ims technical program preview 2016 international...

IMS Technical Program Preview2016 International Microwave Symposium

MOSCONE CENTER • SAN FRANCISCO, CALIFORNIA, USA 6102 YAM 62-42 :setaD noitibihxE • 6102 YAM 72-22 :setaD muisopmyS

IMS2016.orgGATEWAY TO THE WIRELESS FUTURE

Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions Technical Track Key: Field, Device and Circuit Tech. Passive Components Active Components Systems & Applications Emerging Technical Areas Special Sessions

Room: 303 Room: 304 Room: 305 Room: 306 Room: 307 Room: 308 Room:309TU1A: Transmission Lines for

System Applications

Chair: Luca Perregrini, University of Pavia

Co-Chair: Tatsuo Itoh, Los Angeles

University of California,

TU1B: Broadband High-E�ciency

Chair: Debasis Dawn, North Dakota

Co-Chair: Ali Darwish, Army Research Lab

TU1C: Multi-GHz Frontend Cir- cuits for Digital ApplicationsChair: Hermann Boss, Rohde & Schwarz

GmbH & Co KGCo-Chair: Gregory Lyons, Massachusetts

Institute of Technology, Lincoln Laboratory

TU1D: RF-MEMS Technology forTunable and Low Power RF

Chair: Pierre Blondy, Xilinx, Inc.Co-Chair: John Ebel, Air Force Research Lab

TU1E: 3-D Printing Techniquesand Technologies

Chair: Rahul Dixit, Raytheon CompanyCo-Chair: Bob Jackson, University of

Massachusetts, Amherst

TU1F: Methodolody and Hardware Development for High Power Mic-rowave Industiral Applications

Chair: Cheng Paul Wen, Peking UniversityCo-Chair: Steven Stitzer, Northrop Grumman

Mission Systems

TU1G: Advanced Acoustic and Tunable Device Technologies for

RF SystemsChair: Robert York, University of California,

Santa BarbaraCo-Chair: Harvey Newman, Naval Research

Laboratory

08:00-08:20

TU1A-1: Compact Three-Dimensional Four-Way Vectorial Steering Modulefor Ka-Band Multiple Feeds-per-BeamSatellite Payload Applications

TU1C-1: A 108GS/s Track and HoldAmpli�er with MOS-HBT Switch

TU1D-1: An Ultra-Low Phase Noise 3.37-3.58 GHz MEMS Varactor Based VCOwith Continuous Frequency Tuning

TU1E-1: High-k and Low-Loss Thermopl-astic Composites for Fused DepositionModeling and their Application to 3D-Printed Ku-Band Antennas

TU1F-1: Full-Wave Circuit Analysis of a TU1G-1: Substrate Agnostic MonolithicIntegration of 12.5 THz Fco Inline Phase-

08:20-08:40

TU1A-2: Tunable Dielectric Delay LinePhase Shifter Based on Liquid Crystal

Calibration Scheme at 100 GHz Technology for a SPDT in a Radiometer

TU1B-2: Highly Linear CMOS Power TU1C-2: A 55-dB SFDR 16-GS/s Track-and-Hold Ampli�er in 0.18 µm SiGe UsingDi�erential Feedthrough CancellationTechnique

TU1D-2: A Low-Loss 1.4-2.1 GHz CompactTunable Three-Pole Filter With Impro-ved Stopband Rejection Using RF-MEMSCapacitors

TU1E-2: Ultra-Wideband Hybrid Substr-ate Integrated Ribbon Waveguides Us-ing 3D Printing

TU1F-2: Measurement of Temperature Dependent Permittivity of Liquid underMicrowave Heating

TU1G-2: BAW Filter Design Method Basedon Intrinsically Switchable FerroelectricBST FBARsSeungku Lee, University of Michigan, Amir Mortazawi, University of Michigan

08:40-09:00

TU1A-3: Low Permittivity Cladding toImprove the Performance of DielectricRod Waveguides and Dielectric End-FireAntennas

TU1B-3: A Highly E�cient CMOS SOIPower Ampli�er for U-Band Applications

TU1C-3: A 50-GHz-Bandwidth InP-HBTAnalog-MUX Module for High-Symbol- Rate Optical Communications Systems

TU1D-3: Inductive Coupling for IncreasedBandwidth of Aluminum Nitride ContourMode Microresonator Filters

TU1E-3: 3D Printed Metalized-Polymer UWB High-Gain Vivaldi Antennas

TU1F-3: Analog Amplitude-Locked LoopCircuit to Support RF Energy SolutionsHolger Heuermann, FH Aachen University of AppliedSciences, Arash Sadeghfam, FH Aachen University of Applied Sciences

ntiguous Filters For Next-GenerationLTE-Advanced PlatformsCristian Cassella, Northeastern University, Matteo Rinaldi, Northeastern University

TU1F-4: A 300W Complete GaN SolidState Power Ampli�er for PositioningSystem Satellite Payloads

09:00-09:10

TU1A-4: High Directivity Negative-Resistance Composite Right/Left-Handed Leaky-Wave Antenna

TU1B-4: A 60-GHz 20.6-dBm SymmetricRadial-Combining Wideband Power Ampli�er with 20.3% Peak PAE and

TU1C-4: An Over-67-GHz-Bandwidth 2Vppd Linear Di�erential Ampli�er withGain Control in 0.25-µm InP DHBT Tech-

TU1D-4: A 20–40 GHz Tunable MEMSBandpass Filter with Enhanced Stability

TU1E-4: Nanowire-based Through Sub-strate Via for Millimeter-Wave Frequencies

TU1G-4: A New Tunable SAW Filter Circuitfor Recon�gurable RFTakaya Wada, Murata Manufacturing Co., Ltd.TakashiOgami, Murata Manufacturing Co., Ltd., Atsushi Horita, Murata Manufacturing Co., Ltd.,Hidenori Obiya, Murata Manufacturing Co., Ltd., Masayoshi Koshino, Murata Manufacturing Co., Ltd., Makoto Kawashima, Murata Manufac-turing Co., Ltd.

