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IBM System Storage DCS9900 1269-3S1 Storage Expansion Unit Installation, Service, and User's Guide GA32-0612-02

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Page 1: DCS9900 1269-3S1 Storage Expansion Unit Installation Service and User Guide

IBM System Storage™

DCS9900 1269-3S1 Storage ExpansionUnit Installation, Service, and User's Guide

GA32-0612-02

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Page 2: DCS9900 1269-3S1 Storage Expansion Unit Installation Service and User Guide
Page 3: DCS9900 1269-3S1 Storage Expansion Unit Installation Service and User Guide

IBM System Storage™

DCS9900 1269-3S1 Storage ExpansionUnit Installation, Service, and User's Guide

GA32-0612-02

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Note: Before using this information and the product it supports, read the general information in “Notices” on page E-1, theWarranty and Support Information document, and the Environmental Notices and User's Guide on the IBM DocumentationCD.

Second Edition, May 2009

© Copyright International Business Machines Corporation 2009.US Government Users Restricted Rights – Use, duplication or disclosure restricted by GSA ADP Schedule Contractwith IBM Corp.

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Contents

1 Introduction .................................................................................................................................... 11.1 The IBM DCS9900 3S1 Storage Expansion Unit System .......................................................... 11.2 Enclosure Core Product ............................................................................................................. 2

1.2.1 Enclosure Chassis ............................................................................................................. 31.3 The Plug-in Modules ................................................................................................................... 3

1.3.1 Power Cooling Module (PCM) ........................................................................................... 31.3.2 Input/Output (I/O) Module .................................................................................................. 41.3.3 Drive Carrier Module and Status Indicator ........................................................................ 61.3.4 DEM Card .......................................................................................................................... 6

1.4 Front Panel Indicators ................................................................................................................ 81.5 Environment ............................................................................................................................... 91.6 IBM DCS9900 3S1 Storage Expansion Unit Technical Specification ........................................ 9

1.6.1 Dimensions ........................................................................................................................ 91.6.2 Weight ............................................................................................................................... 91.6.3 AC INPUT PCM ............................................................................................................... 101.6.4 PCM Safety and EMC Compliance ................................................................................. 101.6.5 Power Cord ..................................................................................................................... 101.6.6 Temperature .................................................................................................................... 101.6.7 Electrical Power ............................................................................................................... 111.6.8 Acoustical (Noise) Level .................................................................................................. 11

2 Getting Started ............................................................................................................................. 132.1 Planning Your Installation ......................................................................................................... 13

2.1.1 Enclosure Bay Numbering Convention ........................................................................... 142.2 Enclosure Installation Procedures ............................................................................................ 162.3 I/O Module Configurations ....................................................................................................... 17

2.3.1 Controller Options ........................................................................................................... 172.4 DEM .......................................................................................................................................... 172.5 Drive Enclosure Device Addressing ......................................................................................... 172.6 Grounding Checks .................................................................................................................... 18

3 Operation ...................................................................................................................................... 193.1 Before You Begin ..................................................................................................................... 193.2 Power On / Power Down .......................................................................................................... 19

3.2.1 PCM LEDs ....................................................................................................................... 193.2.2 I/O Panel LEDs ................................................................................................................ 20

4 Troubleshooting and Problem Solving ...................................................................................... 214.1 Overview ................................................................................................................................... 214.2 Initial Start-up Problems ........................................................................................................... 21

4.2.1 Faulty Cords .................................................................................................................... 214.2.2 Alarm Sounds On Power Up ........................................................................................... 214.2.3 Green “Signal Good” LED on I/O Module Not Lit ............................................................ 214.2.4 DCS9900 Doesn’t Recognize the 3S1 Subsystem ......................................................... 22

4.3 LEDs ......................................................................................................................................... 224.3.1 HDD (Hard Disk Drive) .................................................................................................... 224.3.2 PCM (Power Cooling Module) ......................................................................................... 234.3.3 DEM (Drive Expander Module) ....................................................................................... 234.3.4 I/O Module ....................................................................................................................... 244.3.5 Front Panel Drive Activity Indicators ............................................................................... 25

4.4 Troubleshooting ........................................................................................................................ 26

IBM System Storage DCS9900 1269-3S1 Storage Expansion Unit Installation, Service, and User Guide 1

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4.4.1 Thermal Control ............................................................................................................... 264.4.2 Thermal Alarm .................................................................................................................. 274.4.3 Thermal Shutdown ........................................................................................................... 27

4.5 Dealing with Hardware Faults ................................................................................................... 274.6 Continuous Operation During Replacement ............................................................................. 284.7 Replacing a Module .................................................................................................................. 28

4.7.1 Power Cooling Modules ................................................................................................... 284.7.2 I/O Module ........................................................................................................................ 304.7.3 Replacing the Drive Carrier Module ................................................................................. 31

4.8 Replacing the DEM ................................................................................................................... 324.9 Spare Parts and Ancillary Items ................................................................................................ 334.10 Bezel Installation ....................................................................................................................... 34

Appendix A. Drive Enclosure Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-1

Appendix B. Rack-Mounting the IBM DCS9900 3S1 Storage Expansion Unit System . . . . . . . . . . . . . . . . B-1

Appendix C. 4x15 to 2x30 to 1x60 Migration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C-1

Appendix D. DCS9900 SAS and SATA Drive Placement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D-1

2 IBM DCS9900 3S1 Storage Expansion Unit Installation, Service, and User Guide

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Preface

What is in this guide

This guide gives you step-by-step instructions on how to install, configure, and connect this product to your IBM DCS9900. In addition, it provides instructions on how to operate and service this product.

Who should use this guide

This guide assumes that you have a working knowledge of the SAS environment into which you are attaching the product. If you do not have these skills, or are not confident with the instructions in this guide, do not proceed with the installation.

NOTE : Not all information contained in the following sections will pertain directly to your particular product model.

Getting information, help, and service

If you need help, service, or technical assistance or just want more information about IBM products, you will find a wide variety of sources available from IBM to assist you. This section contains information about where to go for additional information about IBM and IBM products, what to do if you experience a problem with your IBM System Storage DCS9900 product, and whom to call for service, if it is necessary.

Support information

For online support information for your IBM System Storage DCS9900 product, visit the following web site:

www.ibm.com/support

For telephone support information, in the United States, contact IBM at 1-800-IBM-SERV (426-7378).

In other countries, visit the following web site for support telephone numbers:

www.ibm.com/planetwide/

Before you call

Before you call, make sure that you have taken these steps to try to solve the problem yourself:

• Check all cables on your hardware to make sure that they are connected properly.

• Check the power switches to make sure that the system is turned on.

• Use the troubleshooting information in your system documentation and use the diagnostic tools that come with your system.

Using the documentation

Information about the DCS9900 product is available on a documentation CD that comes with your product. You can also access documents using the IBM Publications Center:

http://www.ibm.com/shop/publications/order

IBM System Storage DCS9900 1269-3S1 Storage Expansion Unit Installation, Service, and User Guide 1

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International Standards

This product complies with the applicable Information Technology (IT) standards set forth by EMC and product safety for world wide shipment.

Qualified Personnel

The personnel qualified to use this device are referred to within this document as follows:

• Service Person: Someone with the appropriate and necessary technical training and experience to be aware of hazards to which they may be exposed in performing a task and of measures to minimize the risks to that person or other persons.

• User/Operator: Any person authorized to handle/operate the product other than a Service Person.

Delivery and Subsequent Transportation of the Equipment

You must prepare your environment to accept the new product based on the installation planning information provided, with assistance from an IBM Installation Planning Representative (IPR) or IBM authorized service provider. In anticipation of the equipment delivery, prepare the final installation site in advance so that professional movers or riggers can transport the equipment to the final installation site within the computer room. If for some reason, this is not possible at the time of delivery, you must make arrangements to have professional movers or riggers return to finish the transportation at a later date. Only professional movers or riggers should transport the equipment. The IBM authorized service provider can only perform minimal frame repositioning within the computer room, as needed, to perform required service actions. You are also responsible for using professional movers or riggers when you relocate or dispose of equipment.

Rack Relocation

Observe the following precautions when you need to relocate your rack:

• Before you add or remove drawers, always lower the leveling feet and install the anti-tip plates, or have the rack bolted to the floor.

• Always install drawers at the bottom of the rack first.

• Always remove drawers from the top of the rack first.

• Always install the heaviest drawers on the bottom of the rack.

• Never push on the sides of the rack.

• When relocating the DCS9900 rack with 1269-3S1 draws installed, the hard drives installed in the drawers must be removed to avoid a side-to-side tip-over hazard.

Safe Handling

Do not try to lift the enclosure by yourself. An enclosure can weigh from 9 kg (19.8 lb) to 37 kg (77.6 lb). Before removing an enclosure from a rack cabinet, always first remove all modules and drives from the enclosure to minimize weight.

Figure P-4 Danger (D006) Heavy Equipment Label

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Figure P-5 2 Man Lift Safety Label

Do not try to lift the enclosure by the handles on the PSU/Cooling module. The handles are not designed to support the weight of the populated enclosure.

Figure P-6 Weight Handling Label: Lifting and Tipping

Figure P-7 Pinch Hazard Label: Keep Hands Clear

Safety Guidelines

Caution ! If this product is used in a manner not specified by the manufacturer, the protection provided by the product may be impaired.

