IMS Technical Program Preview2016 International Microwave Symposium
MOSCONE CENTER • SAN FRANCISCO, CALIFORNIA, USA 6102 YAM 62-42 :setaD noitibihxE • 6102 YAM 72-22 :setaD muisopmyS
IMS2016.orgGATEWAY TO THE WIRELESS FUTURE
Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions
Room: 303 Room: 304 Room: 305 Room: 306 Room: 307 Room: 308 Room:309TU1A: Transmission Lines for
System Applications
Chair: Luca Perregrini, University of Pavia
Co-Chair: Tatsuo Itoh, Los Angeles
University of California,
TU1B: Broadband High-E�ciency
Chair: Debasis Dawn, North Dakota
Co-Chair: Ali Darwish, Army Research Lab
TU1C: Multi-GHz Frontend Cir- cuits for Digital ApplicationsChair: Hermann Boss, Rohde & Schwarz
GmbH & Co KGCo-Chair: Gregory Lyons, Massachusetts
Institute of Technology, Lincoln Laboratory
TU1D: RF-MEMS Technology forTunable and Low Power RF
Chair: Pierre Blondy, Xilinx, Inc.Co-Chair: John Ebel, Air Force Research Lab
TU1E: 3-D Printing Techniquesand Technologies
Chair: Rahul Dixit, Raytheon CompanyCo-Chair: Bob Jackson, University of
Massachusetts, Amherst
TU1F: Methodolody and Hardware Development for High Power Mic-rowave Industiral Applications
Chair: Cheng Paul Wen, Peking UniversityCo-Chair: Steven Stitzer, Northrop Grumman
Mission Systems
TU1G: Advanced Acoustic and Tunable Device Technologies for
RF SystemsChair: Robert York, University of California,
Santa BarbaraCo-Chair: Harvey Newman, Naval Research
Laboratory
08:00-08:20
TU1A-1: Compact Three-Dimensional Four-Way Vectorial Steering Modulefor Ka-Band Multiple Feeds-per-BeamSatellite Payload Applications
TU1C-1: A 108GS/s Track and HoldAmpli�er with MOS-HBT Switch
TU1D-1: An Ultra-Low Phase Noise 3.37-3.58 GHz MEMS Varactor Based VCOwith Continuous Frequency Tuning
TU1E-1: High-k and Low-Loss Thermopl-astic Composites for Fused DepositionModeling and their Application to 3D-Printed Ku-Band Antennas
TU1F-1: Full-Wave Circuit Analysis of a TU1G-1: Substrate Agnostic MonolithicIntegration of 12.5 THz Fco Inline Phase-
08:20-08:40
TU1A-2: Tunable Dielectric Delay LinePhase Shifter Based on Liquid Crystal
Calibration Scheme at 100 GHz Technology for a SPDT in a Radiometer
TU1B-2: Highly Linear CMOS Power TU1C-2: A 55-dB SFDR 16-GS/s Track-and-Hold Ampli�er in 0.18 µm SiGe UsingDi�erential Feedthrough CancellationTechnique
TU1D-2: A Low-Loss 1.4-2.1 GHz CompactTunable Three-Pole Filter With Impro-ved Stopband Rejection Using RF-MEMSCapacitors
TU1E-2: Ultra-Wideband Hybrid Substr-ate Integrated Ribbon Waveguides Us-ing 3D Printing
TU1F-2: Measurement of Temperature Dependent Permittivity of Liquid underMicrowave Heating
TU1G-2: BAW Filter Design Method Basedon Intrinsically Switchable FerroelectricBST FBARsSeungku Lee, University of Michigan, Amir Mortazawi, University of Michigan
08:40-09:00
TU1A-3: Low Permittivity Cladding toImprove the Performance of DielectricRod Waveguides and Dielectric End-FireAntennas
TU1B-3: A Highly E�cient CMOS SOIPower Ampli�er for U-Band Applications
TU1C-3: A 50-GHz-Bandwidth InP-HBTAnalog-MUX Module for High-Symbol- Rate Optical Communications Systems
TU1D-3: Inductive Coupling for IncreasedBandwidth of Aluminum Nitride ContourMode Microresonator Filters
TU1E-3: 3D Printed Metalized-Polymer UWB High-Gain Vivaldi Antennas
TU1F-3: Analog Amplitude-Locked LoopCircuit to Support RF Energy SolutionsHolger Heuermann, FH Aachen University of AppliedSciences, Arash Sadeghfam, FH Aachen University of Applied Sciences
ntiguous Filters For Next-GenerationLTE-Advanced PlatformsCristian Cassella, Northeastern University, Matteo Rinaldi, Northeastern University
TU1F-4: A 300W Complete GaN SolidState Power Ampli�er for PositioningSystem Satellite Payloads
09:00-09:10
TU1A-4: High Directivity Negative-Resistance Composite Right/Left-Handed Leaky-Wave Antenna
TU1B-4: A 60-GHz 20.6-dBm SymmetricRadial-Combining Wideband Power Ampli�er with 20.3% Peak PAE and
TU1C-4: An Over-67-GHz-Bandwidth 2Vppd Linear Di�erential Ampli�er withGain Control in 0.25-µm InP DHBT Tech-
TU1D-4: A 20–40 GHz Tunable MEMSBandpass Filter with Enhanced Stability
TU1E-4: Nanowire-based Through Sub-strate Via for Millimeter-Wave Frequencies
TU1G-4: A New Tunable SAW Filter Circuitfor Recon�gurable RFTakaya Wada, Murata Manufacturing Co., Ltd.TakashiOgami, Murata Manufacturing Co., Ltd., Atsushi Horita, Murata Manufacturing Co., Ltd.,Hidenori Obiya, Murata Manufacturing Co., Ltd., Masayoshi Koshino, Murata Manufacturing Co., Ltd., Makoto Kawashima, Murata Manufac-turing Co., Ltd.
09:20-09:40
TU1A-5: Modal Analysis and Closure ofthe Bandgap in 2D Transmission-Line
TU1B-5: A 104GHz-117GHz Power Ampl- TU1C-5: A 100-Gb/s, 1-tap Feed-forwardbased Analog Equalizer for Optical Co-
TU1D-5: Compact Thin-Film Packaged RF-MEMS Switched Capacitors
TU1E-5: Low-Pro�le and Chip-Scale RF FEM Using Si-Interposer Technology
TU1F-5: High Pressure Microwave FlowReactor for Raw Oil TreatmentAndreas Rosin, Universität Bayreuth, Thorsten Gerd-es, Universität Bayreuth, Monika Willert Porada, Un-iversität Bayreuth
TU1G-5: Two-Port Tunable Interdigital Capacitors Fabricated on Low-Loss MBE-Grown Ba0.29Sr0.71TiO3
Tuesday Technical Sessions 08:00-09:40 Tuesday Technical Sessions 08:00-09:40
Grids
Millimeter-Wave Power Ampli�ers
State University
TU1B-1: Design and Performance of 16-40GHz GaN Distributed Power Ampli�erMMICs Utilizing an Advanced 0.15um GaN Process
Ampli�er for mm-Wave Applications
20-dB Gain in 90-nm CMOS
i�er With 10.4% PAE in Thin Digital65nm Low Power CMOS Technology
nology
mmunication Applications
System
by Gold-Vanadium Micro-CorrugatedDiaphragms
TU1D-6: Piezoelectric RF Resonant Volt-age Ampli�ers for IoT Applications
09:10-09:20
TU1G-3: Cross-Sectional Lamé Mode Co-
Split-Cylinder Cavity
Yoshio Nikawa, Kokushikan University
Change Switch Technology
Cedric Meyers, University of California, Santa Barbara,Christopher Freeze, University of California, Santa Bar-baraSusanne Stemmer, Robert York, University of Cali-fornia, Santa Barbara
TU1G-6: Microwave Power Detection an Anharmonic Dipolar Resonance
08:00-08:2008:20-08:40
08:40-08:5008:50-09:00
09:20-09:4009:00-09:10
09:10-09:20
Michael Schneider, Airbus DS GmbH,Tilo Welker, Technische Universität Ilmenau, Jens Müller, Matthias Hein, Technische Universität Ilmenau
Matthias Jost, Technische Universität Darmstadt, Roland Reese, Technische Universität Darmstadt, Christian Weickhmann,Technische Universität Darmstadt
Denise Lugo, University of South Florida, Ramiro Ramirez, University of South Florida, Jing Wang, University of South Florida, Tom Weller, University of South Florida
Kepei Sun, Syracuse University, Jay Lee, Syracuse University, Jun Choi, Syracuse University
Ayman Dorrah, University of Toronto, George Eleftheriades, University of Toronto, Mohammad Memarian, University of California, Los Angeles
Charles Campbell, QORVO, Inc., Sabyasachi Nayak, QORVO, Inc., Ming-Yih Kao, QORVO, Inc., Shuoqi Chen
Byungjoon Park, Postech University, Daechul Jeong, Postech University, Jooseung Kim, Postech University, Yunsung Cho, Postech University, Kyunhoon Moon, Postech University, Bumman Kim, Postech University
Sultan Helmi, Saeed Mohammadi, Purdue Univer-sity
Cheng-Feng Chou, National Taiwan University, YuanHong Hsiao, National Taiwan University, Yi-Ching Wu, National Taiwan University,Yu-Hsuan Lin, National Taiwan University, Huei Wang, National Taiwan University
Kefei Wu, Rensselaer Polytechnic Institute, Mona Hella, Rensselaer Polytechnic Institute, Sriram Muralidharan, Analog Devices, Inc.
Konstantinos Vasilakopoulos, University of Toronto, Sorin Voinigescu, University of Toronto, Andreia Cathelin, STMicroelectronics, Pascal Chevalier, STMicroelectronics, Thelinh Nguyen, Finisar Corporation
Ya-Che Yeh, National Central University, Yu-An Lin, National Central University, Yu-Cheng Liu, National Central University, Hong-Yeh Chang, National Central University
Hiroshi Yamazaki, Nippon Telegraph and Telephone Corp., Hitoshi Wakita, Nippon Telegraph and Telephone Corp., Hideyuki Nosaka, Nippon Telegraph and Telephone Corp., Kenji Kurishima, Nippon Telegraph and Telephone Corp., Minoru Ida, Nippon Telegraph and Telephone Corp., Akihide Sano, Yutaka Miyamoto, Nippon Telegraph and Telephone Corp., Munehiko Nagatani, Nippon Telegraph and Telephone Corp.
Munehiko Nagatani, Nippon Telegraph and Telephone Corp., Kenji Kurishima, Nippon Telegraph and Telephone Corp., Minoru Ida, Hideyuki Nosaka, Nippon Telegraph and Telephone Corp., Hitoshi Wakita, Nippon Telegraph and Telephone Corp.
Ronan Mettetal, Quartz Laboratory, ENSEA, Jean-Yves Dupuy, Agnieszka Konczykowska, III-V Lab, Filipe Jorge, Alcatel Lucent Bell Labs, Muriel Riet, Alcatel Lucent Bell Labs, Virginie Nodjiadjim, Alcatel Lucent Bell Labs, Achour Ouslimani, Ecole Nationale Supérieure de l'Electronique et de
Gerhard Kahmen, Rohde & Schwarz, Matthias Wiet-struck, IHP Microelectronics, Hermann Schumacher, University of Ulm
Abdullah Alazemi, University of California at San Diego, Gabriel Rebeiz, University of California at San Diego
Christopher Nordquist, Peggy Clews, Stefan Lepko-wski, Emily Crespin, Alejandro Grine, Christopher Dyck, Michael Henry, Sandia National Laboratories, Janet Nguyen, QORVO, Inc., Roy Olsson, Defense Adv-anced Research Projects Agency
ZhengAn Yang, Purdue University, Dimitrios Perou-lis, Purdue University
Ruochen Lu, University of Illinois at Urbana-Cham-paign, Tomas Manzaneque, University of Illinois at Urbana-Champaign, Michael Breen, University of Illinois at Urbana-Champaign, Anming Gao, University of Illinois at Urbana-Champaign, Songbin Gong, University of Illinois at Urbana-Champaign
Juan Castro, University of South Florida, Eduardo Rojas-Nastrucci, University of South Florida, Anthony Ross, University of South Florida, Tom Weller, University of South Florida, Jing Wang, University of South Florida
Jennifer Byford, Michigan State University, Premjeet Chahal, Michigan State University
Mohd Ifwat Mohd Ghazali, Michigan State Universi-ty, Joshua Myers, Michigan State University, Kyoung Youl Park, Michigan State University, Premjeet Chah-al, Michigan State University, John Papapolymerou, Michigan State University
Júlio Pinheiro, University of Sao Paulo, Marcus Pelegrini, University of Sao Paulo, Leonardo Gomes, Gustavo Rehder, University of Sao Paulo, Ariana Serrano, University of Sao Paulo, Philippe Ferrari, Grenoble Institute of Technology
Seong-Ryul Kim, Korea Electronics TechnologyInstitute
David Marqués-Villarroya, Universitat Politècnica de València, Felipe Penaranda-Foix, Universitat Politècnica de València, Jose M Catala-Civera,Univer-sitat Politècnica de València, Beatriz García-Baños, Universitat Politècnica de València, J.Daniel Gutierrez-Cano, Universitat Politècnica de València
Rocco Giofre, Paolo Colantonio, University of Rome, Francisco De Arriba, Laura Gonzalez, TTI (Information and Communication Technologies) Lorena Cabria, University of Cantabria
Nabil El-Hinnawy, Northrop Grumman Electronic Systems, Pavel Borodulin, Northrop Grumman Electronic Systems, Andris Ezis, Northrop Grumman Electronic Systems, Colin Furrow, Northrop Grumman Electronic Systems, Carlos Padilla, Northrop Grumman Electronic Systems, Matthew King, Northrop Grumman Electronic Systems, Brian Wagner, Northrop Grumman Electronic Systems, Doyle Nichols, Northrop Grumman Electronic Systems, Robert Young, Northrop Grumman Electronic Systems, Jeyanandh Paramesh, Carnegie Mellon University, James Bain, Carnegie Mellon University, Evan Jones, LSI
Nitin Parsa, University of Akron, Michael Gasper, University of Akron, Ryan Toonen, University of Akron, Mathew Ivill, U.S Army Research Laboratory, Samuel Hirsch, U.S Army Research Laboratory
Kevin Nadaud, University of Limoges, Fabien Roubeau, University of Limoges, Arnaud Pothier, XLIM Research Institute, Ling Yan ZHANG, Xlim University of Limoges, Romain Stefanini, Airmems, Pierre Blondy, XLIM Université de Limoges CNRS
Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions
Room: 303 Room: 304 Room: 305 Room: 306 Room: 308 Room:309Room: 307TU2A: Design and Implement-ation of Transmission Lines
Chair: George Elefteriades, University of Toronto
Co-Chair: Christian Damm, TechnischeUniversity Darmstadt
TU2C: Novel Aspects of RFID
Chair: Thomas Ussmueller, Universityof Innsbruck
Co-Chair: Amin Rida, MAJA Systems
TU2D: Multiband, Multimode, and Multilayer Filter Techniques
Chair: Sanghoon Shin, Naval ResearchLaboratory
Co-Chair: Alejandro Garcia Lamperez,Charles University
TU2E: High Frequency Inter-connects and Packaging
Chair: Hiroshi Kondoh, EHF Consulting
Co-Chair: John Papapolymerou, Michigan State University
TU2F: Microwave Biological Sensing
Chair: James Hwang, Lehigh University
Co-Chair: Katia Grenier, Centre National dela Recherche Scienti�que
TU2G: Microwave ComponentsBased on New Material and Fab-rication Methods for the Next
Chair: Ajay Poddar, OSCICo-Chair: Brian Sequeira, Johns Hopkins
University
10:10-10:30
TU2A-1: A General Conical to Coaxial Line TransitionRyno Beyers, Dirk de Villiers, University of Stellenbosch Alirio Boaventura, University of Aveiro, Nuno Carva-
lho, Instituto de Telecomunicacoes
TU2D-1: A Design of the Microstrip Tri-passband Bandpass Filter With Hexagonal
Cheng-Yu Lee, National Chung Cheng University,Tung-Yi Hsieh, National Chung Cheng University
TU2E-1: X Band Low-Cost GaN TR Modulewith Anti-Radiation StructureYukinobu Tarui, Mitsubishi Electric Corporation, Aki-michi Hirota, Mitsubishi Electric Corporation, IsamuRyokawa, Mitsubishi Electric Corporation, Makoto Ki-mura, Mitsubishi Electric Corporation, Yoshihiro Tsu-bota, Mitsubishi Electric Corporation, Shuichi Sakata,Kiyoshi Ishida, Mitsubishi Electric Corporation
TU2F-1: Selectivity-Enhanced Glucose Mea- TU2G-1: Multi-Band Multi-Tone TunableMillimeter-Wave Frequency Synthesizer
Rainee Simons, NASA
10:30-10:40
TU2A-2: A Predictive Model for Slow-Wave Coplanar Striplines in IntegratedTechnologyAlfredo Bautista, Université Grenoble Alpes, Marwa Abdel Aziz, Ain Shams University, Florence Podevin, Grenoble Institute of Technology, Philippe Ferrari, Gre-noble Institute of Technology
TU2C-2: Software-De�ned Reader for
John Kimionis, Georgia Institute of Technology, Manos Tentzeris, Georgia Institute of Technology
TU2D-2: Novel Septuple-Mode Balanced Filter With Enhanced Selectivity and Extended UpperStopband Using Multi-mode Slotline StructureZhao-An Ouyang, South China University of Technology, Qing-Xin Chu, South China University of Technology
Salih Can Aksoy, Meteksan Savunma Ind. Inc., Ali İhsan Çubukçu, Meteksan Savunma Ind. Inc., Irfan Yildiz, Meteksan Savunma Ind. Inc.
TU2E-2: Heterogeneous Microwave and Millimeter-wave System IntegrationUsing Quilt Packaging
Samuel Jameson, Tel Aviv University, Bassam Khamai-si, Eran Socher, Tel Aviv University
TU2F-2: A 40-nm CMOS Permittivity Sensor for Chemical/Biological Material Charact-erization at RF/Microwave Frequencies
TU2G-2: Micro�uidic Liquid Metal Based Me-chanically Recon�gurable Antenna UsingReversible Gecko Adhesive Based BondingMersedeh Zandvakili, University of Alberta, Moham-mad Mahdi Honari, University of Alberta, Dan Same-oto, University of Alberta, Pedram Mousavi, Universityof Alberta
10:50-11:00
TU2A-3: Design of Substrate Integrated Gap Waveguide
TU2C-3: Experimental Analysis of Power Optimized Waveforms for Enhancing
TU2D-4: Novel Compact Quasi-Elliptic SIWFilter Based on Quarter-Mode Cavities
TU2E-3: A +6dBm 128GHz Source Modulewith Full F-band Waveguide Package and Wirebonded CMOS Chip
TU2F-3: Reproducible Broadband Meas-urement for Cytoplasm Capacitance ofa Biological CellXiao Ma, Lehigh University, Xiaotian Du, Lehigh University, Caroline Multari, Lehigh University, Yaqing Ning, Lehigh University, Xi Luo, Lehigh University, Vahid Gholizadeh, Cristiano Palego, Lehigh University, Xuanhong Cheng,Lehigh University, James Hwang, Lehigh University
Array SystemsShilei Hao, University of California, Davis, TongningHu, University of California, Davis, Jane Gu, Universityof California, Davis
TU2F-4: BiCMOS Micro�uidic Sensor forSingle Cell Label-Free Monitoring Through Microwave Intermodulation
11:10-11:30
TU2A-4: Mode-Selective Transmission Line for DC-to-THz Super-BroadbandOperation
TU2C-5: Near-Field Power Transfer andBackscattering Communication to Mini- ature RFID Tag in 65 nm CMOS Technology Nai-Chung Kuo, University of California, Bo Zhao, University of California, Ali Niknejad, University ofCalifornia
TU2D-5: A Multilayered Combline Filterwith High Harmonic Suppression
TU2E-4: Millimeter Wave Planar Transitionfrom Plastic Rectangular Waveguide to
Ilja Ocket, IMEC/CMST, Maarten Cauwe, IMEC/CMST
TU2G-4: Plane Spiral Orbital Angular Mo-mentum Wave and Its ApplicationsZhuofan Zhang, Zhejiang University, Shilie Zheng,Zhejiang University, Jiayu Zheng, Zhejiang University, Xiaofeng Jin, Zhejiang University, Hao Chi, Zhejiang University, Xianmin Zhang, Zhejiang University
11:30-11:40
TU2C-6: Harmonic-WISP: A Passive Broad- TU2D-6: Multiband SuperconductingFilters
TU2F-5: In-�ow Dielectric Characterizationof Single Biological Cells Using a WidebandDEP CytometerSamaneh Afshar, University of Manitoba, Elham Sali-mi, University of Manitoba, Katrin Braasch, Universityof Manitoba, Michael Butler, University of Manitoba, Douglas Thomson, University of Manitoba, Greg Brid-ges, University of Manitoba
Tuesday Technical Sessions 10:10-11:50 Tuesday Technical Sessions 10:10-11:50
Systems
TU2C-1: Measurement of Sensitivity Improvement in RFID Tags
Multi-Modal RFID Sensing
Band Harmonic RFID PlatformYunfei Ma, Cornell University, Xiaonan Hui, Cornell Uni-versity, Edwin Kan, Cornell University
Raafat Mansour, University of Waterloo, Paul Laforge,University of Regina
1 mm Coax
TU2E-6: An Ultra-Wideband Common-ModeNoise Filter for Di�erential Signals UsingCompact Patterned Ground StructureFangxu Yang, Shanghai Jiao Tong University, Min Tang,Shanghai Jiao Tong University, Junfa Mao, Shanghai Jiao Tong University
TU2G-3: Phase Noise Improvement for
surement in Multicomponent Aqueous So- lution by Broadband Dielectric SpectroscopyMasahito Nakamura, Nippon Telegraph and TelephoneCorp., Takuro Tajima, Nippon Telegraph and TelephoneCorp.,Katsuhiro Ajito, Hiroshi Koizumi, Nippon Tele-graph and Telephone Corp.