09:20-09:40

TU1A-5: Modal Analysis and Closure ofthe Bandgap in 2D Transmission-Line

TU1B-5: A 104GHz-117GHz Power Ampl- TU1C-5: A 100-Gb/s, 1-tap Feed-forwardbased Analog Equalizer for Optical Co-

TU1D-5: Compact Thin-Film Packaged RF-MEMS Switched Capacitors

TU1E-5: Low-Pro�le and Chip-Scale RF FEM Using Si-Interposer Technology

TU1F-5: High Pressure Microwave FlowReactor for Raw Oil TreatmentAndreas Rosin, Universität Bayreuth, Thorsten Gerd-es, Universität Bayreuth, Monika Willert Porada, Un-iversität Bayreuth

TU1G-5: Two-Port Tunable Interdigital Capacitors Fabricated on Low-Loss MBE-Grown Ba0.29Sr0.71TiO3

Tuesday Technical Sessions 08:00-09:40 Tuesday Technical Sessions 08:00-09:40

Grids

Millimeter-Wave Power Ampli�ers

State University

TU1B-1: Design and Performance of 16-40GHz GaN Distributed Power Ampli�erMMICs Utilizing an Advanced 0.15um GaN Process

Ampli�er for mm-Wave Applications

20-dB Gain in 90-nm CMOS

i�er With 10.4% PAE in Thin Digital65nm Low Power CMOS Technology

nology

mmunication Applications

System

by Gold-Vanadium Micro-CorrugatedDiaphragms

TU1D-6: Piezoelectric RF Resonant Volt-age Ampli�ers for IoT Applications

09:10-09:20

TU1G-3: Cross-Sectional Lamé Mode Co-

Split-Cylinder Cavity

Yoshio Nikawa, Kokushikan University

Change Switch Technology

Cedric Meyers, University of California, Santa Barbara,Christopher Freeze, University of California, Santa Bar-baraSusanne Stemmer, Robert York, University of Cali-fornia, Santa Barbara

TU1G-6: Microwave Power Detection an Anharmonic Dipolar Resonance

08:00-08:2008:20-08:40

08:40-08:5008:50-09:00

09:20-09:4009:00-09:10

09:10-09:20

Michael Schneider, Airbus DS GmbH,Tilo Welker, Technische Universität Ilmenau, Jens Müller, Matthias Hein, Technische Universität Ilmenau

Matthias Jost, Technische Universität Darmstadt, Roland Reese, Technische Universität Darmstadt, Christian Weickhmann,Technische Universität Darmstadt

Denise Lugo, University of South Florida, Ramiro Ramirez, University of South Florida, Jing Wang, University of South Florida, Tom Weller, University of South Florida

Kepei Sun, Syracuse University, Jay Lee, Syracuse University, Jun Choi, Syracuse University

Ayman Dorrah, University of Toronto, George Eleftheriades, University of Toronto, Mohammad Memarian, University of California, Los Angeles

Charles Campbell, QORVO, Inc., Sabyasachi Nayak, QORVO, Inc., Ming-Yih Kao, QORVO, Inc., Shuoqi Chen

Byungjoon Park, Postech University, Daechul Jeong, Postech University, Jooseung Kim, Postech University, Yunsung Cho, Postech University, Kyunhoon Moon, Postech University, Bumman Kim, Postech University

Sultan Helmi, Saeed Mohammadi, Purdue Univer-sity

Cheng-Feng Chou, National Taiwan University, YuanHong Hsiao, National Taiwan University, Yi-Ching Wu, National Taiwan University,Yu-Hsuan Lin, National Taiwan University, Huei Wang, National Taiwan University

Kefei Wu, Rensselaer Polytechnic Institute, Mona Hella, Rensselaer Polytechnic Institute, Sriram Muralidharan, Analog Devices, Inc.

Konstantinos Vasilakopoulos, University of Toronto, Sorin Voinigescu, University of Toronto, Andreia Cathelin, STMicroelectronics, Pascal Chevalier, STMicroelectronics, Thelinh Nguyen, Finisar Corporation

Ya-Che Yeh, National Central University, Yu-An Lin, National Central University, Yu-Cheng Liu, National Central University, Hong-Yeh Chang, National Central University

Hiroshi Yamazaki, Nippon Telegraph and Telephone Corp., Hitoshi Wakita, Nippon Telegraph and Telephone Corp., Hideyuki Nosaka, Nippon Telegraph and Telephone Corp., Kenji Kurishima, Nippon Telegraph and Telephone Corp., Minoru Ida, Nippon Telegraph and Telephone Corp., Akihide Sano, Yutaka Miyamoto, Nippon Telegraph and Telephone Corp., Munehiko Nagatani, Nippon Telegraph and Telephone Corp.

Munehiko Nagatani, Nippon Telegraph and Telephone Corp., Kenji Kurishima, Nippon Telegraph and Telephone Corp., Minoru Ida, Hideyuki Nosaka, Nippon Telegraph and Telephone Corp., Hitoshi Wakita, Nippon Telegraph and Telephone Corp.