• The product can weigh up to 35 kg (77 lb). Do not try to lift it by yourself.

Figure P-8 Chassis Warning Label: Weight Hazard

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Caution ! Plug-in modules are part of the fire enclosure and must only be removed when a replacement can be immediately added. The system must not be run without all units in place. Operate the system with the enclosure top cover closed and blanking plates fitted where modules are missing.

• To comply with applicable safety, emission, and thermal requirements, keep all enclosure covers securely fitted and keep all bays fitted with plug-in modules.

• Enclosures must be only operated from a power supply input voltage range of 100 V AC to 240 V AC.When a redundant power input module is fitted, it must be operated from a reduced input voltage range of 200 V AC to 240 V AC.

• The plug on the power supply cord is used as the main disconnect device. Ensure that the socket outlets are located near the product and are easily accessible.

• The product is intended to operate with three (3) working PSUs. Before the removal or replacement of any module, disconnect all supply power for complete isolation.

The enclosure MUST be grounded before applying power.

Permanently unplug the product if you think that it has become damaged in any way and before you move it.

To ensure protection against electric shock caused by HIGH LEAKAGE CURRENT (TOUCH CURRENT), the enclosure must be connected to at least two separate and independent sources. This should ensure a reliable earth connection.

!Warning

!Warning

!Warning

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Figure P-9 PSU/Cooling Module Caution Label: Do not operate with modules missing.

• A faulty power supply/cooling module must be replaced with a fully operational module within 24 hours.

• Do not remove a faulty power supply/cooling module unless you have a correct replacement product ready for insertion.

Figure P-10 PSU Warning Label (Power Hazards)

• Always disconnect power to the product prior to removal of the power supply/cooling module from the product chassis.

• When powered by multiple AC sources, disconnect all supply power for complete isolation.

• Provide a safe electrical earth (ground) connection for the power cord. Check the grounding of the enclosure before applying power.

• Provide a suitable power source with electrical overload protection to meet the requirements detailed in the product’s technical specifications.

To ensure your system has warning of a power failure, disconnect the power from the PSU by either the switch (where present) or by physically removing the power source, prior to removing the PSU from the enclosure.

Do not remove covers from the Power Supply Unit (PSU). Danger of electric shock inside. Return the damaged PSU to your supplier for repair.

!Warning

!Warning

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Figure P-11 PSU Safety Label (Electric Shock Hazard Inside)

Figure P-12 Redundant Power Input Switch Module Label (Hazardous Voltage)

Figure P-13 I/O Module Caution Label (Do not operate with modules missing)

Figure P-14 Drive Carrier Module Caution Label (Drive Spin down time 30 seconds)

• Do not operate with modules missing.

Operation of the product with ANY modules MISSING in the product’s chassis will disrupt airflow and the drives will not receive sufficient cooling. It is ESSENTIAL that all bays in a product chassis are filled before operating the product.

!Warning

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Class 1 Laser Product

When the product is supplied with optical modules, it contains a laser that complies with Laser Class 1, US 21 QFR (J) & EN 60825-1, UL (NRTL) and TUV.

Caution ! If optical modules are to be provided and fitted by the end user, the modules must be a UL (or other North American NRTL) RECOGNISED COMPONENT, must be approved by TUV (or other European Product safety test house), and the laser in the module must comply with Laser Class 1, US 21 QFR (J) & EN 60825-1.

Important ! Observe all applicable safety precautions (for example, weight restrictions, handling batteries and lasers etc.) detailed in the preceding paragraphs when dismantling and disposing of this product or its components.

European Regulations

This equipment complies with European Regulations EN 55022 Class A: Limits and Methods of Measurement of Radio Disturbance Characteristics of Information Technology Equipments and EN50082-1: Generic Immunity.

Special Tools and Equipment

There are no special tools required, but in order to complete the assembly of some configurations, you may need the following (not supplied):

• Security keys (one of these should be included with your IBM System Storage DCS9900 3S2 Storage Expansion Unit for use with the drive locks).

Taiwan Contact Information

Rack System Precautions

The following safety requirements must be considered when the product is mounted in a rack:

• The rack design should incorporate stabilizing features suitable to prevent the rack from tipping or being pushed over during installation or in normal use.

• When loading a rack with the units, fill the rack from the bottom up and empty from the top down.

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• System must be operated with low pressure rear exhaust installation. (Back pressure created by rack doors and obstacles should not exceed 5 pascals [0.5mm Water gauge].)

• The rack design should take into consideration the maximum operating ambient temperature for the unit, which is 32°C.

• The rack should have a safe electrical distribution system. It must provide overcurrent protection for the unit and must not be overloaded by the total number of units installed in the rack. Consideration of the electrical power consumption rating shown on the nameplate should be used when addressing these concerns.

• The electrical distribution system must provide a reliable earth grounding for each unit and the rack.

• Each power supply in each unit has an earth leakage current of 1.8mA. The design of the electrical distribution system must take into consideration the total earth leakage current from all the power supplies in all the units. The rack will require labelling with “HIGH LEAKAGE CURRENT. Earth connection essential before connecting supply”.

• The rack when configured with the units must meet the safety requirements of UL 60950 and IEC 60950.

ESD Precautions

Caution ! It is recommended that you wear a working (examine before wearing) anti-static wrist or ankle strap and observe all conventional ESD precautions when handling Chassis slug-in modules and components. Avoid contact with backplane components, module connectors, etc.

Data Security

• Before beginning product installation, power down your DCS9900 and all attached peripheral devices.

• Disk drives are fragile. Handle them with care, and keep them away from strong magnetic fields.

• All the supplied plug-in modules and blanking plates must be in place for the air to flow correctly around the enclosure and to complete the internal circuitry.

• If the subsystem is used with modules or blanking plates missing for more than a few minutes, the enclosure can overheat, causing power failure and data loss.

• If you remove any drive module, you may lose data.

• If you remove a drive module, replace it immediately. Replace it with a drive module of the same type and capacity

• Do not abandon your backup routines. No system is completely foolproof.

Do not slide more than one product enclosure chassis out of the rack at a time, to avoid the rack from toppling over. !

Warning

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Introduction

Chapter 1

Introduction

1.1 The IBM DCS9900 3S1 Storage Expansion Unit SystemThe IBM DCS9900 3S1 Storage Expansion Unit system is an ultra dense 4U 60 disk drive enclosure based on 3.5 inch SAS or SATA Hard Disk Drives (HDDs). Figure 1–1 and Figure 1–2 show front and rear views of an IBM DCS9900 3S1 Storage Expansion Unit respectively. Module and major components and their locations are shown in Figure 1–3.

Figure 1–1 The IBM DCS9900 3S1 Storage Expansion Unit System - front open view

Figure 1–2 The IBM DCS9900 3S1 Storage Expansion Unit System - rear isometric and rear views

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Figure 1–3 IBM DCS9900 3S1 Storage Expansion Unit Module Locations

30 Drive Bays

30 Drive Bays

I/O-B

I/O-A

PCMs8 DEMs

1.2 Enclosure Core Product The IBM DCS9900 3S1 Storage Expansion Unit design concept is based on a subsystem together with a set of plug-in modules and (as supplied) comprises:

• Enclosure Chassis with integral Front Panel Drive Status Indicator (Figure 1–10).

• Two (2) 1865W Power Cooling (PCM) plug-in modules (Figure 1–4).

• Two (2) plug-in Input/Output (I/O) modules (Figure 1–6).

• A midplane separates the front and back of the chassis and provides the interconnect system between the PCMs, I/O modules, and the baseboard.

• Up to 60 top loadable HDDs in a 5x12 matrix.

• Heterogenous and homogenous configuration of SAS and/or SATA drives (Table 1–1) are supported in the 1269-3S1. See SAS/SATA Intermix flyer PN 49Y4164 for SAS/SATA intermix guidelines. This is also included in Appendix D of this document.

• Eight (8) SAS DEMs.

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Introduction

Table 1–1 SAS and SATA Drive Information

Type RPM Capacity

SAS 15K 146GB, 300GB, 450GB

SATA 72.K 500GB, 750GB, 1TB

1.2.1 Enclosure Chassis

The chassis assembly contains 60 drive bays at the front, each of which accommodates a plug-in drive carrier module capable of holding a 3.5 inch SAS or SATA Hard Disk Drive (HDD). The 60 drive bays are arranged in five rows of twelve drives (5x12). At the rear, the chassis assembly contains two (2) PCMs and two (2) I/O modules (Figure 1–3). The chassis is fitted with 19-inch rack mounting features which enables it to be fitted to 19-inch racks and uses four (4) EIA units of rack space.

1.3 The Plug-in ModulesAn IBM DCS9900 3S1 Storage Expansion Unit Enclosure requires the following modules for normal operation:

• Power Cooling Module (PCM)• Input/Output Module (I/O)• Drive Carrier Module• DEM

1.3.1 Power Cooling Module (PCM)Two (2) auto ranging AC 1865W Power Cooling modules (Figure 1–4) are supplied already mounted in the rear of the enclosure as part of the subsystem core product.

Figure 1–4 Power Cooling Module (1).

