dezső sima 2011 december (ver. 1.5) sima dezső, 2011 platforms ii

Dezső Sima

2011 December

(Ver. 1.5) Sima Dezső, 2011

Platforms II.

3. Platform architectures

Contents

3.1. Design space of the basic platform architecture•

3.2. DT platforms

3. Platform architectures•

3.2.1. Design space of the basic architecture of DT platforms

3.2.2. Evolution of Intel’s home user oriented multicore DT platforms

•

•

•

3.2.3. Evolution of Intel’s business user oriented multicore DT platforms

•

3.3. DP server platforms•

3.3.1. Design space of the basic architecture of DP server platforms

•

3.3.2. Evolution of Intel’s low cost oriented multicore DP server platforms

•

3.3.3. Evolution of Intel’s performance oriented multicore DP server platforms

•

Contents

3.4. MP server platforms•

3.4.2. Evolution of Intel’s multicore MP server platforms•

3.4.3. Evolution of AMD’s multicore MP server platforms•

3.4.1. Design space of the basic architecutre of MP server platforms

•

3.1. Design space of the basic platform architecture

3.1 Design space of the basic platform architecture (1)

Platform architecture

Architecture of theprocessor subsystem

• Interpreted only for DP/MP systems• In SMPs: Specifies the interconnection of the processors and the chipset• In NUMAs: Specifies the interconnections between the processors

Specifies

MCH

ICH

P P P P

MCH

..

..

. .

ICH

P P P P

• Memory is attached to the MCH• There are serial FB-DIMM channels

Processors are connected to the MCH by individual buses

Architecture of the I/O subsystem

Specifies the structure of the I/O subsystem

(Will not be discussed)

Example: Core 2/Penryn based MP platform

MCH

..

..

. .

ICH

P P P P

The chipset consist of two partsdesignated as the MCH and the ICH

FSB

Architecture of thememory subsystem

• the point and • the layout

of the interconnection

The notion of Basic platform architecture





Basic platform architecture


SMP systems

Architecture of the processor subsystem

NUMA systems

Scheme of attaching the processors

to the rest of the platform

Scheme of interconnecting the processors

MCH

ICH

P P P P

FSB

P

..

..

..

..

..

..

PP

..

..

..

..

..

..

P

Examples


Interpreted only for DP and MP systems.The interpretation depends on whether the multiprocessor system is an SMP or NUMA


a) Scheme of attaching the processors to the rest of the platform

(In case of SMP systems)

Scheme of attaching the processors to the rest of the platform

DP platforms MP platforms

MCH

P P P P

Memory MCH

P P P P

Memory MCH

..

P P P P

Memory

P P

Memory MCH

P P

MemoryMCH

Dual FSBsSingle FSB Dual FSBsSingle FSB Quad FSBs


b) Scheme of interconnecting the processors

(In case of NUMA systems)

PP

PP

PP

PP

Fully connected mesh

Memory

Memory

Memory

Memory

Memory

Memory

Memory

Memory

Partially connected mesh

Scheme of interconnecting the processors


The notion of Basic platform architecture







Architecture of the memory subsystem (MSS)

Layout of the interconnection

Point of attachingthe MSS



MCH Memory

MemoryProcessor

?

Point of attaching the MSS

a) Point of attaching the MSS (Memory Subsystem) (1)

Platform

Platform


Attaching memory to the MCH (Memory Control Hub)


Attaching memory to the processor(s)

Point of attaching the MSS (2)

• Longer access time (~ 20 – 70 %), • Shorter access time (~ 20 – 70 %),

• As the memory controller is on the processor die, the memory type (e.g. DDR2 or DDR3) and speed grade is bound to the processor chip design.

• As the memory controller is on the MCH die, the memory type (e.g. DDR2 or DDR3) and speed grade is not bound to the processor chip design.


Attaching memory to the MCH (Memory Control Hub)



DT platforms DP/MP platformsDT platforms DP/MP platforms

DT Systems with off-die memory controllers

DT Systems with on-die memory controllers

Shared memory DP/MP systems

Distributed memory DP/MP systems

SMP systems

(SymmetricalMultiporocessors)

(Systems w/ non uniformmemory access)

NUMA systems

Related terminology


Attaching memory to the MCH



MCH

ICH

FSB

Processor

MCH

ICH

FSB

Processor

Intel’s processors before Nehalem Intel’s Nehalem and subsequent processors

Memory

Memory

Example 1: Point of attaching the MSS in DT systems

DT System with off-die memory controller DT System with on-die memory controller

Examples


Intel’s processors before Nehalem

• Shared memory DP server aka Symmetrical Multiprocessor (SMP)

• Memory does not scale with the number of processors

MCH

ICH

FSB

ProcessorProcessor

Memory

• Distributed memory DP server aka System w/ non-uniform memory access (NUMA)

• Memory scales with the number of processors

Intel’s Nehalem and subsequent processors

MCH

ICH

FSB

MemoryMemory ProcessorProcessor

Attaching memory to the MCH



Example 2: Point of attaching the MSS in SMP-based DP servers

Examples



Attaching memory to the processor(s) Attaching memory to the MCH

POWER4 (2C) (2001) POWER5 (2C) (2005)and subsequent POWER families

Montecito (2C) (2006)

Opteron server lines (2C) (2003)and all subsequent AMD lines

PA-8800 (2004)PA-8900 (2005)

and all previous PA lines

Core 2 Duo line (2C) (2006)and all preceding Intel lines

Core 2 Quad line (2x2C) (2006/2007)Penryn line (2x2C) (2008)

Figure: Point of attaching the MSS

Nehalem lines (4) (2008)and all subsequent Intel lines

Examples

Tukwila (4C) (2010??)

