chip design < work on palpidefs >

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System IC Design Lab. Dongguk University 1 Chip design < Work on pALPIDEfs > KIM,D.H. , KWON,Y. ,SONG,M.K. Department of Semiconductor Science, Dongguk Univ. for the ALICE collaboration. Department of Physics, Yonsei Univ. for the ALICE collaboration.

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Chip design < Work on pALPIDEfs >. KIM,D.H. , KWON,Y. ,SONG,M.K. Department of Semiconductor Science, Dongguk Univ. for the ALICE collaboration. Department of Physics, Yonsei Univ. for the ALICE collaboration. < CONTENTS >. pALPIDEfs – work on DACs - PowerPoint PPT Presentation

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Page 1: Chip design < Work on  pALPIDEfs  >

System IC Design Lab.

Dongguk University1

Chip design< Work on pALPIDEfs >

KIM,D.H. , KWON,Y. ,SONG,M.K.

Department of Semiconductor Science,Dongguk Univ. for the ALICE collaboration.

Department of Physics, Yonsei Univ. for the ALICE collaboration.

Page 2: Chip design < Work on  pALPIDEfs  >

System IC Design Lab.

Dongguk University2

< CONTENTS >

I. pALPIDEfs – work on DACs

II. pALPIDEfs version 2 – work on I/O PAD

III. Next plan

Page 3: Chip design < Work on  pALPIDEfs  >

System IC Design Lab.

Dongguk University3

I. pALPIDEfs – work on DAC - Layout of pALPIDEfs

Pixel Matrix: sensitive area

Periphery circuit ( DACs, PADs, periphery readout logic, etc)

Matrix

DACs

Periphery Logic

I/O pads

Page 4: Chip design < Work on  pALPIDEfs  >

System IC Design Lab.

Dongguk University4

I. pALPIDEfs – work on DAC DAC - List of Voltage and Current DACs

Voltage DAC Current DAC

Resolution • 8bit • 8bit

Type • Resistor • pMOS

Output/unitcol-umn

• 6EA 1) VCASP 2) VCASN 3) VRESET 4) VPULSE_LOW 5) VPULSE_HIGH 6) VAUX

• 5EA 1) IBIAS 2) ITHR 3) IDB 4) IAUX1 5) IAUX2

Page 5: Chip design < Work on  pALPIDEfs  >

System IC Design Lab.

Dongguk University5

I. pALPIDEfs – work on DAC DAC – Voltage DAC

Bottom

Top

Resistor (256)

Unit cell (256)

Control Block(256)

VCASP

VCASN

VRESET

DACMONV

VPLSE_HIGH

VAUX

SET

_VC

ASP

<255

:0>

SET

_VC

ASN

<255

:0>

SET

_VR

ESE

T<2

55:0

>

SET

_VPL

SE_L

OW

<255

:0>

SET

_VPL

SE_H

IGH

<255

:0>

SET

_VA

UX

<255

:0>

VPLSE_LOW

VC

ASP

VC

ASN

VR

ESE

T

VPL

SE_L

OW

VPL

SE_H

IGH

VA

UX

SWC

NT

L_V

CA

SP

SWC

NT

L_V

CA

SN

SWC

NT

L_V

RE

SET

SWC

NT

L_V

PLSE

_LO

W

SWC

NT

L_V

PLSE

_HIG

H

SWC

NT

L_V

AU

X

SWC

NT

L_D

AC

MO

NV

VR

ESE

T_I

NT

VPL

SE_L

OW

_IN

T

VPL

SE_H

IGH

_IN

T

VA

UX

_IN

T

VRESET_INT

VPLSE_LOW_INT

VPLSE_HIGH_INT

VAUX_INT

SET_VCASP

SET_VCASN

SET_VRESET

SET_VPLSE_LOW

SET_VPLSE_HIGH

SET_VAUX

SWCNTL_VCASPB

SWCNTL_VCASNB

SWCNTL_VRESETB

SWCNTL_VPLSE_LOWB

SWCNTL_VPLSE_HIGHB

SWCNTL_VAUXB

SWCNTL_DACMONVB

SWCNTL_VCASP

SWCNTL_VCASN

SWCNTL_VRESET

SWCNTL_VPLSE_LOW

SWCNTL_VPLSE_HIGH

SWCNTL_VAUX

SWCNTL_DACMONVB

SWCNTL_DACMONVB

SWCNTL_DACMONVB

SWCNTL_DACMONVB

SWCNTL_DACMONVB

VR

EF

AV

SS

DA

CR

EF

VCASP VCASN VRESET VPLSE_LOW

VPLSE_HIGH VRESET

0 0 0 368mV 368mV 368mV 368mV255 1.8V 1.8V 1.8V 1.8V 1.8V 1.8V

<Voltage DACS output range at nominal corner simulation>

VREF AVSS

<Voltage DAC resistor divider> <Voltage DAC unit block >

• Block diagram & Simulation result

Page 6: Chip design < Work on  pALPIDEfs  >

System IC Design Lab.