Ronan Mettetal, Quartz Laboratory, ENSEA, Jean-Yves Dupuy, Agnieszka Konczykowska, III-V Lab, Filipe Jorge, Alcatel Lucent Bell Labs, Muriel Riet, Alcatel Lucent Bell Labs, Virginie Nodjiadjim, Alcatel Lucent Bell Labs, Achour Ouslimani, Ecole Nationale Supérieure de l'Electronique et de

Gerhard Kahmen, Rohde & Schwarz, Matthias Wiet-struck, IHP Microelectronics, Hermann Schumacher, University of Ulm

Abdullah Alazemi, University of California at San Diego, Gabriel Rebeiz, University of California at San Diego

Christopher Nordquist, Peggy Clews, Stefan Lepko-wski, Emily Crespin, Alejandro Grine, Christopher Dyck, Michael Henry, Sandia National Laboratories, Janet Nguyen, QORVO, Inc., Roy Olsson, Defense Adv-anced Research Projects Agency

ZhengAn Yang, Purdue University, Dimitrios Perou-lis, Purdue University

Ruochen Lu, University of Illinois at Urbana-Cham-paign, Tomas Manzaneque, University of Illinois at Urbana-Champaign, Michael Breen, University of Illinois at Urbana-Champaign, Anming Gao, University of Illinois at Urbana-Champaign, Songbin Gong, University of Illinois at Urbana-Champaign

Juan Castro, University of South Florida, Eduardo Rojas-Nastrucci, University of South Florida, Anthony Ross, University of South Florida, Tom Weller, University of South Florida, Jing Wang, University of South Florida

Jennifer Byford, Michigan State University, Premjeet Chahal, Michigan State University

Mohd Ifwat Mohd Ghazali, Michigan State Universi-ty, Joshua Myers, Michigan State University, Kyoung Youl Park, Michigan State University, Premjeet Chah-al, Michigan State University, John Papapolymerou, Michigan State University

Júlio Pinheiro, University of Sao Paulo, Marcus Pelegrini, University of Sao Paulo, Leonardo Gomes, Gustavo Rehder, University of Sao Paulo, Ariana Serrano, University of Sao Paulo, Philippe Ferrari, Grenoble Institute of Technology

Seong-Ryul Kim, Korea Electronics TechnologyInstitute

David Marqués-Villarroya, Universitat Politècnica de València, Felipe Penaranda-Foix, Universitat Politècnica de València, Jose M Catala-Civera,Univer-sitat Politècnica de València, Beatriz García-Baños, Universitat Politècnica de València, J.Daniel Gutierrez-Cano, Universitat Politècnica de València

Rocco Giofre, Paolo Colantonio, University of Rome, Francisco De Arriba, Laura Gonzalez, TTI (Information and Communication Technologies) Lorena Cabria, University of Cantabria

Nabil El-Hinnawy, Northrop Grumman Electronic Systems, Pavel Borodulin, Northrop Grumman Electronic Systems, Andris Ezis, Northrop Grumman Electronic Systems, Colin Furrow, Northrop Grumman Electronic Systems, Carlos Padilla, Northrop Grumman Electronic Systems, Matthew King, Northrop Grumman Electronic Systems, Brian Wagner, Northrop Grumman Electronic Systems, Doyle Nichols, Northrop Grumman Electronic Systems, Robert Young, Northrop Grumman Electronic Systems, Jeyanandh Paramesh, Carnegie Mellon University, James Bain, Carnegie Mellon University, Evan Jones, LSI

Nitin Parsa, University of Akron, Michael Gasper, University of Akron, Ryan Toonen, University of Akron, Mathew Ivill, U.S Army Research Laboratory, Samuel Hirsch, U.S Army Research Laboratory

Kevin Nadaud, University of Limoges, Fabien Roubeau, University of Limoges, Arnaud Pothier, XLIM Research Institute, Ling Yan ZHANG, Xlim University of Limoges, Romain Stefanini, Airmems, Pierre Blondy, XLIM Université de Limoges CNRS


Room: 303 Room: 304 Room: 305 Room: 306 Room: 308 Room:309Room: 307TU2A: Design and Implement-ation of Transmission Lines

Chair: George Elefteriades, University of Toronto

Co-Chair: Christian Damm, TechnischeUniversity Darmstadt

TU2C: Novel Aspects of RFID

Chair: Thomas Ussmueller, Universityof Innsbruck

Co-Chair: Amin Rida, MAJA Systems

TU2D: Multiband, Multimode, and Multilayer Filter Techniques

Chair: Sanghoon Shin, Naval ResearchLaboratory

Co-Chair: Alejandro Garcia Lamperez,Charles University

TU2E: High Frequency Inter-connects and Packaging

Chair: Hiroshi Kondoh, EHF Consulting

Co-Chair: John Papapolymerou, Michigan State University

TU2F: Microwave Biological Sensing

Chair: James Hwang, Lehigh University

Co-Chair: Katia Grenier, Centre National dela Recherche Scienti�que

TU2G: Microwave ComponentsBased on New Material and Fab-rication Methods for the Next

Chair: Ajay Poddar, OSCICo-Chair: Brian Sequeira, Johns Hopkins

University

10:10-10:30

TU2A-1: A General Conical to Coaxial Line TransitionRyno Beyers, Dirk de Villiers, University of Stellenbosch Alirio Boaventura, University of Aveiro, Nuno Carva-

lho, Instituto de Telecomunicacoes

TU2D-1: A Design of the Microstrip Tri-passband Bandpass Filter With Hexagonal

Cheng-Yu Lee, National Chung Cheng University,Tung-Yi Hsieh, National Chung Cheng University