AMD’s K7 lines (1C) (1999-2003)

UltraSPARC III (2001)and all subsequent Sun lines

UltraSPARC II (1C) (~1997)


Figure: Attaching memory via parallel channels or serial links


Attaching memoryvia parallel channels

Attaching memory via serial links

Data are transferred overparallel buses

Data are transferred overpoint-to-point links in form of packets

01

E.g: 16 cycles/packet on a 1-bit wide link

15

E.g: 4 cycles/packet on a 4-bit wide link

01

MC

t

MC

t

MC

t

101

100

E.g: 64 bits data + address, command andcontrol as well as clock signals in each cycle

b) Layout of the interconnection


b1) Attaching memory via parallel channels

The memory controller and the DIMMs are connected

Example 1: Attaching DIMMs via a single parallel memory channel to the memory controller that is implemented on the chipset [45]


• by a single parallel memory channel• or a few number of memory channels

to synchron DIMMs, such as SDRAM, DDR, DDR2 or DDR3 DIMMs.

Example 2: Attaching DIMMs via 3 parallel memory channels to memory controllers implemented on the processor die

(This is actually Intel’s the Tylersburg DP platform, aimed at the Nehalem-EP processor, used for up to 6 cores) [46]


The number of lines needed depend on the kind of the memory modules, as indicated below:

SDRAM

DDR

DDR2

DDR3

168-pin

184-pin

240- pin

240-pin

All these DIMM modules provide an 8-byte wide datapath and optionally ECC and registering.

The number of lines of the parallel channels



Serial links attach FB-DIMMs

..

..

..

Serial

link

Serial

link

..

FB-DIMMs provide buffering and S/P conversion

Proc./MCH

Serial links attach S/P converters w/ parallel channels

Proc./MCH

S/P

..

..

..

S/P

..

..

..

Serial

link

Serial

link

..


b2) Attaching memory via serial links

Serial memory links are point-to-point interconnects that use differential signaling.

65 nm Pentium 4 Prescott DP (2x1C)/

Core2 (2C/2*2C)

E5000 MCH

631*ESB/632*ESB IOH

FSB

65 nm Pentium 4 Prescott DP (2C)/Core2 (2C/2*2C)

FB-DIMMw/DDR2-533

Xeon 5000(Dempsey)

2x1C

Xeon 5100(Woodcrest)

2C

Xeon 5300(Clowertown)

2x2C

/ /

ESI

ESI: Enterprise System Interface 4 PCIe lanes, 0.25 GB/s per lane (like the DMI interface,

providing 1 GB/s transfer rate in each direction)

Xeon 5400(Harpertown)

2x2C


2C

// /

Example 1: FB-DIMM links in Intel’s Bensley DP platform aimed at Core 2 processors-1


Example 2: SMI links in Intel’s the Boxboro-EX platform aimed at the Nehalem-EX processors-1


Nehalem-EX (8C) Westmere-EX

(10C)

QPI

QPI

DDR3-1067

SMB

SMB

SMB

SMB

ICH10

ESI

DDR3-1067

SMB

SMB

SMB

SMB

7500 IOH

QPI

Nehalem-EX aimed Boxboro-EX scalable DP server platform (for up to 10 cores)

or

Xeon 6500(Nehalem-EX)

(Becton)

Xeon E7-2800(Westmere-EX)

ME

SMI: Serial link between the processor and the SMB

SMB: Scalable Memory Buffer with Parallel/serial conversion

SMI links SMI links


(10C)

• The SMI interface builds on the Fully Buffered DIMM architecture with a few protocol changes, such as those intended to support DDR3 memory devices. • It has the same layout as FB-DIMM links (14 outbound and 10 inbound differential lanes as well as a few clock and control lanes).

• It needs altogether about 50 PC trails.

Example 2: The SMI link of Intel’s the Boxboro-EX platform aimed at the Nehalem-EX processors-2 [26]


SMB

..

. .




Serial links attach S/P-converters w/ par. channels

Att

ach

ing

mem

ory

to t

he p

rocessor(

s)

Poin

t of

att

ach

ing

mem

ory

Att

ach

ing

mem

ory

to

th

e M

CH

P

S/P

..

..

S/P

..

..

..

S/P

..

..

.. ..

S/P

..

... .P

. .

MCH

..

S/P

..

..