Dongguk University6

I. pALPIDEfs – work on DAC DAC – Current DAC

• Block diagram & Simulation result

Current DAC Current reduc-tion

SLOW@ 1.62V , 60°C

NOM@ 1.8V , 27°C

FAST@ 1.98V , 0°C

0 255 0 255 0 255

IBIAS 1 : 128 90pA 15nA 300pA 80.4nA 2nA 500nA

ITHR 1 : 4096 10pA 0.65nA 12pA 2.56nA 60pA 15.5nA

IDB 1 : 256 46pA 10.6nA 162pA 41.7nA 1nA 259nA

IRESET 1 : 256000 0.8pA 2.56pA 0.7pA 26.2pA 0.9pA 192pA

IAUX2 1:1 Not used

Unit cell (256)

AVSS

AVSS

AVSS

VDD

ITHR_MTX_INT

AVSS

AVSS

AVSS

AVDD IBIAS_MTX_INT

SET_IAUX

SET_IBIAS

SWCNTL_IBIASb SWCNTL_IBIAS

SWCNTL_IBIAS

SWCNTL_DACMONb

SWCNTL_IAUXb SWCNTL_IAUX

SWCNTL_IAUX

SWCNTL_DACMONb

C u r r e n t m i r r o r

C u r r e n t m i r r o r

C u r r e n t m i r r o r

C u r r e n t m i r r o r

IAUX_INT

IBIAS_INT IBIAS_MTX_INT

IDB_MTX_INT

IRESET_MTX_INT

IAUX

IAUX

ITHR

IBIAS

IDB

IRESET

SET

_IB

IAS<

255:

0>

SET

_IT

HR

<255

:0>

SET

_ID

B<2

55:0

>

SET

_IR

ESE

T<2

55:0

>

SET

_IA

UX

<255

:0>

SWC

NT

L_I

BIA

S

SWC

NT

L_I

TH

R

SWC

NT

L_I

DB

SWC

NT

L_I

RE

SET

SWC

NT

L_I

AU

X

SWC

NT

L_D

AC

MO

NI

Control Block(256)

IBIAS_INT

ITHR_INT

IDB_INT

IRESET_INT

IAUX_INT

DA

CR

EF

<Current DACs scheme><Current DACs, corner simulations results>

Page 7: Chip design < Work on  pALPIDEfs  >

System IC Design Lab.

Dongguk University7

II. pALPIDEfs Version 2 – work on PAD - Specification of I/O PAD

PAD

Output driver

InputBuffer

R1 R2

R3

Chip<0>

PAD

Output driver

InputBuffer

R1 R2

R3

CPAD

CCABLE

RCABLE

Chip<6>

CPAD

CABLE

Property of Cable• R=170mΩ/cm @ W= 100um• C=1pF/cm @ W= 100um

100um

21cm

• RCABLE = 3.57 Ω• CCABLE = 21pF

3.57 Ω 21pF

6pF 6pF

10 Ω 10 Ω 50 Ω 50 Ω

Pull down or Pull up

Total Load at the output driver• RLOAD = 3.57Ω + 10 Ω ≈ 14Ω • CLOAD = 6pF x 7 + 21pF ≈ 65pF

40 kΩ

DVDD or DVSS

40 kΩ

DVDD or DVSS Pull down or Pull up

Page 8: Chip design < Work on  pALPIDEfs  >

System IC Design Lab.

Dongguk University8

II. pALPIDEfs Version 2 – work on PAD - design of I/O PAD

92um

90um

CIN

OEN

D_O

UT

PAD

DVSS

DVDD

AVSS

AVDD

SUB

ESD diode

Buffer & Resistor

PAD

Output driver

InputBuffer

10Ω

CPAD

50Ω

40kΩ

DVSS

CIN

OEN

D_O

UT

PAD

< Layout of I/O PAD>

< Block diagram of I/O PAD>

CINDOUT

Page 9: Chip design < Work on  pALPIDEfs  >

System IC Design Lab.

Dongguk University9

II. pALPIDEfs Version 2 – work on PAD - Simulation result of I/O PAD

CIN

OEN

D_O

UT

PAD

TypeStructure

Type Result

Standard Core Input Transition = 0.5 ns Pad Load = 4Ω ,65pFSlow (80°C) Normal (25°C) Fast (0°C)

Rising Falling Rising Falling Rising Falling

R1 = 10Ω for protect buffer, 1x buf -fer

Out-put Driver(CorePAD)

Transi(ns) 4.96 5.43 4.11 4.11 3.29 3.61

tCMOS(ns) 323 3.76 2.50 2.80 1.96 232

tOE(ns) 6.30 6.20 4.60 4.66 3.81 4.06

Input Buf -fer(PADCore)

Transi(ns) 0.58 0.26 0.44 0.18 0.34 0.15

tCD(ns) 0.56 0.44 0.41 0.34 0.31 0.28

Power DVDD(pJ)

Tot. Int. Load. Tot. Int. Load. Tot. Int. Load.

174.6 4 170.6 215.9 5.3 210.6 261.

9 7.1 254.8

DOUT

PAD

50%

35% 65%

50%

tCMOS(falling) tCMOS(rising)

10%90%

Transition(falling)T1 T2 T3 T4

Transition(rising)

90%10%

Dout

90%50%

10%

50%90%10%

50%65%35%

Post simulation result of PAD_I/O (with parasitic parameter) Output driver : Delay < 5ns @ Load : 4Ω, 65pF Input buffer : Load : 0.5Ω, 160fF

Page 10: Chip design < Work on  pALPIDEfs  >

System IC Design Lab.

Dongguk University10

III. Next plan - Study of discriminator

CIN

OEN

D_O

UT

PAD

VRESET

PWELL

IBIAS_PIX

source

curfeed

VCASP

VDDA

GNDA

HITB

VCASN

ITHR_PIX

IDB

D0

D1

M0

M1

M2

M3

Cs

Cf

M4

M5M6

M7

<pALPIDEfs Front-End principle>

• Analysis of front-end and design new structure

Page 11: Chip design < Work on  pALPIDEfs  >

System IC Design Lab.

Dongguk University11

Thank you