cpc1788 single-pole, normally open integrated c d isoplus

INTEGRATED CIRCUITS DIVISION

DS-CPC1788-R04 www.ixysic.com 1

e3

Characteristics

Features• 2.45ADC Load Current with 5°C/W Heat Sink• Low 1.25 On-Resistance• 1000VP Blocking Voltage• 2500Vrms Input/Output Isolation• Low Thermal Resistance (0.3 °C/W)• Electrically Non-conductive Thermal Pad for Heat

Sink Applications• Low Drive Power Requirements• Arc-Free With No Snubbing Circuits• No EMI/RFI Generation• Machine Insertable, Wave Solderable

Applications• Industrial Controls / Motor Control• Robotics• Medical Equipment—Patient/Equipment Isolation• Instrumentation• Multiplexers• Data Acquisition• Electronic Switching• I/O Subsystems• Meters (Watt-Hour, Water, Gas)• Transportation Equipment• Aerospace/Defense

Approvals• UL 508 Certified Component: File E69938

Pin Configuration

DescriptionIXYS Integrated Circuits Division and IXYS have combined to bring OptoMOS® technology, reliability and compact size to a new family of high-power Solid State Relays.

As part of this new family, the CPC1788 single-pole normally open (1-Form-A) DC Solid State Power Relay employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation.

The optically coupled outputs, that use patented OptoMOS architecture, are controlled by a highly efficient GaAIAs infrared LED. The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance DC switching applications.

The unique ISOPLUS-264 package pioneered by IXYS enables Solid State Relays to achieve the highest load current and power ratings. This package features a unique IXYS process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation, but also very low thermal resistance (0.3 °C/W).

Ordering Information

Switching Characteristics

Parameter Rating Units

Blocking Voltage 1000 VP

Load Current, TA=25°C:

With 5°C/W Heat Sink 2.45ADC

No Heat Sink 1

On-Resistance (max) 1.25

RJC 0.3 °C/W

1 2 3 4

+ - - +

Part Description

CPC1788J ISOPLUS-264 Package (25 per tube)

Form-A

IF

ILOAD10%

90%

ton toff

CPC1788Single-Pole, Normally Open

ISOPLUS™-264 DC Power Relay


R04 www.ixysic.com 2

CPC1788

1 Specifications

1.1 Absolute Maximum Ratings @ 25°C

Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied.

1.2 Electrical Characteristics @ 25°C

1 Higher load currents possible with proper heat sinking.2 Measurement taken within 1 second of on-time.3 For applications requiring high temperature operation (TC > 60ºC) a LED drive current of 20mA is recommended.

Symbol Ratings Units

Blocking Voltage 1000 VP

Reverse Input Voltage 5 V

Input Control Current 100 mA

Peak (10ms) 1 ADC

Input Power Dissipation 150 mW

Isolation Voltage, Input to Output 2500 Vrms

Operational Temperature -40 to +85 °C

Storage Temperature -40 to +125 °C

Parameter Conditions Symbol Minimum Typical Maximum Units

Output Characteristics

Load Current 1

Peak t10ms

IL- -

12 AP

Continuous No Heat Sink 1

Continuous TC=25°C 10.3 ADC

Continuous TC=99°C IL(99) 1.2

On-Resistance 2 IF=10mA, IL=1A RON - 1 1.25

Off-State Leakage Current VL=1000VP ILEAK - - 1 A

Switching Speeds

Turn-OnIF=20mA, VL=10V

ton - 2.85 20ms

Turn-Off toff - 0.11 5

Output Capacitance VL=25V, f=1MHz Cout - 640 - pFInput Characteristics

Input Control Current to Activate 3 IL=1A IF - - 10 mA

Input Control Current to Deactivate - IF 0.6 - - mA

Input Voltage Drop IF=5mA VF 0.9 1.2 1.4 V

Reverse Input Current VR=5V IR - - 10 AInput/Output Characteristics

Capacitance, Input-to-Output - CI/O - 1 - pF


3 www.ixysic.com R04

CPC1788

2 Thermal Characteristics

2.1 Thermal Management

Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient thermal resistance of 12.5°C/W.

2.2 Heat Sink Calculation

Higher load currents are possible by using lower thermal resistance heat sink combinations.

Parameter Conditions Symbol Minimum Typical Maximum Units

Thermal Resistance (Junction to Case) - RJC - - 0.3 °C/W

Thermal Resistance (Junction to Ambient) Free Air RJA - 33 - °C/W

Junction Temperature (Operating) - TJ -40 - 100 °C

TJ = Junction Temperature (°C), TJ ≤ 100°C *TA = Ambient Temperature (°C)IL(99) = Load Current with Case Temperature @ 99°C (ADC)IL = Desired Operating Load Current (ADC), IL ≤ IL(MAX)

RθJC = Thermal Resistance, Junction to Case (°C/W) = 0.3°C/WRθCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)PD(99) = Maximum power dissipation with case temperature held at 99ºC = 3.33W

* Elevated junction temperature reduces semiconductor lifetime.

Heat Sink Rating

RθCA = - RθJC

(TJ - TA) IL(99)2

IL2 • PD(99)



CPC1788

3 Performance Data

Unless otherwise specified, all performance data was acquired without the use of a heat sink.

The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department.