Gerasimos Vlachogiannakis, Delft University of Tech-nology, Marco Spirito, Delft University of Technology, Michiel A. P. Pertijs, Leo C. N. de Vreede, Delft Univ-ersity of Technology
For Satellite Beacon Transmitter
TU2G-5: Multi-OAM-mode Microwave Co-mmunication With the Partial Arc Samp-ling Receiving SchemeWeite Zhang, Zhejiang University, Shilie Zheng, Zhejia-ng University, Yiping Hu, Zhejiang University, XiaofengJin, Zhejiang University, Hao Chi, Zhejiang University, Xianmin Zhang, Zhejiang University
10:10-10:3010:30-10:50
10:50-11:1011:10-11:20
1120-11:301130-11:40
11:40-11:50
TU2C-4: Pulse Shaping for BackscatterRadioJohn Kimionis, Georgia Institute of Technology, Manos Tentzeris, Georgia Institute of Technology
TU2C-7: Low-Cost Miniaturized Open-Ended Slot-Based UHF RFID Tag for
Hossein Saghlatoon, University of Alberta, Moham-mad Mahdi Honari, University of Alberta, Rashid Mir-zavand Boroujeni, Pedram Mousavi, Univ. of Alberta
TU2D-3: Microstrip Balanced Quad-ChannelDiplexer Using Dual-Open/Short-Stub Load-ed Resonator
10:40-10:5011:00-11:10
11:40-11:50
Generation Electronics
Wake-up Radio Sensitivity
Harsh Environment
Grounded Resonators
TU2B: Celebrating the 80th Ann-
Chair: Leo de Vreede, Delft Universityof Technology
Co-Chair: Christian Fager, ChalmersUniversity of Technology
Joseph Staudinger, NXP Semiconductors
TU2B-2: Odd-Mode Doherty Power
Jawad Qureshi, Nagoya University
TU2B-3: Joint Circuit-Level and DigitalPredistortion Strategies for Enhancing the
TU2B-4: Design of Linear Doherty PowerAmpli�er for Handset ApplicationBumman Kim, POSTECH University, Yunsung Cho, POSTECH University
Slim Boumaiza, University of Waterloo, Hamed Gole-staneh, University of Waterloo
TU2B-5: Mixed-Signal Doherty Power
iversary of the Doherty Patent
TU2B-1: Doherty History, Principles and Key Developments
Ampli�er
Ampli�ers in CMOSHua Wang, Georgia Institute of Technology, Song Hu, Georgia Institute of Technology, Shouhei Kousai, Toshiba Corporation
TU2B-6: Will Doherty Continue to Rulefor 5G?Peter Asbeck, University of California, San Diego
Linearity-E�ciency tradeo� of DohertyPower Ampli�ers Driven with Carrier Aggregated Signals
Fangxu Yang, Shanghai Jiao Tong University, Min Tang, Shanghai Jiao Tong University, Junfa Mao, Shanghai JiaoTong University
TU2E-5: High-Integrity Terabit-per-SecondSignal Interconnects with Mode-SelectiveTransmission Line
Massimo Del Prete, University di Bologna, Alessandra Costanzo, University di Bologna, Diego Masotti, University di Bologna, Tom-maso Polonelli, University di Bologna, Michele Magno, Eidgenös-sische Technische Hochschule Zürich, Luca Benini, Swiss Federal Institute of Technology
Wei Jiang, Univ. of South Carolina,Yujia Peng, Univ. of South Carolina, Tengxing Wang, Guoan Wang, Univ. of South Carolina, Yong Mao Huang, University of Electronic Science & Technology of China
Jing Zhang, Concordia University, Xiupu Zhang, Concordia University, Dongya Shen, ConcordiaUniversity
Faezeh Fesharaki, École Polytechnique de Montréal, Tarek Djera�, École Polytechnique de Montréal, Ke Wu, École Polytechnique de Montréal, Mohamed Chaker, INRS (Institut National de la Recherche Scienti�que)
Stefano Moscato, University of Pavia, Cristiano Tomassoni, University of Perugia, Maurizio Bozzi, University of Pavia, Luca Perregrini, University of Pavia
Tian Lu, Indiana Integrated Circuits, LLC, Jason Kulick, Indiana Integrated Circuits, LLC, Gary Bernstein, University of Notre Dame, Patrick Fay, University of Notre Dame, John Lannon, RTI International
Cristiano Palego, Bangor University, Guillaume Perry, Bangor Un-iversity, Chris Hancock, Bangor University, Fatima Hjeij, Limoges University,Claire Dalmay, Limoges University, Annie Bessaudou, IHP Microelectronics, Pierre Blondy, XLIM Université de Limoges CNRS, Arnaud Pothier, XLIM Research Institute, Fabrice Lalloué, Limoges University, Barbara Bessette, IHP Microelectronics, Marie-Odile Jauberteau, IHP Microelectronics, Canan Baristiran Kaynak, IHP Microelectronics, Matthias Wietstruck, IHP Micro-electronics, Mehmet Kaynak, IHP Microelectronics, Michael Casbon, Cardi� University, Johannes Benedikt, Cardi� University, David Barrow, Cardi� University, Adrian Porch, Cardi� University
Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions
Room: 303 Room: 304 Room: 305 Room: 306 Room: 308 Room:309Room: 307TU3A: Couplers and Dividers
Chair: Guoan Wang, University of South Carolina
Co-Chair: Banyaner Arigong, In�neon Technologies Americas
TU3C: Radio Architectures for E�cient Spectrum Utilization
Chair: Ethan Wang, Univ. of California,Los Angeles
Co-Chair: Shoichi Narahashi, NTT DoCoMo,Inc.
TU3D: Advances in Terahertz Photonics
Chair: Mona Jarrahi, Univ. of California,Los Angeles
Co-Chair: Je�rey Nanzer, Johns Hopkins Univ.
TU3E: Signal Generation Techni-ques For Radar and Communica-tion Systems
Chair: Deukhyoun Heo, Washington State Univ.
Co-Chair: Brad Nelson, QORVO, Inc.
TU3F: Novel Planar and Lumped-Element Filtering Devices
Chair: Shamsur Mazymder, RaytheonCompany
Co-Chair: Roberto Gomez-Garcia, Univ. of Alcala
TU3G: Green, Flexible, Wearable,Recon�gurable Technologies
Chair: Zaher Bardai, IMN Epiphany
Co-Chair: Ramesh Gupta, LightSquared
13:30-13:50
TU3A-1: A Planar Filtering Crossover forThree Intersecting ChannelsLin-Sheng Wu, Shanghai Jiao Tong University, JunfaMao, Shanghai Jiao Tong University
Jun Gi Hong, Soonchunhyang Univ., Seok-Jae Lee,Soonchunhyang Univ., Jongsik Lim, Soonchunhyang Univ., Won-Sang Yoon, Hoseo Univ., Sang-Min Han,Soonchunhyang Univ.
TU3D-1: Photonic-based Millimeter andTerahertz Wave Generation Using a Hy-brid Integrated Dual DBR Polymer LaserGuillermo Carpintero, Universidad Carlos Iii De Madrid, Shintaro Hisatake, Osaka Univ., David De Felipe, Fraun-hofer Heinrich Hertz Institute, Robinson Cruzoe Guzman,Universidad Carlos III de Madrid,Tadao Nagatsuma, OsakaUniv., Norbert KEIL, Fraunhofer Heinrich Hertz Institute, Thorsten Göbel, Fraunhofer Heinrich Hertz Institute, Thorsten Göbel, Fraunhofer Heinrich Hertz Institute
TU3E-1: A 10 GHz Phase Noise Filter with10.6 dB Phase Noise Suppression and -116 dBc/Hz Sensitivity at 1 MHz O�set
TU3F-1: Power-Dependent Bandstop Filtersfor Frequency-Selective Limiting
TU3G-1: E�ciency Enhancement Solutionsfor an Original Linear Green RF Transmitters
13:50-14:10
TU3A-2: A Balanced-to-Balanced Power Divider with Common-Mode NoiseAbsorptionSiang Chen, National Taiwan University, Wei-ChiangLee, National Taiwan University, Tzong-Lin Wu, Nat-ional Taiwan University
Fei Wang, Georgia Institute of Technology, Hua Wang,Georgia Institute of Technology
Ali Darwish, Army Research Lab., Kenneth McKnight, Army Research Lab., Mona Zaghloul, George Washing-ton University,Edward Viveiros, Army Research Lab.,Alfred Hung, Army Research Lab.
TU3C-2: A Nonreciprocal, Frequency-Tunable Notch Ampli�er Based on Distr-ibutedly Modulated Capacitors (DMC)Shihan Qin,Univ. of California, Los Angeles, YuanxunEthan Wang, Univ. of California, Los Angeles
TU3D-2: High-Power Continuous-Wave Terahertz Generation Through PlasmonicPhotomixersMona Jarrahi, University of California, Los Angeles
Nezih Yardimci, University of California, Los Angeles,Mona Jarrahi, University of California, Los Angeles
Ning Wang, University of California, Los Angeles,Hamid Javadi, Jet Propulsion Laboratory, Mona Jar-rahi, University of California, Los Angeles
TU3E-2: A Fully-Integrated Digitally-Program-mable 4×4 Picosecond Digital-to-Impulse Radiating Array in 65nm Bulk CMOS
TU3F-2:Tunable Acoustic-Wave-Lumped-Element Resonator (AWLR)-Based Band-Pass Filters
TU3G-2: Green Microwave Electronics forthe Coming Era of Flexible Electronics
14:10-14:20
TU3A-3: Bandpass Filtering Power Dividerwith Sharp Roll-O� Skirt and EnhancedIn-Band Isolation
TU3C-3: Integrated Diversity Front-Endfor Digital Satellite Radio Reception
TU3D-3: High-Power, Broadband TerahertzRadiation from Large Area Plasmonic Pho-toconductive Emitters Operating at Tele-communication Optical Wavelengths
TU3E-3: A 65nm CMOS 88-105 GHz DDFS-Based Fractional Synthesizer For High Re-solution Planetary Exploration Spectroscopy
TU3F-3: A Compact 1.9-3.4GHz Diplexerwith Controllable Transmission Zeros, Improved Isolation, and Constant Fract-ional Bandwidth
Dimitra Psychogiou, Purdue University, Roberto Gomez-Garcia, University of Alcala, Dimitrios Peroulis, Purdue University
TU3F-4: A Class of Fully-Recon�gurable Planar Multi-Band Bandstop Filters
14:30-14:4014:40-14:50
TU3A-4: General Model for Loaded StubBranch-Line Coupler
TU3A-5: An N-Way Transformer BasedWilkinson Power Divider in CMOS
TU3A-7: A Design of Negative Group Delay Power Divider: Coupling Matrix Approachwith Finite Unloaded-Qu Resonators
TU3A-6: Simple Broadband Gysel Comb-iner with a Single Coupled Line
TU3C-4: All-Digital Flexible Uplink RemoteRadio Head for C-RANAndré Prata, Universidade de Aveiro, Arnaldo Oliveira, Universidade de Aveiro - DETI / IT - Aveiro, Nuno Carva-lho, Instituto de Telecomunicacoes
TU3D-4: Heterodyne Terahertz Detectionwith Plasmonic Photomixers
TU3E-4: A K-Band Low Phase Noise andHigh Gain Gm Boosted Colpitts VCO for 76 – 81 GHz FMCW Radar Applications
TU3G-4: Electrically Tunable BandpassFiltering Balun on Engineered SubstrateEmbedded with Patterned PermalloyThin Film
14:50-15:00
TU3C-5: Design for TV Whitespace Opera-tional Compliance for Cognitive RadioEnabled HighIF WLAN/LTE Front-Ends
TU3D-5: Fully-Integrated and Electronically-Controlled Millimeter-Wave Beam-Scanning
TU3D-6: Metamaterial Modulators forTerahertz Communications and CodedAperture Imaging
TU3F-5: Multi-Functional Low-Pass FiltersWith Dynamically-Controlled In-Band Re-jection Notches
Tuesday Technical Sessions 13:30-15:10 Tuesday Technical Sessions 13:30-15:10
TU3C-1: RF Spectrum Sensing ReceiverSystem with Improved Frequency Chan-nel Selectivity for Cognitive IoT SensorNetwork Applications
Arun Ashok, RWTH Aachen Univ., Iyappan Subbiah, RWTH Aachen University, Gabor Varga, RWTH AachenUniversity, Moritz Schrey, RWTH Aachen University,Stefan Heinen, RWTH Aachen University
Willie Padilla, Duke University
TU3G-3: Investigation of Microwave ActiveElements Embedded in CompositeStructures
13:30-13:5013:50-14:10
14:10-14:3014:30-14:50
14:50-15:10
Juergen Roeber, Univ. of Erlangen-Nuremberg,Simon Senega, Universität der BundeswehrMünchen, Andreas Baenisch, In�neon TechnologiesAG, Amelie Hagelauer, Univ. of Erlangen-Nuremberg,Robert Weigel, Univ. of Erlangen-Nuremberg, StefanLindenmeier, Universität der Bundeswehr München
14:20-14:3015:00-15:10
TU3B: Wideband Power Ampli�ersChair: Ruediger Quay, Fraunhofer IAF
Co-Chair: Arvind Keerti, Qualcomm, Inc.
Takaaki Yoshioka, Mitsubishi Electric Corporation, Naoki Kosaka, Mitsubishi Electric Corporation, Ma-satake Hangai, Mitsubishi Electric Corporation, Koji Yamanaka, Mitsubishi Electric Corporation
TU3B-2: A 2-22 GHz Wideband Active Bi-directional Power Divider/Combiner in130 nm SiGe BiCMOS TechnologyIckhyun Song, Georgia Institute of Technology, Moon-Kyu Cho, Georgia Institute of Technology, Jeong-Geun Kim, Kwangwoon University, Glenn Hopkins, GeorgiaTech Research
TU3B-3: A 2.8-to-6 GHz High-E�ciencyCMOS Power Ampli�er with High-orderHarmonic Matching Network
TU3B-5: Measured Linearity Improvementof 10 W GaN HEMT PA with Dynamic GateBiasing Technique for Flat Transfer Phase
TU3B-4: Two-way Concurrent Dual-BandPower Ampli�er at 0.9/1.8 GHz with LowSecond Harmonic and Intermodulation
Dragan Gecan, Norwegian Univ. of Science and Technology, Morten Olavsbråten, Norwegian Univ. of Science and Techno-logy, Karl Martin Gjertsen, Disruptive Technologies Research
TU3B-1: An S-band 240 W Output / 54 % PAE GaN Power Ampli�er with BroadbandOutput Matching Network for both Fund-amental and 2nd Harmonic Frequencies
TU3E-5: A 5.8 GHz and -192.9 dBc/Hz FoMTCMOS Class-B Capacitively-Coupled VCO with Gm-Enhancement
Shilei Hao, University of California, Davis, Jane Gu,University of California, Davis
Eric Naglich, Naval Research Laboratory, Andrew Guyette, Naval Research Laboratory Nathalie Deltimple, University of Bordeaux,
Guillaume Ferré, University of Bordeaux, Mouna Ben Mabrouk, University of Bordeaux, Eric Kerhervé, University of Bordeaux
Zhenqiang Ma, University of Wisconsin, Yei Hwan Jung, University of Wisconsin, Tzu-Hsuan Chang, University of Wisconsin, Jung-Hun Seo, University of Wisconsin, Huilong Zhang, University of Wisconsin, Zhiyong Cai, USDA Forrest Products Laboratory, Shaoqin Gong, University of Wisconsin
Thomas Baum, RMIT University, Richard Ziolkowski, University of Arizona, Kelvin Nicholson, DST Group, Richard Ziolkowski, University of Arizona
Yujia Peng, University of South Carolina, Yong Mao Huang, University of Electronic Science & Technology of China, Tengxing Wang, University of South Carolina, Wei Jiang, University of South Carolina, Guoan Wang, University of South Carolina
Tao Yang, University of California at San Diego, Gabriel Rebeiz, University of California at San Diego
Dimitra Psychogiou, Purdue University, Roberto Gomez-Garcia, University of Alcala, Dimitrios Peroulis, Purdue University
Dimitra Psychogiou, Purdue University, Roberto Gomez-Garcia, University of Alcala, Dimitrios Peroulis, Purdue University
M. Mahdi Assefzadeh, Rice University, Aydin Babakhani, Rice University
Adrian Tang, Jet Propulsion Laboratory, Theodore Reck, Jet Propulsion Laboratory, Yangyho Kim, University of California, Los Angeles, Gabriel Virbila, University of California, Los Angeles, Goutam Chattopadhyay, Jet Propulsion Laboratory, Mau-Chung Chang, University of California, Los Angeles
Run Levinger, IBM Research - Haifa, Roee Ben Yishay, IBM Research - Haifa, Jakob Vovnoboy, IBM Research - Haifa, Oded Katz, IBM Research - Haifa, Danny Elad, IBM Research - Haifa
Tai Nguyen, Washington State University, Pawan Agarwal, Washington State University, Deukhyoun Heo, Washington State University
Wei Jiang,Univ. of South Carolina, Tengxing Wang, Univ. of South Carolina, Yujia Peng, Univ. of South Carolina, Yong Mao Huang, Univ. of Electronic Science & Technology of China, Guoan Wang, Univ. of South Carolina
Qiuyi Wu, University of Ontario Institute of Technology, Yimin Yang, University of Waterloo, Ying Wang, University of Ontario Institute of Technology, Xiaowei Shi, Xidian
JiKang Nai, National Taiwan Univ.,YuanHong Hsiao, National Taiwan Univ., YuanShan Wang, National Taiwan Univ., Yu-Hsuan Lin, National Taiwan Univ., Huei Wang, National Taiwan Univ.
Zhijiang Dai, Univ. of Electronic Science and Tech. of China, Songbai He, Univ. of Electronic Science and Tech. of China, Jingzhou Pang, Univ. of Ele-ctronic Science and Tech. of China, Chaoyi Huang, Univ. of Electronic Sci-ence and Tech. of China, Tian Qi, Univ. of Electronic Science & Tech. of China
Girdhari Chaudhary, Chonbuk National Univ., Phirun Kim, Chonbuk National Univ., Junhyung Jeong, Chonbuk National Univ.,Yongchae Jeong, Chonbuk National Univ.
Mohammed Reza Hashemi, Univ. of California, Los Angeles, ShangHua Yang, Univ. of California, Los Angeles, Tongyu Wang, Michigan State Univ., Nelson Sepúlveda, Michigan State Univ., Mona Jarrahi,Univ. of California, Los Angeles
Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions
Room: 303 Room: 304 Room: 305 Room: 306 Room: 309 Room:310Room: 308
Chair: Kamal Samanta, AMWT Ltd. UK
Co-Chair: Alexander Koelpin, Univ. of Erlangen-Nuremberg
Chair: David R. Jackson, Univ. of HoustonCo-Chair: Jan Machac, Czech Technical Unv.
in Prague
Chair: Michel Nakhla, Carleton Univ.
Co-Chair: Vikas Shilimkar, NXPSemiconductors
Chair: Costas Sarris, Univ. of TorontoCo-Chair: Peter Russer, Technische Univ.München
Chair: Ken Mays, KMays Technical ServicesCo-Chair: Jiang Zhu, Google, Inc.
Chair: Julio Navarro, Boeing
Co-Chair: James Skala, Georgia Institute of Technology
15:55-16:15
TU4A-1: Wideband Tunable GaN HEMTModule Utilizing Thin-Film BST Varactorsfor E�ciency Optimization
TU4D-1: Polynomial-Based Surrogate Model-ing of Microwave Structures in Frequency Domain Exploiting the Multinomial Theorem
TU4F-1: Explicit and Unconditionally Stable FDTD Method Without Eigenvalue Solutions
TU4G-1: A Metamaterial-Inspired Miniaturi-zed Wide-Band Microwave Interferometry Sensor for Liquid Chemical Detection
TU4H-1: An 8-Element 2–16 GHz Phased Ar-ray Receiver with Recon�gurable Number of Beams in SiGe BiCMOS
16:15-16:35
TU4A-2: Recon�gurable Single/Multi-BandPlanar Impedance Transformers With Inco-rporated Bandpass Filtering Functionality
TU4C-2: Solution of Periodically LoadedWaveguides Using the Eigenmode Proj-ection Technique
TU4D-2: E�cient Variability Analysis usingParameterized Model-Order Reduction
TU4F-2: PMLC: A Perfectly Matched Layer Co-llimator and its Applications to Time and Fre-quency Domain Numerical Techniques
TU4G-2: A Low Cost and Pipe Conformable Microwave-Based Water-Cut Sensor
TU4H-2: A 2-15 GHz Built-in-Self-Test Sys-tem for Wide-band Phased Arrays Using Self-Correcting 8-State I/Q Mixers
16:35-16:55
TU4A-3: A Substrate Integrated MatchedLoad with Embedded Resistive Thick Film
TU4C-3: Accurate Substrate Integrated Wav-eguide Modeling Using An Exact AnalyticalFormulation for Multiple Cylinder Scattering
TU4D-3: Low-Cost Dimension Scaling andTuning of Microwave Filters Using Response Features
TU4F-3: Novel Single-Source Integral Equation for Inductance Extraction in Transmission Lin-es Embedded in Lossy Layered Substrates
TU4G-3: Low Temperature Plasma forTunable Resonant Attenuation
Muhammad Akram Karimi, King Abdullah University of Science and Technology, Muhammad Arsalan, Saudi Ar-amco, Atif Shamim, King Abdullah University of Science and Technology
TU4G-4: Accurate Multi-Bias EquivalentCircuit Model for Graphene Resonant Channel Transistors
16:55-17:15
TU4A-4: Broadband Directional MorenoCoupler for High-Performance Air-FilledSIW-Based Substrate Integrated Systems
TU4C-4: Direct Full-Wave Modeling of Bi-dimensional Structures Combining E-Planeand H-Plane Analysis Techniques
TU4D-4: Reduced Dimensional PolynomialChaos Approach for E�cient UncertaintyAnalysis of Multi-Walled Carbon NanotubeInterconnects
TU4F-4: Modeling of Waveguide Compon-ents by the BI-RME Method with the Ewa-ld Green’s Function and the SegmentationTechnique
TU4H-4: Bi-Directional Active and PassiveMeandered Circularly Polarized CRLH-In-spired Leaky-Wave Antennas Based on Substrate Integrated Waveguide
Tuesday Technical Sessions 15:55-17:15 Tuesday Technical Sessions 15:55-17:15
TU4C-1: A Hands-on Approach for Engin-eering Students and Practitioners to An-alyze Electromagnetic Interactions onFlat Boundaries
TU4H-3: Two-dimensional Full-HemisphereFrequency Scanning Array Based on Meta-material Leaky Wave Antennas and FeedNetworks
15:55-16:1516:15-16:25
16:25-16:3516:35-16:55
16:55-17:0517:05-17:15
Chair: Paul Draxler, Qualcomm Technologies, Inc.