The IBM DCS9900 3S1 Storage Expansion Unit must always be operated with two (2) Power Cooling Modules fitted (PCMs). Module replacement should only take a few minutes to perform but must be completed within 10 minutes from removal of the failed module. Four (4) LEDs mounted on the PCM

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(Table 1–2) indicate the status of the PCM and the fans. PCM voltage operating ranges are nominally 200V to 240V AC.

Figure 1–5 PCM LEDs View: Normal/Faults

PCM LEDs

Normal Operation LEDs Faults LEDs

Table 1–2

ICON LED Description COLOR Normal Behavior

PCM AC ok GREEN ON-AC input to PCM within tolerances. OFF-failed PCM

PCM DC ok GREEN ON-DC output of PCM within tolerances. OFF-failed PCM

PCM Fault AMBER ON-PCM fault detected OFF-no detected PCM faults.

PCM ID BLUE ON-receiving SES Identify command OFF-NOT receiving SES Identify command

PCM LEDs

.

1.3.2 Input/Output (I/O) Module The IBM DCS9900 3S1 Storage Expansion Unit storage subsystem includes an enclosure with rear facing bays which house two (2) I/O modules (Figure 1–6). Processors housed on the I/O modules provide enclosure management and interface to devices on the Backplane, PCM, and Display Panel in order to monitor internal functions.

The plug-in I/O modules have been designed for integration into an IBM DCS9900 3S1 Storage Expansion Unit storage subsystem, providing external SAS cable interfacing with up to 60 SAS or SATA disk drives.

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Introduction

Figure 1–6 I/O Module

Host Port 1 Expansion Port 1 Host Port 2 Expansion Port 2

Table 1–3 defines the LED indicators incorporated on the I/O module.

Table 1–3 I/O Module LEDs

LED Description Color Normal Behavior

Host Port 1 Expansion Port 1

Host Port 2 Expansion Port 2

SAS Link Green ON-a valid SAS link established on at least 1 of the 4 SAS links of the 4-wide SAS port OFF-no SAS links

Host Port 1 Expansion Port 1

Host Port 2 Expansion Port 2

SAS Link Fault Amber ON-a detectable fault on at least 1 of the 4 SAS links of the 4-wide SAS port OFF-no detectable faults

I/O Module OK Green ON-properly booted and functioning correctly OFF-I/O Module internal fault

I/O Module Fault Amber ON-I/O module fault detected OFF-no detected I/O module faults

I/O Module Identify Blue ON-receiving SES Identify command OFF-NOT receiving SES Identify command

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1.3.3 Drive Carrier Module and Status IndicatorThe Drive Carrier Module comprises a hard disk mounted in a carrier (Figure 1–7). Each drive bay can house a single Low Profile 1.0 inch high, 3.5 inch form factor disk drive in its carrier. A fully loaded enclosure contains 60 drive carrier modules.

The handle provides the following functions:• Camming of carrier into and out of drive bays.• Positive 'spring loading' of the drive/baseplane connector. • The handle assembly also incorporates a Drive Status LED (Figure 1–7).

Note The homogenous enclosure system design allows for drive bays to be left empty without the need for fitting dummy drive carriers. When intermixing SAS and SATA drives, a drive filler is required. See SAS/SATA Intermix flyer PN49Y4164 for SAS/SATA intermix drive filler usage. This is also included in Appendix D of this document.

Figure 1–7 Drive Carrier Module: Closed and Opened

LED

1.3.3.1 SATA Interposer CardThe IBM DCS9900 3S1 Storage Expansion Unit storage subsystem supports a SATA interposer card which allows simultaneous access to the SATA HDD from both IO modules installed in the enclosure as well as the power cycling of a single HDD through SES commands.

Note A SATA interposer card is required to run SATA HDDs.

1.3.4 DEM CardThe IBM DCS9900 3S1 Storage Expansion Unit enclosure contains eight (8) top-loadable, hot-swappable DEMs. The DEMs (Figure 1–8) provide the SAS connectivity between the I/O module and the HDDs located within the enclosure.

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Introduction

Figure 1–8 DEM

Locking Mechanism

Note The DEM is a serviceable PCB which may be replaced by trained personnel.

Each DEM connects to a single port of the HDD based on the location within the enclosure within which it is installed (Figure 1–9). Each provides power control signals to each drive slot. It controls HDD identify/service LEDs and monitors the status from partner DEM. Each pair of DEMs supports 15 drives; there are 8 DEMs in a fully configured system.

Figure 1–9 Drive Carrier and DEM Locations

Note In some components, the failure LED is internal to the enclosure and visible only when the cover is open. The Internal LED indicators are explained in Table 1–4.

Table 1–4 INTERNAL LED Indicators

Description Location Color Normal Behavior

DEM DC DEM internal to enclosure

GREEN ON-1.2VDC regulator circuit correctly functioning OFF- faulty 1.2VDC regulator circuit

DEM ID DEM internal to enclosure

BLUE ON-receiving SES Identify command OFF-NOT receiving SES Identify command

HDD ID HDD internal to enclosure

BLUE ON-receiving SES Identify command OFF-NOT receiving SES Identify command

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1.4 Front Panel Indicators Note The Front Panel is an integral part of the enclosure chassis assembly and is not field replaceable.

The Front Panel Indicators show the aggregated status of all the modules and drive activity. This panel and its associated LEDs are shown in Figure 1–10. The Front Panel LEDs are defined in Table 1–5.

Figure 1–10 Front Panel Indicators

Table 1–5 Display Panel LEDs

ICON LABEL COLOR Definition Normal Behavior

Shelf Identify AMBER Enclosure Identify NOT CURRENTLY IMPLEMENTED

ON-SES is sending an Identify command. OFF-SES is NOT sending an Identify command

System Fault AMBER Enclosure Fault ON-one or more components within enclosure have failed. A service action is required. Exact failed component has its own amber fault LED lit. OFF-no detectable faults

System Power GREEN Enclosure Powered ON ON - DC power is present OFF - DC power is NOT present LED does NOT flash under normal operating conditions.

Cover Open AMBER Enclosure cover is open OFF-both cover pieces securely closed and latched in place. ON-either of the cover pieces is NOT securely closed and latched in place

Note: The baseplane incorporates an Audible Alarm. This alarm is used to indicate a “cover open” condition. To silence alarm, close the cover.

DEM Fault AMBER DEM fault NOT CURRENTLY IMPLEMENTED

OFF-all DEMs operating correctly. ON-at least one DEM has failed; service action required

Drive Fault AMBER Drive fault NOT CURRENTLY IMPLEMENTED

ON-one or more HDDs are faulted. SES must determine exact HDD. OFF-no detectable drive faults

Individually numbered

HDDs GREEN HDD activity ON-indicates HDD activity OFF-no HDD activity

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Introduction

1.5 EnvironmentThe enclosure and all of its sub-components are compliant to the European Union RoHS (Restriction of Hazardous Substances) Directive (Directive 2002/95/EC) with no exceptions or exemptions.

1.6 IBM DCS9900 3S1 Storage Expansion Unit Technical Specification

1.6.1 Dimensions Enclosure inches millimetersHeight 7.0 178Width (including flanges) 19.0 483Depth front surface of bezel to end of cable management arms

42 1067

LENGTH rack mounting surface to rear connectors surface

36 914

1.6.2 Weight

Item Quantity per System

LBS (kg)(per unit part)

Extended Weight (Qty x LBS (kg))

Chassis Includes Base PCB & Midplane

1 83 (37.48) 83 (37.48)

PCM 2 12 (5.44) 24 (10.88)I/O Modules 2 (Modules) 4 (1.81) per module 8 (3.63) for 2 modulesDrives in module 60 Drives) 2 (0.91) per drive 120 (54.43) for 60 drivesMiscellaneous 1 5 (2.27) 5 (2.27)

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1.6.3 AC INPUT PCM

Input Parameter ValueInput Voltage 190 - 240 VAC

Input Frequency 50 - 60 Hz and 400 hzMaximum Input Current 13.1A RMS @ 190 VAC

Peak Inrush Current 50A @ 230VAC, 250C, 5 msec maxMinimum Efficiency

measured at 30% and 50% load and nominal line

(208 VAC)90%

Power (typical/peak) with no drives installed 210/1865 wattsPower (typical/peak) with 60 drives installed 1200/1865 watts

1.6.4 PCM Safety and EMC ComplianceSafety Compliance UL 60950

IEC 60950 EN 60950

EMC Compliance CFR47 Part 15B Class AEN55022EN55024

1.6.5 Power Cord(minimum requirements)

Cord Type SV or SVT, 18 AWG minimum, 3 conductorPlug 250V, 10ASocket IEC 320 C-14, 250V, 15A

Note Power cord is not included in the standard IBM DCS9900 3S1 Storage Expansion Unit enclosure package.