TU2E-1: X Band Low-Cost GaN TR Modulewith Anti-Radiation StructureYukinobu Tarui, Mitsubishi Electric Corporation, Aki-michi Hirota, Mitsubishi Electric Corporation, IsamuRyokawa, Mitsubishi Electric Corporation, Makoto Ki-mura, Mitsubishi Electric Corporation, Yoshihiro Tsu-bota, Mitsubishi Electric Corporation, Shuichi Sakata,Kiyoshi Ishida, Mitsubishi Electric Corporation

TU2F-1: Selectivity-Enhanced Glucose Mea- TU2G-1: Multi-Band Multi-Tone TunableMillimeter-Wave Frequency Synthesizer

Rainee Simons, NASA

10:30-10:40

TU2A-2: A Predictive Model for Slow-Wave Coplanar Striplines in IntegratedTechnologyAlfredo Bautista, Université Grenoble Alpes, Marwa Abdel Aziz, Ain Shams University, Florence Podevin, Grenoble Institute of Technology, Philippe Ferrari, Gre-noble Institute of Technology

TU2C-2: Software-De�ned Reader for

John Kimionis, Georgia Institute of Technology, Manos Tentzeris, Georgia Institute of Technology

TU2D-2: Novel Septuple-Mode Balanced Filter With Enhanced Selectivity and Extended UpperStopband Using Multi-mode Slotline StructureZhao-An Ouyang, South China University of Technology, Qing-Xin Chu, South China University of Technology

Salih Can Aksoy, Meteksan Savunma Ind. Inc., Ali İhsan Çubukçu, Meteksan Savunma Ind. Inc., Irfan Yildiz, Meteksan Savunma Ind. Inc.

TU2E-2: Heterogeneous Microwave and Millimeter-wave System IntegrationUsing Quilt Packaging

Samuel Jameson, Tel Aviv University, Bassam Khamai-si, Eran Socher, Tel Aviv University

TU2F-2: A 40-nm CMOS Permittivity Sensor for Chemical/Biological Material Charact-erization at RF/Microwave Frequencies

TU2G-2: Micro�uidic Liquid Metal Based Me-chanically Recon�gurable Antenna UsingReversible Gecko Adhesive Based BondingMersedeh Zandvakili, University of Alberta, Moham-mad Mahdi Honari, University of Alberta, Dan Same-oto, University of Alberta, Pedram Mousavi, Universityof Alberta

10:50-11:00

TU2A-3: Design of Substrate Integrated Gap Waveguide

TU2C-3: Experimental Analysis of Power Optimized Waveforms for Enhancing

TU2D-4: Novel Compact Quasi-Elliptic SIWFilter Based on Quarter-Mode Cavities

TU2E-3: A +6dBm 128GHz Source Modulewith Full F-band Waveguide Package and Wirebonded CMOS Chip

TU2F-3: Reproducible Broadband Meas-urement for Cytoplasm Capacitance ofa Biological CellXiao Ma, Lehigh University, Xiaotian Du, Lehigh University, Caroline Multari, Lehigh University, Yaqing Ning, Lehigh University, Xi Luo, Lehigh University, Vahid Gholizadeh, Cristiano Palego, Lehigh University, Xuanhong Cheng,Lehigh University, James Hwang, Lehigh University

Array SystemsShilei Hao, University of California, Davis, TongningHu, University of California, Davis, Jane Gu, Universityof California, Davis

TU2F-4: BiCMOS Micro�uidic Sensor forSingle Cell Label-Free Monitoring Through Microwave Intermodulation

11:10-11:30

TU2A-4: Mode-Selective Transmission Line for DC-to-THz Super-BroadbandOperation

TU2C-5: Near-Field Power Transfer andBackscattering Communication to Mini- ature RFID Tag in 65 nm CMOS Technology Nai-Chung Kuo, University of California, Bo Zhao, University of California, Ali Niknejad, University ofCalifornia

TU2D-5: A Multilayered Combline Filterwith High Harmonic Suppression

TU2E-4: Millimeter Wave Planar Transitionfrom Plastic Rectangular Waveguide to

Ilja Ocket, IMEC/CMST, Maarten Cauwe, IMEC/CMST

TU2G-4: Plane Spiral Orbital Angular Mo-mentum Wave and Its ApplicationsZhuofan Zhang, Zhejiang University, Shilie Zheng,Zhejiang University, Jiayu Zheng, Zhejiang University, Xiaofeng Jin, Zhejiang University, Hao Chi, Zhejiang University, Xianmin Zhang, Zhejiang University

11:30-11:40

TU2C-6: Harmonic-WISP: A Passive Broad- TU2D-6: Multiband SuperconductingFilters

TU2F-5: In-�ow Dielectric Characterizationof Single Biological Cells Using a WidebandDEP CytometerSamaneh Afshar, University of Manitoba, Elham Sali-mi, University of Manitoba, Katrin Braasch, Universityof Manitoba, Michael Butler, University of Manitoba, Douglas Thomson, University of Manitoba, Greg Brid-ges, University of Manitoba


Systems

TU2C-1: Measurement of Sensitivity Improvement in RFID Tags

Multi-Modal RFID Sensing

Band Harmonic RFID PlatformYunfei Ma, Cornell University, Xiaonan Hui, Cornell Uni-versity, Edwin Kan, Cornell University

Raafat Mansour, University of Waterloo, Paul Laforge,University of Regina

1 mm Coax

TU2E-6: An Ultra-Wideband Common-ModeNoise Filter for Di�erential Signals UsingCompact Patterned Ground StructureFangxu Yang, Shanghai Jiao Tong University, Min Tang,Shanghai Jiao Tong University, Junfa Mao, Shanghai Jiao Tong University

TU2G-3: Phase Noise Improvement for

surement in Multicomponent Aqueous So- lution by Broadband Dielectric SpectroscopyMasahito Nakamura, Nippon Telegraph and TelephoneCorp., Takuro Tajima, Nippon Telegraph and TelephoneCorp.,Katsuhiro Ajito, Hiroshi Koizumi, Nippon Tele-graph and Telephone Corp.