..

S/P

..

... .MCH

PP

..

..

..

..

..

..

..

..

..

. .


MCH

PP

..

..

. .

..

..

. . . .

..

..

. .

Parallel channels attachDIMMs

Design space of the architecture of the MSS


Subsequent fields from left to right and from top to down of the design space of the architecture of MSS allow to implement an increasing number of memory channels (nM), as discussed in Section 4.2.5 and indicated in the next figure.

Max. number of memory channels that can be implemented while using particular design options of the MSS


..

. .




Serial links attach S/P-converters w/ par. channels

Att

ach

ing

mem

ory

to t

he p

rocessor(

s)

Poin

t of

att

ach

ing

mem

ory

Att

ach

ing

mem

ory

to

th

e M

CH

P

S/P

..

..

S/P

..

..

..

S/P

..

..

.. ..

S/P

..

... .P

. .

MCH

..

S/P

..

..

..

S/P

..

... .MCH

PP

..

..

..

..

....

..

..

..

. .


MCH

PP

..

..

. .

..

..

. . . .

..

..

. .

nC

Parallel channels attachDIMMs

Design space of the architecture of the MSS


The design space of the basic platform architecture-1







The design space of the basic platform architectures-2

Obtained as the combinations of the options available for the main aspects discussed.



Scheme of attaching the processors

(In case of SMP systems)

Scheme of interconnectingthe processors

(In case of NUMA systems)


Layout of theinterconnection

Point of attachingthe MSS


Design space of the basic architecture of particular platforms

Design space of the basic architecture of

DT platforms

Design space of the basic architecture of

DP server platforms

Design space of the basic architecture of MP server platforms

The design space of the basic platform architecture of DT, DP and MP platforms will be discussed subsequently in the Sections 3.2.1, 3.3.1 and 3.4.1.


3.2. DT platforms

3.2.1. Design space of the basic architecture of DT platforms

3.2.2. Evolution of Intel’s home user oriented multicore DT platforms

•

•

3.2.3. Evolution of Intel’s business user oriented multicore DT platforms

•

3.2 DT platforms

3.2 DT platforms

3.2.1 Design space of the basic architecture of DT platforms

3.2.1 Design space of the basic architecture of DT platforms (1)

MCH

..

..

. .

ICH

P

P

..

..

. .

..

..

. .

Layou

t of

the in

terc

on

necti

on

Att

ach

ing

mem

ory

via

seri

al lin

ks

Seri

al lin

ks

att

ach

FB

-DiM

Ms

Att

ach

ing

mem

ory

via

para

llel ch

an

nels


MCH

..

..

..

P

ICH

P

..

..

..

....

..

Attaching memory to the MCH Attaching memory to the processor

Pentium D/EE to Penryn (Up to 4C) 1. G. Nehalem to Sandy Bridge (Up to 6C)

DT platforms

No. of mem. channels

..

S/P

..

..

..

S/P

..

... .MCH

P

ICH

..

S/P

..

..

S/P

..

..

..

S/P

..

..

.. ..

S/P..

... .P

. .

Seri

al lin

ks a

ttach

.S

/P c

on

v.

w/

par.

ch

an

.P

ara

llel ch

an

nels

att

ach

DIM

Ms

Layou

t of

the in

terc

on

necti

on

Att

ach

ing

mem

ory

via

seri

al lin

ks

Seri

a l lin

ks a

ttach

FB

-DIM

Ms

Att

ach

ing

mem

ory

via

para

llel

ch

an

nels

Seri

al lin

ks a

ttach

S/P

con

vert

ers

w

/ p

ar.

ch

an

nels

Pentium D/EE 2x1C (2005/6)Core 2 2C (2006)

Core 2 Quad 2x2C (2007)Penryn 2C/2x2C (2008)

1. G. Nehalem 4C (2008)Westmere-EP 6C (2010)2. G. Nehalem 4C (2009)

Westmere-EP 2C+G (2010)Sandy Bridge 2C/4C+G (2011)

Sandy Bridge-E 6C (2011)

Attaching memory to the MCH Attaching memory to the processor

Point of attaching the MSSEvolution of Intel’s DT platforms (Overview)

No. of memory channels

No.

of

mem

ory

ch

an

nels

No need for higher memory bandwidththrough serial memory interconnection

Para

llel ch

an

nels

att

ach

DIM

Ms

3.2.1 Design space of the basic architecture of DT platforms (2)

Up to DDR2-667

2/4 DDR2 DIMMsup to 4 ranks

Pentium D/Pentium EE

(2x1C)

945/955X/975X MCH

ICH7

FSB

DMI

Core2 2CCore 2 Quad (2x2C)/Penryn (2C/2*2C)

965/3-/4- Series

MCH

ICH8/9/10

FSB

DMI

Up to DDR2-800Up to DDR3-1067

X58 IOH

ICH10

QPI

DMI

1. gen. Nehalem (4C)/

Westmere-EP (6C)

Up to DDR3-1067

Tylersburg (2008)Anchor Creek (2005)

