common heat spreader: cu more expensive and commercially available heat spreaders: capillary driven...
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Common heat spreader: CuMore expensive and commercially available heat spreaders: capillary driven fluid convection devices, diamond, SiC
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Interface materials are subject to challenging requirements, including the ability to reduce thermal stress between region with vastly differing thermal expansion coefficients.
Common Thermal interface materials a variety of polymer based materials with high thermal conductivity particle inclusions, typically with 1-25 micro meter. Effective thermal conductivity is around 2 W/mK
Metallic TIMs are less attractive due to their high mechanical stiffness.
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Thermal Transport in one dimensional nanotubes and nanowires
k of single wall carbon nanotube: 6000W/mK
k of Randomly aligned mat of nanotube ropes=35 W/mK For a large density >200 W/mK
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Field effect transistor
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Graphene- the latest of the discovered allotropes of carbon: k= 3080-5300
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