Co-Chair: Leo de Vreede, Delft Univ. of Technology
TU4B-2: A Pulse-Mode CMOS Power Amp-li�er for Multi-Band LTE Femtocell BaseStations
TU4B-3: Advanced Envelope Delta-SigmaTransmitter Architecture with PLM PowerAmpli�er for Multi-Standard Applications
TU4B-4: A Three-Level Class-G Modulated 1.85 GHz RF Power Ampli�er for LTE Appli-cations with over 50% PAE
TU4B-1: A 43% PAE Inverse Class-F PowerAmpli�er at 39-42 GHz with a Quarter-Wavelength Transformer Based HarmonicFilter in 0.13-um SiGe BiCMOS
Jin Yan, Purdue University, Dan Jiao, Purdue University Ali Pourghorban Saghati, Texas A&M University,
Jaskirat Singh Batra, Texas A&M University, Jun Kameoka, Texas A&M University, Kamran Entesari, Texas A&M University
Mustafa Sayginer, University of California at San Diego, Gabriel Rebeiz, University of California at San Diego
Tumay Kanar, University of California at San Diego, Gabriel Rebeiz, University of California at San Diego
Mehdi SalarKaleji, Wayne State University,Moham-mad Ashraf Ali, Wayne State University, Chung-Tse Michael Wu, Wayne State University
Dongyin Ren, Syracuse University, Hanseung Lee, Skyworks Solutions, Jun Choi, Syracuse University
Abbas Semnani, Purdue University, Hee Jun Yang, University of Illinois at Urbana-Champaign, Michael Sinanis, Purdue University, Sung-Jin Park, University of Illinois at Urbana-Champaign, Sergey Macheret, Purdue University, Dimitrios Peroulis, Purdue University, Gary Eden, University of Illinois at Urbana-Champaign
Tengda Mei, University of Electronic Science and Technology of China , Yuehang Xu, University of Electronic Science and Technology of China, Oupeng Li, University of Electronic Science and Technology of China, Yu Lan, University of Electronic Science and Technology of China, Yunqiu Wu, University of Electronic Science and Technology of China, Ruimin Xu, University of Electronic Science and Technology of China
Costas Sarris, University of Toronto, Shashwat Sharma, University of Toronto
Shucheng Zheng, University of Manitoba, Anton Menshov, University of Texas at Austin, Vladimir Okhmatovski, CEMWorks Inc.
Simone Battistutta, University of Pavia, Maurizio Bozzi, University of Pavia, Marco Bressan, University of Pavia, Marco Pasian, University of Pavia, Luca Perregrini, University of Pavia
TU4A: Advanced Passive Circuits TU4B: Switch-mode Techniques for RF / MM-Wave Power Ampli�ers
TU4C: Advances in Numerical and Analytical Electromagnetic Modeling
TU4D: Advanced CAD Algoritms and Techniques
TU4F: Advances and Applications of Time- and Frequency-Domain Numerical Techniques
TU4G: New Technologies for Micr-owave Applications - Sensors, Graph-ene Models, Tunable Resonators
TU4H: Integrated Phased Arrays and CRLH Beam Formers
Room: 307
Chair: Luca Roselli, Univ. of Perugia
Co-Chair: Kazuya Yamamoto, Mitsubishi Electric Corp.
TU4E-1: Chipless RFID Reading System Independent of Polarization
TU4E-2: A Novel Compact Harmonic RFIDSensor in Paper Substrate Based on a Var-iable Attenuator and Nested Antennas
TU4E-3: All-inkjet-printed Micro�uidics-Bas-ed Encodable Flexible Chipless RFID Sensors
TU4E-4: Inkjet-Printed Van-Atta Re�ect-Array sensors: A new paradigm for Long-Range Chipless Low Cost Ubiquitous Sma-rt Skin Sensors of the Internet of Things
TU4E-5: 3D Scanning and Sensing Technique for the Detection and Remote Reading of a Passive Temperature Sensor
TU4E: Advances in Chipless RFID Technology
Co-Chair: Qing He, Oracle Corporation
Jimmy Hester, Georgia Institute of Technology, Manos Tentzeris, Georgia Institute of Technology
Dominique Henry, LAAS-CNRS, Hervé Aubert, LAAS-CNRS, Patrick Pons, LAAS-CNRS
Wenjing Su, Georgia Institute of Technology, Qi Liu, Zhejiang University, Benjamin Cook,Texas Instruments, Inc., Manos Tentzeris, Georgia Institute of Technology
Valentina Palazzi, University of Perugia, Paolo Mezzanotte, University of Perugia
Marco Garbati, Grenoble Institute of Technology, Angel Ramos, Grenoble Institute of Technology, Romain Siragusa, Grenoble Institute of Technology, Etienne Perret, Grenoble Institute of Technology, Christophe Halope, Arjowiggins Security
Alex Wiens, Technische Universität Darmstadt, Sebastian Preis, Ferdin and-Braun-Institut, Leibniz-Institut fuer Ho, Christian Schuster, Technische Universität Darmstadt, Mohammad Nikfalazar, Technische Universität Darmstadt, Christian Damm, Technische Universität Darmstadt, Martin Schuessler, Technische Universität Darmstadt, Wolfgang Heinrich, Ferdinand-Braun-Insti-tut, Olof Bengtsson, Ferdinand-Braun-Institut, Rolf Jakoby,
Seyed Yahya Mortazavi, Virginia Polytechnic Institute and State University, Kwang-Jin Koh, Virginia Polytechnic Institute and State University
Walid Dyab, École Polytechnique de Montréal, Mohammad Abdallah, Syracuse University, Tapan Sarkar, Syracuse University, Magdalena Salazar-Palma, Universidad Carlos Iii De Madrid
Jose Chavez-Hurtado, ITESO - The Jesuit University of Guadalajara, Jose Rayas Sanchez, ITESO - The Jesuit University of Guadalajara
Ye Tao, Carleton University, Mina Adel, Carleton University, Behzad Nouri, Carleton University, Michel Nakhla, Carleton University, Ramachandra Achar, Carleton University
Slawomir Koziel, Reykjavik University, John Bandler, McMaster University
Daniel Lawrence, Technology Service Corporation
Tarek Mealy, Cairo University, Islam Eshrah, Cairo University, Tamer Abuelfadl, Cairo University
Carlos Carceller, Universitat Politècnica de València, Pablo Soto,Technical University of Valencia, Jordi Gil, Aurora Software and Testing, Vicente Boria, Universitat Politècnica de València
Nikolai Wol�, Ferdinand-Braun-Institut, Leibniz-Institut fuer Ho, Wolfgang Heinrich, Ferdinand-Braun-Institut, Manfred Berroth, University of Stut-tgart, Olof Bengtsson, Ferdinand-Braun-Institut
Maryam Jouzdani, University of Calgary, Mohamed Helaoui, University of Calgary, Fadhel Ghannouchi, University of Calgary
Hao-Shun Yang, National Taiwan University, Yi-Jan Chen, National Taiwan University, Jau-Horng Chen, National Taiwan University
Aditi Prasad, Colorado State University, Degen Zhou, Colorado State University, Sourajeet Roy, Colorado State University
Roberto Gomez-Garcia, University of Alcala, Dimitra Psychogiou, Purdue University, Dimitrios Peroulis, Purdue University
Christian Rave, Technical University of Hamburg, Arne Jacob, Technical University of Hamburg
Frederic Parment, University of Grenoble-Alpes, Anthony Ghiotto, University of Bordeaux, Tan-Phu Vuong, University of Grenoble-Alpes, Jean-Marc Duchamp, University of Grenoble-Alpes, Ke Wu, École Polytechnique de Montréal TU4H-4: A Series Feed Network Based on
a Distributed CRLH Stripline for Frequen-cy Scanning ApplicationsMichael Enders, Syracuse University, Jun Choi, Syracuse University
Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions
Room: 303 Room: 304 Room: 305 Room: 306 Room: 307 Room:308
Chair: Ian Gresham, ANOKIWAVECo-Chair: Mojgan Daneshmand,
Univ. of Alberta
Chair: Q.J. Zhang, Carleton Univ.Co-Chair: Peter Aaen, Univ. of Surrey
Chair: Miguel Laso, Public Univ. ofNavarre (UPNA)
Co-Chair: Vicente Boria, TechnicalUniv of Valencia
Chair: Zoya Popovic, Univ. of ColoradoCo-Chair: Paolo Mezzanotte, Univ.
of Perugia
Chair: Joseph Bardin, Univ. of Massachusetts, Amherst
Co-Chair: Theodore Reck, JetPropulsion Lab
WE1A-1: Same Side Dual SIL-Radar Systemfor Real-Time Vital Sign Monitoring withRandom Body Movement Cancellation
WE1D-1: A Compact Wideband UHF HelicalResonator Diplexer
WE1E-1: Radio Frequency Wireless Power Transfer to Chip-scale Apparatuses
WE1F-1: 500-750 GHz Submillimeter-WaveMEMS Waveguide Switch
WE1A-2: Enhanced Q Double Resonant Active Sensor for Humidity and Moisture E�ect Elimination
WE1C-2: Iso-thermal and Iso-dynamic Direct Charge Function Characterizationof GaN FET with Single Large-Signal Measurement
WE1D-2: Ka-band Surface-Mountable Pseudo-elliptic Filter in Multilayer Micromachined Tec-hnology for On-board Communication Systems
WE1E-2: Geometry Optimization of SlidingInductive Links for Position-independentWireless Power Transfer
WE1F-2: A Fully Encapsulated WaveguideCoupled Passive Imaging W-Band Radio-meter Module with RF Frontend IC in a SiGe-BiCMOS Technology
WE1A-3: High sensitivity, GHz OperatingSAW Pressure Sensor Structures Manufac-tured by Micromachining and Nano-proc-essing of GaN/Si
WE1A-4: Low-Power Planar Complex Diel-ectric Sensor with DC Readout Circuit in aBiCMOS Technology
WE1C-3: Non-Linear Electro-Thermal AlGaN/GaN Model Including Large-Signal DynamicThermal-Trapping e�ects
WE1D-3: Compact Triple-Band BandpassFilters Using Rectangular WaveguideResonators
WE1E-3: A Hybrid Heuristic Design Techn-ique for Real-time Matching Optimizationfor wearable near-�eld ambient RF ener-gy harvesters
WE1E-4: Class-E Power Converters for AC(50/60 Hz) Wireless Transmission
WE1E-5: High E�ciency GaN HEMT Synch-ronous Recti�er with an Octave Bandwi-dth for Wireless Power Applications
WE1E-6: A UHF Recti�er with One OctaveBandwidth Based On a Non-Uniform Transmission Line
WE1A-5: Application of Broadside-CoupledSplit Ring Resonator (BC-SRR) Loaded Tran-smission Lines to the Design of Rotary Enc-oders for Space Applications
WE1A-6: Wrist Location by Wearable Bracelet Belt Resonators
WE1C-4: Small signal modelling approachfor submillimeter wave III-V HEMTs with analysation and optimization possibilities
WE1C-4: Small-Signal Model Extraction of mm-wave N-polar GaN MISHEMT Exhibit-ing Record Performance: Analysis of Gain and Validation by 94 GHz Loadpull
WE1D-4: A Canonical Prototype for Coup-led-Resonator FIlters with Frequency-Dependent Couplings
WE1D-5: Mixed-Mode Resonator using TE101 Cavity Mode and TE01d DielectricMode
WE1D-6: Compact Bandpass Filters Basedon a New Substrate Integrated Wave-guide Coaxial Cavity
WE1F-4: A High-Q W Band Tunable Band-pass Filter
Wednesday Technical Sessions 08:00-09:40 Wednesday Technical Sessions 08:00-09:40
WE1C-1: Transient Gate Resistance Ther-mometry Demonstrated on GaAs andGaN FET
WE1F-3: BiCMOS Integrated Waveguidewith Arti�cial Dielectric at SubmillimeterWave Frequencies
Chair: George Duh, BAE Systems, Inc.Co-Chair: Shahed Reza, Sandia National
Laboratories
WE1B-2: Advances in the Super-Lattice Cast-ellated Field E�ect Transistor (SLCFET) for Wi-deband Low Loss RF Switching Applications
WE1B-3: Soldered Hot-via E-band and W-band Power Ampli�er MMICs for Millimet-er-wave Chip Scale Packaging
WE1B-4: A Fully Integrated High E�ciencyWideband Class EF2 PA for 5GHz WLAN 802.11ac Systems
WE1B-5: A GaN HEMT X-band Cavity Oscilla-tor with Electronic Gain Control
WE1B-6: Single-ended/di�erential 2.5-GS/s Do-uble Switching Track-and-Hold Ampli�er with 26GHz bandwidth in SiGe BiCMOS Technology
WE1B-1: A Single-Chip In-Band Full-DuplexLow-IF Transceiver with Self-InterferenceCancellation Liuqing Gao, Univ. of Illinois at Urbana-Champaign, Yansong Yang,
Univ. of Illinois at Urbana-Champaign, Brandon Arakawa, Univ. of Illinois at Urbana-Champaign, Justin Postma, Micron Technology, Inc., Songbin Gong, Univ. of Illinois at Urbana-Champaign
Alex Pacini, Alma Mater Studiorum - Università di Bologna, Riccar-do Trevisan, Univ. di Bologna, Franco Mastri, Univ. di Bologna, Die-go Masotti, Univ. di Bologna, Alessandra Costanzo, Univ. di Bologna
Umer Shah, KTH Royal Institute of Technology,The-odore Reck, Jet Propulsion Laboratory, Emmanuel Decrossas, Jet Propulsion Laboratory, Cecile Jung-Kubiak, Jet Propulsion Laboratory, Henrik Frid, KTH Royal Institute of Technology, Goutam Chattopadhyay, Jet Propulsion Laboratory, Imran Mehdi, Jet Propulsion Laboratory, Joachim Oberhammer, KTH Royal Institute of Technology
Andreas Strodl, University of Ulm, Václav Valenta, University of Ulm, Alina Bunea, IMT-Bucharest, Rolf Jonsson, Swedish Defence Research Agency (FOI), Shakila Reyaz, Uppsala University, Robert Malmqvist, Swedish Defence Research Agency (FOI), Hermann Schumacher, University of Ulm
Maria Alonso-DelPino, Jet Propulsion Laboratory, Harshitha Shivamurthy, Delft University of Technology, Daniele Cavallo, Delft University of Technology, Luca Galatro, Delft University of Technology, Marco Spirito, Delft University of Technology
James Do, University of California, Davis, Yusha Bey, University of California, Davis, Xiaoguang Liu, University of California, Davis
Jo Bito, Georgia Institute of Technology, Apostolos Georgiadis, Centre Tecnologic de Telecomunicacions de Cataluny, Manos Tentzeris, Georgia Institute of Technology
Jose-Ramon Perez-Cisneros, University of Zaragoza, Maria-Nieves Ruiz Lavin, University of Cantabria, Manuel Lobeira, University de Cantabria, Christian Brañas, University of Cantabria, Jesus de Mingo, University de Zaragoza, Jose Garcia, University of Cantabria
Thomas Johnson, University of British Columbia
Ferran Bolos, Centre Tecnologic de Telecomunicacions de Catalunya, Daniel Belo, University of Aveiro, Apostolos Georgiadis, Centre Tecnologic de Telecomunicacions de Catalunya
WE1A: Microwave Sensors for Practical Applications
WE1B: Latest Advancements in Semiconductor Technologies and
MMICs
WE1C: GaN HEMT Modeling and Characterization
WE1D: Non-Planar Microwave Filters and Multiplexers 1
WE1E: UHF and HF Components for Wireless Power Transfer
WE1F: Component Technologies from MM to Submm-Waves
Mu-Cyun Tang, National Sun Yat-sen University, Chao-Yun Kuo, National Sun Yat-sen University, Da-Cian Wun, National Sun Yat-sen University, Fu-Kang Wang, National Sun Yat-sen University, Tzyy-Sheng Horng, National Sun Yat-sen University
Xuebei Yang, Rice University, Aydin Babakhani, Rice University
Bryan Schwitter,M/A-COM Technology Solutions Holdings, Inc.,Anthony Parker,Macquarie University,Simon Mahon,M/A-COM Technology Solutions Holdings, Inc.,Michael Heimlich,Macqua-rie University
Ping Zhao, Chinese University of Hong Kong, Zhiliang Li, Chinese University of Hong Kong, Jianhua Wu, Huawei Tec-hnologies Co., Ltd., Ke-Li Wu, Chinese University of Hong Kong, Yanan Cui, Huawei Technologies Co., Ltd.
Paola Farinelli, RF Microtech, Luca Pelliccia, University of Perugia, Benno Margesin, Fondazione Bruno Kessler, Roberto Sorrentino, University of Perugia
Li Zhu, Com Dev Intl Ltd, Raafat Mansour, University of Waterloo, Ming Yu, Com Dev Intl Ltd
Agostino Benvegnu, XLIM Laboratory, Olivier Jardel, III-V Lab, Sylvain Laurent, XLIM Laboratory, Denis Barataud, University of LIMOGES - XLIM Laboratory, Matteo Meneghini, University of Padova, Enrico Zanoni, University of Padova, Raymond Quere, XLIM Laboratory
Daniel Niessen, University di Bologna, Gian Piero Gibiino, University of Bologna DEI "G. Marconi", Rafael Cignani, University of Bologna DEI "G. Marconi", Alberto Santarelli, University di Bologna, Dominique M. M.-P. Schreurs, ESAT-TELEMIC, Ku Leuven, Fabio Filicori, University di Bologna
Matthias Ohlrogge, Fraunhofer IAF, Rainer Weber, Fraunhofer IAF, Hermann Massler, Fraunhofer IAF, Matthias Seelmann-Eggebert, Fraunhofer IAF, Axel Tessmann, Fraunhofer IAF, Arnulf Leuther, Fraunhofer IAF, Michael Schlechtweg, Fraunhofer IAF, Oliver Ambacher, Fraunhofer IAF
Matthew Guidry, Univ. of California, Santa Barbara, Steven Wienecke, Univ. of California, Santa Barbara, Brian Rom-anczyk, Univ. of California, Santa Barbara, Haoran Li, Univ. of California, Santa Barbara, Xun Zheng, Univ. of California, Santa Barbara, Elaheh Ahmadi, Univ. of California, Santa Barbara, Karine Hestro�er, Univ. of California, Santa Barbara, Stacia Keller, Univ. of California, Santa Barbara, Umesh Mishra, Univ. of California, Santa Barbara
Mao Mengda, Nanyang Technological University, Chirn Chye Boon, Nanyang Technological University, Devrishi Khanna, Nanyang Technological University, Pilsoon Choi, Massachusetts Institute of Technology, Li-Shiuan Peh, Massachusetts Institute of Technology
Alexandre Bessemoulin, Macom, Melissa Rodriguez, Macom, Simon Mahon, M/A-COM Technology Solutions Holdings, Inc.
Mikael Horberg, Chalmers University of Technology, Dan Kuylenstierna, Chalmers University of Technology
Arnaud Meyer, Thales, Patricia Desgreys, Télécom ParisTech, Hervé Petit, Télécom ParisTech, Bruno Louis, Thales, Vincent Petit, Thales
Robert Howell, Northrop Grumman, Eric Stewart, Nor-throp Grumman, Ron Freitag, Northrop Grumman, Justin Parke, Northrop Grumman, Bettina Nechay, Northrop Grumman, Matthew King, Northrop Grum-man, Shalini Gupta, Northrop Grumman, Megan Snook, Northrop Grumman, Ishan Wathuthanthri, Northrop Grumman, Parrish Ralston, Northrop Grumman, George Henry, Northrop Grumman
Stefano Tamiazzo, Commscope Italy, Giuseppe Macchiarella, Politecnico di Milano
Cristiano Tomassoni, University of Perugia, Simone Bastioli, RS Microwave Company, Richard Snyder, RS Microwave Company, Inc.