1.6.6 TemperatureTemperature/Temperature Range (operating): 5 to 32 degrees C (41 to 89.6 degrees FOperational Derating: Derate ambient temperature by 1 degree C for

every 1000 feet (304.8 meters) increase above sea level

Relative Humidity: 20% to 80%Capacity of Exhaust: 200 cfmCooling (typical/peak) without any drives installed 717/6367 BTU/hourCooling (typical/peak) with 60 drives installed 4100/6367 BTU/hour

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Introduction

1.6.7 Electrical PowerVoltage Range: 190-240 V ac, 5.0 amperes maximum per input

Note This product is not specified for operation below 190 V ac.Operating Current: 8-11 amperes totalPower: 1200 watts (4.08 kBTU/Hr) typical with 60 disk drives Frequency: 50-60 Hz

1.6.8 Acoustical (Noise) Level

Declared Sound Power with SATA drives 7.4 belsDeclared Sound Power with SAS drives 8.2 bels

Note The following two DCS9900 system configurations which use the 3S1 Storage Expansion Units, exceed IBM's recommended criteria for acceptable noise levels. o DCS9900 configuration with Specify feature (#9221) - One DCS9900 Model CP2 controller with five Model 3S1 SAS/SATA Expansion Units installed in a 45U rack. o DCS9900 configuration with Specify feature (#9222) - One DCS9900 Model CP2 controller with ten Model 3S1 SAS/SATA Expansion Units installed in a 45U rack. For detailed measurement data, refer to the DCS9900 Noise Declaration document included in the RPQ package for DCS9900 configurations that utilize the 3S1 Storage Expansion Unit. The DCS9900 Noise Declaration document is also available by visiting http://www.datadirectnet.com/dcs9900/

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Getting Started

Chapter 2

Getting StartedCaution When connecting up the IBM DCS9900 3S1 Storage Expansion Unit subsystem, use only the cables

supplied.

2.1 Planning Your InstallationBefore you begin installation you should become familiar with the configuration requirements of your IBM DCS9900 3S1 Storage Expansion Unit system and the correct positions of each of the optional plug-in modules (Table 2–1).

Table 2–1 DCS9900 3S1 Storage Expansion Unit System Configuration

Module Location

Drive Bays You can install from 1 - 60 drives in the enclosure.

In 1x mode, (connected to 10 enclosures), you can install any number of drives in the enclosure, but every enclosure should have the same number of drives.

In 2x mode, (connected to 5 enclosures), you must install drives in multiples of two (2).

In 4x mode, (connected to 3 enclosures), you must install drives in multiples of four (4).

Power Cooling Modules (PCM) Two (2) PCMs must be fitted. Full power and cooling redundancy is provided while a faulty module is replaced. Install the PCMs in lower rear bays A and B.

Note: Rear bays are numbered from A and B starting from the left when viewed from the back.

I/O Module One or two I/O modules should be Installed in the upper rear bays A & B.

Note: If only one module is installed, it should be fitted in Module Location A and a blank plate must be fitted over the unused bay.

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Figure 2–1 DEM Pair Locations

Bay BI/O

Bay AI/O

2.1.1 Enclosure Bay Numbering ConventionWarning Operation of the Enclosure with ANY of the plug-in modules missing from the rear of the

enclosure will disrupt the airflow and the drives will not receive sufficient cooling. It is ESSENTIAL that all (rear) apertures are filled before operating the unit.

The IBM DCS9900 3S1 Storage Expansion Unit subsystem is housed in a 60-drive bay enclosure, arranged in four (4) groups. Each group comprises two banks of 15 bays, that is, (as viewed from the front): 12 bays across the enclosure by 5 bays deep.

There are three numbering schemes: 1x60, 2x30, and 4x15.

The drive bays are numbered in accordance with the tables shown in Figure 2–2, Figure 2–3, and Figure 2–4 when viewed from above.

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Getting Started

Figure 2–2 1X60 Drive Numbering Table.

Figure 2–3 2x30 Drive Numbering Table

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Figure 2–4 4x15 Drive Numbering Table

2.2 Enclosure Installation Procedures Warning The IBM DCS9900 3S1 Storage Expansion Unit Enclosure with all its component parts installed is

too heavy for a single person to easily install into a Rack cabinet.

Caution Ensure that you have fitted and checked a suitable anti-static wrist or ankle strap and observe all conventional ESD precautions when handling IBM DCS9900 3S1 Storage Expansion Unit modules and components. Avoid contact with Backplane components and module connectors, etc.

Note IBM DCS9900 3S1 Storage Expansion Unit enclosures are supplied and delivered populated with Backplane, Baseplane, Front Panel, DEMs, and with PCMs installed. The Drive Carrier Modules are supplied as a separate package.

The IBM DCS9900 3S1 Storage Expansion Unit enclosure is in compliance with EIA-310-D “Cabinets, Racks, Panels, and Associated Equipment”. The enclosure is designed to fit within a 4U rack space. A typical rack mounting installation in shown in Figure 2–5

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Getting Started

Figure 2–5 Full Rack without 9900 controllers.

2.3 I/O Module Configurations

2.3.1 Controller Options The IBM DCS9900 3S1 Storage Expansion Unit has a standard SAS JBOD IO controller, which employs a 36-port expander with zoning. The zoning is implemented via a preset piano-switch located on the enclosure baseboard. Host ports 1 and 2 present drives 1 through 30 and host ports 3 and 4 present drives 31 through 60. Each host port responds with drive information applicable only to the drives presented on the respective zone and enclosure status information for the entire enclosure.

2.4 DEMThe IBM DCS9900 3S1 Storage Expansion Unit enclosure contains eight (8) top-loadable, hot swappable DEMs. The DEMs provide the SAS connectivity between the I/O module and the HDDs located within the enclosure. Each DEM connects to a single port of the HDD based on the location within the enclosure in which it is installed. Each of the eight DEMS installed in the enclosure has a unique I2C and SAS address based on a proprietary SAS address generation scheme.

2.5 Drive Enclosure Device AddressingSee Appendix A.

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2.6 Grounding ChecksThe product must only be connected to a power source that has a safety electrical earth connection.

Warning If more than one product is fitted in a rack, the earth connection to the rack is even more important, because the rack will then have a high “EARTH LEAKAGE CURRENT” (“TOUCH CURRENT”).

The earth connection to the rack must be checked before switching on, by an electrical engineer who is qualified to the appropriate local and National standards to perform the check.

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Operation

Chapter 3

Operation

3.1 Before You BeginBefore powering up the enclosure, please ensure that all the modules are firmly seated in their correct bays.

3.2 Power On / Power DownCaution Do not operate the subsystem until the ambient temperature is within the specified operating range. If the

drives have been recently installed, ensure they have had time to acclimatize before operating them.

To Power On the enclosure.

• Apply AC power to the enclosure. Turn the PCMs to ON.

All LEDs on the I/O Panel should be lit (Green) when the enclosure power is activated (and the disk drive motors should start).

Important If AC power is lost for any reason, on restoration of power the enclosure will re-start automatically.

To power the enclosure down:• Switch off the PCMs installed in the Enclosure.

3.2.1 PCM LEDsThe PCM incorporates 4 LEDs, located above the On/Off switch. Please refer to Figure 1–4 and Table 1–2.

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3.2.2 I/O Panel LEDsThe I/O Panel LEDs fault and status conditions are shown in Figure 3–1.

Figure 3–1 I/O Panel LEDs

ITable 3–1 defines the LED indicators incorporated on the I/O module.

Table 3–1 I/O Module LEDs

LED Color STATUS Definition

Host Port 1 Expansion Port 1

Host Port 2 Expansion Port 2

Green ON OFF

•Incoming signal is GOOD•No connection or incorrect connection

Host Port 1 Expansion Port 1

Host Port 2 Expansion Port 2

Amber ON OFF

•Fault•No faults

I/O Module OK

Green ON OFF

•properly booted and functioning correctly internal fault

I/O Module Fault

Amber OFF ON

•No Faults present I/O Fault

I/O Module Identify

Blue ON OFF

•Receiving SES Command Not receiving SES Command

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Troubleshooting

Chapter 4

Troubleshooting and Problem Solving

4.1 Overview The IBM System Storage DCS9900 3S1 Storage Expansion Unit includes an Enclosure Services Processor and associated monitoring and control logic to enable it to diagnose problems within the enclosure’s power, cooling, and drive systems.

The sensors for power and cooling conditions are housed within the PCMs. Each unit is independently monitored.

Important Please wear safety goggles/eyewear when installing, checking, or performing maintenance on system equipment hardware and cables.

4.2 Initial Start-up Problems

4.2.1 Faulty Cords First check that you have wired up the subsystem correctly. If:

• cords are missing or damaged, • plugs are incorrect, • cords are too short,

Call your supplier for a replacement.

4.2.2 Alarm Sounds On Power Up

The Audible Alarm sounds anytime the top cover is open. The alarm mutes automatically once the cover is closed.

4.2.3 Green “Signal Good” LED on I/O Module Not LitCheck to ensure that the cables have not been reversed during installation.

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4.2.4 DCS9900 Doesn’t Recognize the 3S1 Subsystem

1 Check that the SAS interface cables from the 3S1enclosure to the DCS9900, or I/O controller, are fitted correctly.

2 Check that all drive carrier modules have been correctly installed.

3 Check that there is a valid SAS signal present at the I/O connector. If there is no signal present, ensure the cable has been properly inserted.

4 Check the I/O module setup as follows:– Ensure the I/O module has been correctly installed and all external links and cables are securely

fitted.– Ensure the maximum cable length has not been exceeded.

4.3 LEDsGreen LEDs are always used for good or positive indication. Amber LEDs indicate there is a critical fault present within the module. See specific LED tables for further information.