Bridge Creek (2006) (Core 2 aimed)Salt Creek (2007) (Core 2 Quad aimed)Boulder Creek (2008) (Penryn aimed)

3.2.2 Evolution of Intel’s home user oriented multicore DT platforms (1)


X58 IOH

ICH10

QPI

DMI


Westmere-EP (6C)

2. gen. Nehalem (4C)/Westmere-EP (2C+G)

5- Series

PCH

FDI DMI

Sandy Bridge (4C+G)

6- Series

PCH

FDI DMI2

Up to DDR3-1067

Up to DDR3-1333

Sugar Bay (2011)

Up to DDR3-1333

Tylersburg (2008) Kings Creek (2009)



X58 IOH

ICH10

QPI

DMI


Westmere-EP (6C)

Up to DDR3-1067

Tylersburg (2008)

Up to DDR3-1600

Waimea Bay (2011)

X79

PCH

DMI2

DDR3-1600: up to 1 DIMM per channelDDR3-1333: up to 2 DIMMs per channel

Sandy Bridge-E (4C)/6C)



Up to DDR2-667

2/4 DDR2 DIMMsup to 4 ranks

Pentium D/Pentium EE

(2x1C)

945/955X/975X MCH

ICH7

FSB

DMI

Core2 (2C)Core 2 Quad (2x2C)Penryn (2C/2*2C)

Q965/Q35/Q45

MCH

ICH8/9/10

FSB

Up to DDR2-800Up to DDR3-1067

Up to DDR3-1333

Piketon (2009)Lyndon (2005)

Averill Creek (2006) (Core 2 aimed)Weybridge (2007) (Core 2 Quad aimed)McCreary (2008) (Penryn aimed)

82573E GbE(Tekoe)

Gigabit Ethernet LAN connection

LCI

82566/82567 LAN PHY

LCI/GLCI

Gigabit EthernetLAN connection

82578GbE LAN PHY

PCIe 2.0/SMbus 2.0


DMI C-link

ME

MEQ57 PCH

ME

2. gen. Nehalem (4C)Westmere-EP (2C+G)

FDI DMI

3.2.3 Evolution of Intel’s business user oriented multicore DT platforms (1)


Sugar Bay (2011)

Up to DDR3-1333

82578GbE LAN PHY

PCIe 2.0/SMbus 2.0


Q57 PCHME

Piketon (2009)

2. gen. Nehalem (4C)Westmere-EP (2C+G)

GbE LAN

PCIe 2.0/SMbus 2.0


Q67 PCHME

Sandy Bridge (4C+G)

FDI DMI FDI DMI2

Up to DDR3-1333



3.3. DP server platforms

3.3.1. Design space of the basic architecture of DP server platforms

•

3.3.2. Evolution of Intel’s low cost oriented multicore DP server platforms

•

3.3.3. Evolution of Intel’s performance oriented multicore DP server platforms

•

3.3 DP server platforms

3.3 DP server platforms

3.3.1 Design space of the basic architecture of DP server platforms

MCH

..

..

..

P P

MCH

..

..

..

P P

ICH ICH

MCH

..

..

. .

ICH

P P

MCH

..

..

. .

ICH

P P

3.3.1 Design space of the basic architecture of DP server platforms (1)

Single FSB Dual FSBs

90 nm Pentium 4 DP 2x1C (2005)

Core 2/Penryn 2C/2x2C (2006/7)

65 nm Pentium 4 DP 2x1CCore 2/Penryn 2C/2x2C (2006/7)

PP

..

..

..

....

..

..

S/P

..

..

..

S/P

..

... .MCH

P P

ICH

..

S/P

..

....

S/P

..

... .MCH

ICH

P P ..

P

S/P

..

..

S/P

..

..

..

S/P

..

..

.. ..

S/P..

... .P

. .

PP

..

..

. .

..

..

. .

NUMA

Nehalem-EX/Westmere-EX8C/10C (2010/11)

Nehalem-EP to Sandy Bridge -EP/EN Up to 8 C (2009/11)

Layou

t of

the in

terc

on

necti

on

Att

ach

ing

mem

ory

via

seri

al lin

ks

Seri

al lin

ks

att

ach

FB

-DiM

Ms A

ttach

ing

mem

ory

via

para

llel ch

an

nels

Seri

al lin

ks a

ttach

.S

/P c

on

v.

w/

par.

ch

an

.P

ara

llel ch

an

nels

att

ach

DIM

Ms

nM

DP platforms

Single FSB Dual FSBs

90 nm Pentium 4 DP 2x1C (2006)

Core 2 2C/Core 2 Quad 2x2C/

Penryn 2C/2x2C (2006/2007)

SMP NUMA

Nehalem-EP 4C (2009)Westmere-EP 6C (2010)


(Paxville DP)

(Cranberry Lake) (Tylersburg-EP)

Nehalem-EX/Westmere-EX

8C/10C (2010/2011)

(Boxboro-EX)

65 nm Pentium 4 DP2x1C

Core 2 2CCore 2 Quad 2x2CPenryn 2C/2x2C

(2006/2007)

(Bensley)

Eff. Eff.