Miguel Sanchez-Soriano, University of Alicante, Stefano Sirci, Technical University of Valencia, Jorge D. Martinez, Technical University of Valencia, Vicente Boria, Universitat Politècnica de València
Mohammad Abdolrazzaghi,University of Alberta, Mojgan Daneshmand, University of Alberta
Alexandru Muller, IMT Bucharest, Antonis Stavrinidis, FORTH IESL Heraklion, Ioana Giangu, IMT Bucharest, Alexandra Stefanescu, IMT Bucharest, George Stavrinidis, FORTH IESL Heraklion, Alexandros Pantazis, Foundation for Research and Technology Hellas, Adrian Dinescu, IMT Bucharest, George Boldeiu, IMT Bucharest, George Konstantinidis, FORTH IESL Heraklion
Mohamed Eissa, IHP Microelectronics, Farabi Jamal, IHP Microelectronics, Subhajit Guha, IHP Microelectronics, Cha�k Meliani,IHP Microelectronics, Dietmar Kissinger, IHP Microelectronics, Jan Wessel, IHP Microelectronics
Jordi Naqui, University Autònoma de Barcelona, Ferran Martín, University Autònoma de Barcelona
Chieh-Sen Lee, HTC Corporation,Chun-Yih Wu, HTC Corporation,Yen-Kiang Kuo, HTC Corporation
WE1F-5: Silicon Image Guide (SIG) Technol-ogy Platform for High Performance Sub Millimeter-Wave Passive Structures Aidin Taeb, Univ. of Waterloo, Luyao Chen, Univ. of Waterloo, Suren Gigoyan, Univ. of Waterloo, Mohamed Basha, Zewail City of Science and Technology, Sa�eddin Safavi-Naeini, Univ. of Waterloo
08:00-08:1008:10-08:20
08:20-08:4008:40-09:00
09:00-09:2009:20-09:30
09:30-09:40
08:00-08:1008:10-08:20
08:20-08:4008:40-09:00
09:00-09:2009:20-09:30
09:30-09:40
Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions
WEIF1-2: Metallic Air Cavities Integratedwith Surface Mount Tuning Componentsfor Tunable Evanescent-Mode Resonators
WEIF1-2: Characterization of BroadbandLow-NEP SiGe Square-Law Detectors for mm-wave Passive Imaging
WEIF1-2: Scalable Modeling of ResistiveLosses in On-Chip Interconnects at mm-Wave Frequencies
WEIF1-3: Recon�gurable Bandpass FilterTopology using Cul-de-sac Resonators with Adjustable Notches
WEIF1-1: The In�uence of Dielectric andConductor Losses on the Properties ofSpherical Resonators
WEIF1-3: High Sensitivity Tunable PowerDetector
WEIF1-4: Temperature-Compensated Lu-mped Element Tunable Bandpass Filter
WEIF1-2: Electrostatic Analysis of Multi-conductor Transmission Lines Using an Eigenmode Projection Technique
WEIF1-1: Analysis of self-injection locked oscillators for motion sensing applications
WEIF1-1: Development of a Double-Octave (7-??34 GHz), Highly Linear SingleBalanced Resistive HEMT Mixer Using Device Linearization Techniques
WEIF1-2: SiGe based Ka-band re�ectiontype phase shifter for integrated phasedarray transceivers
WEIF1-3: Backward Leaky-Wave Radiationof Microstrip Patterned With Sub-wavele-ngth Hole Array
WEIF1-2: Multi-Frequency Large-SignalAnalysis Using Describing Functions
WEIF1-4: Enhancement of point-sourceresolution via 2-D and 3-D electromagn-etic time-reversal
WEIF1-3: AM/PM Distortion Physical Originsin Si LDMOS Doherty Power Ampli�ers
WEIF1-1: Cheap Method for Accurate Cha-racterization of Orthomode Transducers
WEIF1-2: Parallel EM Optimization Appro-ach to Microwave Filter Design Using Fea-ture Assisted Neuro-Transfer Functions
WEIF1-3: Low-Cost Multi-Objective Designof Compact Microwave Structures Using Domain Patching
WEIF1-4: Fast Yield Estimation and Optimiza-tion of Microwave Filters Using a Cognition-Driven Formulation of Space Mapping
WEIF1-5: Accurate Simulation-DrivenModeling and Design Optimization ofCompact Microwave Structures
WEIF1-1: A Hybrid Topology OptimizationMethod Based on Sensitivity Analysis
Lei Zheng, Oregon State University, Andrew Ferrara, Oregon State University, Andreas Weisshaar, Oregon State University
INTERACTIVE FORUMWednesday | Time: 09:00-11:00 | Room: 301 & 302
WEIF1-1: Novel Remote Controlled Dual ModeFilter Providing Flexible Re-Allocation of Cent-er Frequency and Bandwidth
WEIF1-3: An N-Path Bandpass Filter with aTuning Range of 0.1-12 GHz and StopbandRejection > 20 dB in 32 nm SOI CMOS
WEIF1-1: A Single Input Transformer-lessPush-Pull Microwave Power Ampli�er
WEIF1-1: Noise Measurement of CryogenicLow Noise Ampli�ers Using a Tunnel-Jun-ction Shot-Noise Source
WEIF1-1: Cascaded Splitter/Combiner Mic-rostrip Sections Loaded with Complemen-tary Split Ring Resonators (CSRRs): Model-ing, Analysis and Applications
INTERACTIVE FORUMWednesday | Time: 09:00-11:00 | Room: 301 & 302
Uwe Rosenberg, Mician Global Engineering GbR, Ralf Beyer, Mician GmbH, Peter Krauss, Mician GmbH, Thomas Sieverding, Mician GmbH, Andreas Papanastasiou, Com Dev International, Marcos Pueyo-Tolosa, Com Dev International, Petronilo Martin Iglesias, ESA, Christoph Ernst, ESA
Kerim Kibaroglu, University of California at San Diego, Gabriel Rebeiz, University of California at San Diego
Gavin Watkins, Toshiba Research Europe LimitedSu-Wei Chang, University of Massachusetts, Amherst, Jose Aumentado, National Institute of Standards and Technology, Joseph Bardin, University of Massachusetts, Amherst
Eduard Malotaux, Delft University of Technology, Marco Spirito, Delft University of Technology
Muh-Dey Wei, RWTH Aachen University, Saad Qayyum, RWTH Aachen University, Renato Negra, RWTH Aachen University
Mabel Ponton, University de Cantabria, Almudena Suarez, University of Cantabria
Scott Schafer, University of Colorado, Zoya Popovic, University of Colorado
Luis Nunes, Universidade de Aveiro, Pedro Cabral, Universidade de Aveiro, Jose Pedro, Instituto de Telecomunicacoes - Universidade de Aveiro
Matteo Oldoni, SIAE Microelettronica SpA, Dario Tresoldi, SIAE Microelettronica SpA
Ingo Wol�, IMST GmbH
Islam Eshrah, Cairo University, Tamer Abuelfadl, Cairo University
Xinru Li, Tianjin University, Clive Tzuang, Tianjin University, Qianru Weng, Tianjin University, Chang Lu, Tianjin University, Hsien-Shun Wu, Tianjin University
Huilin TU, University of Electronic Science and Technology of China, Shaoqiu XIAO, University of Electronic Science and Technology of China , Bingzhong WANG, University of Electronic Science and Technology of China
Jian Wang, University of Electronic Science and Technology of China, Xue-Song Yang, University of Electronic Science and Technology of China
Feng Feng, Carleton University, Venu-Madhav-Reddy Gongal-Reddy, Carleton University,Chao Zhang, Carleton University, Shunlu Zhang, Carleton University, Qijun Zhang, Carleton University
Adrian Bekasiewicz, Reykjavik University, Slawomir Koziel, Reykjavik University, John Bandler, McMaster University
Chao Zhang, Carleton University, Weicong Na, Carleton University, Qijun Zhang, Carleton University, John Bandler, McMaster University
Slawomir Koziel, Reykjavik University, Adrian Bekasiewicz, Reykjavik University
Xiaoguang Liu, University of California, Davis
Seunggoo Nam, Korea University, Boyoung Lee, Korea University, Juseop Lee, Korea University
Mohammad Abu Khater, Purdue University, Kaiyuan Zeng, Purdue University, Dimitrios Peroulis, Purdue University
Thuy Nguyen, University of California, Davis, Anh-Vu Pham, University of California, Davis, Kohei Fujii, M/A-COM Technology Solutions, Alfy Riddle
Nadav Mazor, IBM Research - Haifa, Oded Katz, IBM Research - Haifa, Roee Ben Yishay, IBM Research - Haifa, Duixian Liu, IBM Research, Alberto Valdes Garcia, IBM Research, Danny Elad, IBM Research - Haifa
WEIF1-2: Hybrid Cylindrical Radial Super-lattice Conductor-based Air-Lifted RF Ind-uctors with Ultra-High Quality Factor for UWB and K-bands
WEIF1-3: An Electrically Actuated Liquid-Metal Switch With Metastable SwitchingStates
WEIF1-1: Online Spectral Estimation of Phase Noise in FMCW Radar Transceiver MMICs
WEIF1-2: Ka-Band Metamaterial MöbiusOscillator (MMO) Circuit
WEIF1-3: A 90 nm CMOS Low Phase Noise Sub-harmonically Injection-locked Voltage-Controlled Oscillator with FLL Self-alignmentTechnique
WEIF1-1: Tunable RF MEMS-based Freque-ncy Dependent Power LimiterDesireh Shojaei-Asanjan, University of Waterloo, Sara Attar, University of Waterloo, Raafat Mansour, University of Waterloo Lijuan Su, University Autònoma de Barcelona, Jordi
Naqui, University Autònoma de Barcelona, Javier Mata, University Autònoma de Barcelona, Ferran Martin, University Autònoma de Barcelona
Arian Rahimi, University of Florida, Yong-Kyu Yoon, University of Florida
George Zhang, University of Hawaii, Ryan Gough, University of Hawaii, Matthew Moore�eld, University of Hawaii, Aaron Ohta, University of Hawaii, Wayne Shiroma, University of Hawaii
Alexander Melzer, Johannes Kepler University of Linz, Alexander Onic, DICE GmbH & Co. KG, Mario Huemer, Johannes Kepler University of Linz
Ajay Poddar, Synergy Microwave, Ulrich Rohde, Brandenburg University of Technology Cottbus, Anisha Apte, Brandenburg University of Technology, Shiban Koul, Indian Institute of Technology Delhi
Yen-Liang Yeh, National Central University, Shu-Yan Huang, National Central University, Yi-En Shen, National Central University, Hong-Yeh Chang, National Central University
Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions
Room: 303 Room: 304 Room: 305 Room: 306 Room: 307 Room:308
Chair: Douglas Teeter, QORVO, Inc.
Co-Chair: Wolfgang Heinrich, Ferdinand-Braun-Institut
Chair: Clemens Ruppel, TDKCo-Chair: Chengjie Zuo, Qualcomm
Technologies, Inc.
Chair: Magdalena Salazar Palma,Charles Univ.
Co-Chair: Clark Bell, HF Plus
Chair: Richard Snyder, RS MicrowaveCo-Chair: Steven Reising, Colorado
State Univ.
Chair: Imran Mehdi, Jet Propulsion LabCo-Chair: Jae-Sung Rieh, Korea Univ.
WE2A-1: Linear Doherty Power Ampli�er with Adaptive Bias Circuit for Average Power-Tracking
WE2D-1: Novel Microstrip Realization andStraightforward Design of Fully Canonical Cul-de-Sac Coupling Bandpass Filters
WE2E-1: Kiyo Tomiyasu: A Lifetime of Ex-ceptional Service and Generosity to IEEE
WE2F-1: Cross-Polarized Multi-ChannelW-Band Radar for Turbulent Flow Velo-city Measurements
WE2A-2: A 80W High Gain and BroadbandDoherty Power Ampli�er for 4/5G Wire-less Communication Systems
WE2C-2: Investigations on Design Techn-ologies for SAW Quadplexer with NarrowDuplex Gap
WE2D-2: Multilevel Aggressive Space Mapping Applied to Coupled-ResonatorFilters
WE2E-2: Kiyo Tomiyasu: One of the MTT-S Fathers
WE2F-2: Multi-Section Auto-Focus Mill-imeter-Wave Holography
WE2A-3: Current Scaled Doherty Ampli�erfor High E�ciency and High Linearity
WE2A-4: A Concurrent 2.15/3.4 GHz Dual-Band Doherty Power Ampli�er with Exte-nded Fractional Bandwidth
WE2C-3: Low Loss and High Isolation Techniques for High Power RF AcousticDevices
WE2D-3: Direct Synthesis and Design of High Degree Lowpass Filters with Ultra-Wide Stopband
WE2E-3: Kiyo Tomiyasu: Key Contributorto the IEEE Geoscience and Remote Sens-ing Society (GRSS) from 1981 to 2013
WE2E-4: Re�ections on Kiyo Tomiyasuand his Connections to Modern Trends in Interferometric SAR for Earth Science
WE2E-5: Kiyo Tomiyasu: The Mentor
WE2E-6: My Friend and Mentor, Kiyo Tomiyasu
WE2A-5: Novel Design of Highly-E�cient Conc-urrent Dual-band GaN Doherty Power Ampli�erUsing Direct-Matching Impedance Transformers
WE2A-6: Deign of Broadband Highly E�cienct Doherty Power Ampli�ers By Using Series Of Continuous Modes
WE2A-7: A 112W GaN Dual Input Doherty-Outphasing Power Ampli�er
WE2C-4: Multiplexers as a Method of Supporting Same-Frequency-Range Down Link Carrier Aggregation
WE2C-5: Multiplexers: a Necessary Exten-sion for 4G/5G Systems
WE2D-4: First-Order Re�ectionless lump-ed-Element Lowpass Filter (LPF) and Bandpass Filter (BPF) Design
WE2D-5: Two-Branch Channelized Passive Fi-lters for Lowpass and Bandpass Applications
WE2D-6: Coupling Matrix and Admittance Fu-nction Synthesis for Mixed Topology Filters
WE2F-4: A Spectral Pro�ling Method of MM-Wave and Terahertz Radiation Sources
Wednesday Technical Sessions 10:10-11:50 Wednesday Technical Sessions 10:10-11:50
WE2C-1: Carrier Aggregation and its Challenges – or: The Golden Age for Acoustic Filters
WE2F-3: An Integrated 100-Element Sch-ottky Varactor Diode Array for Sideband Generation at 1.6 THz
Chair: Dietmar Kissinger, IHP Micro-electronics
Co-Chair: Anand Gopinath, Univ.of Minnesota
WE2B-2: Low Cost Inkjet Printed Smart Bandage for Wireless Monitoring of Chronic Wounds
WE2B-3: Full Mutual Coupling Suppressionin NMR Transmit Arrays in the Presence of High-Permittivity Pads
WE2B-4: New MRI-safe Implant Electr-ode Design
WE2B-5: Characterization of a Novel Microwave Heater for Continuous Flow Micro�uidics Fabricated on High-Resist-ivity Silicon
WE2B-1: Microwave System and Methodsfor Combined Heating and Radiometric Sensing for Blood Perfusion Measurement of Tissue
Michael Deering, IEEE
Jozef Modelski, Warsaw University of Technology
Timo Jaeschke, Ruhr University Bochum, Christian Bredendiek, Ruhr-University Bochum, Simon Kueppers, Ruhr-University Bochum, Christian Schulz, Ruhr-University Bochum, Christoph Baer, Ruhr-University Bochum, Nils Pohl, Ruhr-University Bochum
Hang Cheng, Beijing Institute of Technology, Jane Gu, University of California, Davis, Yu Cheng, Beijing Institute of Technology, Shiyong Li, Beijing Institute of Technology, Houjun Sun, Beijing Institute of Technology
Sami Hawasli, University of Virginia, Souheil Nadri, University of Virginia, Linli Xie, University of Virginia, Robert Weikle, University of Virginia
Richard Al Hadi, University of California, Los Angeles, Yan Zhao, University of California, Los Angeles, Yilei Li, University of California, Los Angeles, Yuan Du,University of California, Los Angeles, Christopher Curwen, University of California, Los Angeles, Benjamin Williams, University of California, Los Angeles, Mau-Chung Chang, University of California, Los Angeles
Steven Reising, Colorado State University
Paul Rosen, California Institute of Technology
Jón Atli Benediktsson, University of Iceland
Richard Snyder, RS Microwave
WE2A: Doherty Ampli�ers are Aive and Well After 80 Years
WE2B: RF Systems and Instru-mentation for Healthcare
Applications
WE2C: Acoustic Multiplexers for Carrier Aggregation
WE2D: New Theory and Synthe-sis Techniques for Planar Filters
WE2E: Memorial Session in Honor of Dr. Kiyo Tomiyasu
WE2F: Emerging MM & Submm-Wave Applications
Yunsung Cho, POSTECH University, Kyunghoon Moon, POSTECH University, Jooseung Kim, POSTECH University, Byungjoon Park, POSTECH University, Bumman Kim, POSTECH University
Mohammad-Reza To�ghi, Pennsylvania State University, Harrisburg, Jayendrasingh Pardeshi, Pennsylvania State University, Harrisburg, Brian Maicke, Pennsylvania State University, Harrisburg
Gernot Fattinger, QORVO, Inc., Alexandre Volatier, QORVO, Inc., Mudar Al-Joumayly, QORVO, Inc.,Yazid Yusuf, University of Central Florida, Robert Aigner, QORVO, Inc., Nadim Khlat, QORVO, Inc., Marcus Granger-Jones, QORVO, Inc.
Masataka Ohira, Saitama University, Toshiki Kato, Saitama University, Zhewang Ma, University of Tsukuba
Alejandro Garcia-Lamperez, Universidad Carlos Iii De Madrid, Magdalena Salazar-Palma, Universidad Carlos Iii De Madrid
Zhiliang Li, Chinese University of Hong Kong, Ke-Li Wu, Chinese University of Hong Kong
Masanori Ueda, TAIYO YUDEN Co., Ltd., Osamu Kawachi, TAIYO YUDEN Mobile Technology Co., Ltd., Tokihiro Nishihara, TAIYO YUDEN Co., Ltd., Jun Tsutsumi, TAIYO YUDEN Co., Ltd.
Yuichi Takamine, Murata Manufacturing Co., Ltd., Hideki Iwamoto, Murata Manufacturing Co., Ltd., Masayoshi Koshino, Murata Manufacturing Co., Ltd., Masahiro Hiramoto, Murata Manufacturing Co., Ltd., Takaya Wada, Murata Manufacturing Co., Ltd., Norio Nakajima, Murata Manufacturing Co., Ltd.
William Mueller, Avago Technologies, Richard Ruby, Avago Technologies
Edgar Schmidhammer, EPCOS AG, Thomas Metzger, EPCOS AG, Christian Ho�mann, EPCOS AG
Steven McCabe, University of Waikato, Jonathan Scott, University of Waikato
Atefeh Kordzadeh, University of Alberta, Nicola DeZanche, University of Alberta
Tomislav Markovic, KU Leuven, div. ESAT-TELEMIC, Ilja Ocket, IMEC, Paolo Fiorini, Imec, Bart Nauwelaers, KU Leuven, div. ESAT-TELEMIC
Muhammad Fahad Farooqui, King Abdullah University of Science and Technology, Atif Shamim, King Abdullah University of Science and Technology
Tae-Hak Lee, Korea University, Boyoung Lee, Korea University, Juseop Lee, Korea University
Roberto Gomez-Garcia, University of Alcala, Andrew Guyette, Naval Research Laboratory
Yuxing He, Univ. of Science and Technology of China, Gang Wang, Univ. of Science and Technology of China, Liguo Sun, Univ. of Science and Technology of China, Gerard Rushingabigwi, Univ. of Science and Technology of China
Chaoyi Huang, Univ. of Electronic Science and Technology of China, Songbai He, Univ. of Electronic Science and Technology of China, Zhijiang Dai, Univ. of Electronic Science and Technology of China, Jingzhou Pang, Univ. of Electronic Science and Technology of China, Zhebin Hu, Univ. of Electronic Science and Technology of China
William Hallberg, Chalmers Univ. of Technology, Mustafa Ozen, Chalmers Univ. of Technology, Christian Fager, Chalmers Univ. of Technology
Mingming Liu, University of Waterloo, Hamed Golestaneh, University of Waterloo, Slim Boumaiza, University of Waterloo
Jingzhou Pang, Univ. of Electronic Science and Technology of China, Songbai He, Univ. of Electronic Science and Technology of China, Zhijiang Dai, Univ. of Electronic Science and Technology of China, Chaoyi Huang, Univ. of Electronic Science and Technology of China, Jun Peng, Univ. of Electronic Science and Tec-hnology of China, Fei You, Univ. of Electronic Science and Technology of China
Weimin Shi, Univ. of Electronic Science and Technology of China, Songbai He, Univ. of Electronic Science and Technology of China, Qiang-an Liu, Univ. of Electronic Science and Technology of China
Abdul Qureshi, Delft Univ. of Technology, Mustafa Acar, Ampleon, Jawad Qureshi, Ampleon, Robin Wesson, Ampleon, Leo C. N. de Vreede, Delft Univ. of Technology
10:10-10:3010:30-10:40
10:50-11:1011:10-11:20
11:20-11:3011:30-11:40
10:40-10:5011:40-11:50
10:10-10:3010:30-10:50
10:50-11:1011:10-11:30
11:30-11:4011:40-11:50
Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions
Room: 303 Room: 304 Room: 305 Room: 306 Room: 307 Room:308
Chair: Glenn Hopkins, Georgia Instituteof Technology
Co-Chair: Aly Fathy, Univ. of Tennessee
Chair: Debabani Choudhury, Intel Corp.Co-Chair: Olga Boric-Lubecke, Univ.
of Hawaii
Chair: Andrew Guyette, Naval Research Laboratory
Co-Chair: Roberto Gomez-Garcia, Univ.of Alcala
Chair: George Ottman, Retired: Hughes Air-craft Co., Past President MTT Society
Co-Chair: Jerry Hausner, Retired: Owner, Electro Science Technologies
Chair: Farshid Aryanfar, Straight PathCommunications
Co-Chair: Jim Buckwalter, Univ. of California, Santa Barbara
WE3A-1: Recon�gurable X-Band 4x4 But-ler Array in 32nm CMOS SOI for Angle-Reject Arrays
WE3D-1: A High Dynamic Range 4th-order4-8 GHz Q-Enhanced LC Band-Pass Filter with 2-25% Tunable Fractional Bandwidth
WE3E-1: Honoring Seymour Cohn, 1920 --2015 His Impact on Mid-20th Century Microwave Technology
WE3F-1: Miniaturized 122 GHz System-on-Chip Radar Sensor with On-Chip Ant-ennas Utilizing a Novel Antenna DesignApproach
WE3A-2: A Broadband Compact Low-Loss 4×4 Butler Matrix in CMOS with StackedTransformer Based Quadrature Couplers
WE3C-2: A Fully Integrated Ka-Band Front End for 5G Transceiver
WE3D-2: Tunable Blocker-Tolerant RF Front-end Filter with Dual Adaptive Not-ches for Recon�gurable Receivers
WE3F-2: A W-Band 65nm CMOS/InP-Hy-brid Radiometer & Passive Imager
We2A-3: A Planar Recon�gurable Focal Plane Array Antenna for 24 GHz
WE3A-4: An F-Band Re�ection Ampli�er Using 28 nm CMOS FD-SOI Technology forActive Re�ectarrays and Spatial Power Combining Applications
WE3C-3: A 60 GHz 64-Element Phased-Array Beam-Pointing Communication System for 5G 100 meter Links up to 2 GBps
WE3D-3: Tunable RF Multiferroic Band-Pass Filters Based on NEMS Magneto-electric Resonators
WE3A-5: Dual-Band Millimeter-Wave Interlea-ved Antenna Array Exploiting Low-Cost PCB Technology for High Speed 5G Communication
WE3A-6: A Coupled-Resonator Decoupling Net-work for Full-Duplex Radios
WE3C-4: Broadband Parametric Circulat-or with Balanced Monolithic Integrated Distributedly Modulated Capacitors(DMC)
WE3C-5: A 2.59-GHz RF Self-Interference CancellationCircuit with Wide Dynamic Range for In-Band Full-Duplex Radio
WE3C-5: Improving Phaseless DoA Estim-ation in Multipath-Impaired Scenarios byExploiting Dual-Band Operations
WE3D-4: Super Compact and Ultra-Wide-band Bandpass Filter using Bridged-T Coils
WE3D-5: On-Chip Bandpass Single-Pole-Double-Throw Switch Based on Multi-coupled Line
WE3F-4: The V-Band CMOS Multi-Frequ-ency Transmitter for Plasma Imaging Radar Re�ectometric Diagnostics
Wednesday Technical Sessions 13:30-15:10 Wednesday Technical Sessions 13:30-15:10
WE3C-1: Mobile Station Radio FrequencyUnit for 5G Communications at 28GHz
WE3F-3: A Low-Power SiGe D-Band TotalPower Radiometer with NEPmin of 1.4 fW/Hz1/2 and NETD of 0.25K
Chair: Phillip Smith, BAE Systems, Inc. Co-Chair: Luciano Boglione, Naval Research
Laboratory
WE3B-2: A 12.7dBm IIP3, 1.34dB NF, 4.9GHz-5.9GHz 802.11a/n LNA in 0.13µmPD-SOI CMOS with Body-Contacted Transistor
WE3B-3: Co-Design of a SiGe BiCMOS X-Band, Asymmetric, Low Insertion Loss, High Power Handling SPDT Switch and anUltra Low Noise LNA for Next-GenerationT/R Modules
WE3B-4: Q-Band InAlGaN/GaN LNA UsingCurrent Reuse Topology
WE3B-5: A Millimeter-Wave Low-NoiseAmpli�er MMIC with Integrated PowerDetector and Gain Control Functionality
WE3B-1: 100-mV 44-uW 2.4-GHz LNA in 16 nm FinFET Technology
H Clark Bell, HF Plus, Alvin Clavin, Retired: Hughes Aircraft Company, Jerry Hausner, Retired: Owner, Electro Science Technologies, George Oltman,Retired, Hughes Aircraft Company
Herman Ng, IHP Microelectronics, Jan Wessel, IHP Microelectronics, Dieter Genschow, IHP Microelectronics, Ruoyu Wang, IHP Microelectron-ics,Yaoming Sun, IHP Microelectronics, Dietmar Kissinger, IHP Microelectronics
Adrian Tang, Jet Propulsion Laboratory, Theodore Reck, Jet Propulsion Laboratory, Ran Shu, Univ. of California, Davis, Lorene Samoska, Jet Propulsion Laboratory, Yangyho Kim, Univ. of California, Los Angeles,Yu Ye, Univ. of California, Davis, Qun Gu, Univ. of California, Davis, Brian Drouin, Jet Propulsion Laboratory, Richard Al Hadi,University of Cali- fornia, Los Angeles,Yinuo Xu,Univ. of California, Davis, Steve Sarkozy, Northrop Grumman Space Technology, Richard Li, Northrop Grumman Space Technology, Mau-Chung Chang, Univ. of California, Davis, Imran Mehdi, Jet Propulsion Laboratory
Tumay Kanar, University of California at San Diego, Gabriel Rebeiz, University of California at San Diego
Yu-Ting Chang, University of California, Davis, Yu Ye, University of California, Davis, Jane Gu, University of California, Davis, Calvin Domier,University of California, Davis, Neville Luhmann, University of California, Davis
WE3A: Integrated Beam Formers and Communications Antennas
WE3B: Advances in LNA Technologies
WE3C: Enabling Technologies for 5G
WE3D: New Advances on Active and Integrated Filters
WE3E: A Memorial Recognizing "Mr Microwave" -- Seymour Cohn, 1920 -
2015
WE3F: MM-Wave ICs for Radar and Imaging
Arun Natarajan, Oregon State University, Amro Tork, Oregon State University
Jun-De Jin,Taiwan Semiconductor Manufacturing Co., Ltd.