4.3.1 HDD (Hard Disk Drive)When a HDD is faulted, Table 4–1 describes the fault LED behavior.

• Under Normal conditions, the LEDs should all be illuminated constant GREEN• If a problem is detected, the color of the relevant LED will change to AMBER.

Table 4–1 HDD LEDs

Location Color Identifier Behavior

Enclosure front Amber Enclosure fault This LED is ON if enclosure has a fault.

Enclosure front Amber Drive fault This LED is ON if a drive has a fault.

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4.3.2 PCM (Power Cooling Module)The PCM LEDs are shown in Table 4–2.

• Under Normal conditions, the LEDs should all be illuminated constant GREEN• If a problem is detected, the color of the relevant LED will change to AMBER.

Table 4–2 PCM LEDs

Location Color LED Identifier Behavior

FRONT Enclosure Amber Enclosure fault This LED is ON with a PCM fault.

REAR Enclosure PCM

Amber PCM fault This LED is ON with an AC input, DC output, fan or other PCM fault.

REAR Enclosure PCM

Green AC OK This LED is ON with a DC or fan fault.This LED is OFF with an AC input failure.

REAR Enclosure PCM

Green DC OK This LED is ON with an AC or fan fault.This LED is OFF with an DC output failure

4.3.3 DEM (Drive Expander Module)The DEM fault LEDs are explained in Table 4–3.

• Under Normal conditions, the LEDs should all be illuminated constant GREEN• If a problem is detected, the color of the relevant LED will change to AMBER.

Table 4–3 DEM LEDs

Location Color LED Identifier Behavior

FRONT Enclosure Amber Enclosure fault ON with a DEM fault.

FRONT Enclosure Amber DEM fault ON with a DEM fault.

Internal (DEM) Enclosure

Amber DEM fault ON with a DEM fault.

Internal (DEM) Enclosure

Green DC OK ON when the DC voltage regulation is within limits. OFF with a DC output failure.

Internal (DEM) Enclosure

Green Expander MIPS ready

ON when the expander internal processor is booted and operating correctly.OFF when the expander internal processor is NOT booted or ready.

Internal (DEM) Enclosure

BLUE DEM identify ON indicates that this DEM is being sent an identify command by the SEP.

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4.3.4 I/O ModuleThe I/O fault LEDs are explained in Table 4–4.

• Under Normal conditions, the LEDs should all be illuminated constant GREEN• If a problem is detected, the color of the relevant LED will change to AMBER.

Table 4–4 I/O LEDs

Location Color LED Identifier Behavior

FRONT Enclosure Amber Enclosure fault ON with an I/O fault.

REAR Enclosure Green I/O OK OFF when an I/O module detectable fault is present.INDEPENDENT of SAS link fault condition and stays lit during a SAS link fault.

REAR Enclosure Amber I/O fault ON when a detectable fault is present in the I/O module.INDEPENDENT of SAS link fault condition and stays lit during a SAS link fault.

REAR Enclosure Green SAS Link Activity

ON when a valid link is present on any of the 4 links of the 4-wide port. OFF when none of the 4 links of the 4-wide port have a valid connection.

REAR Enclosure Amber SAS Link Fault ON when a fault is present on any of the 4 links of the 4-wide port. OFF when none of the 4 links of the 4-wide port have a fault.

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4.3.5 Front Panel Drive Activity IndicatorsThe Front Panel Drive Activity Indicators show the aggregated status of all the modules. This panel and its associated LEDs are shown in Figure 4–1. The Display Panel LEDs are defined in Table 4–5.

Figure 4–1 Front Panel Drive Activity Indicators Panel

Table 4–5 Display Panel LEDs

ICON LABEL COLOR Definition Normal Behavior

Shelf Identify BLUE enclosure Identify ON-SES is sending an Identify command. OFF-SES is NOT sending an Identify command

System Fault AMBER Enclosure Fault ON-one or more components within enclosure have failed. A service action is required. Exact failed component has its own amber fault LED lit. OFF-no detectable faults

System Power GREEN Enclosure Powered ON

ON - DC power is present OFF - DC power is NOT present LED does NOT flash under normal operating conditions.

Cover Open AMBER Enclosure cover is open

OFF-both cover pieces securely closed and latched in place. ON-either of the cover pieces is NOT securely closed and latched in place

DEM Fault AMBER DEM fault OFF-all DEMs operating correctly. ON-at least one DEM has failed; service action required

Drive Fault AMBER Drive fault ON-one or more HDDs are faulted. SES must determine exact HDD. OFF-no detectable drive faults

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4.4 TroubleshootingThe following sections describe common problems, with possible solutions, which can occur with your IBM System Storage DCS9900 3S1 Storage Expansion Unit.

4.4.1 Thermal ControlThe IBM System Storage DCS9900 3S1 Storage Expansion Unit uses extensive thermal monitoring and takes a number of actions to ensure component temperatures are kept low and also to minimize acoustic noise. Air flow is from the front, over the drive section, through the midplane, through the I/O modules to rear of the enclosure.

Symptom Cause Action

If the ambient air is cool (below 25 °C) and the fans are observed to increase in speed, then some restriction on airflow may be causing additional internal temperature rise.

Note: This is not a fault condition.

The first stage in the thermal control process is for the fans to automatically increase in speed when a thermal threshold is reached. This may be caused by higher ambient temperatures in the local environment and may be perfectly normal.

Note: This threshold changes according to the number of drives and PCMs fitted.

1 Check the installation for any airflow restrictions at either the front or rear of the enclosure. A minimum gap of 25mm at the front and 50mm at the rear is recommended.

2 Check for restrictions due to dust build-up; clean as appropriate.

3 Check for excessive re-circulation of heated air from rear to the front. Use in a fully enclosed rack installation is not recommended.

4 Check that all Blank modules are in place.

5 Reduce the ambient temperature.

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Troubleshooting

4.4.2 Thermal Alarm

Symptom Cause Action

• Display Panel PCM/Cooling Fault LED.

• An AMBER LED on one or more PCMs.

• Audible Alarm Sounding.

• Air temperature exiting PCM above 35°C.

If the internal temperature measured in the airflow through the enclosure exceeds a pre-set threshold, a thermal alarm will sound.

1 Check local ambient environment temperature is below the upper 40°C specification.

2 Check the installation for any airflow restrictions at either the front or rear of the enclosure. A minimum gap of 25mm at the front and 50mm at the rear is recommended.

3 Check for restrictions due to dust build-up. Clean as appropriate.

4 Check for excessive re-circulation of heated air from rear to the front. Use in a fully enclosed rack installation is not recommended.

5 If possible, shutdown the enclosure and investigate the problem before continuing.

4.4.3 Thermal ShutdownImportant An Enclosure will shut down when a critical temperature threshold is exceeded in order to prevent

permanent damage to the disk drives.

4.5 Dealing with Hardware FaultsEnsure that you have obtained a replacement module of the same type before removing any faulty module.

Warning If the IBM System Storage DCS9900 3S1 Storage Expansion Unit is powered up and you remove any module, replace it immediately. If the subsystem is used with modules or module blanks missing for more than a few minutes, the Enclosure can overheat, causing power failure and data loss. Such use will invalidate the warranty.

• Replace a faulty drive with a drive of the same type and equal or greater capacity.

• All the supplied plug-in PCMs, electronics modules, and blank modules must be in place for the air to flow correctly around the cabinet.

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4.6 Continuous Operation During Replacement Depending on how the subsystem is set up, if a disk unit fails, it can normally be replaced without interrupting the use of the system.

4.7 Replacing a ModuleWarning Whenever replacing a module NEVER leave an EMPTY bay in the rear of the enclosure, obtain a

replacement before removing the problem part.

Please refer to Chapter 2 , ”Getting Started” for information on the initial installation of the plug-in modules in the IBM System Storage DCS9900 3S1 Storage Expansion Unit.

Warning Observe all conventional ESD precautions when handling IBM System Storage DCS9900 3S1 Storage Expansion Unit modules and components. Avoid contact with Backplane components and module connectors, etc.

4.7.1 Power Cooling ModulesWarning Do not remove covers from the Power Cooling module (PCM). There is a danger of electric shock.

Return the PCM to your supplier for repair.

Warning To ensure your system has warning of a power failure please disconnect the power from the power supply, by either the switch (where present) or by physically removing the power source, prior to removing the PCM from the enclosure/shelf. Do not remove the faulty PCM unless you have a replacement unit of the correct type ready for insertion. The system must not be run without all units in place.

If a power supply unit or its fan is faulty, you must replace the whole PCM. You must not take any longer than 5 minutes to replace this unit to prevent the enclosure from over-heating.

As there should always be two (2) PCMs installed, you can continue working while replacing the faulty module.

To remove an AC PCM/Cooling Module- Handle Model:

Warning Do not remove the faulty PCM/Cooling module unless you have a replacement unit of the correct type ready for insertion.

If a power supply unit or its fan is faulty, you must replace the whole PCM/Cooling module.

As there should always be two PCMs installed, you can continue working while replacing the faulty module.

1 Make sure you identify the faulty PCM correctly from the two modules installed.

2 Lift latch which secures the power supply cord.

3 Switch off and disconnect the power supply cord.

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Troubleshooting

4 Lift the PCM handle to the open position to cam the PCM out of the enclosure.

5 Grip the handle and withdraw the PCM.

To remove an AC PCM - Thumb Screw Model:

Warning Do not remove the faulty PCM unless you have a replacement unit of the correct type ready for insertion.

