donner analysis.docx

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Introduction

Donner Company, started in 1985, manufactures printed circuit boards (PCB) according tospecifications of electronic manufacturers. It is one of the leading PCB manufacturers in United

States. The industry is witnessing growth due to the increase in use of electronic appliances. The

president of the company, Edward Plummer is reviewing the company position in October 1987,

before deciding on plans for 1988. During the review he does in-depth study of how various

process and operations are carried out and challenges.

The basic work process can be divided into three important stages – preparation, image transfer and fabrication.

On receiving an order, price was quoted based on estimations of labour and material costs. Based

on acceptance by the client, delivery time of 3 weeks was quoted for orders below 1000 boardsand 5 weeks for rest. Rush orders were also accepted which needed to be served in four days

Issues faced by Donner

Problems in production process design:

The major difficulty faced in production process design was frequentlychanging bottleneck process in the manufacturing system.

Reasons:

Continuous change in the product specifications by client.

Delays caused due to improper management and procurement policies for raw material

requirements.

Interference of rush orders with the process flows causing imbalances.

Problems in Productivity:

Reasons:

Idle machines and incorrectly defined hours.

Higher time estimates than competitors

Problems in Delivery System:

The company was frequently defaulting on delivery deadlines.

Reason:



The policy of clearing all the work possible out of the shop prior to the end of each month

resulting in more number of shipment in the second half of the month.

Serious Implications for loss of Revenue:

Searby has expressed serious concerns regarding present problems of the companyand says these may cause a decrease in sales. He forecasts that present system mayrestrict sales to $2 million which can be increased to $3 million if the processes areimproved.

Data analysis

Data analysis gives deep insight into the some of the problems plaguing Donner Company.Some of the observations are mentioned below.

Drilling Process is the bottleneck capacity in generalThe Company’s shop floor policy of not using CNC machine for drilling if orders are less

than 100 boards is flawedDifferent Operations strategy needs to be used depending on the number of boards being

manufactured

Case I No of Boards = 1Standard

Production Time

Times (in minutes)

Total Run OperatingTime

Operation Type Setup Run

Time(using

Manual

Drilling)

PREPARATION

Artwork Generation 29 0 29

Inspect & Shear 20 0.5/panel 0.5 20.5

Punch Tooling Holes 10 0.5/panel 0.5 10.5

IMAGE TRANSFER

Drill Holes



Manual 15 0.08/hole 40 55

Metallization 10 0.75/panel 0.75 10.75

Dry Film Photoresist

1. Panel Prep 5 0.20/panel 0.2 5.22. Laminate &

Expose 20 2/panel 2 22

3. Develop 20 0.2/panel 0.2 20.2

Electroplate 25 8.5/panel 8.5 33.5

Strip DFPR 5 0.2/panel 0.2 5.2

Etch & Tin Strip 10 0.2/panel 0.2 10.2

FABRICATION

Soldermask 45 1.5/panel 1.5 46.5

Solder Dip 30 0.5/panel 0.5 30.5

Profile

Punch Press 50 1.0/board 1 51

Inspect and pack 45 1.5/board 1.5 46.5

Total 396.55

For CNC machine, add 242, subtract 55, add 150.5, and subtract

51= 683.

CASE II 8 Boards

Standard

Production Time

Times (in minutes)

Total Run Operating

Operation Type Setup Run Time Time

PREPARATION


Inspect & Shear 20 0.5 0.5 20.5

Punch Tooling Holes 10 0.5 0.5 10.5

IMAGE

TRANSFER

Drill Holes

CNC Drill 240 0.004 16 256

Metallization 10 0.75 0.75 10.75

Dry Film

Photoresist

1. Panel Prep 5 0.2 0.2 5.22. Laminate &



Expose 20 2 2 22

3. Develop 20 0.2 0.2 20.2

Electroplate 25 8.5 8.5 33.5

Strip DFPR 5 0.2 0.2 5.2

Etch & Tin Strip 10 0.2 0.2 10.2

FABRICATION

Soldermask 45 1.5 1.5 46.5

Solder Dip 30 0.5 0.5 30.5

Profile

Punch Press 50 1 8 58

Inspect and pack 45 1.5 12 57

Total 615.05

CASE III 200 Boards

Standard

Production Time

Times (in minutes)

Total Run Operating

Operation Type Setup Run Time Time

PREPARATION


Inspect & Shear 20 0.5 12.5 32.5Punch Tooling Holes 10 0.5 12.5 22.5

IMAGE TRANSFER

Drill Holes

CNC Drill 240 0.004 400 640

Metallization 10 0.75 18.75 28.75

Dry Film Photoresist

1. Panel Prep 5 0.2 5 10

2. Laminate & Expose 20 2 50 70

3. Develop 20 0.2 5 25

Electroplate 25 8.5 212.5 237.5

Strip DFPR 5 0.2 5 10

Etch & Tin Strip 10 0.2 5 15

FABRICATION

Soldermask 45 1.5 37.5 82.5

Solder Dip 30 0.5 12.5 42.5

Profile

Punch Press or CNCRouter 50 1 200 250



Inspect and pack 45 1.5 300 345

Total 1840.25

donner analysis.docx

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