cheminform abstract: tensile properties and microstructural characterization of sn—0.7cu—0.4co...

2008 Inorganic chemistry Z 0100 Tensile Properties and Microstructural Characterization of Sn—0.7Cu—0.4Co Bulk Solder Alloy for Electronics Applications — [24 refs.]. — (ANDERSSON*, C.; SUN, P.; LIU, J.; J. Alloys Compd. 457 (2008) 1-2, 97-105; Bionano Syst. Lab., Dep. Microtechnol. Nanosci., Chalmers Univ. Technol., S-412 96 Goeteborg, Swed.; Eng.) — Schramke 31- 225

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Page 1: ChemInform Abstract: Tensile Properties and Microstructural Characterization of Sn—0.7Cu—0.4Co Bulk Solder Alloy for Electronics Applications

2008

Inorganic chemistryZ 0100 Tensile Properties and Microstructural Characterization of Sn—0.7Cu—0.4Co

Bulk Solder Alloy for Electronics Applications — [24 refs.]. — (ANDERSSON*, C.; SUN, P.; LIU, J.; J. Alloys Compd. 457 (2008) 1-2, 97-105; Bionano Syst. Lab., Dep. Microtechnol. Nanosci., Chalmers Univ. Technol., S-412 96 Goeteborg, Swed.; Eng.) — Schramke

31- 225

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