If a power supply unit or its fan is faulty, you must replace the whole PCM.

As there should always be two PCMs installed, you can continue working while replacing the faulty module.

1 Make sure you identify the faulty PCM correctly from the two modules installed.

2 Lift latch which secures the power supply cord.

3 Switch off and disconnect the power supply cord.

4 Remove the two thumbscrews on the right and left sides of the unit.

5 Firmly grip the handle on the bottom of the unit and withdraw the PCM.

To install an AC PCM - Handle Model:

6 Check for damage, especially to the rear connector on the PCM.

Caution Handle the module carefully and avoid damaging the connector pins. Do not install the module if any pins appear to be bent.

7 With the PCM handle in the open position, slide the module into the enclosure.

8 Cam the module home by manually closing the PCM handle. A click should be heard as the handle latches engage.

9 Connect the power supply cord to the power source, secure the latch over the cord, and switch the power supply ON.

Note The alarm will sound until the new PCM is operating correctly.

To install an AC PCM - Thumbscrew Model:

1 Check for damage, especially to the rear connector on the PCM.

Caution Handle the module carefully and avoid damaging the connector pins. Do not install the module if any pins appear to be bent.

2 Slide the module into the enclosure and push unit you hear a click as the latch is engaged.

3 Secure the two thumbscrews on the left and right sides of the unit.

4 Connect the power supply cord to the power source; secure latch, and switch the power supply ON.

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Note The alarm will sound until the new PCM is operating correctly.

4.7.2 I/O ModuleWarning Do not remove this module unless a replacement can be immediately added. The system must not

be run without all units in place.

To remove the I/O Module:

1 Release the two latches on the bottom of the unit by simply pulling each latch out and away from unit.

2 Pull the latches forward to cam the module out of the enclosure.

3 Grip the unit securely and withdraw the module.

To installing the I/O Module:

4 With the latches in the open position, slide the EBOD module into the enclosure until the latch engages automatically.

5 Cam the module home by manually closing the latches. A click should be heard as the latch engages.

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Troubleshooting

4.7.3 Replacing the Drive Carrier ModuleWarning Observe all conventional ESD precautions when handling IBM System Storage DCS9900 3S1

Storage Expansion Unit modules and components. Avoid contact with backplane components and module connectors, etc.

Instructions are also clearly labeled on the inside cover of the enclosures.

Figure 4–2 Drive Carrier - Handle Released

Caution Drive spin down Damage can occur to a drive if it is removed while still spinning. If possible, use the operating system to spindown the drives prior to removal. If this is not possible, we recommend that you perform All steps of the following procedure to ensure that the drive has stopped prior to removal:

To Insert the Drive Carrier Module

1 Release the carrier handle by sliding the latch backwards.

2 Insert the carrier into the enclosure.

3 Slide the drive carrier, gently, all the way into the enclosure.

4 Cam the drive carrier home. The camming foot on the base of the carrier will engage into a slot in the enclosure.

5 When the carrier is fully home, close the handle. You should hear a click as the latch engages and holds the handle closed.

6 Close the enclosure.

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4.8 Replacing the DEMImportant The DEM card should only be replaced by trained personnel. The handle rib will light up BLUE for

service.

Warning Observe all conventional ESD precautions when handling Storage Scaler 6000 modules and components. Avoid contact with backplane components and module connectors, etc.

Instructions are also clearly labeled on the inside cover of the enclosures (Figure 4–3).

Figure 4–3 DEM Removal Label

To Replace the DEM

1 Grip the top latch, rotate it until you reach the limit of rotation, and then pull up to remove the DEM.

2 Insert the replacement DEM.

3 Press on the latch to rotate it down to lock it into place.

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Troubleshooting

4.9 Spare Parts and Ancillary ItemsTable 4–6 displays the replaceable parts that are available for IBM System Storage DCS9900 3S1 Storage Expansion Unit:

Table 4–6 IBM MTM 1269-3S1 SAS Disk Chassis FRUs

Part Number Description

46M5802 1269-3S1 SAS/SATA disk chassis assembly FRU (include chassis, backplane and baseplane)

46M5803 SAS DEM card FRU

46M5804 Bezel FRU

46M5805 1865W Power Cooling (PCM) plug in module FRU

46M5736 Power cord FRU

46M5806 Input/Output module FRU

46M5807 rail kit FRU

46M5808 146GB SAS HDD FC 3231 FRU (5X12)

46M5809 300GB SAS HDD FC 3232 FRU (5X12)

46M5810 450GB SAS HDD FC 3233 FRU (5X12)

46M5811 500GB SATA HDD FC 3201 FRU (5X12)

46M5812 750GB SATA HDD FC 3202 FRU (5X12)

46M5813 1000GB SATA HDD FC 3203 FRU (5X12)

46M5814 cable management arm FRU KIT

49Y4165 Drive blank Filler FRU

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4.10 Bezel Installation1 Unpack the 1269-3S1 bezel and locate the bag containing four (4) screws (Figure 4–4)

Figure 4–4 1269-3s1 Bezel and bag with four screws

2 Align the bezel to the 3S1 enclosure front panel (Figure 4–5). The chassis’ four (4) metal pins align into the matching sockets in the bezel.

Figure 4–5 Attaching bezel to enclosure front panel.

Slide 3S1 chassis forward into openposition before attaching bezel.

LED light pipes will align into matching holes in the3S1 chassis.

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Troubleshooting

3 Use a phillips (+) screwdriver to fasten the four (4) screws in the four (4) corners of the bezel as shown in Figure 4–6.

Figure 4–6 Attaching bezel with phillips head screw driver.

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ADrive Enclosure Addressing

A.1 Background

This sections explains the drive enclosure addressing of the disk enclosures for the IBM DCS9900 3S1 StorageExpansion Unit Drive Enclosure. There are two drive numbering options:

• 1 x 60 (one set of drives 1 through 60); (Figure A–1, Figure A–4, and Figure A–5).

• 2 x 30 (two sets of drives 1 through 30); (Figure A–2 and Figure A–6).

• 4 X 15 (four sets of drives 1 through 15); (Figure A–3 and Figure A–7).

Figure A–1 1 x 60 Drive Layout Configuration

Figure A–2 2 x 30 Drive Layout Configuration

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Figure A–3 4 x 15 Drive Layout Configuration

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Figure A–4 IBM DCS9900 3S1 Storage Expansion Unit - 1x60 Configuration

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Figure A–5 IBM DCS9900 3S1 Storage Expansion Unit - Daisy Chain Configuration for 2 Rack 20 Drawer

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Figure A–6 IBM DCS9900 3S1 Storage Expansion Unit - 2x30 Configuration

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Figure A–7 IBM DCS9900 3S1 Storage Expansion Unit - 4 x 15 Configuration

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B Rack-Mounting the IBM DCS9900 3S1 Storage Expansion Unit System

The IBM DCS9900 3S1 Storage Expansion Unit System is designed to fit within a 4U rack space. Follow thesesteps to mount the system in your rack:

1. Using eight (8) 32 0.188" Phillips panhead screws for each slider, attach the four (4) inner sliders to thechassis as shown in Figure B-1. below.

2.Loosen the nine (9) screws on the rail kit and set the length to fit the depth of your rackFigure B-2.. Tighten all the screws once the rail kit is set to the desired length. Repeat forthe other rail kit.

3.Attach the two (2) rail kits to your rack as shown in Figure B-2.. Make sure you leaveenough space for the unit—bottom of screw plate aligns to bottom of IBM DCS9900 3S1Storage Expansion Unit System chassis. At the front, use one (1) screw plate, one (1)

Figure B-1. Attach 4 Inner Sliders to Chassis

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Platecrews

A Brackets

shelf locking bracket (installed from behind), and six (6) #10 screws. For the rear end,use one (1) screw plate and four (4) #10 screws.

4.If the depth of your rack is more than 25.5inches (647mm), attach the two (2) CableManagement Arm (CMA) brackets to the rear end of the rail kits Figure B-2..

5.Using two (2) 10-320.50” (100d) Phillips flathead screws for each CMA, attach the CMAto the CMA brackets Figure B-3.. If the depth of your rack is 25.5inches (647mm) or less,attach the CMA directly to the rack, above the rail kits. For square-hole rack, add 100d#10 shoulder washers.

Figure B-2. Attach Rail Kits to Rack

Attach Screw Platewith (6) #10 Screws

Shelf Locking Bracketinstalled from Behind

Bottom of Screw Plate Alignsto Bottom of Chassis

Front of Rack

Attach Screwwith (4) #10 S

Attach (2) CM

Loosen (9) Screws toAdjust Rail Kit Length

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A to Chassis with.25” Phillips

Screws

6.With the help of a partner, hold the chassis close to the rail kits. Align the rear flanges onchassis with the rail kit flanges Figure B-3. and slide the chassis into rack until the slidersare engaged (slide in about 12 inches until stopped). Then slide the chassis out untillocked. Depress the slider locks and proceed to slide the chassis all the way in.

7.Using two (2) 8-320.25” Phillips panhead screws, secure the two CMA to rear of chassis.

