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![Page 1: ChemInform Abstract: Tensile Properties and Microstructural Characterization of Sn—0.7Cu—0.4Co Bulk Solder Alloy for Electronics Applications](https://reader036.vdocuments.net/reader036/viewer/2022080306/575003c91a28ab11489b15b1/html5/thumbnails/1.jpg)
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Inorganic chemistryZ 0100 Tensile Properties and Microstructural Characterization of Sn—0.7Cu—0.4Co
Bulk Solder Alloy for Electronics Applications — [24 refs.]. — (ANDERSSON*, C.; SUN, P.; LIU, J.; J. Alloys Compd. 457 (2008) 1-2, 97-105; Bionano Syst. Lab., Dep. Microtechnol. Nanosci., Chalmers Univ. Technol., S-412 96 Goeteborg, Swed.; Eng.) — Schramke
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