HP

HP

No.

of

mem

ory

ch

an

nels

Sandy Bridge-EN 8C (2011) Romley-EN

Sandy Bridge-EP 8C (20 11) Romley-EP

Layou

t of

the in

terc

on

necti

on

Att

ach

ing

mem

ory

via

seri

al lin

ks

Seri

al lin

ks

att

ach

FB

-DiM

Ms

Att

ach

ing

mem

ory

via

para

llel ch

an

nels

Seri

al lin

ks a

ttach

.S

/P c

on

vert

ers

w/

par.

ch

an

.

Para

llel ch

an

nels

att

ach

DIM

Ms

nM

HP

HP

Scheme of attaching and interconnecting DP processorsEvolution of Intel’s DP platforms (Overview)

3.3.1 Design space of the basic architecture of DP server platforms (2)

3.3.2 Evolution of Intel’s low cost oriented multicore DP server platforms (1)

3.3.2 Evolution of Intel’s low cost oriented multicore DP server platforms

90 nm Pentium 4Prescott DP (2C)

E7520 MCH

ICH5R/6300ESB IOH

FSB

HI 1.5

90 nm Pentium 4Prescott DP (2C)

FSB

DDR-266/333DDR2-400

90 nm Pentium 4 Prescott DP aimed DP server platform (for up to 2 C)

Xeon DP 2.8 /Paxville DP)

HI 1.5 (Hub Interface 1.5)8 bit wide, 66 MHz clock, QDR,

66 MB/s peak transfer rate

Core 2 (2C/Core 2 Quad (2x2C)/

Penryn (2C/2x2C)

E5100 MCH

ICHR9

FSB

ESI

Core 2 (2C/Core 2 Quad (2x2C)//Penryn (2C/2x2C)

DDR2-533/667

Penryn aimed Cranberry Lake DP server platform (for up to 4 C)


2x2C


4C


2C

or or



Evolution from the Pentium 4 Prescott DP aimed DP platform (up to 2 cores) to the Penryn aimed Cranberry Lake DP platform (up to 4 cores)


Sandy Bridge-EN (Socket B2) aimed Romley-EN DP server platform

(for up to 8 cores)

Sandy Bridge-EN (8C)

Socket B2

C600 PCH

DMI2

QPI Sandy Bridge-EN (8C)

Socket B2

DDR3-1600

Penryn aimed Cranberry Lake DP platform (for up to 4 C)

Core 2 (2C/2x2C)/ Penryn (2C/4C)

proc.

E5100 MCH

ICHR9

FSB

ESI

Core 2 (2C/2x2C)/ Penryn (2C/4C)

proc.

DDR2-533/667


2x2C


4C


2C

or or

E5-2400Sandy Bridge–EN 8C

Evolution from the Penryn aimed Cranberry Lake DP platform (up to 4 cores) to the Sandy Bridge-EP aimed Romley-EP DP platform (up to 8 cores)


3.3.3 Evolution of Intel’s performance oriented multicore DP server platforms (1)

3.3.3 Evolution of Intel’s performance oriented multicore DP server platforms

90 nm Pentium 4Prescott DP (2x1C)

E7520 MCH

ICH5R/6300ESB IOH

FSB

HI 1.5

90 nm Pentium 4Prescott DP (2x1C)

FSB

DDR-266/333DDR2-400

65 nm Pentium 4 Prescott DP (2x1C)/

Core2 (2C/2*2C)

E5000 MCH

631*ESB/632*ESB IOH

FSB


FB-DIMMw/DDR2-533

Evolution from the Pentium 4 Prescott DP aimed DP platform (up to 2 cores) to the Core 2 aimed Bensley DP platform (up to 4 cores)

90 nm Pentium 4 Prescott DP aimed DP server platform (for up to 2 C)

Core 2 aimed Bensley DP server platform (for up to 4 C)

Xeon DP 2.8 /Paxville DP)

Xeon 5000(Dempsey)

2x1C

Xeon 5100(Woodcrest)

2C


2x2C

/ /

ESI






2x2C


2C

// /


FBDIMMw/DDR2-533


5000 MCH

631*ESB/632*ESB IOH

FSB


ESI

65 nm Core 2 aimed high performance Bensley DP server platform (for up to 4 C)

1First chipset with PCI 2.0ME: Management Engine

Nehalem-EP aimed Tylersburg-EP DP server platformwith dual IOHs (for up to 6 C)

DDR3-1333

Nehalem-EP (4C) Westmere-EP (6C)

55xx IOH1

QPI

QPI

ICH9/ICH10

ESI

QPI

CLink

DDR3-1333ME


DDR3-1333


QPI

QPI

ICH9/ICH10

ESI

QPI

CLink

DDR3-1333

ME


55xx IOH1QPI

55xx IOH1

ME

Nehalem-EP aimed Tylersburg-EP DP server platformwith a single IOH (for up to 6 C)