Dimitris Psychoudakis, Samsung Research America, Hongyu Zhou, Facebook, Behzad Biglarbegian, SiBeam, Thomas Henige, Samsung Research America, Farshid Aryanfar, Samsung Research America
Farooq Amin, Virginia Polytechnic Institute and State Universit, Sanjay Raman, Virginia Polytechnic Institute and State University, Kwang-Jin Koh, Virginia Polytechnic Institute and State University
Md Naimul Hasan, University of California, Davis, Jane Gu, University of California, Davis, Xiaoguang Liu, University of California, Davis
Hwaider Lin, Northeastern Univ., Tianxiang Nan, Univ. of Wisconsin, Zhenyun Qian, Northeastern Univ., Yuan Gao, Northeastern Univ., Yu Hui, Northeastern Univ., Xinjun Wang, Northeastern Univ., Matteo Rinaldi, Northeastern Univ.,Nian-Xiang Sun, Northeastern Univ., Rongdi Guo, Northeastern Univ., Wei Shi, Inner Mongolia Univ. of Science and Technology, Amine Belkessam, Northeastern Univ.
Samet Zihir, University of California at San Diego, Gabriel Rebeiz, University of California at San Diego
Je�ery Curtis, Samsung Research America, Hongyu Zhou, Facebook, Farshid Aryanfar, Samsung Research America
Shihan Qin, University of California, Los Angeles, Yuanxun Ethan Wang, University of California, Los Angeles
Seunghyeon Kim, Kwangwoon Univ., Youngil Jeon, Kwangwoon Univ., Gosan Noh, Electronics and Telecommunications Research Institute, Youn-Ok Park, Electronics and Telecommunications Research Institute, Ilgyu Kim, Electronics and Telecommunications Research Institute, Hyunchol Shin, Kwangwoon Univ.
Alessandro Cidronali, Univ. of Florence, Giovanni Collodi, Univ. of Florence, Stefano Maddio, Univ. of Florence, Marco Passa�ume, Univ. degli Studi di Firenze, Giuseppe Pelosi, Univ. of Florence, Stefano Selleri, Univ. of Florence
Masaru Sato,Fujitsu Laboratories Ltd., Yoshitaka Niida, Fujitsu Laboratories Ltd., Yoichi Kamada, Fujitsu Laboratories Ltd., Kozo Makiyama, Fujitsu Laboratories Ltd., Shiro Ozaki, Fujitsu Laboratories Ltd., Toshihiro Ohki, Fujitsu Laboratories Ltd., Naoya Okamoto, Fujitsu Laboratories Ltd., Kazukiyo Joshin, Fujitsu Laboratories Ltd.
Inchan Ju, Georgia Institute of Technology, Robert Schmid, Johns Hopkins Applied Physics Lab, Moon-Kyu Cho, GGeorgia Institute of Technology,-Saeed Zeinolabedinzadeh, Georgia Institute of Technology, Mark Mitchell, Georgia Tech Research Institute, John Cressler, Georgia Institute of Technology
Axel Tessmann, Fraunhofer IAF, Arnulf Leuther, Fraunhofer IAF, Hermann Massler, Fraunhofer IAF, Sandrine Wagner, Fraunhofer IAF, Fabian Thome, Fraunhofer IAF, Michael Schlechtweg, Fraunhofer IAF, Oliver Ambacher, Fraunhofer IAF
Raphaël Paulin, STMicroelectronics, Philippe Cathelin, STMicroelectronics
Tze-Hao Tseng, National Central University, Yo-Shen Lin, National Central University
Jian-Fong Wu, National Central University, Yo-Shen Lin, National Central University
Fei Wang, Georgia Institute of Technology, Hua Wang, Georgia Institute of Technology
Michael Sporer, University of Erlangen-Nuremberg, Robert Weigel, University of Erlangen-Nuremberg, Alexander Koelpin, University of Erlangen-Nurem-berg
Naftali Landsberg, Tel Aviv University, Eran Socher, Tel Aviv University
Wenyao Zhai, Huawei Technologies Co., Ltd., Vahid Miraftab, Huawei Technologies Co., Ltd., Morris Repeta, Huawei Technologies Co., Ltd., David Wessel, Huawei Technologies Co., Ltd., Wen Tong, Huawei Technologies Co., Ltd.
Ping Zhao, Chinese University of Hong Kong, Kewei Qian, University of Electronic Science and Technology of China, Ke-Li Wu, Chinese University of Hong Kong
13:30-13:5013:50-14:10
14:10-14:3014:30-14:50
14:50-15:0015:00-15:10
13:30-13:5013:50-14:10
14:10-14:3014:30-14:50
14:50-15:10
Room:310
Chair: Chinchun Meng, National ChiaoTung Univ.
Co-Chair: Hiroshi Okazaki, NTT DoCoMo, Inc.
WE3H-1: A Novel 30-90 GHz Singly Balan-ced Mixer with Broadband LO/IF
WE3H-2: A 57-66 GHz Re�ection-TypePhase Shifter with Near-Constant Insertion Loss
WE3H-4: A Low Phase and Gain Error Passive Phase Shifter in 90 nm CMOS for 60GHz Phase Array System Application
WE3H-5: Method to Improve the Linear-ity of Active Communtating Mixers UsingDynamic Current Injection
WE3H-3: A 2-to-67 GHz 0-dBm LO PowerBroadband Distributed NMOS-HBT Darl-ington Mixer in 0.18 µm SiGe Process
Yi-Ching Wu, National Taiwan University, Chau-Ching Chiong, Academia Sinica and National Taiwan University, Huei Wang, National Taiwan University
Danny Elad, IBM Research - Haifa
Yi-Wei Chang, National Central University, Ya-Che Yeh,National Central University, Shou-Hsien Weng, National Central University, Hong-Yeh Chang, National Central University
Yu-Hsuan Lin, National Taiwan University, Huei Wang, National Taiwan University
Mohammad Mahdi Mohsenpour, Queen's University, Carlos Saavedra, Queen's University
WE3H: Advances in Mixer and Phase-Shifter Circuits and
Techniques
Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions
WEIF2-1: Wideband All-digital Transmit-ter Based on Multicore DSM
WEIF2-2: A Novel Method to Design Triple-mode SIW Filter Based on the Complemen-tary Split Ring Resonators (CSRRs)
WEIF2-2: Rigorous simulation of ballistic graphene-FET
WEIF2-2: An FPGA-based All-Digital Tran-smitter with 28-GHz Time-Interleaved Delta-Sigma Modulation
WEIF2-3: Involving Source-Load LeakageE�ects to Improve Isolation in Ladder Acoustic Wave Filters
WEIF2-3: A New Class of Microwave Dual-Band Filter Based on Hybrid ChebyshevPolynomials
WEIF2-3: Tunable Delta-Sigma Modulatorfor Agile All-Digital Transmitters
WEIF2-4: Study of a low-loss self-biasedcirculator at 40 GHz: in�uence of temper-ature
WEIF2-1: A four-pole parallel-coupled dual-mode resonator bandpass �lter
WEIF2-4: Modeling and Predistortion forDigital Transmitters Based on Delta-Sigma and Pulse-Width Modulation
WEIF2-1: An Ultra-Compact Folded Indu-ctor Based Mm-Wave Rat-Race Coupler in CMOS
WEIF2-5: 60GHz Substrate Integrated Waveguide Resonance Isolator
WEIF2-2: A Dual-Band Bandpass Filter Based on Hybrid Structure of Substrate Integrated Waveguide and Substrate Integrated Coaxial Line
WEIF2-6: A Ferrite Nanoparticle BasedPrinting Process for Tunable MicrowaveComponents
WEIF2-3: A V-band CPW Bandpass Filter withControllable Transmission Zeros in Integrat-ed Passive Devices (IPD) Technology
WEIF2-2: A Co-Designed Band 1-Band 3 Ca-rrier Aggregation Power Ampli�er Quadpl-exer in GaAs-HBT and BAW Technologies
WEIF2-4: A Recon�gurable Filtering PowerDivider
WEIF2-5: A Compact Branch Line CouplerUsing Novel Periodically Grounded Slow-Wave Structure
WEIF2-6: Wideband Filters using Via-Less End-Connected Broadside Coupled Asym-metric Coplanar Striplines
WEIF2-7: SIW/HMSIW-to-Microstrip Tran-sitions Using Lumped-Elements and TheirQuadrature Power Divider Application
WEIF2-3: A Compact Self-Packaged Lump-ed-Element Coupler Using Substrate Inte-grated Suspended Line Technology
Abbas Semnani, Purdue University, Michael Sinanis, Purdue University, Garrett Sha�er, Purdue University, Dimitrios Peroulis, Purdue University
Davide Mencarelli, Università Politecnica Delle Marche, Luca Pierantoni, Università Politecnica Delle Marche
INTERACTIVE FORUMWednesday | Time: 14:00-16:00 | Room: 301 & 302
WEIF2-1: 3D Printed Low-Cost, Low-Loss Microwave Components up to 40GHz
WEIF2-2: Lossy Resonators as Decoupling Elements in Densely Packed Arrays
WEIF2-1: Lateral-Wave Spurious-ModesElimination in Switchable Ferroelectric BST-on-Si Composite FBARs
WEIF2-1: Design of Integrated Diplexer-Power Divider
WEIF2-1:Field Emission Mitigation in X-Band Silicon-Etched Cavity Resonators
INTERACTIVE FORUMWednesday | Time: 14:00-16:00 | Room: 301 & 302
Benjamin Rohrdantz, Technical University of Hamburg, Christian Rave, Technical University of Hamburg, Arne Jacob, Technical University of Hamburg,
Umair Naeem, COMSATS Institute of Information Technology, Muhammad Farhan Sha�que, COMSATS Institute of Information Technology, Stéphane Bila, XLIM UMR 6172, Université de Limoges/CNRS
Seungku Lee, University of Michigan, Milad Zolfagharloo Koohi, University of Michigan, Amir Mortazawi, University of Michigan
Milad Shari� Sorkherizi, Concordia University, Abbas Vosoogh, Chalmers University of Technology, Ahmed Kishk, Concordia University, Per-Simon Kildal, Chalmers University of Technology
Zheng Liu, Shanghai Jiao Tong University, Gaobiao Xiao, Shanghai Jiao Tong University, Lei Zhu, University of Macau
Peng Wen Wong, University Teknologi Petronas, Socheatra Soeung, Universiti Teknologi Petronas, Elden Chien Pheng Zee, Universiti Teknologi Petronas, Sovuthy Cheab, Universiti Teknologi Petronas
Chih-Jung Chen, National Taiwan Ocean University
Zhaosheng He, University of Electronic Science and Technology of China, Zhenhai Shao, University of Electronic Science and Technology of China, Xiang Li, University of Electronic Science and Technology of China, Mengkui Shen, University of Electronic Science and Technology of China
Yin-Cheng Chang, National Chip Implementation Center, Ping-Yi Wang, National Tsing Hua University, Shawn Hsu, National Tsing Hua University, Ta-Yeh Lin, National Chip Implementation Center, Chao-Ping Hsieh, National Chip Implementation Center, Da-Chiang Chang, National Chip Implementation Center
Mingdong Li, QORVO, Inc., Christian Bildl, QORVO, Inc., Bernd Schleicher, QORVO, Inc., Tatyana Purtova, QORVO, Inc., Bernd Schleicher, QORVO, Inc., Andreas Link, QORVO, Inc.
Alfred Gimenez, University Autònoma de Barcelona, Pedro de Paco, University Autònoma de Barcelona
Vincent Laur, Lab-STICC, Richard Lebourgeois, Thales Research & Technology, Eric Laroche, Chelton Telecom & Microwave trading as Cobham Microwave, Jean-Luc Mattei, Lab-STICC, Patrick Que�elec, Lab-STICC, Jean-Pierre Ganne, Thales Research & Technology, Gilles Martin, Chelton Telecom & Microwave trading as Cobham Microwave
Qiao Li, University of Minnesota, Twin Cities, Xiaomei Guo, Boston Applied Technologies Inc, Huihong Song, Boston Applied Technologies Inc, Kewen Li, Boston Applied Technologies Inc, Yingyin Zou, Boston Applied Technologies Inc, Hua Jiang, Boston Applied
Farhan Abdul Gha�ar, King Abdullah University of Science and Technology, Mohammad Vaseem, King Abdullah University of Science and Technology, Muhammad Fahad Farooqui, King Abdullah University of Science and Technology, Atif Shamim, King Abdullah University of Science and Technology
Yongqiang Wang, University of Electronic Science and Technology of China, Kaixue Ma, University of Electronic Science and Technology of China, Shouxian Mou, University of Electronic Science and Technology of China
Shih-Fong Chao, National Kaohsiung Marine University, Kun-Rong Lin, National Kaohsiung Marine University, Yen-Yu Chen, National Kaohsiung Marine University
Yasuo Morimoto, University of California, Los Angeles, Amogh Waghmare, University of California, Los Angeles, Kirti Dhwaj, University of California, Los Angeles, Tatsuo Itoh, University of California, Los Angeles,
Azadeh Taslimi, National University of Singapore, Koen Mouthaan, National University of Singapore
Dong-Sik Eom, Ajou University, Hai-Young Lee, Ajou University
Rui Cordeiro, Instituto de Telecomunicações, Arnaldo Oliveira, Universidade de Aveiro - DETI / IT - Aveiro, José Vieira, Universidade de Aveiro, Tomás Silva, Universidade de Aveiro
Masaaki Tanio, NEC Corporation, Shinichi Hori, NEC Corporation, Noriaki Tawa, NEC Corporation, Tomoyuki Yamase, NEC Corporation, Kazuaki Kunihiro, NEC Corporation
Daniel Dinis, Universidade de Aveiro, Rui Cordeiro, Instituto de Telecomunicações, Arnaldo Oliveira, Universidade de Aveiro - DETI / IT - Aveiro, José Vieira, Universidade de Aveiro
Lei Ding, Texas Instruments, Inc., Rahmi Hezar, Texas Instruments, Inc., Shai Erez, Texas Instruments, Inc.
Min-Yu Huang, Georgia Institute of Technology, Hua Wang, Georgia Institute of Technology
WEIF2-5: Compact Parallel-Coupled Sext-Band Bandpass Filter Using Semi-LumpedResonators
WEIF2-6: Dual-band Filter Design with Pole-Zero Distribution in the Complex Fre-quency Plane
WEIF2-1: Fast and Precise Ranging Basedon Stepped-Frequency Continuous Wave Radar Measurements Using Compressive Sensing Algorithms
WEIF2-2: Demonstration of 20-Gbps Wireless DataTransmission at 300 GHz for KIOSK Instant Data Downloading Applications with InP MMICs
WEIF2-3: Spatial-Domain Technique to Overcome Grating Lobes in Sparse Mono-static mm-Wave Imaging Systems
WEIF2-4: Miniaturized Dual-wideband Bandpass Filter Using Coupled Slotted Open StubsAbdullah Alburaikan, University of Manchester Institute of Science and Technology, Mohammed Aqeeli, University of Manchester Institute of Science and Technology, Zhirun Hu, University of Manchester Institute of Science and Technology
Ko-Wen Hsu, National Chung-Shan Institute of Science and Technology, Hong-Yeh Chang, National Central University, Wen-Hua Tu, National Central University
Xiaofeng Sun, Nanyang Technological University, Eng Leong Tan, Nanyang Technological University
Haofei Wang, Beijing Institute of Technology, Linyun Ren, University of Tennessee, Ozlem Kilic, The Catholic University of America, Aly Fathy, University of Tennessee
Ho-Jin Song, NTT Device Technology Labs., Toshihiko Kosugi, NTT Device Technology Labs., Hiroshi Hamada, NTT Device Technology Labs.,Takuro Tajima, Nippon Telegraph and Telephone Corp., Amine El Moutaouakil, NTT Device Technology Labs., Hideaki Matsuzaki,NTT Device Technology Labs., Makoto Yaita, NTT Device Technology Labs., Yoichi Kawano, Fujitsu Limited, Tsuyoshi Takahashi, Fujitsu Limited, Yasuhiro Nakasha, Fujitsu Limited, Naoki Hara, Fujitsu Limited, Katsumi Fujii, National Institute of Information and Communications Technology, Issei Watanabe, National Institute of Information and Communications Technology, Akifumi Kasamatsu, National Institute of Information and Communications Technology
Babak Mamandipoor, University of California, Santa Barbara, Mojtaba Fallahpour, Stanford University, Greg Malysa, Stanford University, Karam Noujeim, Upamanyu Madhow, University of California, Santa Barbara, Amin Arbabian, Stanford University
Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions
Room: 303 Room: 304 Room: 305 Room: 306 Room: 307 Room:308
Chair: Charles Baylis, Baylor Univ.Co-Chair: Dimitrios Peroulis, Purdue Univ.
Chair: Fabrizio Bonani, Politecnico di TorinoCo-Chair: David Root, Keysight Technologies
Chair: Xiaoguang Liu, Univ. ofCalifornia, Davis
Co-Chair: Xun Gong, Univ. of Central Florida
Chair: Robert Caverly, Villanova Univ.Co-Chair: Frank Sullivan, Raytheon Company
Chair: Goutam Chattopadhyay, NASA’s Jet Propulsion Lab
Co-Chair: Joe Qiu, U.S. ARMY Research O�ce
WE4A-1: Tuning Technology for Adapt-able Radar Bandwidth
WE4D-1: Octave-Tunable Constant Absol-ute Bandwidth Bandstop Filter Utilizing a Novel Passively-Compensated Coupling Method
WE4E-1: 650-W High-E�ciency Ampli�erfor 704 MHz
WE4E-2: Transmission-Line BroadbandGaN FET Class-E Power Ampli�er
WE4E-3: An Octave High Power Push-Pull Doherty Ampli�er With Broadband 2nd Harmonic Termination Control
WE4E-4: Constant-Gain Envelope Track-ing in a UHF Outphasing Transmitter Bas-ed on Continuous-Mode Class-E GaN HEMT PAs
WE4F-1: 90-Degree Hybrid-Coupler Bas-ed Phase-Interpolation Phase-Shifter for Phased-Array Applications at W-Bandand Beyond
WE4A-2: A Simplex Optimization Tech-nique for Real-Time, Recon�gurable Power Ampli�ers
WE4C-2: A Novel Approach to MicrowaveCircuit Large-Signal Variability AnalysisThrough E�cient Device Sensitivity-Based Physical Modeling
WE4D-2: Adaptive-Transfer-FunctionBandpass Filters Using Recon�gurableEvanescent-Mode-Cavity Resonator Cascades
WE4F-2: Wideband mm-Wave Phase Shifters Based on Constant-Impedance Tunable Transmission Lines
We4A-3: E�cient Radar Transmitters forAmplitude-Tapered Pulses with Improved Spectral Con�nement
WE4A-4: A Constant-Transfer-Function Widely-Tunable VHF Modular Field-Progr-ammable Filter Array (FPFA) with IIP3 of38-52 dBm
WE4C-3: Substrate Network Modeling ofRF Power LDMOS Devices Including Non-linear E�ects
WE4D-3: A High-Q and Octave Tunable All-Silicon Cavity Filter Using Magneto-static Actuation
WE4C-4: Investigation of TSV NoiseCoupling in 3D-ICs Using an Experiment-al Validated 3D TSV Circuit Model Includ-ing Si Substrate E�ects and TSV Capacit-ance Inversion Behavior After Wafer Thinning
WE4D-4: An Evanescent-Mode TunableDual-Band Filter with Independently-Controlled Center Frequencies
WE4F-4: An Investigation of Millimeter WaveSwitches Based on Shunt Transistors Includ-ing SPDT Switch MMICs up to 300 GHz
WE4F-5: A 219-GHz Fundamental Oscillatorwith 0.5 mW Peak Output Power and 2.08% DC-to-RF E�ciency in a 65 nm CMOS
Wednesday Technical Sessions 15:55-17:15 Wednesday Technical Sessions 15:55-17:15
WE4C-1: Circuit Envelope Physical Semi-conductor Device Simulation
WE4F-3: Quintic Mixer: An LO-less Sub-harmonic Up-Conversion Mixer for THz Transmitter Supporting Complex DigitalModulation
Chair: Jose Rayas Sanchez, IITESO, TheJesuit Unvi. of Guadalajara
Co-Chair: Roni Khazaka, McGill Univ.