Gerasimos Vlachogiannakis, Delft University of Tech-nology, Marco Spirito, Delft University of Technology, Michiel A. P. Pertijs, Leo C. N. de Vreede, Delft Univ-ersity of Technology

For Satellite Beacon Transmitter

TU2G-5: Multi-OAM-mode Microwave Co-mmunication With the Partial Arc Samp-ling Receiving SchemeWeite Zhang, Zhejiang University, Shilie Zheng, Zhejia-ng University, Yiping Hu, Zhejiang University, XiaofengJin, Zhejiang University, Hao Chi, Zhejiang University, Xianmin Zhang, Zhejiang University

10:10-10:3010:30-10:50

10:50-11:1011:10-11:20

1120-11:301130-11:40

11:40-11:50

TU2C-4: Pulse Shaping for BackscatterRadioJohn Kimionis, Georgia Institute of Technology, Manos Tentzeris, Georgia Institute of Technology

TU2C-7: Low-Cost Miniaturized Open-Ended Slot-Based UHF RFID Tag for

Hossein Saghlatoon, University of Alberta, Moham-mad Mahdi Honari, University of Alberta, Rashid Mir-zavand Boroujeni, Pedram Mousavi, Univ. of Alberta

TU2D-3: Microstrip Balanced Quad-ChannelDiplexer Using Dual-Open/Short-Stub Load-ed Resonator

10:40-10:5011:00-11:10

11:40-11:50

Generation Electronics

Wake-up Radio Sensitivity

Harsh Environment

Grounded Resonators

TU2B: Celebrating the 80th Ann-

Chair: Leo de Vreede, Delft Universityof Technology

Co-Chair: Christian Fager, ChalmersUniversity of Technology

Joseph Staudinger, NXP Semiconductors

TU2B-2: Odd-Mode Doherty Power

Jawad Qureshi, Nagoya University

TU2B-3: Joint Circuit-Level and DigitalPredistortion Strategies for Enhancing the

TU2B-4: Design of Linear Doherty PowerAmpli�er for Handset ApplicationBumman Kim, POSTECH University, Yunsung Cho, POSTECH University

Slim Boumaiza, University of Waterloo, Hamed Gole-staneh, University of Waterloo

TU2B-5: Mixed-Signal Doherty Power

iversary of the Doherty Patent

TU2B-1: Doherty History, Principles and Key Developments

Ampli�er

Ampli�ers in CMOSHua Wang, Georgia Institute of Technology, Song Hu, Georgia Institute of Technology, Shouhei Kousai, Toshiba Corporation

TU2B-6: Will Doherty Continue to Rulefor 5G?Peter Asbeck, University of California, San Diego

Linearity-E�ciency tradeo� of DohertyPower Ampli�ers Driven with Carrier Aggregated Signals

Fangxu Yang, Shanghai Jiao Tong University, Min Tang, Shanghai Jiao Tong University, Junfa Mao, Shanghai JiaoTong University

TU2E-5: High-Integrity Terabit-per-SecondSignal Interconnects with Mode-SelectiveTransmission Line

Massimo Del Prete, University di Bologna, Alessandra Costanzo, University di Bologna, Diego Masotti, University di Bologna, Tom-maso Polonelli, University di Bologna, Michele Magno, Eidgenös-sische Technische Hochschule Zürich, Luca Benini, Swiss Federal Institute of Technology

Wei Jiang, Univ. of South Carolina,Yujia Peng, Univ. of South Carolina, Tengxing Wang, Guoan Wang, Univ. of South Carolina, Yong Mao Huang, University of Electronic Science & Technology of China

Jing Zhang, Concordia University, Xiupu Zhang, Concordia University, Dongya Shen, ConcordiaUniversity

Faezeh Fesharaki, École Polytechnique de Montréal, Tarek Djera�, École Polytechnique de Montréal, Ke Wu, École Polytechnique de Montréal, Mohamed Chaker, INRS (Institut National de la Recherche Scienti�que)

Stefano Moscato, University of Pavia, Cristiano Tomassoni, University of Perugia, Maurizio Bozzi, University of Pavia, Luca Perregrini, University of Pavia

Tian Lu, Indiana Integrated Circuits, LLC, Jason Kulick, Indiana Integrated Circuits, LLC, Gary Bernstein, University of Notre Dame, Patrick Fay, University of Notre Dame, John Lannon, RTI International

Cristiano Palego, Bangor University, Guillaume Perry, Bangor Un-iversity, Chris Hancock, Bangor University, Fatima Hjeij, Limoges University,Claire Dalmay, Limoges University, Annie Bessaudou, IHP Microelectronics, Pierre Blondy, XLIM Université de Limoges CNRS, Arnaud Pothier, XLIM Research Institute, Fabrice Lalloué, Limoges University, Barbara Bessette, IHP Microelectronics, Marie-Odile Jauberteau, IHP Microelectronics, Canan Baristiran Kaynak, IHP Microelectronics, Matthias Wietstruck, IHP Micro-electronics, Mehmet Kaynak, IHP Microelectronics, Michael Casbon, Cardi� University, Johannes Benedikt, Cardi� University, David Barrow, Cardi� University, Adrian Porch, Cardi� University


Room: 303 Room: 304 Room: 305 Room: 306 Room: 308 Room:309Room: 307TU3A: Couplers and Dividers

Chair: Guoan Wang, University of South Carolina

Co-Chair: Banyaner Arigong, In�neon Technologies Americas

TU3C: Radio Architectures for E�cient Spectrum Utilization

Chair: Ethan Wang, Univ. of California,Los Angeles

Co-Chair: Shoichi Narahashi, NTT DoCoMo,Inc.