Figure B-3. Install Chassis to Rack

Rail Kit Flange(Rear Flange of Chassismust set on Rail Kit Flange)

Rear Flange on Chassis

Attach CM(2) 8-32x0Panhead

Attach CMA with(2) 10-32x0.50” (100d)Phillips Flathead Screws(Add 100d #10 Shoulder Washersfor Square-Hole Rack)

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C 4x15 to 2x30 to 1x60 Migration

C.1 IntroductionThis section provides instructions to convert a 3-box configuration to a 5-box configuration or a 5-boxconfiguration to a 10-box configuration for the DCS9900 1269-3S1.

C.2 To convert from a 3-box to a 5-box configuration:

1. Offload all data.

2. Shutdown your system by powering down all enclosures and DCS9900s.

3. Adjust the dip switch configuration on the enclosures. The dip switch is located on the lower right sideof the LED board on the front of the enclosure. Switch 3 which is in the raised position will need to bepushed to the down position (<Reference>Figure C–1).

4. Install the 2 additional enclosures in the rack. <Reference>Figure C–2 shows 3-box enclosureconfiguration.

5. Re-cable system as shown in <Reference>Figure C–3.

6. Label the physical drives at this time so that you know into which tier/channel they should be re-installed.

7. Install the drives in their new locations.

NOTE : INCORRECT DRIVE PLACEMENT CAN RESULT IN DATA LOSS OR DATA CORRUPTION

Figure C–1 Front Panel Dip Switch Settings

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8. Boot up the DCS9900 Controller 1.

9. Change tier mapping from SAS-4X to SAS-2X. If possible, do this before the controller finishes booting.

10. Boot up the DCS9900 Controller 2.

11. Change tier mapping to SAS-2X.

12. Verify the health of both systems before returning to normal production executing the following CLIcommands:

• DISK• TIER• FAULTS• SES SHOW DEVICES• LUN VERIFY=ON

C.3 To convert from a 5-box to a 10-box configuration:

1. Stop all I/O on the system.

2. Install the 5 additional enclosures in the rack. The DCS9900s will need to be in the middle with 5enclosures above (new) and 5 enclosures below (existing).

3. Re-cable as shown in <Reference>Figure C–4. Assume the 5 new enclosures go above the 5 existingenclosures.

4. Label the physical drives at this time so that you know into which tier/channel they should be re-installed.

5. Install the drives in their new locations.

NOTE : INCORRECT DRIVE PLACEMENT CAN RESULT IN DATA LOSS OR DATA CORRUPTION

6. Boot up the DCS9900 Controller 1.

7. Change tier mapping from SAS-2X to SAS-1X. If possible, do this before the controller finishes booting.

8. Boot up the DCS9900 Controller 2.

9. Change tier mapping to SAS-1X.

10. Verify the health of both systems before returning to normal production executing the following CLIcommands:

• DISK• TIER• FAULTS• SES SHOW DEVICES• LUN VERIFY=ON

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C.4 3-box Cabling Enclosures:

Figure C–2 IBM DCS9900 3S1 Storage Expansion Unit - 4 x 15 Configuration

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C.5 5-box Cabling Enclosures:

Figure C–3 IBM DCS9900 3S1 Storage Expansion Unit - 2x 30 Configuration

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C.6 10-box Cabling Enclosures:

Figure C–4 IBM DCS9900 3S1 Storage Expansion Unit - 1x60 Configuration

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Table of Contents

Best practice for mixing SAS and SATA drives in the DCS9900 1269 – 3S1..................................3 1.0 Introduction ...........................................................................................................................3 2.0 Related documents ...............................................................................................................3 3.0 Terminology ..........................................................................................................................3 4.0 Disk drive placement rules and considerations.....................................................................6 4.1 Sample drive population scenarios….………………………………………….…………………7 5.0 MES disk drive population rules............................................................................................8 6.0 Enclosure bay numbering convention ...................................................................................8

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Best practice for mixing SAS and SATA drives in the DCS9900 1269 – 3S1

1 Introduction This document provides information and guidelines for SAS and SATA drive placement in the IBM® DCS9900 1269 - 3S1 enclosure. It also addresses some concerns about performance expectations and Rotational Vibration Interference (RVI) in mixed SAS and SATA environments.

2 Related documents • DCS9900 1269-CP2 Installation, Service, and User Guide • DCS9900 1269-3S1 Storage Expansion Unit Installation, Service, and User Guide

3 Terminology Bay: A bay is a compartment in the enclosure drawer that contains either a drive or a blank carrier. The DCS9900 1269 - 3S1 enclosure drawer has 60 bays (see Figure 1).

Figure 1. DCS9900 1269 - 3S1, 60 empty bays (top view)

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Row: An enclosure drawer row consists of 12 bays across. The DCS9900 1269 - 3S1 60-bay enclosure drawer has 5 rows of 12 bays (see Figure 2).

Figure 2. DCS9900 1269 - 3S1, 5 rows (top view)

Column: An enclosure drawer column consists of 5 bays from front to rear. The DCS9900 1269 - 3S1 60-bay enclosure drawer has 12 columns of 5 bays (see Figure 3).

Figure 3. DCS9900 1269 - 3S1, 12 columns (top view)

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Section: An enclosure drawer section consists of 6 contiguous bays on either the left or right side of the middle divider. The DCS9900 1269 - 3S1 60-bay enclosure drawer has 10 sections of 6 bays (see Figure 4).

Figure 4. DCS9900 1269 - 3S1, 10 sections (top view)

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4 Disk drive placement rules and considerations • SAS drives generate more heat than SATA drives. Populate the DCS9900 1269 - 3S1 with SAS drives

starting in the front of the enclosure to keep a spatial separation between these hotter drives and the hottest part of the enclosure, the rear (see Figure 5).

• Rotational Vibration Interference (RVI) can negatively affect the performance of the slower spinning SATA drives when they are seated next to the faster spinning SAS drives. To reduce RVI, always keep SAS and SATA drives in separate sections (see Figure 6).

Note: When SAS and SATA drives are randomly mixed in one enclosure, up to a 15% reduction in performance of the SATA drives can occur. Follow the rules and considerations in this document to help reduce the effects of RVI as much as possible, which is typically up to 1%.

• For the DCS9900 1269 - 3S1 in 1X Mode, you can populate one section with SAS drives and the adjoining section with SATA drives (see Figure 6).

• To maintain proper air flow, each bay in the enclosure must contain a drive or a blank carrier (see Figure 7).

• Plan the initial population of the enclosure for future intermix expansion, as follows:

Minimum number of drives per enclosure is 15 Initial quantity of SAS drives is 6 or more Initial quantity of SATA drives is 6 or more Maximum quantity of SAS drives is 54 Maximum quantity of SATA drives is 54 Do not intermix SAS and SATA drives in the same six-drive section Install SAS drives from front to back (filling each six-drive section) Install SATA drives from back to front (filling each six-drive section) Fill all empty bays with blank carriers

• After the initial population, you can add only drives in full sections of the same type or blank carriers.

Note: If you add just one drive at a time, be sure to fill all remaining bays with blank carriers.

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4.1 Sample drive population scenarios

Figure 5. DCS9900 1269 - 3S1 SAS and SATA drive load (top view)

Figure 6. DCS9900 1269 - 3S1 with a mixed-load configuration of 6 SAS tiers and 54 SATA tiers (top view)

Figure 7: DCS9900 1269 - 3S1 with a 1X configuration of 16 SATA tiers, 8 SAS tiers, and 36 blank carriers (top view)

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5 MES disk drive population rules MES is supported only on configurations that are initially ordered with intermix planned. The rules are as follows:

• Minimum number of SAS drives is 6 • Maximum number of SAS drives is 54 • Minimum number of SATA drives is 6 • Maximum number of SATA drives is 54 • Do not intermix SAS and SATA drives in the same six-drive section • Install SAS drives from front to back (filling each six-drive section) • Install SATA drives from back to front (filling each six-drive section) • Fill all empty bays with blank carriers

6 Enclosure bay numbering convention Attention: To avoid potential damage and ensure proper airflow and cooling for the drives, do not operate the

enclosure if any of the plug-in modules are missing from the rear of the enclosure. Always verify that all rear apertures are filled before operating the enclosure.

The IBM DCS9900 3S1 subsystem is housed in a 60-bay enclosure and is arranged in two (2) groups. Each group consists of two 15-bay banks; that is (as viewed from the front), 12 bays across the enclosure by 5 bays deep. The numbering convention for the 1x60 configuration supports SAS and SATA drive intermix. The 2x30 configuration is not supported for SAS and SATA intermix. When viewed from above, the drive bays are numbered in accordance with the tables provided in Figure 8. SAS tiers: 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25 SATA tiers: 6, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58,59, 60 Blank carriers: 26, 27, 28, 29, 30, 31, 32, 33, 34, 35 The DCS9900 3S1 enclosure contains eight (8) top-loadable, hot-swappable Drive Expander Modules (DEMs). The DEMs provide the SAS connectivity between the I/O module and the hard disk drives in the enclosure. Based on the location of a hard disk drive installed in the enclosure, each DEM connects to a single port of the drive, provides power-control signals to each drive bay, controls the drive identify and service LEDs, and monitors the status from its partner DEM. A fully configured system contains 8 DEMs and each DEM pair supports 15 drives.