Evolution from the Core 2 aimed Bensley DP platform (up to 4 cores)

to the Nehalem-EP aimed Tylersburg-EP DP platform (up to 6 cores)


Basic system architecture of the Sandy Bridge-EN and -EP aimed Romley-EN and –EP DP server platforms

Nehalem –EP (4C)Westmere-EP (6C)

34xx PCH

DMI

QPI Nehalem-EP (4C)Westmere-EP (6C)

DDR3-1333DDR3-1333ME

Xeon 55xx(Gainestown)

Xeon 56xx(Gulftown)/

Nehalem-EP aimed Tylersburg-EP DP server platform (for up to 6 cores)

Sandy Bridge-EP (Socket R) aimed Romley-EP DP server platform (for up to 8 cores) (LGA 2011)

C600 PCH

DMI2

QPI 1.1

DDR3-1600

QPI 1.1

Sandy Bridge-EP (8C)

Socket R

Sandy Bridge-EP (8C)

Socket R

E5-2600Sandy Bridge–EP 8C

E5-2600Sandy Bridge-EP 8C



(10C)

QPI

QPI

DDR3-1067

SMB

SMB

SMB

SMB

ICH10

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DDR3-1067

SMB

SMB

SMB

SMB

7500 IOH

QPI


34xx PCH

ESI

QPI

DDR3-1333DDR3-1333ME

Nehalem-EX aimed Boxboro-EX scalable DP server platform (for up to 10 cores)

Xeon 5500(Gainestown)

Xeon 5600(Gulftown)or

Nehalem-EP aimed Tylersburg-EP DP server platform (for up to 6 cores)


(10C)

or

Xeon 6500(Nehalem-EX)

(Becton)

Xeon E7-2800(Westmere-EX)

ME

Contrasting the Nehalem-EP aimed Tylersburg-EP DP platform (up to 6 cores) to the Nehalem-EX aimed very high performance scalable Boxboro-EX DP platform (up to 10 cores)


SMI: Serial link between the processor and the SMB

SMB: Scalable Memory Buffer with Parallel/serial conversion

SMI links SMI links


3.4. MP server platforms

3.4.2. Evolution of Intel’s multicore MP server platforms•

3.4.3. Evolution of AMD’s multicore MP server platforms•

3.4.1. Design space of the basic architecture of MP server platforms

•

3.4 MP server platforms

3.4 MP server platforms

3.4.1 Design space of the basic architecture of MP server platforms

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(Truland)

Core 2/Penryn up to 6C

(2006/2007)Caneland

Part. conn.mesh

Fully conn.mesh

SMP NUMA

Scheme of attaching and interconnecting MP processors

Nehalem-EX/Westmere up to 10C (2010/11)

(Boxboro-EX)

AMD DCA 1.0 (2003)

AMD DCA 2.0 (2010)


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Evolution of Intel’s MP platforms (Overview)


3.4.2 Evolution of Intel’s multicore MP server platforms (1)

3.4.2 Evolution of Intel’s multicore MP server platforms

Xeon MP1

SCXeon MP1

SC

FSB

Xeon MP1

SCXeon MP1

SC

Preceding ICH

Preceding NBs

E.g. HI 1.5

HI 1.5 266 MB/s

E.g. DDR-200/266 E.g. DDR-200/266

85001/8501

ICH5

XMB

XMB

DDR-266/333DDR2-400

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XMB

XMB

HI 1.5

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Xeon 7000(Paxville MP) 2x1C

Xeon 7100(Tulsa) 2C

Xeon MP(Potomac) 1C

/ /

90 nm Pentium 4 Prescott MP aimed Truland MP server platform (for up to 2 C)

Pentium 4Xeon MP 1C/2x1C




Previous Pentium 4 MP aimedMP server platform (for single core processors)

Evolution from the first generation MP servers supporting SC processors to the 90 nm Pentium 4 Prescott MP aimed Truland MP server platform (supporting up to 2 cores)


Core 2 (2C/2x2C)

Penryn (6C)

Core 2 (2C/2x2C)

Penryn (6C)

Core 2 (2C/2x2C)

Penryn (6C)

Core 2 (2C/2x2C)

Penryn (6C)

7300

631xESB/632xESB

4 channelsup to

8 DIMMs/channel

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XMB

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XMB

XMB

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FSB

HI 1.5

DDR-266/333DDR2-400

FB-DIMMDDR2-533/667

Xeon 7000(Paxville MP) 2x1C

Xeon 7100(Tulsa) 2C

Xeon MP(Potomac) 1C

/ /

1 The E8500 MCH supports an FSB of 667 MT/s and consequently only the SC Xeon MP (Potomac)

Xeon 7200(Tigerton DC) 1x2C

Xeon 7300(Tigerton QC) 2x2C

Xeon 7400(Dunnington 6C)

/ /

90 nm Pentium 4 Prescott MP aimed Truland MP server platform (for up to 2 C)

Core 2 aimed Caneland MP server platform (for up to 6 C)