TU3D: Advances in Terahertz Photonics

Chair: Mona Jarrahi, Univ. of California,Los Angeles

Co-Chair: Je�rey Nanzer, Johns Hopkins Univ.

TU3E: Signal Generation Techni-ques For Radar and Communica-tion Systems

Chair: Deukhyoun Heo, Washington State Univ.

Co-Chair: Brad Nelson, QORVO, Inc.

TU3F: Novel Planar and Lumped-Element Filtering Devices

Chair: Shamsur Mazymder, RaytheonCompany

Co-Chair: Roberto Gomez-Garcia, Univ. of Alcala

TU3G: Green, Flexible, Wearable,Recon�gurable Technologies

Chair: Zaher Bardai, IMN Epiphany

Co-Chair: Ramesh Gupta, LightSquared

13:30-13:50

TU3A-1: A Planar Filtering Crossover forThree Intersecting ChannelsLin-Sheng Wu, Shanghai Jiao Tong University, JunfaMao, Shanghai Jiao Tong University

Jun Gi Hong, Soonchunhyang Univ., Seok-Jae Lee,Soonchunhyang Univ., Jongsik Lim, Soonchunhyang Univ., Won-Sang Yoon, Hoseo Univ., Sang-Min Han,Soonchunhyang Univ.

TU3D-1: Photonic-based Millimeter andTerahertz Wave Generation Using a Hy-brid Integrated Dual DBR Polymer LaserGuillermo Carpintero, Universidad Carlos Iii De Madrid, Shintaro Hisatake, Osaka Univ., David De Felipe, Fraun-hofer Heinrich Hertz Institute, Robinson Cruzoe Guzman,Universidad Carlos III de Madrid,Tadao Nagatsuma, OsakaUniv., Norbert KEIL, Fraunhofer Heinrich Hertz Institute, Thorsten Göbel, Fraunhofer Heinrich Hertz Institute, Thorsten Göbel, Fraunhofer Heinrich Hertz Institute

TU3E-1: A 10 GHz Phase Noise Filter with10.6 dB Phase Noise Suppression and -116 dBc/Hz Sensitivity at 1 MHz O�set

TU3F-1: Power-Dependent Bandstop Filtersfor Frequency-Selective Limiting

TU3G-1: E�ciency Enhancement Solutionsfor an Original Linear Green RF Transmitters

13:50-14:10

TU3A-2: A Balanced-to-Balanced Power Divider with Common-Mode NoiseAbsorptionSiang Chen, National Taiwan University, Wei-ChiangLee, National Taiwan University, Tzong-Lin Wu, Nat-ional Taiwan University

Fei Wang, Georgia Institute of Technology, Hua Wang,Georgia Institute of Technology

Ali Darwish, Army Research Lab., Kenneth McKnight, Army Research Lab., Mona Zaghloul, George Washing-ton University,Edward Viveiros, Army Research Lab.,Alfred Hung, Army Research Lab.

TU3C-2: A Nonreciprocal, Frequency-Tunable Notch Ampli�er Based on Distr-ibutedly Modulated Capacitors (DMC)Shihan Qin,Univ. of California, Los Angeles, YuanxunEthan Wang, Univ. of California, Los Angeles

TU3D-2: High-Power Continuous-Wave Terahertz Generation Through PlasmonicPhotomixersMona Jarrahi, University of California, Los Angeles

Nezih Yardimci, University of California, Los Angeles,Mona Jarrahi, University of California, Los Angeles

Ning Wang, University of California, Los Angeles,Hamid Javadi, Jet Propulsion Laboratory, Mona Jar-rahi, University of California, Los Angeles

TU3E-2: A Fully-Integrated Digitally-Program-mable 4×4 Picosecond Digital-to-Impulse Radiating Array in 65nm Bulk CMOS

TU3F-2:Tunable Acoustic-Wave-Lumped-Element Resonator (AWLR)-Based Band-Pass Filters

TU3G-2: Green Microwave Electronics forthe Coming Era of Flexible Electronics

14:10-14:20

TU3A-3: Bandpass Filtering Power Dividerwith Sharp Roll-O� Skirt and EnhancedIn-Band Isolation

TU3C-3: Integrated Diversity Front-Endfor Digital Satellite Radio Reception

TU3D-3: High-Power, Broadband TerahertzRadiation from Large Area Plasmonic Pho-toconductive Emitters Operating at Tele-communication Optical Wavelengths

TU3E-3: A 65nm CMOS 88-105 GHz DDFS-Based Fractional Synthesizer For High Re-solution Planetary Exploration Spectroscopy

TU3F-3: A Compact 1.9-3.4GHz Diplexerwith Controllable Transmission Zeros, Improved Isolation, and Constant Fract-ional Bandwidth

Dimitra Psychogiou, Purdue University, Roberto Gomez-Garcia, University of Alcala, Dimitrios Peroulis, Purdue University

TU3F-4: A Class of Fully-Recon�gurable Planar Multi-Band Bandstop Filters

14:30-14:4014:40-14:50

TU3A-4: General Model for Loaded StubBranch-Line Coupler

TU3A-5: An N-Way Transformer BasedWilkinson Power Divider in CMOS

TU3A-7: A Design of Negative Group Delay Power Divider: Coupling Matrix Approachwith Finite Unloaded-Qu Resonators