Figure 8: DCS9900 1269 – 3S1 enclosure with a 1x60 configuration of 25 SATA tiers, 25 SAS tiers, 10 blank carriers, and 8 DEMs

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E Notices

This information was developed for products and services offered in the U.S.A.

IBM® may not offer the products, services, or features discussed in this document inother countries. Consult your local IBM representative for information on theproducts and services currently available in your area. Any reference to an IBMproduct, program, or service is not intended to state or imply that only that IBMproduct, program, or service may be used. Any functionally equivalent product,program, or service that does not infringe any IBM intellectual property right may beused instead. However, it is the user’s responsibility to evaluate and verify theoperation of any non-IBM product, program, or service.

IBM may have patents or pending patent applications covering subject matterdescribed in this document. The furnishing of this document does not give you anylicense to these patents. You can send license inquiries, in writing, to:

IBM Director of LicensingIBM CorporationNorth Castle DriveArmonk, NY 10504-1785U.S.A.

INTERNATIONAL BUSINESS MACHINES CORPORATION PROVIDES THISPUBLICATION “AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESSOR IMPLIED, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIESOF NON-INFRINGEMENT, MERCHANTABILITY OR FITNESS FOR APARTICULAR PURPOSE. Some states do not allow disclaimer of express orimplied warranties in certain transactions, therefore, this statement may not apply toyou.

This information could include technical inaccuracies or typographical errors.Changes are periodically made to the information herein; these changes will beincorporated in new editions of the publication. IBM may make improvements and/orchanges in the product(s) and/or the program(s) described in this publication at anytime without notice.

Any references in this information to non-IBM Web sites are provided forconvenience only and do not in any manner serve as an endorsement of thoseWeb sites. The materials at those Web sites are not part of the materials for thisIBM product, and use of those Web sites is at your own risk.

IBM may use or distribute any of the information you supply in any way it believesappropriate without incurring any obligation to you.

TrademarksIBM, the IBM logo, and ibm.com are trademarks or registered trademarks ofInternational Business Machines Corporation in the United States, other countries,or both. If these and other IBM trademarked terms are marked on their firstoccurrence in this information with a trademark symbol (® or ™), these symbolsindicate U.S. registered or common law trademarks owned by IBM at the time thisinformation was published. Such trademarks may also be registered or common lawtrademarks in other countries. A current list of IBM trademarks is available on theWeb at “Copyright and trademark information” at http://www.ibm.com/legal/copytrade.shtml.

© Copyright IBM Corp. 2009 E-1

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Adobe and PostScript are either registered trademarks or trademarks of AdobeSystems Incorporated in the United States and/or other countries.

Cell Broadband Engine is a trademark of Sony Computer Entertainment, Inc., in theUnited States, other countries, or both and is used under license therefrom.

Intel, Intel Xeon, Itanium, and Pentium are trademarks or registered trademarks ofIntel Corporation or its subsidiaries in the United States and other countries.

Java and all Java-based trademarks are trademarks of Sun Microsystems, Inc., inthe United States, other countries, or both.

Linux is a registered trademark of Linus Torvalds in the United States, othercountries, or both.

Microsoft, Windows, and Windows NT are trademarks of Microsoft Corporation inthe United States, other countries, or both.

UNIX is a registered trademark of The Open Group in the United States and othercountries.

Other company, product, or service names may be trademarks or service marks ofothers.

Important notesProcessor speed indicates the internal clock speed of the microprocessor; otherfactors also affect application performance.

CD or DVD drive speed is the variable read rate. Actual speeds vary and are oftenless than the possible maximum.

When referring to processor storage, real and virtual storage, or channel volume,KB stands for 1024 bytes, MB stands for 1 048 576 bytes, and GB stands for1 073 741 824 bytes.

When referring to hard disk drive capacity or communications volume, MB standsfor 1 000 000 bytes, and GB stands for 1 000 000 000 bytes. Total user-accessiblecapacity can vary depending on operating environments.

Maximum internal hard disk drive capacities assume the replacement of anystandard hard disk drives and population of all hard disk drive bays with the largestcurrently supported drives that are available from IBM.

Maximum memory might require replacement of the standard memory with anoptional memory module.

IBM makes no representations or warranties with respect to non-IBM products.Support (if any) for the non-IBM products is provided by the third party, not IBM.

Some software might differ from its retail version (if available) and might not includeuser manuals or all program functionality.

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Electronic emission notices

Federal Communications Commission (FCC) statementNote: This equipment has been tested and found to comply with the limits for aClass A digital device, pursuant to Part 15 of the FCC Rules. These limits aredesigned to provide reasonable protection against harmful interference when theequipment is operated in a commercial environment. This equipment generates,uses, and can radiate radio frequency energy and, if not installed and used inaccordance with the instruction manual, may cause harmful interference to radiocommunications. Operation of this equipment in a residential area is likely to causeharmful interference, in which case the user will be required to correct theinterference at his own expense.

Properly shielded and grounded cables and connectors must be used in order tomeet FCC emission limits. IBM is not responsible for any radio or televisioninterference caused by using other than recommended cables and connectors or byunauthorized changes or modifications to this equipment. Unauthorized changes ormodifications could void the user’s authority to operate the equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to thefollowing two conditions: (1) this device may not cause harmful interference, and (2)this device must accept any interference received, including interference that maycause undesired operation.

Industry Canada Class A emission compliance statementThis Class A digital apparatus complies with Canadian ICES-003.

Avis de conformité à la réglementation d’Industrie CanadaCet appareil numérique de la classe A est conforme à la norme NMB-003 duCanada.

Australia and New Zealand Class A statementAttention: This is a Class A product. In a domestic environment this product maycause radio interference in which case the user may be required to take adequatemeasures.

European Union EMC Directive conformance statementThis product is in conformity with the protection requirements of EU CouncilDirective 2004/108/EC on the approximation of the laws of the Member Statesrelating to electromagnetic compatibility. IBM cannot accept responsibility for anyfailure to satisfy the protection requirements resulting from a nonrecommendedmodification of the product, including the fitting of non-IBM option cards.

This product has been tested and found to comply with the limits for Class AInformation Technology Equipment according to CISPR 22/European Standard EN55022. The limits for Class A equipment were derived for commercial and industrialenvironments to provide reasonable protection against interference with licensedcommunication equipment.

Attention: This is a Class A product. In a domestic environment this product maycause radio interference in which case the user may be required to take adequatemeasures.

E Notices E-3

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European Community contact:IBM Technical RegulationsPascalstr. 100, Stuttgart, Germany 70569Telephone: 0049 (0)711 785 1176Fax: 0049 (0)711 785 1283E-mail: [email protected]

Taiwanese Class A warning statement

Germany Electromagnetic Compatibility DirectiveDeutschsprachiger EU Hinweis:

Hinweis für Geräte der Klasse A EU-Richtlinie zur ElektromagnetischenVerträglichkeit

Dieses Produkt entspricht den Schutzanforderungen der EU-Richtlinie 2004/108/EGzur Angleichung der Rechtsvorschriften über die elektromagnetische Verträglichkeitin den EU-Mitgliedsstaaten und hält die Grenzwerte der EN 55022 Klasse A ein.

Um dieses sicherzustellen, sind die Geräte wie in den Handbüchern beschrieben zuinstallieren und zu betreiben. Des Weiteren dürfen auch nur von der IBMempfohlene Kabel angeschlossen werden. IBM übernimmt keine Verantwortung fürdie Einhaltung der Schutzanforderungen, wenn das Produkt ohne Zustimmung derIBM verändert bzw. wenn Erweiterungskomponenten von Fremdherstellern ohneEmpfehlung der IBM gesteckt/eingebaut werden.

EN 55022 Klasse A Geräte müssen mit folgendem Warnhinweis versehen werden:“Warnung: Dieses ist eine Einrichtung der Klasse A. Diese Einrichtung kann imWohnbereich Funk-Störungen verursachen; in diesem Fall kann vom Betreiberverlangt werden, angemessene Maßnahmen zu ergreifen und dafür aufzukommen.”

Deutschland: Einhaltung des Gesetzes über dieelektromagnetische Verträglichkeit von GerätenDieses Produkt entspricht dem “Gesetz über die elektromagnetische Verträglichkeitvon Geräten (EMVG)”. Dies ist die Umsetzung der EU-Richtlinie 2004/108/EG inder Bundesrepublik Deutschland.

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Zulassungsbescheinigung laut dem Deutschen Gesetz über dieelektromagnetische Verträglichkeit von Geräten (EMVG) (bzw. derEMC EG Richtlinie 2004/108/EG) für Geräte der Klasse ADieses Gerät ist berechtigt, in Übereinstimmung mit dem Deutschen EMVG dasEG-Konformitätszeichen - CE - zu führen. Verantwortlich für dieKonformitätserklärung des EMVG ist die IBM Deutschland GmbH, 70548 Stuttgart.

Generelle Informationen:

Das Gerät erfüllt die Schutzanforderungen nach EN 55024 und EN 55022Klasse A.

People's Republic of China Class A warning statement

Japanese Voluntary Control Council for Interference (VCCI) statement

Korean Class A warning statement

E Notices E-5

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IBM Taiwan product service

IBM Taiwan product service contact information:IBM Taiwan Corporation3F, No 7, Song Ren Rd.Taipei, TaiwanTelephone: 0800-016-888

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