Evolution from the 90 nm Pentium 4 Prescott MP aimed Truland MP platform (up to 2 cores) to the Core 2 aimed Caneland MP platform (up to 6 cores)


Nehalem-EX 8CWestmere-EX

10C

7500 IOH

QPI

QPI

QPIQPI QPI QPI

QPIQPI

SMB

SMB

DDR3-1067

SMB

SMB

SMB

SMB

SMB

SMB

ICH10

ESI

DDR3-1067

SMI: Serial link between the processor and the SMBs

SMB: Scalable Memory Buffer Parallel/serial converter

SMB

SMB

SMB

SMB

SMB

SMB

SMB

SMB2x4 SMI

channels2x4 SMI

channels

ME

ME: Management Engine

Xeon 7500(Nehalem-EX)(Becton) 8C

Xeon 7-4800(Westmere-EX) 10C


10C


10C


10C

/

Nehalem-EX aimed Boxboro-EX MP server platform (for up to 10 C)

Evolution to the Nehalem-EX aimed Boxboro-EX MP platform (that supports up to 10 cores) (In the basic system architecture we show the single IOH alternative)


3.4.3 Evolution of AMD’s multicore MP server platforms (1)

3.4.3 Evolution of AMD’s multicore MP server platforms [47] (1)

Introduced in the single core K8-based Opteron DP/MP servers (AMD 24x/84x) (6/2003)Memory: 2 channels DDR-200/333 per processor, 4 DIMMs per channel.

Introduced in the 2x6 core K10-based Magny-Course (AMD 6100)(3/2010)Memory: 2x2 channels DDR3-1333 per processor, 3 DIMMs per channel.

3.4.3 Evolution of AMD’s multicore MP server platforms [47] (2)

3.4.3 Evolution of AMD’s multicore MP server platforms (2)

9. References

9. References (1)

[1]: Wikipedia: Centrino, http://en.wikipedia.org/wiki/Centrino

[2]: Industry Uniting Around Intel Server Architecture; Platform Initiatives Complement Strong Intel IA-32 and IA-64 Targeted Processor Roadmap for 1999, Business Wire, Febr. 24 1999, http://www.thefreelibrary.com/Industry+Uniting+Around+Intel+Server +Architecture%3B+Platform...-a053949226

[3]: Intel Core 2 Duo Processor, http://www.intel.com/pressroom/kits/core2duo/

[4]: Keutzer K., Malik S., Newton R., Rabaey J., Sangiovanni-Vincentelli A., System Level Design: Orthogonalization of Concerns and Platform-Based Design, IEEE Transactions on Computer-Aided Design of Circuits and Systems, Vol. 19, No. 12, Dec. 2000, pp. 1-29.

[5]: Krazit T., Intel Sheds Light on 2005 Desktop Strategy, IDG News Service, Dec. 07 2004, http://pcworld.about.net/news/Dec072004id118866.htm

[6]: Perich D., Intel Volume platforms Technology Leadership, Presentation at HP World 2004, http://98.190.245.141:8080/Proceed/HPW04CD/papers/4194.pdf

[7] Powerful New Intel Server Platforms Feature Array Of Enterprise-Class Innovations. Intel’s Press release, Aug. 2, 2004 , http://www.intel.com/pressroom/archive/releases/2004/20040802comp.htm

[8]: Smith S., Multi-Core Briefing, IDF Spring 2005, San Francisco, Press presentation, March 1 2005, http://www.silentpcreview.com/article224-page2

[9]: An Introduction to the Intel QuickPath Interconnect, Jan. 2009, http://www.intel.com/ content/dam/doc/white-paper/quick-path-interconnect-introduction-paper.pdf

[10]: Davis L. PCI Express Bus, http://www.interfacebus.com/PCI-Express-Bus-PCIe-Description.html

9. References (2)

[11]: Ng P. K., “High End Desktop Platform Design Overview for the Next Generation Intel Microarchitecture (Nehalem) Processor,” IDF Taipei, TDPS001, 2008, http://intel.wingateweb.com/taiwan08/published/sessions/TDPS001/FA08%20IDF- Taipei_TDPS001_100.pdf

[12]: Computing DRAM, Samsung.com, http://www.samsung.com/global/business/semiconductor /products/dram/Products_ComputingDRAM.html

[13]: Samsung’s Green DDR3 – Solution 3, 20nm class 1.35V, Sept. 2011, http://www.samsung.com/global/business/semiconductor/Greenmemory/Downloads/ Documents/downloads/green_ddr3_2011.pdf

[14]: DDR SDRAM Registered DIMM Design Specification, JEDEC Standard No. 21-C, Page 4.20.4-1, Jan. 2002, http://www.jedec.org

[15]: Datasheet, http://download.micron.com/pdf/datasheets/modules/sdram/ SD9C16_32x72.pdf

[16]: Solanki V., „Design Guide Lines for Registered DDR DIMM Module,” Application Note AN37, Pericom, Nov. 2001, http://www.pericom.com/pdf/applications/AN037.pdf