TU3A-6: Simple Broadband Gysel Comb-iner with a Single Coupled Line

TU3C-4: All-Digital Flexible Uplink RemoteRadio Head for C-RANAndré Prata, Universidade de Aveiro, Arnaldo Oliveira, Universidade de Aveiro - DETI / IT - Aveiro, Nuno Carva-lho, Instituto de Telecomunicacoes

TU3D-4: Heterodyne Terahertz Detectionwith Plasmonic Photomixers

TU3E-4: A K-Band Low Phase Noise andHigh Gain Gm Boosted Colpitts VCO for 76 – 81 GHz FMCW Radar Applications

TU3G-4: Electrically Tunable BandpassFiltering Balun on Engineered SubstrateEmbedded with Patterned PermalloyThin Film

14:50-15:00

TU3C-5: Design for TV Whitespace Opera-tional Compliance for Cognitive RadioEnabled HighIF WLAN/LTE Front-Ends

TU3D-5: Fully-Integrated and Electronically-Controlled Millimeter-Wave Beam-Scanning

TU3D-6: Metamaterial Modulators forTerahertz Communications and CodedAperture Imaging

TU3F-5: Multi-Functional Low-Pass FiltersWith Dynamically-Controlled In-Band Re-jection Notches


TU3C-1: RF Spectrum Sensing ReceiverSystem with Improved Frequency Chan-nel Selectivity for Cognitive IoT SensorNetwork Applications

Arun Ashok, RWTH Aachen Univ., Iyappan Subbiah, RWTH Aachen University, Gabor Varga, RWTH AachenUniversity, Moritz Schrey, RWTH Aachen University,Stefan Heinen, RWTH Aachen University

Willie Padilla, Duke University

TU3G-3: Investigation of Microwave ActiveElements Embedded in CompositeStructures

13:30-13:5013:50-14:10

14:10-14:3014:30-14:50

14:50-15:10

Juergen Roeber, Univ. of Erlangen-Nuremberg,Simon Senega, Universität der BundeswehrMünchen, Andreas Baenisch, In�neon TechnologiesAG, Amelie Hagelauer, Univ. of Erlangen-Nuremberg,Robert Weigel, Univ. of Erlangen-Nuremberg, StefanLindenmeier, Universität der Bundeswehr München

14:20-14:3015:00-15:10

TU3B: Wideband Power Ampli�ersChair: Ruediger Quay, Fraunhofer IAF

Co-Chair: Arvind Keerti, Qualcomm, Inc.

Takaaki Yoshioka, Mitsubishi Electric Corporation, Naoki Kosaka, Mitsubishi Electric Corporation, Ma-satake Hangai, Mitsubishi Electric Corporation, Koji Yamanaka, Mitsubishi Electric Corporation

TU3B-2: A 2-22 GHz Wideband Active Bi-directional Power Divider/Combiner in130 nm SiGe BiCMOS TechnologyIckhyun Song, Georgia Institute of Technology, Moon-Kyu Cho, Georgia Institute of Technology, Jeong-Geun Kim, Kwangwoon University, Glenn Hopkins, GeorgiaTech Research

TU3B-3: A 2.8-to-6 GHz High-E�ciencyCMOS Power Ampli�er with High-orderHarmonic Matching Network

TU3B-5: Measured Linearity Improvementof 10 W GaN HEMT PA with Dynamic GateBiasing Technique for Flat Transfer Phase

TU3B-4: Two-way Concurrent Dual-BandPower Ampli�er at 0.9/1.8 GHz with LowSecond Harmonic and Intermodulation

Dragan Gecan, Norwegian Univ. of Science and Technology, Morten Olavsbråten, Norwegian Univ. of Science and Techno-logy, Karl Martin Gjertsen, Disruptive Technologies Research

TU3B-1: An S-band 240 W Output / 54 % PAE GaN Power Ampli�er with BroadbandOutput Matching Network for both Fund-amental and 2nd Harmonic Frequencies

TU3E-5: A 5.8 GHz and -192.9 dBc/Hz FoMTCMOS Class-B Capacitively-Coupled VCO with Gm-Enhancement

Shilei Hao, University of California, Davis, Jane Gu,University of California, Davis

Eric Naglich, Naval Research Laboratory, Andrew Guyette, Naval Research Laboratory Nathalie Deltimple, University of Bordeaux,

Guillaume Ferré, University of Bordeaux, Mouna Ben Mabrouk, University of Bordeaux, Eric Kerhervé, University of Bordeaux

Zhenqiang Ma, University of Wisconsin, Yei Hwan Jung, University of Wisconsin, Tzu-Hsuan Chang, University of Wisconsin, Jung-Hun Seo, University of Wisconsin, Huilong Zhang, University of Wisconsin, Zhiyong Cai, USDA Forrest Products Laboratory, Shaoqin Gong, University of Wisconsin

Thomas Baum, RMIT University, Richard Ziolkowski, University of Arizona, Kelvin Nicholson, DST Group, Richard Ziolkowski, University of Arizona

Yujia Peng, University of South Carolina, Yong Mao Huang, University of Electronic Science & Technology of China, Tengxing Wang, University of South Carolina, Wei Jiang, University of South Carolina, Guoan Wang, University of South Carolina

Tao Yang, University of California at San Diego, Gabriel Rebeiz, University of California at San Diego



M. Mahdi Assefzadeh, Rice University, Aydin Babakhani, Rice University

Adrian Tang, Jet Propulsion Laboratory, Theodore Reck, Jet Propulsion Laboratory, Yangyho Kim, University of California, Los Angeles, Gabriel Virbila, University of California, Los Angeles, Goutam Chattopadhyay, Jet Propulsion Laboratory, Mau-Chung Chang, University of California, Los Angeles

