolytically treating printed circuit boards and conductor foils using an elec- trolytic fluid, through which ap- paratus the printed circuit boards or conductor foils are continu- ously guidable in a plane of con- veyance in a substantially hori- zontal direction. IN-SITU DISPLACEMENT/STRESS CONTROL IN ELECTROPLATING U.S. Patent 6,238,539. May 29, 2001 R.J. Joyce et al., assignors to Hughes Electronics Corp. A method for controlling electro- plated film shrinkage or expan- sion relative to a substrate and resulting in substrate displace- ment comprising disposing the substrate for electroplating with a cathode in a fountain plating sys- tem; disposing a plating material with an anode in the fountain plating system; disposing a plat- ing solution in the fountain plat- ing system; maintaining the tem- perature of the fountain plating system at a constant level; estab- lishing a flow of current between a power supply, the cathode and the anode; directly measuring a dis- placement of the substrate itself through a displacement senior system so as to eliminate the need for a comparative measurement of a dummy part, the displacement occurring upon the flow of current resulting in an electroplated film on the substrate; and controlling the flow of current to the cathode and the anode in response to a displacement measurement of the substrate itself. BRIGHTENER FOR ZINC AND ZINC ALLOY ELECTROLYTES U.S. Patent 6,238,542. May 29, 2001 T. Helden, Solingen, Germany A process for galvanic precipita- tion of zinc deposits and/or zinc alloy deposits comprising provid- ing an aqueous acid electrolyte ef- fective for galvanic precipitation of a zinc or zinc alloy deposit on a Dry 250 Ibs. of small parts in seconds ~w Holland dryersare the right choice to dry your parts spot-free in 60 ;econds. Heavy-duty construction gives you years of dependableservice. Model capacities: 7, 75, 150 and 250 Ibs. Phone (717) 355-1458 or Fax (717) 355-3440 New Holland North America, Inc. P.O. Box 262 New Holland, PA 17557 www.newholland.com/na/Products/Dryers.html See us at SUR/FIN 2002 Booth #1103 ~W HOLLAN:) Circle 146 on reader card or go to www.thru.to/webconnect Circle 050 on reader card or go to www,thru.to/webconnect June 2002 157

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Page 1: Brightener for zinc and zinc alloy electrolytes

conta in ing alkyl polyglycoside surfactant mixtures.

DEVICE FOR ELECTROLYTIC TREATMENT OF CIRCUIT BOARDS U.S. Patent 6,238,529. May 29, 2001 J. Geissler et al., assignors to Atotech Deutschland GmbH, Berlin, Germany

An apparatus for electrolytically t rea t ing pr inted circuit boards and conductor foils using an elec- trolytic fluid, through which ap- paratus the printed circuit boards or conductor foils are continu- ously guidable in a plane of con- veyance in a substantial ly hori- zontal direction.

IN -S ITU D ISPLACEMENT/STRESS CONTROL IN ELECTROPLATING U.S. Patent 6,238,539. May 29, 2001

R.J. Joyce et al., assignors to Hughes Electronics Corp.

A method for controlling electro- plated film shrinkage or expan- sion relative to a substrate and result ing in substrate displace- ment comprising disposing the substrate for electroplating with a cathode in a fountain plating sys- tem; disposing a plating material with an anode in the fountain plating system; disposing a plat- ing solution in the fountain plat- ing system; maintaining the tem- perature of the fountain plating system at a constant level; estab- lishing a flow of current between a power supply, the cathode and the anode; directly measuring a dis- placement of the substrate itself through a displacement senior

system so as to eliminate the need for a comparative measurement of a dummy part, the displacement occurring upon the flow of current resulting in an electroplated film on the substrate; and controlling the flow of current to the cathode and the anode in response to a displacement measurement of the substrate itself.

BRIGHTENER FOR Z INC A N D Z INC ALLOY ELECTROLYTES U.S. Patent 6,238,542. May 29, 2001 T. Helden, Solingen, Germany

A process for galvanic precipita- tion of zinc deposits and/or zinc alloy deposits comprising provid- ing an aqueous acid electrolyte ef- fective for galvanic precipitation of a zinc or zinc alloy deposit on a

Dry 250 Ibs. of small parts in seconds

~w Holland dryers are the right choice

to dry your parts spot-free in 60

;econds. Heavy-duty construction gives

you years of dependable service.

Model capacities: 7, 75, 150 and

250 Ibs.

Phone (717) 355-1458 or Fax (717) 355-3440 New Holland North America, Inc. P.O. Box 262 New Holland, PA 17557 www.newholland.com/na/Products/Dryers.html

See us at SUR/FIN 2002 Booth #1103

~W HOLLAN:)

Circle 146 on reader card or go to www.thru.to/webconnect Circle 050 on reader card or go to www,thru.to/webconnect

June 2002 157

Page 2: Brightener for zinc and zinc alloy electrolytes

metal l ic surface containing at least one bath soluble zinc salt and a high gloss enhancing agent effective for impar t ing a high gloss on the subsequent deposit, said high gloss agent selected from the group consisting of N- a lkyla ted pyrazolenes, N-alky- lated pyroles, N-alkylated imida- zoles, N-alkylated quinolines, and mixtures thereof, wherein the al- kyl group attached to the nitrogen has three or greater carbon at- oms, quar ternary salts, and mix- tures thereof; and depositing a high gloss zinc or zinc alloy coat- ing on the metallic surface.

APPARATUS FOR PAINTING VEHICLE BODIES U.S. Patent 6,238,646. May 29, 2001 H. Fukuoka et al., assignors to

Honda Giken Kogyo KK Tokyo, Japan

A method of painting successively carried vehicle bodies with a suit- able color paint selected from a variety of primary color paints.

ELECTHOLESS PLATING PROCESS U.S. Patent 6,238,749. May 29, 2001 N.P. Willard et al., assignors to U.S. Philips Corp., New York, N.Y.

A method of providing a metal pat tern on an electrically insulat- ing subs t ra te in an electroless process, in which method the sub- s trate is pret reated and subse- quently exposed to light according to a pattern, whereafter the sub- strate is brought into contact with an aqueous metal salt solution to metallize unexposed areas of the

substra te , thereby forming the metal pat tern on the substrate character ized in tha t the sub- strate is a glass substrate and is pretreated by bringing it into con- tact with an aqueous tin-free pal- ladium sol, which is stabilized with a water -so luble polymer, thereby depositing palladium nu- clei on the substrate, and in that the substrate, thus provided with the palladium nuclei, is exposed ac- cording to the pattern to a pulsed laser light beam of such energy con- tent per pulse that the palladium nuclei are removed from the ex- posed areas and in that an electro- less metallization bath is used to metallize the unexposed areas of the substrate thereby forming the metal pattern on the substrate.

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E-maih [email protected] www. fa r rmfg .com

Cimle 049 on reader card or go to www.thru.to/webconnect

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158 Metal Finishing