[17]: Detecting Memory Bandwidth Saturation in Threaded Applications, Intel, March 2 2010, http://software.intel.com/en-us/articles/detecting-memory-bandwidth-saturation-in- threaded-applications/

[18]: McCalpin J. D., STREAM Memory Bandwidth, July 21 2011, http://www.cs.virginia.edu/stream/by_date/Bandwidth.html

[19]: Rogers B., Krishna A., Bell G., Vu K., Jiang X., Solihin Y., Scaling the Bandwidth Wall: Challenges in and Avenues for CMP Scaling, ISCA 2009, Vol. 37, Issue 1, pp. 371-382

9. References (3)

[20]: Vogt P., Fully Buffered DIMM (FB-DIMM) Server Memory Architecture: Capacity, Performance, Reliability, and Longevity, Febr. 18 2004, http://www.idt.com/content/OSA_S008_FB-DIMM-Arch.pdf

[21]: Wikipedia: Intel X58, 2011, http://en.wikipedia.org/wiki/Intel_X58

[22]: Sharma D. D., Intel 5520 Chipset: An I/O Hub Chipset for Server, Workstation, and High End Desktop, Hotchips 2009, http://www.hotchips.org/archives/hc21/2_mon/ HC21.24.200.I-O-Epub/HC21.24.230.DasSharma-Intel-5520-Chipset.pdf

[23]: DDR2 SDRAM FBDIMM, Micron Technology, 2005, http://download.micron.com/pdf/datasheets/modules/ddr2/HTF18C64_128_256x72F.pdf

[24]: Wikipedia: Fully Buffered DIMM, 2011, http://en.wikipedia.org/wiki/Fully_Buffered_DIMM

[25]: Intel E8500 Chipset eXternal Memory Bridge (XMB) Datasheet, March 2005, http://www.intel.com/content/dam/doc/datasheet/e8500-chipset-external-memory- bridge-datasheet.pdf

[26]: Intel 7500/7510/7512 Scalable Memory Buffer Datasheet, April 2011, http://www.intel.com/content/dam/doc/datasheet/7500-7510-7512-scalable-memory- buffer-datasheet.pdf

[27]: AMD Unveils Forward-Looking Technology Innovation To Extend Memory Footprint for Server Computing, July 25 2007, http://www.amd.com/us/press-releases/Pages/Press_Release_118446.aspx

[28]: Chiappetta M., More AMD G3MX Details Emerge, Aug. 22 2007, Hot Hardware, http://hothardware.com/News/More-AMD-G3MX-Details-Emerge/

9. References (4)

[29]: Goto S. H., The following server platforms AMD, May 20 2008, PC Watch, http://pc.watch.impress.co.jp/docs/2008/0520/kaigai440.htm

[30]: Wikipedia: Socket G3 Memory Extender, 2011, http://en.wikipedia.org/wiki/Socket_G3_Memory_Extender

[31]: Interfacing to DDR SDRAM with CoolRunner-II CPLDs, Application Note XAPP384, Febr. 2003, XILINC inc.

[32]: Ahn J.-H., „Memory Design Overview,” March 2007, Hynix, http://netro.ajou.ac.kr/~jungyol/memory2.pdf

[33]: Ebeling C., Koontz T., Krueger R., „System Clock Management Simplified with Virtex-II Pro FPGAs”, WP190, Febr. 25 2003, Xilinx, http://www.xilinx.com/support/documentation/white_papers/wp190.pdf

[34]: Kirstein B., „Practical timing analysis for 100-MHz digital design,”, EDN, Aug. 8, 2002, www.edn.com

[35]: Jacob B., Ng S. W., Wang D. T., Memory Systems, Elsevier, 2008

[36]: Allan G., „The outlook for DRAMs in consumer electronics”, EETIMES Europe Online, 01/12/2007, http://eetimes.eu/showArticle.jhtml?articleID=196901366&queryText =calibrated

[37]: Ebeling C., Koontz T., Krueger R., „System Clock Management Simplified with Virtex-II Pro FPGAs”, WP190, Febr. 25 2003, Xilinx, http://www.xilinx.com/support/documentation/white_papers/wp190.pdf

9. References (5)

[38]: „Introducing FB-DIMM Memory: Birth of Serial RAM?,” PCStats, Dec. 23, 2005, http://www.pcstats.com/articleview.cfm?articleid=1812&page=1

[45]: Memory technology evolution: an overview of system memory technologies, Technology brief, 9th edition, HP, Dec. 2010, http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00256987/c00256987.pdf

[46]: Kane L., Nguyen H., Take the Lead with Jasper Forest, the Future Intel Xeon Processor for Embedded and Storage, IDF 2009, July 27 2009, ftp://download.intel.com/embedded/processor/prez/SF09_EMBS001_100.pdf

[47]: The AMD Opteron™ 6000 Series Platform: More Cores, More Memory, Better Value, March 29 2010, http://www.slideshare.net/AMDUnprocessed/amd-opteron-6000-series -platform-press-presentation-final-3564470

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