35

30

25

20

15

10

5

01.30 1.31 1.32 1.33 1.34

Dev

ice

Co

un

t (N

)

Typical LED Forward Voltage Drop(N=50, IF=10mA, TA=25ºC)

LED Forward Voltage (V)

35

30

25

20

15

10

5

02.15 2.50 2.85 3.553.20 3.90

Dev

ice

Co

un

t (N

)

Typical Turn-On Time(N=50, IF=20mA, IL=1ADC, TA=25ºC)

Turn-On (ms)

0.080 0.110 0.1400.065 0.095 0.125

Dev

ice

Co

un

t (N

)

25

20

15

10

5

0

CPC1788Typical Turn-Off Time

(N=50, IF=20mA, IL=1ADC, TA=25ºC)

Turn-Off (ms)

35

30

25

20

15

10

5

00.900 0.925 0.950 0.975 1.000 1.025

Dev

ice

Co

un

t (N

)

Typical On-Resistance Distribution(N=50, IF=10mA, IL=1ADC, TA=25ºC)

On-Resistance (Ω)

Typical LED Forward Voltage Dropvs. Temperature

LE

D F

orw

ard

Vo

ltag

e D

rop

(V

) 1.8

1.6

1.4

1.2

1.0

0.8-40 -20 0 20 40 60 80 120100

Temperature (ºC)

IF=50mA

IF=10mAIF=20mA

LED Forward Current (mA)0 5 10 15 20 25 30 35 40 45 50

1211109876543210

Typical Turn-Onvs. LED Forward Current

(IL=250mADC)

Turn

-On

(m

s)

LED Forward Current (mA)0 5 10 15 20 25 30 35 40 45

0.145

0.140

0.135

0.130

0.125

0.120

0.115

0.110

0.105

0.10050

Typical Turn-Offvs. LED Forward Current

(IL=250mADC)

Turn

-On

(m

s)

LE

D C

urr

ent

(mA

)

-40

5.04.54.03.53.02.52.01.51.00.5

0-20 0 20 40 60 80 100

Typical IF for Switch Operationvs. Temperature

(IL=250mADC)

Temperature (ºC)-40

7

6

5

4

3

2

1

0-20 0 20 40 60 80 100

Typical Turn-On vs. Temperature(IL=250mADC)

Temperature (ºC)

IF=10mA

IF=20mA

Turn

-On

(m

s)

-40

0.24

0.21

0.18

0.15

0.12

0.09

0.06

0.06-20 0 20 40 60 80 100

Typical Turn-Off vs. Temperature(IL=250mADC)

Temperature (ºC)

IF=20mA

IF=10mA

Turn

-Off

(m

s)



CPC1788

Unless otherwise specified, all performance data was acquired without the use of a heat sink.

The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department.

-40

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0-20 0 20 40 60 80 100

Typical On-Resistancevs. Temperature

(IF=10mA, IL=250mADC)

Temperature (ºC)

On

-Res

ista

nce

(Ω

)

-40

2.22.01.81.61.41.21.00.80.60.40.20

-20 0 20 40 60 80 100

Typical On-Resistancevs. Temperature

(IF=10mA, IL=Max Rated)

Temperature (ºC)

On

-Res

ista

nce

(Ω

)

Lo

ad C

urr

ent

(A)

0

0.500.450.400.350.300.250.200.150.100.05

00.1 0.2 0.4 0.50.3 0.6

Typical Load Currentvs. Load Voltage

(IF=10mA, TA=25ºC)

Load Voltage (V)

Temperature (ºC)0 20 40 60 80 100

Lo

ad C

urr

ent

(AD

C)

0

1

2

3

4

5

6

Maximum Load Currentvs. Temperature(With Heat Sink)

1ºC/W

Free Air

10ºC/W

5ºC/W

-40

1160

1140

1120

1100

1080

1060

1040

1020

1000-20 0 20 40 60 80 100

Blocking Voltage vs. Temperature

Temperature (ºC)

Blo

ckin

g V

olt

age

(VP)

-40

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0-20 0 20 40 60 80 100

Typical Leakage vs. TemperatureMeasured Across Pins 1&2

(VL=1000VP)

Lea

kag

e (μ

A)

Temperature (ºC)

Lo

ad C

urr

ent

(A)

Energy Rating CurveFree Air, No Heat Sink

15.013.512.010.59.07.56.04.53.01.50

10µs 100µs 1ms 10ms 100ms 1s 10s 100s

Time



CPC1788

4 Manufacturing Information

4.1 Moisture Sensitivity

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee

proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below.

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability.

This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.

4.2 ESD Sensitivity

This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.

4.3 Reflow Profile

This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed.

4.4 Board Wash

IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake may be necessary if a wash is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used.

Device Moisture Sensitivity Level (MSL) Rating

CPC1788J MSL 1

Device Maximum Temperature x Time

CPC1788J 245°C for 30 seconds

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CPC1788

4.5 Mechanical Dimensions

NOTE: Back-side heat sink meets 2500Vrms isolation to the pins.

26.162 ± 0.254(1.030 ± 0.010)

19.914 ± 0.254(0.784 ± 0.010)

20.396 ± 0.508(0.803 ± 0.020)

15.240 ± 0.508(0.600 ± 0.020)

3.810 ± 0.254(0.150 ± 0.010)

2.362 ± 0.381(0.093 ± 0.015)

0.635 ± 0.076(0.025 ± 0.003) 2.794 ± 0.127

(0.110 ± 0.005)

5.029 ± 0.127(0.198 ± 0.005) 1.181 ± 0.076

(0.047 ± 0.003)

1.930 ± 0.381(0.076 ± 0.015)

17.221 ± 0.254(0.678 ± 0.010)

20.600 ± 0.254(0.811 ± 0.010)

1.270 TYP(0.050 TYP)

DIMENSIONSmm

(inches)

For additional information please visit our website at: www.ixysic.comIXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.

Specification: DS-CPC1788-R04©Copyright 2012, IXYS Integrated Circuits DivisionAll rights reserved. Printed in USA.12/17/2012

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cpc1788 single-pole, normally open integrated c d isoplus

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