WE4B-2: Advanced Parametric ModelingUsing Neuro-Transfer Function for EMBased Multiphysics Analysis of Micro-wave Passive Components
WE4B-3: Parallel Matrix Neural NetworkTraining on Cluster Systems for DynamicFET Modeling from Large Datasets
WE4B-4: Surrogate-Based Miniaturiza-tion-Oriented Design of Two-Section Branch-Line Couplers
WE4B-1: Optimization Procedure for Re-movable EBG Common Mode Filter Design
Frederick Raab, Green Mountain Radio Research
Ramon Beltran, Skyworks Solutions
Ayman Jundi, University of Waterloo, Kasyap Patel, University of Waterloo, Slim Boumaiza, University of Waterloo
Maria-Nieves Ruiz Lavin, University of Cantabria, Adan Benito, University of Cantabria, Jose-Ramon Perez-Cisneros, University of Zaragoza, Pere Gilabert, Universitat Politècnica de Catalunya, Gabriel Montoro, Universitat Politècnica de Catalunya, Jose Garcia, University of Cantabria
Sadia Afroz, Virginia Polytechnic Institute and State University, Kwang-Jin Koh, Virginia Polytechnic Institute and State University
Pingyue Song, University of Southern California, Hossein Hashemi, University of Southern California
Kyoya Takano, Hiroshima City University, Shinsuke Hara, National Institute of Information and Communications Technology, Kosuke Katayama, Hiroshima University, Shuhei Amakawa, Hiroshima University, Takeshi Yoshida, Hiroshima University, Minoru Fujishima, Hiroshima University
YFabian Thome, Fraunhofer IAF,Matthias Ohlrogge, Fraunhofer IAF, Arnulf Leuther, Fraunhofer IAF, Michael Schlechtweg, Fraunhofer IAF, Oliver Ambacher, Fraunhofer IAF
Hyeok-Tae Kwon, Chungbuk National University, Dat Nguyen, Chungbuk National University, Jong-Phil Hong, Chungbuk National University
WE4A: Focus Session: Spectrum-Aware and Frequency-Agile
Circuits
WE4B: Advaced Optimization Techniques
WE4C: Physics-Based Modeling of Active and Passive Compo-
nents
WE4D: Recon�gurable 3-D High- Q �lters
WE4E: Advances in High Power, High E�ciency HF-VHF-UHF Power
Ampli�ers
WE4F: Novel CMOS THz/MMW Signal Generation Circuits
Anthony Martone, U.S. Army Research Laboratory, Charles Dietlein, OSD, Kelly Sherbondy, U.S. Army Research Laboratory, Mark Govoni, U.S. Army Communications-Electronics Research, Development And Engineering Center, Je�rey Pulskamp, U.S. Army Research Laboratory
Carlo Olivieri, University of L'Aquila, Francesco De Paulis, University of L'Aquila, Antonio Orlandi, University of L'Aquila, Riccardo Ceccheti, INTECS, Slawomir Koziel, Reykjavik University
Chris Morton, Self-Employed
Mark Hickle, Purdue University, Dimitrios Peroulis, Purdue University
Dimitra Psychogiou ,Purdue University, Roberto Gomez-Garcia, University of Alcala, Dimitrios Peroulis, Purdue University
Muhammad Arif, National University of Science and Technology, Dimitrios Peroulis,Purdue University
Olof Tornblad, In�neon Technologies Americas, Lyle Gi�n, In�neon Technologies Americas, Cindy Blair, In�neon Technologies Americas
Simona Donati Guerrieri, Politecnico di Torino, Fabrizio Bonani, Politecnico di Torino, Giovanni Ghione, Politecnico di Torino
Martin Rack, University Catholiqué de Louvain, Geert Van der Plas, IMEC, Michele Stucchi, IMEC, Phillippe Absil, IMEC, Jean-pierre Raskin, University Catholiqué de Louvain, Eric Beyne, IMEC, Xiao Sun, IMEC, Joeri De vos, IMEC
Piotr Kurgan, Reykjavik University, Slawomir Koziel, Reykjavik University, John Bandler, McMaster University
Shunlu Zhang, Carleton University, Jianjun Xu, Keysight Technologies, Qijun Zhang, Carleton University, David Root, Keysight Technologies
Wei Zhang, Carleton University, Feng Feng, Carleton University, Jianan Zhang, Carleton University, Venu-Madhav-Reddy Gongal-Reddy, Carleton University, Qijun Zhang, Carleton University, Shunlu Zhang, Carleton University
James Chen, University of California, Davis, James Chen, University of California, Davis, Akash Anand, University of California, Davis, Hjalti Sigmarsson, Advanced Radar Research Center, School of Electrical and Computer Engineering, University of Oklahom, Xiaoguang Liu, University of California, Davis
Alexander Tsatsoulas, Baylor University, Joseph Barkate, Baylor University, Charles Baylis, Baylor University, Robert Marks II, Baylor University
Andrew Zai, University of Colorado, Corrado Florian, University di Bologna, Tommaso Cappello, University di Bologna, Zoya Popovic, University of Colorado
Kaiyuan Zeng, Purdue University, Dimitra Psychogiou, Purdue University, Wesley Allen, Purdue University, Dimitrios Peroulis, Purdue University
15:55-16:1516:15-16:35
16:35-16:5516:55-17:15
15:55-16:1516:15-16:35
16:35-16:5516:55-17:05
17:05-17:15
Room:310
Chair: J.-C. Chiao, Univ. of Texas at ArlingtonCo-Chair: Yanzhu Zhao, Medtronic, Inc.
WE4H-1: Microwave Dielectric Spectro-scopy for Single Cell Irreversible Electro-poration Monitoring
WE4H-2: High-Frequency Continuous-Wave Electroporation of Jurkat HumanLymphoma Cells
WE4H-4: 14.5GHz Energy for Dermatolo-gical Applications – Initial in-vivo Data with Histology
WE4H-5: Low-Intensity Microwave Auto-hemotherapy as a Feasible AlternativeDrug-Free Technique
WE4H-3: What the Deep Sea Can Tell UsAbout Microwaves
Amar TAMRA, Laboratoire d'analyse et d'architecture des systèm, David DUBUC, LAAS CNRS, Marie-Pierre ROLS , Institut de pharmacologie et de biologie structurale, Katia Grenier, LAAS-CNRS
Hang Li, Lehigh University, Xiao Ma, Lehigh University, Xiaotian Du, Lehigh University, Xuanhong Cheng, Lehigh University, James Hwang, Lehigh University
Catrin Williams, Cardi� University, David Lloyd, Cardi� University, Jonathan Lees, Cardi� University, Adrian Porch, Cardi� University
Christopher Hancock, NA
Kateryna Arkhypova, O.Ya. Usikov Institute for Radiophysicas and Electronics NAS of Ukraine, Anatoliy Fisun,O.Ya. Usikov Institute for Radiophysicas and Electronics NAS of Ukraine, Oleg Bilous, O.Ya. Usikov Institute for Radiophysicas and Electronics NAS of Ukraine, Andriy Nosatov, Kharkiv City Clinical Hospital No 7, Volodymyr Malakhov, Kharkiv Medical Academy of Post-Graduate Education
WE4H: Microwave Biological E�ects
Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions
Room: 303 Room: 304 Room: 305 Room: 306 Room: 309Room: 308
Co-Chair: Gerald DeJean, Microsoft ResearchCo-Chair: Ed Niehenke, Niehenke Consulting
Co-Chair: Irfan Ashiq, National Instruments Corp.
Co-Chair: Peter Russer, Technische Univ. München
08:00--08:20
TH1A-1: Adaptive Harmonics Comb NotchFilter for Measuring Heart Rate ofLaboratory Rat Using a 60-GHz Radar
TH1D-1: Compact Size Cellular / GSM Band Pass Filter with High Resistivity Thin Film Silicon Integrated Passive Device (IPD) Technology
TH1F-1: Advances in Electromagnetics-based Design Optimization
TH1G-1: High Bandwidth of 8GHz Active Quasi-Circulator with Integrated Digital Leakage Canceler in SiGe BICMOS Technology for Automotive Radar Systems
08:20-08:3008:30-08:40
TH1A-2: Noncontact Vital-Sign Radar SensorUsing Metamaterial-Based Scanning Leaky-Wave Antenna
TH1C-2: High Gain 220GHz Power Ampli�er MMICs with Minimal Footprint
TH1D-2: An Ultra-Compact Integrated Millimeter-Wave Coupled-Line Resonator and a Bandpass Filter in Silicon-Germanium Technology
TH1G-2: Interference-Tolerant Multi-User Radar System Using One-Coincidence Frequency Hopping Code with 1GHz Bandwidth at 24GHz
08:40-08:5008:50-09:00
TH1A-3: A Portable 24-GHz Auditory Radar for Non-contact Speech Sensing with Background Noise Rejection and Directional Discrimination
TH1C-3: 71-95 GHz (23-40% PAE) and 96-120 GHz (19-22% PAE) High E�ciency 100-130 mW Power Ampli�ers in InP HBT
TH1D-3:A Compact Millimeter-Wave Dual-Mode Ring Filter using Loaded Capacitances in CMOS 0.25µm technology
TH1G-3: A Frequency Synchronization Scheme for Time Varying Doppler-shiftCompensation using the Direct Return Signal
Yu-Hsiu Wu,University of California, Yen-Cheng Kuan, University of California, Mau-Chung Frank Chang,University of California
TH1G-4: Concatenated-Code Based Phase-Coded CW MIMO Radar
09:00-09:1009:10-09:20
TH1A-4: Barcode Based Hand Gesture Classi�cation using AC Coupled Quadrature Doppler Radar
TH1C-4: A W-Band Wireless CommunicationTransmitter Utilizing a Stacked-FET Oscillator for High Output Power Performance
TH1D-4: Compact Multi-layered Wideband Bandpass Filter with Multiple Transmission Zeros
Thursday Technical Sessions 08:00-09:40 Thursday Technical Sessions 08:00-09:40
TH1C-1: 7kW GaN W-Band Transmitter
Co-Chair: Allen Katz The College of New Jersey
TH1B-2: A 1.1GHz Bandwidth, 46%-62% E�ciency Continuous Mode Doherty Power Ampli�er
TH1B-4: A Multi-Stage Concurrent Dual-Band DPD Architecture for Closely Spaced Carriers using a Low Bandwidth Feedback Loop
TH1B-1: A 100 W Multi-Band Four-Way Integrated Doherty Ampli�er
John Bandler,McMaster University,Slawomir Koziel,Reykjavik University
Matthias Porranzl,University of Linz,Christoph Wagner,DICE GmbH & Co. KG,Herbert Jaeger,DICE GmbH & Co. KG,Andreas Stelzer,Johannes Kepler University of Linz
Keisuke Nakamura,Mitsubishi Electric Corporation,Kenichi Tajima,Mitsubishi Electric Corporation,Morishige Hieda,Mitsubishi Electric Corporation
Heinz Haderer,Johannes Kepler University of Linz,Reinhard Feger,Johannes Kepler University of Linz,Andreas Stelzer,Johannes Kepler University of Linz
Johannes Russer,Technische Universität München,Andreas Cangellaris,University of Illinois at Urbana-Champaign,Peter Russer,Technische Universität München
TH1A: Biomedical Radar Technologies
TH1B: E�ciency, Linearity Enhancement Techniques
TH1C: Advances in III-V THz/Mm-wave Transmitters &
Components
TH1D: Compact multilayer and integrated planar �lters
TH1F: Field Modeling and Applications - Retrospective and Outlook: in celebration of Prof.
Wolfgang J. R. Hoefer's 75th birthday
TH1G: Advances in Wideband Radar Systems
Room: 307
Co-Chair: Li Yang, Texas Instruments, Inc.
TH1E-2: Miniaturized Stub-Loaded Resonator Bandpass Filter Fabricated Using Multilayer Inkjet Printing Technology
TH1E5: A 24 GHz CMOS Oscillator Transmitter with an Inkjet Printed On-chip Antenna
TH1E: 3D Printed Microwave Components and Systems
Eduardo Rojas-Nastrucci,University of South Florida,Justin Nussbaum,University of South Florida,Tom Weller,University of South Florida,Nathan Crane,University of South Florida
Farhan Abdul Gha�ar,King Abdullah University of Science and Technology,Shuai Yang,King Abdullah University of Science and Technology,Hammad M Cheema,National University of Science and Technology,Atif Shamim,King Abdullah University of Science and Technology
Hsuan-ling Kao,Chang Gung University,Cheng-Lin Cho,National Tsing Hua University,Li-Chun Chang,Ming Chi University of Technology,Yung-Hsien Wu,National Tsing Hua University,Hsien-Chin Chiu,Chang Gung University
Mahdi Haghzadeh,University of Massachusetts, Lowell, Craig Armiento, University of Massachusetts, Lowell, Alkim Akyurtlu, University of Massachusetts, Lowell
Tien-Yu Huang,University of Florida,Linda Hayward,University of Florida,Jenshan Lin,University of Florida
Xavier Moronval,NXP Semiconductors,John Gajadharsing,Ampleon
Kenneth Brown,Raytheon Company,Andrew Brown,Raytheon Company,Travis Feenstra,Raytheon Company,Darin Gritters,Raytheon Company,Shane O'Connor,Raytheon Company,Mike Sotelo,Raytheon Company,Nicholas Kolias,Raytheon Company,K. C. Hwang,Raytheon Company,Je� Kotce,Raytheon Company,Ed Robinson,US Army ARDEC
Ki Shin,ON Semiconductor,Kim Eilert,ON Semiconductor,Neal Mellen,ON Semiconductor
Xi Zhu,Macquarie University,YANG YANG,Macquarie University, Sudipta Chakraborty,Macquarie University, Oya Sevimli, Macquarie University,Karu Esselle,Macqua-rie University, Michael Heimlich,Macquarie University, Quan Xue,City University of Hong Kong
Pedro Rynkiewicz,University de Toulouse, Fabio COCCETTI, Centre National de la Recherche Scienti�que , Matthias Wietstruck, IHP Microelectronics, Mehmet Kaynak, IHP Microelectronics, Anne-Laure Franc, University de Toulouse, Gaëtan Prigent, LAPLACE-ENSEEIHT
Zach Gri�th,Teledyne Scienti�c and Imaging,Miguel Urteaga,Teledyne Scienti�c and Imaging,Petra Rowell,Teledyne Scienti�c and Imaging,Richard Pierson,AMTI
Jerome Cheron,National Institute of Standards and Technology,Erich Grossman,Nist
Fabian Thome,Fraunhofer IAF,Oliver Ambacher,-Fraunhofer IAF
TH1C-5: E�cient Linear Transmission of Complex Waveforms at 216 GHz Using Nonlinear Multiplier ChainsAli Darwish,Army Research Lab.,Joe Qiu,Army Research O�ce,Edward Viveiros,Army Research Laboratory,Alfred Hung,Army Research Laboratory
Andrew Kwan,University of Calgary,Mayada Younes, University of Calgary, Oualid Hammi, University of Calgary, Abubakr Abdelha�z, University of Calgary, Fadhel Ghannouchi, University of Calgary
Haedong Jang,In�neon Technologies Americas,Richard Wilson,In�neon Technologies Americas,Timothy Canning,In�neon Technologies Americas,David Seebacher,In�neon Technologies AG,Christian Schuberth,In�neon Technologies AG,Bayaner Arigong,In�neon Technologies Americas
Xiaofan Chen,Tsinghua University, Wenhua Chen,Tsinghua University, Uni, Fadhel Ghannouchi,iRadio Lab, Department of Electrical and Computer Engineering, Schulich School of Engineering, Uni, Zhenghe Feng,Tsinghua University
DeCheng Gan,University of Electronic Science & Technology of China,Songbai He,University of Electronic Science and Technology of China ,Tian Qi,University of Electronic Science & Technology of China
Chao-Hsiung Tseng,National Taiwan University of Science and Technology,Chia-Hung Chao,National Taiwan University Science and Technology
Heng Zhao,Nanjing University of Science and Technology,Zhengyu Peng,Texas Tech University,Hong Hong,Nanjing University of Science and Technology,Xiaohua Zhu,Nanjing University of Science and Technology,Changzhi Li,Texas Tech University
Xiaomeng Gao,University of Hawaii,Jia Xu,University of Hawaii,Ashikur Rahman,University of Hawaii,Ehsan Yavari,University of Hawaii,Alexander Lee,University of Hawaii,Olga Boric-Lubecke, University of Hawaii
TH1G-5: Compact Bistatic FMCW Radar MMIC with a Mixer-based Synthesizer Concept at 160 GHz
09:20-09:3009:30-09:40
08:00--08:2008:20-08:30
08:30-08:4008:40-08:50
08:50-09:0009:00-09:10
09:10-09:2009:20-09:30
09:30-09:40
TH1A-5: A Di�erential MiniatureTransponder for 9.4/18.8 GHz Harmonic Bee Searching Radar with Low Gain Degradation from Bee’s Body
TH1C-6: A 330 GHz Active Frequency Quadrupler in InP DHBT Transferred-Substrate Technology
TH1D-5: A Design of the Compact Microstrip Bandpass Filter With a Wide Passband and Broad Stopband
TH1F-8: Tracking Impulsive Sources in Space-Time by TLM Time Reversal
Martin Hitzler,University of Ulm,Stefan Saulig, University of Ulm,Linus Boehm,University of Ulm, Winfried Mayer, Endress+Hauser GmbH+Co. KG, Wolfgang Winkler,Silicon Radar GmbH,Christian Waldschmidt, University of Ulm
TH1G-6: Compact 340 GHz homodyne transceiver modules for FMWC imaging radar arrays.Robin Dahlbäck,Chalmers University of Technology, Göran Granström,Gotmic AB,Mattias Frendahl,Gotmic AB,Tomas Bryllert,Chalmers University of Technology
Wolfgang Hoefer,University of Victoria
Bijan Tehrani,Georgia Institute of Technology,Benjamin Cook,Texas Instruments, Inc.,Manos Tentzeris,Georgia Institute of Technology
Maruf Hossain,Ferdinand-Braun-Institut (FBH),Ksenia Nosaeva,Ferdinand-Braun-Institut, Leibniz-Institut fuer Ho,Nils Weimann,Alcatel-Lucent,Viktor Krozer, Ferdinand-Braun-Institut (FBH),Wolfgang Heinrich, Ferdinand-Braun-Institut
TH1C-7: H-band Down-conversion and Up-conversion Mixers with Wide IF Bandwidth Iljin lee,Korea University,Sooyeon Kim,Korea University,Sanggeun Jeon,Korea University
Toshifumi Nakatani, Jonmei Yan, Paul Theilmann, Hamed Gheidi, Donald Kimball, University of California at San Diego
Po-Lin Huang,National Chung Cheng University,Tung-Yi Hsieh,National Chung Cheng University
TH1D-6: Size Reduction and Spurious Suppressionin Microstrip Coupled Line Bandpass Filters by means of Capacitive Electromagnetic BandgapJordi Selga,Univ. Autònoma de Barcelona,Paris Vélez, Univ. Autònoma de Barcelona,Marco Orellana,Univ. Autònoma de Barcelona,Marc Sans,Univ. Autònoma de Barcelona,Ana Rodriguez,Univ. Politècnica de València,Vicente Boria,Univ. Politècnica de València,Ferran Martín,Univ. Autònoma de Barcelona
Yu-ting Liu,National Chung Cheng University,-Mioa-lin Hsu,National Chung Cheng University,Huei Wang,National Taiwan University ,Zuo-min Tsai,National Chung Cheng University
Chair: H. Alfred Hung, Army Research LabChair: H. John Kuno, Quinstar
Chair: Christopher Galbraith Massachusetts Institute of Technology,
Lincoln Laboratory Chair: Jens Bornemann, Univ. of Victoria
Chair: Rudy Emrick, Orbital ATKChair: Telesphor Kamgaing, Intel Corp.Chair: Joseph Staudinger,NXP Semiconductors Co-Chair: Chris Rodenbeck,
Naval Research Laboratory
TH1E1: Fully Printed Varactors and PhaseShifters Based on a BST/Polymer Ink for Tunable Microwave Applications
TH1E-4: Meshed Rectangular Waveguide for High Power, Low Loss and Reduce Weight Applications
TH1E-3: Inkjet-Printed Substrate Integrated Waveguide (SIW) with Drill-less Vias on Paper SubstratesSyed Abdullah Nauroze,Georgia Institute of Technology,Jimmy Hester,Georgia Institute of Technology,Wenjing Su,Georgia Institute of Technology,Manos Tentzeris,Georgia Institute of Technology
TH1E6: Inkjet-Printed 3D Interconnects for Millimeter-Wave System-on-Package Solutions
George Eleftheriades,University of Toronto
Ingo Wol�,IMST GmbH
TH1F-7: Multi-Domain Modeling of 3D Printed, Nanotechnology and Morphing/Origami-based RF Modules
Wei Fan,Department of Electrical and Computer Engineering, Dalhousie University,Zhizhang Chen,School of Electronic Engineering, The University of Electronic Science and Technology of China
Manos Tentzeris,Georgia Institute of Technology,Aristeides Papadopoulos,Georgia Institute of Technology
TH1F-2: Substrate Integrated Waveguide Mode Coupler for Tracking ApplicationsUwe Rosenberg, Mician Global Engineering GbR,Jens Bornemann,University of Victoria,Jan Schorer,University of Victoria
TH1F-3: Correlation Transmission Line Matrix(CTLM) Modeling of Stochastic Electromagnetic Fields
TH1F-4: Transmission-line Metamaterials and their Relation to the Transmission-Line Matrix Method
TH1F-5:Recent Improvements of Finite Di�erence Time Domain Simulation Techniques
TH1F-6: A Condition for Multiple Source Reconstructions with the Time-Reversal Methods
TH1B-3: Self-Outphasing Chireix PowerAmpli�er Using Device Input Impedance Variation
TH1B-5: An Envelope Linearization Algorithm for An Open-Loop Multi-Switcher Envelope Tracking Power Ampli�er
Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions
THIF1-2: A Fully Monolithically Integrated4.6 GHz DC-DC Converter
THIF1-1: SDR Based RFID Reader for Pas-sive Tag Localization Using Phase Di�er-ence of Arrival Techniques
THIF1-3: A Hybrid-Coded Architecture forGlitch-Free Performance
THIF1-1: Open-Ended Waveguide Measure-ment of Liquids at Millimeter Wavelengths
THIF1-2: Characterization of Three-dimen-sional Near-�eld Microwave Imaging Alg-orithms for Stationary and Moving Objects
THIF1-2: Passive RFID-enabled ProximitySensor
THIF1-2: Comprehensive One-Dimensio-nal Mathematical Model of Microwave Sintering
THIF1-3: A Preliminary Evaluation of Act-ive Millimeter-Wave Radiometry at W-Band for Enhancement of Material Contrasts
THIF1-3: Spectral Signature Barcodes Impl-emented by Multi-State Multi-ResonatorCircuits for Chipless RFID Tags
THIF1-1: Nondestructive Re�ection Imag-ing in the W-band Using Photonics-Based Incoherent Signal Source
THIF1-2: Integrating Baseband-over-Fiber and Six-Port Direct Modulation forHigh-Speed High-Frequency Wireless Communications
THIF1-1: In-Package Harmonic Termina-tion Design for Improving Active Device E�ciency
THIF1-4: An Optically Transparent AnalogFrontend for a Solar Powered 24 GHz RFIDTransponder
THIF1-2: MMIC-to-Waveguide Transitionat 160 GHz with Galvanic Isolation
THIF1-1: Study of SOI CMOS Tunable Capa-citor Architectures and Application to Ant-enna Aperture Tuning
THIF1-1: High Resolution RFID LiquidSensing Using a Passive Tag
THIF1-5: Active Imaging with IncoherentSub-Terahertz Radiation from a Photomi-xer array in a severe smoke
THIF1-6: Frequency Chirp Modulation by El-ectro-Optic Modulator Integrated with Mic-rowave Rat-Race Circuit and Measurement of Chirp Parameter by Using Optical Fiber Dispersion
THIF1-7: Frequency Tunable Two-Tone Signal Generation Based on Polarization Multiplexed Optoelectronic Oscillator
THIF1-8: Electrically Controlled TerahertzSpatial Light Modulators with GrapheneArrays
THIF1-4: Integrated Implementation ofUltra Stable VCO using Optical Self-ILPLLTechniques Shawn Bawell, Integrated Device Technology, Inc.
Tomoyuki Yamase, NEC Corporation, Shinichi Hori, NEC Corporation, Masaaki Tanio, NEC Corporation, Tomoya Kaneko, NEC Corporation, Noriaki Tawa, NEC Corporation, Keiichi Motoi, NEC Corporation, Kazuaki Kunihiro, NEC Corporation
INTERACTIVE FORUMThursday | Time: 09:00-11:00 | Room: 301 & 302
THIF1-1: An E�cient Power Recycling Me-thod for Multi-Port Receivers
THIF1-3: Modeling and Digital Predistor-tion Based on Zernike Polynomial Funct-ions for LTE-RoF System
THIF1-9: Terahertz Polarization ModulatorBased on Metasurface
THIF2-3: Cryogenic Microwave Characteri-zation of Kapton Polyimide Using Super-conducting Resonators
THIF1-2: A Digital Radio-over-Fiber Down-link System based on Envelope Delta-sigma Modulation for Multi-band/mode Operation
INTERACTIVE FORUMThursday | Time: 09:00-11:00 | Room: 301 & 302
Rashid Mirzavand Boroujeni, University of Alberta, Mohammad Mahdi Honari, University of Alberta, Pedram Mousavi, University of Alberta
Carlos Mateo, University de Zaragoza, Pedro L. Carro, University de Zaragoza, Paloma Garcia-Ducar, University de Zaragoza, Jesus de Mingo, University de Zaragoza, Jose-Ramon Perez-Cisneros, University de Zaragoza
Yan Zhang, Capital Normal University, Tahsin Akalin, Lille University France Rujun Bai, Auburn University, George Hernandez,
Auburn University, Yang Cao, Auburn University, Drew Sellers, Auburn University, Charles Ellis, Auburn University, David Tuckerman,Tuckerman and Associates, Michael Hamilton, Auburn University
Lukas Görtschacher, Graz University of Technology, Jasmin Grosinger, Graz University of Technology, Hasan Khan, Graz University of Technology, Dominik Amschl, Graz University of Technology, Wolfgang Bösch, Graz University of Technology
Gianfranco Andia Vera, Grenoble Institute of Technology, Abanob Abdelnour, Grenoble Institute of Technology, Apostolos Georgiadis, Centre Tecnologic de Telecomunicacions de Cataluny, Mira Sarkis, Télécom ParisTech, Darine Kaddour, Grenoble Institute of Technology, Smail Tedjini, Grenoble Institute of Technology
Cristian Herrojo Prieto, University Autònoma de Barcelona, Jordi Naqui, University Autònoma de Barcelona, Ferran Paredes Marco, University Autònoma de Barcelona, Ferran Martín, University Autònoma de Barcelona
Quang Huy Dao, Leibniz University of Hannover, Bernard Lüers, Leibniz University of Hannover, Tri Tan Ngo, Leibniz University of Hannover, Bernd Geck, Leibniz University of Hannover
Dominique Nicolas, CEA-LETI Minatec, Alexandre Giry, CEA-LETI Minatec, Essia Ben Abdallah, CEA-LETI Minatec, Serge Bories, CEA-LETI Minatec, Thierry Parra, LAAS-CNRS, Pierre Vincent, CEA-LETI Minatec
Mohammad Hossein Zari�, University of Alberta, Mojgan Daneshmand, University of Alberta
Simon Scott, University of California, Berkeley,John Wawrzynek, University of California, Berkeley
Adrian Tang, Jet Propulsion Laboratory
Sushians Rahimizadeh, University of Colorado, Jerome Cheron, University of Colorado, Qianli Mu, In�neon Technologies Americas, Zoya Popovic, University of Colorado
Martin Hitzler, University of Ulm, Stefan Saulig, University of Ulm, Linus Boehm, University of Ulm, Winfried Mayer, Endress+Hauser GmbH+Co. KG, Christian Waldschmidt, University of Ulm
JTianchi Sun, Drexel University, Li Zhang, Synergy Microwave Corp, Kevin Receveur, Drexel University, Ajay Poddar, Synergy Microwave, Ulrich Rohde, Synergy Microwave Corp, Afshin Daryoush, Drexel University
Naofumi Shimizu, Nippon Telegraph and Telephone Corp., Ken Matsuyama, Tokyo University of Science, Seiji Okinaga, Tokyo University of Science
Tadashi Kawai, University of Hyogo, Ryota Nakamura, University of Hyogo, Naokatsu Yamamoto, National Institute of Information and Communications Technology, Tetsuya Kawanishi, Waseda University
Bindong Gao, Nanjing University of Aeronautics and Astronautics, Fangzheng Zhang, Nanjing University of Aeronautics and Astronautics, Shilong Pan, Nanjing University of Aeronautics and Astronautics, Pei Zhou, Nanjing University of Aeronautics and Astronautics
Nurbek Kakenov, Bilkent University, Taylan Takan, Middle East Technical University, Vedat Ali Ozkan, Middle East Technical University, Osman Balci, Bilkent University, Hakan Altan, Middle East Technical University, Coskun Kocabas, Bilkent University
Ignacio Ramos, University of Colorado, Zoya Popovic, University of Colorado
Tomasz Karpisz, Warsaw University of Technology, Pawel Kopyt, Warsaw University of Technology, Bartlomiej Salski,Warsaw University of Technology, Jerzy Krupka, Warsaw University of Technology
Erin Kiley, Worcester Polytechnic Institute, Vadim Yakovlev, Worcester Polytechnic Institute
Atsushi Kanno, National Institute of Information and Communications Technology, Norihiko Sekine, National Institute of Information and Communica-tions Technology, Akifumi Kasamatsu, National Institute of Information and Communications Technology, Naokatsu Yamamoto, National Institute of Information and Communications Technology, Mitsuru Yoshida, NEC Network and Sensor Systems, Ltd., Norio Masuda, NEC Network and Sensor Systems, Ltd.
Xiaoxiong Song, Beijing University of Posts and Telecommunications, Jianqiang Li, Beijing University of Posts and Telecommunications,Yuting Fan, Beijing University of Posts and Telecommunications, Yi Lei, Beijing University of Posts and Telecommunications, Feifei Yin, Beijing University of Posts and Telecommunications, Yitang Dai, Beijing University of Posts and Telecommunications, Kun Xu, Beijing University of Posts and Telecommunications
THIF1-3: The Impact of Layout DependentE�ects on Mobility and Flicker Noise in Nanoscale Multi�nger nMOSFETs for RF and Analog Design
THIF1-4: Ka band 0.5W TR chip with a novel high power handling switch
THIF1-5: A 30 GSample/s InP/CMOS Sample-Hold Ampli�er with Active Droop Correction
THIF1-1: A Compact Switched Beam-Form-ing Network using Silicon IPD Technologyfor Low-Cost 5G Communication
THIF1-1: A Multi-mode 30 GHz 2 DegreeRMS Power E�cient Phase-Locked Loop Frequency Synthesizer
THIF1-2: Active SPDT Switches for D-BandApplicationsDaniel Mueller, Karlsruhe Institute of Technology, Ulrich Lewark, Karlsruhe Institute of Technology, Axel Tessmann, Fraunhofer IAF, Arnulf Leuther, raunhofer IAF, Thomas Zwick, Karlsruhe Institute of Technology, Ingmar Kallfass, University of Stuttgart
Jyh-Chyurn Guo, National Chiao Tung University, Yi-Zen Lo, National Chiao Tung University, Jun-Rong Ou, National Chiao Tung University
Ye Yuan, University of Electronic Science and Technology of China, Yong Fan, University of Electronic Science and Technology of China
Seong-Kyun Kim, University of California, Santa Barbara, Saeid Daneshgar, Intel Corporation, Myung-Jun Choe, Teledyne Scienti�c and Imaging, Miguel Urteaga, Teledyne Scienti�c and Imaging, Andrew Carter, Teledyne Scienti�c and Imaging, Mark Rodwell, University of California, Santa Barbara
Won-Cheol Lee, Korea Electronics Technology Institute
Nagarajan Mahalingam, Nanyang Technological University, Yisheng Wang, Nanyang Technological University, Bharatha Kumar Thangarasu, Singapore University of Technology and Design, Kaixue Ma, University of Electronic Science and Technology of China, Kiat Seng Yeo, Singapore University of Technology and Design
Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions
Room: 303 Room: 304 Room: 305 Room: 306 Room: 309Room: 308
Co-Chair: Peter Burke, Univ. of California
Co-Chair: Ed Niehenke, Niehenke Consulting Co-Chair: Ming Yu, COM DEV InternationalCo-Chair: Andrea Ferrero, Keysight
Technologies
10:10--10:2010:20--10:30
TH2A-1: Broadband Near-Field Microwave Microscopy Investigation of Fullerene Exposure on Breast Cancer Cells
TH2D-1: Design of a Low Loss Substrate Mounted Waveguide (SMW) Filter Employing Individual Resonators TH2G-1: Design of Dispersion-free Phase-
Shifting Non-reciprocity in Composite Right/Left Handed Metamaterials
10:30-10:50
TH2C-2: Sub-picosecond Wireless Synchronization Based on a Millimeter-Wave Impulse Receiver with an On-chip Antenna in 0.13µm SiGe BiCMOS
TH2G-2: Blazed Metasurface Grating: The Planar Equivalent of a Sawtooth Grating
10:50-11:0011:00-11:10
TH2A-3: Near-Field Microwave Microscopy of One-Dimensional Nanostructures
TH2C-3: An F-Band Dual Band 12+12Gbps Packaged CMOS Bi-Directional Transceiver
TH2D-3: Direct Optimal Synthesis of Microwave Dual Band Filters with Parallel-Connected Topology
TH2G-3: Arti�cial Gradient-Index Lens for Ka-Band using a Single Layer Fishnet Metamaterial
Xiaoqiang Li,University of California, Mohammad Memarian,University of California, Kirti Dhwaj,University of California,Tatsuo Itoh,University of California
TH2G-4: A Quantitative Statistical Analysis of In-Situ IC and Electronics in Complex and Wave-Chaotic Enclosures
11:10-11:2011:20-11:30
TH2A-4: Sensitivity and Accuracy Analysis in Scanning Microwave Microscopy
TH2C-4: CMOS 300-GHz 64-QAM Transmitter
TH2D-4: Advanced Synthesis Technique for Extracted Pole and NRN Filters
Thursday Technical Sessions 10:10-11:50 Thursday Technical Sessions 10:10-11:50
Co-Chair: Gayle Collins, Intel Corp.
TH2B-3: A 100 W GaN HEMT SPA-D with 57% Fractional Bandwidth for DVB-T Applications
TH2B-4: A 40 dBm AlGaN/GaN HEMT Power Ampli�er MMIC for SatCom Applications at K-Band
TH2B-1: 37 W, 75-100 GHz GaN Power Ampli�er
Corrado Florian,University di Bologna,Daniel Niessen, University di Bologna,Tommaso Cappello, University di Bologna, Alberto Santarelli, University di Bologna,Fabio Filicori,University di Bologna, Zoya Popovic, University of Colorado
Tetsuya Ueda,Kyoto Institute of Technology, Keisuke Ninomiya,Kyoto Institute of Technology, Kazuhiro Yoshida,Kyoto Institute of Technology, Tatsuo Itoh,University of California
Matthias Maasch,Technische Universität Darmstadt, Prithvi Bhat, Technische Universität Darmstadt, Matthias Nickel, Technische Universität Darmstadt, Rolf Jakoby, Technische Universität Darmstadt, Christian Damm, Technische Universität Darmstadt
Shen Lin, University of New Mexico, Zhen Peng, University of New Mexico, Thomas Antonsen, University of Maryland
TH2A: Microwaves and Millimeter Waves in Scanning
Probe Microscopy (Focus Session)
TH2B: Millimeter Wave and Satcom/Terrestial Power
Ampli�ers
TH2D: Non-Planar Microwave Filters and Multiplexers 2
TH2F: Novel Nonlinear Measurement Techniques
TH2G: Recent developments and applications in waveguiding and
radiating structures
Room: 307
Co-Chair: Manos Tentzeris, Georgia Institute of Technology
TH2E-2: E-Band RF-to-DC Converter Using Schottky Diode in 0.18-um CMOS Technology
TH2E: Low-power CMOS components for wireless power
reception
Alice Jou, Purdue University, Reza Azadegan, University of Michigan, Hossein Pajouhi, Purdue University, Saeed Mohammadi, Purdue University
Rupam Das,University of Ulsan,Hyoungsuk Yoo,Univ. of Minnesota
Wei Ling Chang, National Chiao Tung University,Chinchun Meng, National Chiao Tung University, Tzu Chien Fu, National Chiao Tung University, Guo-Wei Huang,National Nano Device Laboratories
Soroush Dehghani,University of British Columbia,Thomas Johnson,University of British Columbia
Marco Farina,Univ. Politecnica delle Marche,Francesco Piacenza, National Institute of Health and Science on Aging (INRCA), Francesca De Angelis,Univ. Politecnica delle Marche,Davide Mencarelli, Univ. Politecnica delle Marche,Antonio Morini,Univ. Politecnica delle Marche,Giuseppe Venanzoni,Univ. Politecnica delle Marche,Tiziana Pietrangelo,Univ. "G. D'Annunzio" di Chieti e Pescara,Marco Malavolta,National Inst. of Health and Science on Aging (INRCA),Andrea Basso,National Inst. of Health and Science on Aging (INRCA),Mauro Provinciali,National Inst. of Health and Science on Aging (INRCA),Andrea Di Donato,Univ. Politecnica delle Marche,Xin Jin,Lehigh Univ.,James Hwang,Lehigh Univ.
James Schellenberg,QuinStar Technology, Inc., Edmar Camargo,Quinstar Technology, Inc.,Lani Bui,QuinStar Technology, Inc.,James Schellenberg,Quinstar Technology, Inc.,Edmar Camargo,Quinstar Technology, Inc.
Jan Schorer,University of Victoria,Jens Bornemann,University of Victoria,Uwe Rosenberg, Mician Global Engineering GbR
Fernando Teberio,Public Univ. of Navarre,Ivan Arregui,Public Univ. of Navarre,marco guglielmi,Univ. Politècnica de València,Adrian Gomez-Torrent,Public Univ. of Navarre,Pablo Soto,Tech Univ. of Valencia,Miguel Laso,Universidad Pública de Navarra (UPNA),Vicente Boria,Univ. Politècnica de València
Huan Meng,Chinese University of Hong Kong,Ke-Li Wu,Chinese University of Hong Kong
Nir Weissman,Tel Aviv University,Samuel Jameson,Tel Aviv University,Eran Socher,Tel Aviv University
Babak Jamali,Rice University,Aydin Babakhani,Rice University
Kosuke Katayama,Hiroshima University,Kyoya Takano,Hiroshima City University,Shuhei Amakawa,Hiroshima University,Shinsuke Hara,National Institute of Information and Communications Technology,Takeshi Yoshida,Hiroshima University,Minoru Fujishima,Hiroshima University
Yu Ye,University of California ,Bo Yu,University of California,Jane Gu,University of California
Christian Friesicke,Fraunhofer IAF,Philip Feuerschütz,Technical University of Hamburg, Ruediger Quay,Fraunhofer IAF,Oliver Ambacher,Fraunhofer IAF,Arne Jacob,Technical University of Hamburg
Xuan Anh Nghiem,RWTH Aachen University,Renato Negra,RWTH Aachen University
Yimin Yang, University of Waterloo, Ming Yu, Com Dev
Manuel Kasper,Keysight Technologies,Georg Gramse,Johannes Kepler University of Linz,Ferry Kienberger,Keysight Technologies
Samuel Berweger,National Inst. of Standards and Technology, Paul Blanchard,NIST,Rebecca Quardokus,NIST,Frank DelRio, NIST,Thomas Wallis,National Inst. of Standards and Technology, Pavel Kabos,NIST,Sergiy Krylyuk,NIST,Albert Davydov,NIST
Kamel Haddadi,Universite Lille,Charlene Brillard,Universite Lille,Gilles Dambrine,Institute of Electronics, Microelectronics and Nanotechnology,Didier Theron,Institute of Electronics, Microelectronics and Nanotechnology
TH2G-5: On the Use of Corrugations in Mode Filters for Oversized Rectangular Waveguides
11:30-11:4011:40-11:50
10:10--10:2010:20--10:30
10:30-10:5010:50-11:00
11:00-11:1011:10-11:20
11:20-11:3011:30-11:40
11:40-11:50
TH2A-5: Characterizing Non-Linear Microwave Behavior of Semiconductor Materials with Scanning Microwave Impedance Microscopy
TH2D-5: A New Class of Compact Dual-Mode Dielectric Resonator Filters
Silvio Ceccuzzi,Roma Tre University,Cristina Ponti,Roma Tre University,Gian Luca Ravera,Enea,Giuseppe Schettini,Roma Tre University
TH2G-6: Multipactor Threshold Sensitivity to Total Electron Emission Yield in Parallel-plate Waveguide and TEEY Models Accuracy.Nicolas FIL, Cea, Mohamed Belhaj, ONERA, Julien Hillairet, CEA, Jérôme Puech, CNES
Payman Rezaee,University of Kiel,Michael Höft,University of Kiel
Stuart Friedman,Prime Nano Inc.,Yongliang Yang,Prime Nano Inc.,Fred Stanke,Prime Nano Inc.
TH2A-6: Noninvasive Conductivity Imaging of 2D Materials and Devices by Microwave Impedance MicroscopyKeji Lai,University of Texas at Austin, Di Wu, University of Texas at Austin
Chair: Marco Farina, Univ. Politecnica delle Marche
Chair: H. John Kuno, Quinstar Chair: Simone Bastioli, RS Microwave Chair: Nuno Carvalho, Instituto De Telecomunicacoes Chair: Jan Machac, Czech Technical
Unv. in PragueChair: Alessandra Costanzo, Univ. di Bologna
Co-Chair: Tapan Sarkar, Syracuse Univ.
TH2E-1:Transconductance Mode CMOS Synchronous Recti�er Circuits
Yuxiang Sun, Rice University, Aydin Babakhani, Rice University
Chair: James Kodiak, BAE Systems, Inc.
TH2A-2: An Advanced Impedance Calibration Method for Nanoscale Microwave Imaging
TH2C: Silicon-based THz / MMW Broadband Systems
Peiyu Chen,Rice University,Yiqiu Wang,Rice University,Aydin Babakhani,Rice University
TH2C-1: A 4ps Amplitude Recon�gurable Impulse Radiator with THz-TDS Characterization Method in 0.13µm SiGe BiCMOS
TH2C-5: A 165GHz OOK Transmitter with 10.6% Peak DC-to-RF E�ciency in 65nm Bulk CMOS
TH2D-2: Compact Broadband Waveguide Diplexer for Satellite Applications
TH2E-3: A Wirelessly Powered Injection-Locked Oscillator with On-Chip Antennas in 180nm SOI CMOS
TH2E-4: A CMOS Integrated Rectenna for Implantable Applications
TH2E-5: High E�ciency Unidirectional Wireless Power Transfer by a Triple Band Deep-Tissue Implantable Antenna
TH2F-2: Generation and Measurement of a Millimeter-Wave Phase Dispersion Reference Signal based on a Comb Generator Jan Verspecht, Keysight Technologies
Marwen Ben Rejeb, University of Waterloo, Ahmed Raslan, University of Waterloo, Slim Boumaiza, University of Waterloo
Ali Al-Ziayree, Cardi� University UK, Steve Cripps, Cardi� Univeristy, Richard Perks, Cardi� University
TH2F-3: Phase Calibration for Coherent Multi-Harmonic Modulated Signal Measurements Using Nonlinear Vector Network Analyser
TH2F-4: A Novel Microwave Non-Contact Current Probe with High Spatial Resolution
TH2F-1: Pre-Pulsing Characterization of GaN PAs with Dynamic Supply
Andrei Meller,Universitat Politècnica de València,Alin Moldoveanu,Univ Politehnica Bucharest,Victor Asavei,Politehnical Univ. Bucharest,Esther Codesal,Universitat Politècnica de València,Jean Francois Favennec,Universite de Brest
TH2D-6: Lossy Coupling Matrix Filter Synthesis Based on Hyperbolic Re�ections
Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions
THIF2-2: High Power, Broadband Class-JPA with Internally Pre-matched FET
THIF2-3: Stando� Tracking of MedicalInterventional Devices using Non-ContactMicrowave Thermoacoustic Detection
THIF2-3: Broadband RF Energy HarvestingSystem covering CDMA, GSM900, GSM1800, 3G Bands with Inherent Impedance Matching
THIF2-3: A 6-18 GHz Integrated HPA-DPDT GaN MMIC
THIF2-6: A Broadband Three-device Doh-erty Power Ampli�er based on a Modi�-ed Load Modulation Network
THIF2-4: Subcutaneous Fat ThicknessMeasurement Using Rectangular Wave-guide by Approximation of Waveguide
THIF2-4: Design of Broadband High-E�ci-ency Power Ampli�ers Based on the Hybr-id Continuous Inverse Mode
THIF2-1: Dual-band Linear Filter AssistedEnvelope Memory Polynomial for Linea-rizing Multi-band Power Ampli�ers
THIF2-5: A 5.8 GHz Phase- and Self-Inject-ion-Locked CMOS Radar Sensor Chip for Vital Sign Detector Miniaturization
THIF2-5: A 200 mW InP DHBT W-band PowerAmpli�er in Transferred-Substrate Technolo-gy with Integrated Diamond Heat Spreader
THIF2-1: Broad-Band Poly-Harmonic Wi-ener Modeling of Mixers Based on Large-Signal Vector Measurements
THIF2-2: A 500-W High E�ciency LDMOSClassical Three-way Doherty Ampli�er forBase-Station Applications
THIF2-1: Sub-terahertz Integrated Rece-ivers and Spectrometers
THIF2-1: FMCW Radar Fall Detection basedon ISAR Processing Utilizing the Propertiesof RCS, Range, and Doppler
THIF2-2: Wireless Data Transmission of 30Gbps at a 500-GHz Range Using Resonant-Tunneling-Diode Terahertz Oscillator
THIF2-5: Drive-Characteristic Design for Dual-Input Doherty Power Ampli�ers
THIF2-3: A Compact, Tethered E-Band VNARe�ectometer
THIF2-1: Enhanced Instantaneous Band-width LDMOS RF Power Transistor UsingIntegrated Passive Devices
THIF2-2: A 20 GHz Power Amplifer withIM3 Distortion Cancellation by Load-Split Derivative Superposition
THIF2-3: Optimal Fundamental Load Modulation for Harmonically Tuned Switch Mode Power Ampli�er
THIF2-2: Terahertz Quanti�cation of Etha-nol and Sugar Concentrations in Water andits Application for Noninvasive Real-time Monitoring of Fermentation Mahima Arrawatia, Indian Institute of Technology,
Maryam Baghini, Indian Institute of Technology, Girish Kumar, Indian Institute of Technology
Zhongtao Liu, National University of Singapore, Zheng Zhong, National University of Singapore, Yongxin Guo, National University of Singapore
INTERACTIVE FORUMThursday | Time: 14:00-16:00 | Room: 301 & 302
THIF2-1: Digital Microwave Power Ampli-�er with Energy Recovery
THIF2-1: Cryogenic Temperature, 2-Port, on-Wafer Characterization at WR-5.1 Frequencies
THIF2-4: Stability Analysis of Multi-FingerGaN FET Cells for High Power MMIC Design
THIF2-2: 2-D Wireless Positioning on Mini-mally Invasive Surgical Instruments
THIF2-2: Intermodulation HarvestingRecti�er Design for High E�ciency Multi-sine Wireless Power Transfer
INTERACTIVE FORUMThursday | Time: 14:00-16:00 | Room: 301 & 302
Wolfgang Heinrich, Ferdinand-Braun-Institut, Andreas Wentzel, Ferdinand-Braun-Institut
David Daughton, Lake Shore Cryotonics, Matthew Bauwens, University of Virginia, Jeremy Bluestein, Lake Shore Cryotronics, Emile de Rijk, Swissto12 SA, Mirko Favre, Swissto12 SA, Arthur Lichtenberger, DMPI, Inc., N. Scott Barker, DMPI, Inc., Robert Weikle, University of Virginia, Je�rey Hesler, Virginia Diodes, Inc., Cli� Rowland, Virginia Diodes, Inc., Eric Bryerton, Virginia Diodes, Inc., Doug McLean, Lake Shore Cryotronics, Scott Yano, Lake Shore Cryotronics
Valiallah Zomorrodian, QORVO, Inc., Michael Roberg, QORVO, Inc., Tuong Nguyen, QORVO, Inc., Warren Gaiewski, QORVO, Inc.
Yen-Chih Chang, National Chung Cheng University, Peng Yu Chen, National Chung Cheng University, Cheng Ting Hsieh,National Chung Cheng University, Chia-Chan Chang, National Chung Cheng University, Sheng-Fuh Chang, National Chung Cheng University
George Alexopoulos, Stanford University, Kevin Boyle, Stanford University, Nemat Dolatsha, Stanford University, Hao Nan, Stanford University, Butrus Khuri-Yakub, Stanford University, Amin Arbabian, Stanford University
Byeongdeok Park, University of Seoul, Rae-Seoung Park, University of Seoul, Sangbok Park, University of Seoul
Ping-Hsun Wu, Industrial Technology Research Institute, Feng-Hsu Chung, Industrial Technology Research Institute, Powen Hsu, National Taiwan University
Valery Koshelets, Kotel'nikov Institute of Radio Engineering and Ele
Naoto Oshima, Tokyo Institute of Technology, Kazuhide Hashimoto, Tokyo Institute of Technology, Daisuke Horikawa, Tokyo Institute of Technology, Safumi Suzuki, Tokyo Institute of Technology, Masahiro Asada, Tokyo Institute of Technology
Peter Singerl, In�neon Technologies AG, Thomas Magesacher, Lund University
Shichang Chen, Hangzhou Dianzi University, Pengfei Qiao, Hangzhou Dianzi University, Gaofeng Wang, Hangzhou Dianzi University, Quan Xue, City University of Hong Kong, Zhiqun Cheng, Hangzhou Dianzi University
Jingjing Xia, University of Waterloo, Hai Huang, University of Waterloo, Paul Chen, University of Waterloo, Slim Boumaiza, University of Waterloo
Jingchu He, NXP Semiconductors, Yong Zhang, NXP Semiconductors, Binghui Zhang, NXP Semiconductors, Yinan Wang, NXP Semiconductors, John Gajadharsing, Ampleon, Tao Zhang, Ampleon
Zhengyu Peng, Texas Tech University, Jose-Maria Munoz-Ferreras, University of Alcala, Roberto Gomez-Garcia, University of Alcala, Changzhi Li, Texas Tech University
Olutosin Fawole, University of Utah, Massood Tabib-Azar, University of Utah
Karam Noujeim,Tom Roberts, Anritsu Company
Richard Wilson, In�neon Technologies Americas, Bayaner Arigong, In�neon Technologies Americas, Haedong Jang, In�neon Technologies Americas
Hung-Yu Lin, National Taiwan University, Kun-Yao Kao, National Taiwan University, Kun-You Lin, National Taiwan University
Xiang Li, University of Calgary, Mohamed Helaoui, University of Calgary, Fadhel Ghannouchi, University of Calgary
Eun-Jae Lim, Dept. of Information and Communication Engineering of Kyungnam Univ., Young-Chul Rhee, Dept. of Information and Communication Engineering of Kyungnam Univ., Chan-Sei Yoo, Korea Electrics Technology Institute
Diego Palombini, Elettronica S.p.A., Andrea Bentini, Elettronica S.p.A., Daniele Rampazzo, Elettronica S.p.A.
Qirong Li, University of Electronic Science and Technology of China, Songbai He, University of Electronic Science and Technology of China, Zhijiang Dai, University of Electronic Science and Technology of China
Thual�qar Al-Sawaf, Ferdinand-Braun-Institut, Leibniz-Institut fuer Ho, Ksenia Nosaeva, Ferdinand-Braun-Institut, Leibniz-Institut fuer Ho, Nils Weimann, Ferdinand-Braun-Institut, Viktor Krozer, Ferdinand-Braun-Institut (FBH), Wolfgang
Alessandro Cidronali, University of Florence
THIF2-4: Miniature Packaging Conceptfor LNAs in the 200-300 GHz Range
THIF2-5: Double-Beam CW THz Systemwith Photonic Phase Modulator for Sub-THz Glucose Hydration Sensing
THIF2-6: A planar Schottky diode based int-egrated THz detector for fast electron pulsediagnostics
THIF2-7:A Fully Packaged D-Band MIMOTransmitter Using High-Density Flip-ChipInterconnects on LCP Substrate
THIF2-1: C Band GaN Diode Recti�er with3W DC Output for High Power Microwave Power Transmission Applications
THIF2-3: Non-Contact Di�erential-ModeOn-Wafer Device Characterization in themmW and THz BandsCosan Caglayan, Ohio State University, Kubilay Sertel, Ohio State University
Lorene Samoska, Jet Propulsion Laboratory, Andy Fung, Jet Propulsion Laboratory, Mikko Varonen, Aalto University, Robert Lin, Jet Propulsion Laboratory, Alejandro Peralta, Jet Propulsion Laboratory, Mary Soria, Jet Propulsion Laboratory, Choonsup Lee, Jet Propulsion Laboratory, Sharmila Padmanabhan, Jet Propulsion Laboratory, Richard Lai, Northrop Grumman Space Technology,Stephen Sarkozy, Northrop Grumman Space Technology
Takuro Tajima, Nippon Telegraph and Telephone Corp., Masahito Nakamura, Nippon Telegraph and Telephone Corp., Keiichiro Shiraga, Kyoto University, Yuichi Ogawa, Kyoto University, Katsuhiro Ajito, NNippon Telegraph and Telephone Corp., Hiroshi Koizumi, Nippon Telegraph and Telephone Corp.
Mario Schiselski, Technische Universitaet Dresden, Niels Neumann, Technische Universitaet Dresden, Martin Laabs, Technische Universitaet Dresden, Sergey Kovalev, Helmholtz-Zentrum Dresden-Rossendorf, Michael Gensch, Helmholtz-Zentrum Dresden-Rossen-dorf, Bertram Green, Helmholtz-Zentrum Dresden-Rossendorf
Sensen Li, Georgia Institute of Technology, Taiyun Chi, Georgia Institute of Technology, Jong Seok Park, Georgia Institute of Technology, Hua Wang, Georgia Institute of Technology, John Papapolymerou, Michigan State University
Satoshi Yoshida, Kagoshima Univ., Akihira Miyachi, Japanese Aerospace Exploration Agency (JAXA), Ryoko Kishikawa, Advanced Industrial Science and Technology, Masahiro Horibe, Advanced Industrial Science and Technology, Motoaki Nakatsuka, Mitsubishi Heavy Industries, Ltd, Kenichi Anma, Mitsubishi Heavy Industries, Ltd, Makoto Matsunoshita, Japanese Aerospace Exploration Agency (JAXA), Kenjiro Nishikawa, Kadir Has University, Makoto Kasu, Saga University, Shigeo Kawasaki, Japanese Aerospace Exploration Agency (JAXA)
Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions
Room: 303 Room: 304 Room: 305 Room: 306 Room: 308
Co-Chair: Stephen Goodnick, Arizona StateUniv.
Co-Chair: Je�rey Nanzer, Johns Hopkins Univ.
Co-Chair: Vijay Nair, Intel Corp.
Co-Chair: Leonard Hayden, QORVO, Inc.
13:30-13:5013:50-14:10
TH3C-2: A 40 Gbaud SiGe:C BiCMOS Driver for InP Segmented MZMs with Integrated DAC Functionality for PAM-16 Generation
14:10-14:2014:20-14:30
TH3A-3: A 200 GHz CVD Graphene FET based Resistive Subharmonic Mixer
TH3C-3: Quantum Well Mach-Zehnder Intensity Modulator with Enhanced Linearity
TH3D-1: A Novel Carbon Nanotube LoadedPassive UHF RFID Sensor Tag with Built-in Reference for Wireless Gas Sensing
14:30-14:4014:40-14:50
Thursday Technical Sessions 13:30-15:10 Thursday Technical Sessions 13:30-15:10
Co-Chair: John Wood, Obsidian Microwave, LLC.
TH3B-3: Stability Analysis of Multistage Power Ampli�ers Using Multiple-Input Multiple-Output Identi�cation
TH3B-4: A Channelized Sideband Distortion Model for Suppressing Unwanted Emission of Q-band Millimeter Wave Transmitters
Kazuaki Yazawa,Purdue University,Dustin Kendig,Microsanj LLC.,Justin Rieter, Analog Devices, Inc.,Ali Shakouri, Purdue University
TH3A: Advances in Passive and Active RF Nanotechnology
Applications
TH3B: Nonlinear Circuit Analysis and Modeling
TH3D: Wearable and sensor technologies for Internet of
Things (IOT)
TH3F: Novel and Diverse Measurement Techniques
Room: 307
Co-Chair: Norman CHIANG, SSL
TH3E-2: Development of a CMOS Receiver fora Radio-Telescope Phased-Array Feed
TH3E: New Results in Low Noise Temperature Ampli�ers
Kevin O'Brien,University of California, Chris Macklin,University of California, David Hover, Massachusetts Institute of Technology, Lincoln Laboratory, Mollie Schwartz,University of California, Vladimir Bolkhovsky,Massachusetts Institute of Technology, Lincoln Laboratory, Xiang Zhang, University of California, William Oliver, Massachusetts Institute of Technology, Lincoln Laboratory, Irfan Siddiqi, University of California
Aaron Beaulieu, University of Calgary, Ge Wu, University of Calgary, Leonid Belostotski, University of Calgary, Tom Burgess, National Research Council, Herzberg, Bruce Veidt, National Research Council, Herzberg, James Haslett, University of Calgary
Joel Schleeh,Low Noise Factory, Per-Ake Nilsson, Chalmers University of Technology, Jan Grahn, Chalmers University of Technology, Niklas Wadefalk, Low Noise Factory
Franco Ramirez,University of Cantabria, Almudena Suarez, University of Cantabria,Sergio Sancho, University of Cantabria
Jasmin Grosinger,Graz University of Technology,Lu-kas Görtschacher,Graz University of Technology,Wolfgang Bösch,Graz University of Technology
Ajith Adhur Kutty,Tampere University of Technology,Toni Björninen,Tampere University of Technology,Lauri Sydänheimo,Tampere University of Technology,Leena Ukkonen,Tampere University of Technology
Shilei Jin,University of Massachusetts, Longtao Xu,University of Massachusetts, Yifei Li,University of Massachusetts
Iria Garcia Lopez, IHP Microelectronics, Pedro Rito, IHP Microelectronics, Lars Zimmermann, IHP Microelectronics, Dietmar Kissinger, IHP Microelectronics, Ahmet Cagri Ulusoy, IHP Microelectronics
Ran Zhu,Concordia University, Xiupu Zhang, Concordia University,Dongya Shen,Concordia University
Daniel Onori,CNIT, National Laboratory of Photonic Networks, Francesco Laghezza, CNIT, National Laboratory of Photonic Networks, Filippo Scotti, CNIT National Laboratory of Photonic Networks, Marco Bartocci, Elettronica S.p.A., Antonio Zaccaron, Elettronica S.p.A., Antonio Tafuto, Elettronica S.p.A., Antonella Bogoni, Sant'Anna School of Advanced Studies, Alessandro Albertoni, Elettronica S.p.A., Paolo Ghel�, CNIT National Laboratory of Photonic Networks
Chao Yu, Southeast University, Honglei Sun, Southeast University, Xiao-Wei Zhu, Southeast University, Wei Hong, Southeast University, Anding Zhu, University College Dublin
Libe Mori,University of the Basque Country, UPV/EHU,Aitziber Anakabe,University of the Basque Country, UPV/EHU,Ibone Lizarraga,University of the Basque Country, UPV/EHU,Nerea Otegi,University of the Basque Country, UPV/EHU,Juan-Mari Collantes,UPV/EHU,Vincent Armengaud,French Space Agency (CNES),Geo�roy Soubercaze-Pun,-French Space Agency (CNES)
Bauyrzhan Krykpayev,King Abdullah University of Science and Technology,Muhammad Fahad Farooqui,King Abdullah University of Science and Technology,Rana Muhammad Bilal ,King Abdullah University of Science and Technology,Atif Shamim,King Abdullah University of Science and Technology
Arian Rahimi,University of Florida,Yong-Kyu Yoon,University of Florida
Yaxin Zhang,Chalmers University of Technology,Michael Andersson,Chalmers University of Technology,Jan Stake,Chalmers University of Technology
Xi Luo,Lehigh University,Kuanchen Xiong,Lehigh University,James Hwang,Lehigh University,Yuchen Du,Purdue University,Peide Ye,Purdue University
14:50-15:10
13:30-13:5013:50-14:10
14:10-14:2014:20-14:30
14:30-14:4014:40-14:50
14:50-15:10
TH3A-5: Uncooled Radio Frequency Bolometer based on Carbon Nanotube Thin Films
TH3D-4: Powering Smart Jewelry Using an RF Energy Harvesting NecklaceSon Nguyen,University of California, Nathan Ellis, University of California, Rajeevan Amirtharajah, University of California
Michael Gasper,University of Akron,Ryan Toonen,University of Akron,Samuel Hirsch,U.S Army Research Laboratory,Mathew Ivill,U.S Army Research Laboratory,Henning Richter,Nano-C Inc.,Ramesh Sivarajan,Nano-C Inc.
TH3A-6: Microwave Gas Sensor based on Graphene-loaded Substrate Integrated Waveguide Cavity Resonator Mohammad Ashraf Ali,Wayne State University,Mark Ming-Cheng Cheng,Wayne State University,Jimmy Ching-Ming Chen,Wayne State University,Chung-Tse Michael Wu,Wayne State University
Chair: Luca Pierantoni, Univ. Politecnica delle Marche
Chair: John Xiupu ZHANG, Concordia Univ.Chair: Kavita Goverdhanam,
US Army CERDEC
Chair: Jon Martens, AnritsuChair: Terry CISCO, CAED
TH3E-1: 10 K Room Temperature LNA for SKA Band 1
Wei-Ting Wong,University of Massachusetts, Prasana Ravindran, University of Massachusetts, Su-Wei Chang, University of Massachusetts, Joseph Bardin, University of Massachusetts
Chair: Christopher Silva, The Aerospace Corp.
TH3A-2: Magnetically Tunable Nano-Superlattice Metaconductors for RF Applications
Pierre Franck,Centre National de la Recherche Scienti�que ,Dominique Baillargeat,XLIM CNRS/University of Limoges
TH3A-1: Carbon-Nanotube-Based Wireless On-chip Interconnects
TH3C: Advances in Microwave Photonicss
Pedro Rito, IHP Microelectronics, Iria Garcia Lopez, IHP Microelectronics, Despoina Petousi, IHP Microelectronics, Lars Zimmermann, IHP Microelectronics, Marcel Kroh,IHP Microelectronics, Stefan Lischke, IHP Microelectronics, Dieter Knoll, IHP Microelectronics, Dietmar Kissinger, IHP Microelectronics, Ahmet Cagri Ulusoy, IHP Microelectronics
TH3C-1: A Monolithically Integrated Segmented Driver and Modulator in 0.25 µm SiGe:C BiCMOS with 13 dB Extinction Ratio at 28 Gb/s
TH3C-6: A Direct-Conversion RF Scanning Receiver based on Photonics
Zhenzhou Tang,Nanjing University of Aeronautics and Astronautics,Shilong Pan,Nanjing University of Aeronautics and Astronautics
TH3C-5: Photonic Microwave Image-Reject Mixer with Large Suppression of Mixing Spurs
TH3E-3: A SiGe Ka-Band Cryogenic Low-Noise Ampli�er
TH3E-4: Towards Quantum-Noise Limited Multiplexed Microwave Readout of Qubits
TH3F-2: Kelvin Inductance and Resistance Measurements Using an AC Source and DC VoltmetersWooyeol Choi, University of Texas at Dallas, Kenneth O, University of Texas at Dallas
Wei-Yang Chen, National Chung Cheng University, Yue-Fong Yang, National Chung Cheng University, Pei-Yu Lyu, National Chung Cheng University, Sheng-Fuh Chang, National Chung Cheng University, JanneWha Wu, National Chung Cheng University
Chien-Chang Huang,Yuan Ze University
TH3F-3: An Enhanced Phasor-Sum Method for Accurate Built-In Relative Phase and Amplitude Detection in Beamforming Phased Arrays
TH3F-4: A Fixed Probe Position Self-Calibration Algorithm of Broadband On-Wafer Scattering Parameter Measurements without Impedance-Standard Substrate for RFIC Production Test Applications
TH3F-1: Intrinsic Transient Thermal Response of GaN HEMT
Robert Nakata, University of Hawaii
TH3D-5: RF Techniques for Motion Compensation of an Unmanned Aerial Vehicle for Remote Radar Life Sensing
TH3A-4: Continuous-wave and Transient Characteristics of Phosphorene Microwave Transistors
TH3B-1: Analysis of Oscillation Modes in Free-running Oscillators
Almudena Suarez,University of Cantabria,Sergio Sancho,University of Cantabria,Franco Ramirez,University of Cantabria
TH3B-2: Growth-rate Function for the Nonlinear Analysis of the Transient Dynamics of Microwave Oscillators
TH3C-4: Linearization of Radio-over-Fiber Systems Using Directly Modulated and Electro-Absorption Modulator Integrated Lasers
TH3D-2: Sensor Add-On for Batteryless UHF RFID Tags Enabling a Low Cost IoT Infrastructure
TH3D-3: A WiFi Tracking Device Printed Directly on Textile for Wearable Electronics Applications
WORKSHOPS Sunday | Time: 08:00 – 17:00
WSA | 08:00-12:00Millimeter-wave R&D for 5G: Systems, Phased Arrays, and Handset TransceiversHalf-day
WSB | 13:00-17:00
Half-day
WSC
| 08:00-17:00
Full-day
WSD
| 13:00-17:00 Circuit Techniques and System Architectures for Carrier Aggre-gation and Multi-band Radios
Half-day
WSE
| 08:00-12:00
Half-day
WSF
| 08:00-17:00 Advanced ICs and Systems for Wireless Charging and Energy Harvesting
Full-day
WSG | 08:00-17:00 Frequency Synthesizers of Multi-Band, Multi-Standard Radios and Internet of Things (IoT)Full-day
WSH | 13:00-17:00 RF/Analog IC Design Challenges in Advanced CMOS TechnologyHalf-day
WSI
| 08:00-12:00 High-E�ciency Broadband Multimode Multi Standards Ampl-i�er Design, High E�ciency TransmittersHalf-day
WSJ
| 13:00-17:00 Millimeter-Wave Electronics: from Applications to Manufacturing
Half-day
WSK
| 08:00-17:00 e-Health: Implantable Systems and Communications in theHuman BodyFull-day
WORKSHOPS
WORKSHOPS Monday | Time: 08:00 – 17:00
WMA | 08:00-17:00 Millimeter-wave PAs: Where are We and Where are We Headed? Full-day
WMB
| 08:00-12:00 Advances in High-Power SSPA Technology for KW-Operation at Microwave FrequenciesHalf-day
WMD
| 08:00-17:00Radio Miniaturization, Terahertz Nano-sized Radios and PotentialApplications
Full-day
WME
| 08:00-17:00 Large Signal Network Analysis: from instrumentation architectures to software applications for your RF design �ow
Full-day
WMF | 08:00-17:00 Tunable and Recon�gurable Front Ends for Multiband Communi-cation Systems
Full-day
WMH
| 08:00-17:00 E-Band Communications: Market, Technology and IC designFull-day
WMI
| 08:00-17:00 Autonomous VehiclesFull-day
WFK
| 13:00-17:00 Startups 101Half-day
WORKSHOPS
Highly E�cient 5G PA Design
How mm-wave Systems Reshape the Future of Telecom and SensingApplications
Calibration and Correction Techniques for CMOS Radios
WMG | 0800-17:00Heterogeneous integration of silicon RFIC with III-VFull-day
WMC
| 13:00-17:00 Power and Signal Integrity Characterization TechniquesHalf-day
WORKSHOPS Friday | Time: 08:00 – 17:00
WFA | 08:00-17:00 RF Design and Packaging for wireless wearable and implants
Full-day
WFB | 08:00-12:00 Advanced Millimeter-wave 3D/Multilayer MCM/SoP and PrintingTechnologies
Half-day
WFC | 13:00-17:00 Antenna and Packaging Integration Technologies for mmWaveand Terahertz-Wave Applications
Half-day
WFD | 13:00-17:00 mm-waves Measurement Needs for 5G
Half-day
WFE
| 13:00-17:00 Phase Change Material Switches for a New Class of MicrowaveControl Components
Half-day
WFH | 08:00-17:00Microwave and Photonics Techniques for Terahertz Applicationsin Science and Technology
Full-day
WFI | 08:00-17:00Theory and Applications of Wireless Power Transfer
Full-day
WFJ
| 08:00-17:00 Power Ampli�ers with Variable Loads
Full-day
WORKSHOPSWFF | 08:00-17:00 Emerging Devices for Microwave Circuits and Systems/Beyond Graphene Electronic Devices and their Potential for High-Frequency Applications
Full-day
WFG | 08:00-17:00 Digital Signal Generation With Focus on Direct Digital SynthesisDDS
Full-day
SFA | 08:00-12:00 Fundamental advances on 2D nano-materials and devices
Half-day
SFB | 08:00-17:00 Principles of RF and Microwave Imaging Technology: From Radarto MRI
Full-day
SHORT COURSES
SUNDAY Time: 08:00 – 17:00
FRIDAY Time: 08:00 – 17:00
MONDAY Time: 08:00 – 17:00
| 1300-1700 SSA | 08:00-17:00 Technologies for 5G
Full-day
SSB | 08:00-17:00Power Ampli�ers
Full-day
SMA | 08:00-17:00 High-Speed Optical Transceiver Fundametals
Full-day
SMB | 1300-17:00Multi-Beam Antennas and Beam-Forming Networks
Half-day
PANEL AND RUMP SESSIONS:“Bio-electronics: Silicon in MY body?!” (RFIC Panel) Monday, 12:00-13:15
“Patents – The Good, the Bad and the Ugly” (Joint RFIC/IMS Panel) Tuesday, 12:00-13:15
“The Internet of Space – Technological and Economic Challenges for the Future Space-based Internet” Tuesday, 18:30-21:00
“Are S-parameters Dying?”
“Doing Business in China”
Wednesday, 12:00-13:15
Thursday, 12:00-13:15