Run Levinger, IBM Research - Haifa, Roee Ben Yishay, IBM Research - Haifa, Jakob Vovnoboy, IBM Research - Haifa, Oded Katz, IBM Research - Haifa, Danny Elad, IBM Research - Haifa

Tai Nguyen, Washington State University, Pawan Agarwal, Washington State University, Deukhyoun Heo, Washington State University

Wei Jiang,Univ. of South Carolina, Tengxing Wang, Univ. of South Carolina, Yujia Peng, Univ. of South Carolina, Yong Mao Huang, Univ. of Electronic Science & Technology of China, Guoan Wang, Univ. of South Carolina

Qiuyi Wu, University of Ontario Institute of Technology, Yimin Yang, University of Waterloo, Ying Wang, University of Ontario Institute of Technology, Xiaowei Shi, Xidian

JiKang Nai, National Taiwan Univ.,YuanHong Hsiao, National Taiwan Univ., YuanShan Wang, National Taiwan Univ., Yu-Hsuan Lin, National Taiwan Univ., Huei Wang, National Taiwan Univ.

Zhijiang Dai, Univ. of Electronic Science and Tech. of China, Songbai He, Univ. of Electronic Science and Tech. of China, Jingzhou Pang, Univ. of Ele-ctronic Science and Tech. of China, Chaoyi Huang, Univ. of Electronic Sci-ence and Tech. of China, Tian Qi, Univ. of Electronic Science & Tech. of China

Girdhari Chaudhary, Chonbuk National Univ., Phirun Kim, Chonbuk National Univ., Junhyung Jeong, Chonbuk National Univ.,Yongchae Jeong, Chonbuk National Univ.

Mohammed Reza Hashemi, Univ. of California, Los Angeles, ShangHua Yang, Univ. of California, Los Angeles, Tongyu Wang, Michigan State Univ., Nelson Sepúlveda, Michigan State Univ., Mona Jarrahi,Univ. of California, Los Angeles


Room: 303 Room: 304 Room: 305 Room: 306 Room: 309 Room:310Room: 308

Chair: Kamal Samanta, AMWT Ltd. UK

Co-Chair: Alexander Koelpin, Univ. of Erlangen-Nuremberg

Chair: David R. Jackson, Univ. of HoustonCo-Chair: Jan Machac, Czech Technical Unv.

in Prague

Chair: Michel Nakhla, Carleton Univ.

Co-Chair: Vikas Shilimkar, NXPSemiconductors

Chair: Costas Sarris, Univ. of TorontoCo-Chair: Peter Russer, Technische Univ.München

Chair: Ken Mays, KMays Technical ServicesCo-Chair: Jiang Zhu, Google, Inc.

Chair: Julio Navarro, Boeing

Co-Chair: James Skala, Georgia Institute of Technology

15:55-16:15

TU4A-1: Wideband Tunable GaN HEMTModule Utilizing Thin-Film BST Varactorsfor E�ciency Optimization

TU4D-1: Polynomial-Based Surrogate Model-ing of Microwave Structures in Frequency Domain Exploiting the Multinomial Theorem

TU4F-1: Explicit and Unconditionally Stable FDTD Method Without Eigenvalue Solutions

TU4G-1: A Metamaterial-Inspired Miniaturi-zed Wide-Band Microwave Interferometry Sensor for Liquid Chemical Detection

TU4H-1: An 8-Element 2–16 GHz Phased Ar-ray Receiver with Recon�gurable Number of Beams in SiGe BiCMOS

16:15-16:35

TU4A-2: Recon�gurable Single/Multi-BandPlanar Impedance Transformers With Inco-rporated Bandpass Filtering Functionality

TU4C-2: Solution of Periodically LoadedWaveguides Using the Eigenmode Proj-ection Technique

TU4D-2: E�cient Variability Analysis usingParameterized Model-Order Reduction

TU4F-2: PMLC: A Perfectly Matched Layer Co-llimator and its Applications to Time and Fre-quency Domain Numerical Techniques

TU4G-2: A Low Cost and Pipe Conformable Microwave-Based Water-Cut Sensor

TU4H-2: A 2-15 GHz Built-in-Self-Test Sys-tem for Wide-band Phased Arrays Using Self-Correcting 8-State I/Q Mixers

16:35-16:55

TU4A-3: A Substrate Integrated MatchedLoad with Embedded Resistive Thick Film

TU4C-3: Accurate Substrate Integrated Wav-eguide Modeling Using An Exact AnalyticalFormulation for Multiple Cylinder Scattering

TU4D-3: Low-Cost Dimension Scaling andTuning of Microwave Filters Using Response Features

TU4F-3: Novel Single-Source Integral Equation for Inductance Extraction in Transmission Lin-es Embedded in Lossy Layered Substrates

TU4G-3: Low Temperature Plasma forTunable Resonant Attenuation

Muhammad Akram Karimi, King Abdullah University of Science and Technology, Muhammad Arsalan, Saudi Ar-amco, Atif Shamim, King Abdullah University of Science and Technology

TU4G-4: Accurate Multi-Bias EquivalentCircuit Model for Graphene Resonant Channel Transistors

16:55-17:15

TU4A-4: Broadband Directional MorenoCoupler for High-Performance Air-FilledSIW-Based Substrate Integrated Systems

TU4C-4: Direct Full-Wave Modeling of Bi-dimensional Structures Combining E-Planeand H-Plane Analysis Techniques

TU4D-4: Reduced Dimensional PolynomialChaos Approach for E�cient UncertaintyAnalysis of Multi-Walled Carbon NanotubeInterconnects

TU4F-4: Modeling of Waveguide Compon-ents by the BI-RME Method with the Ewa-ld Green’s Function and the SegmentationTechnique

TU4H-4: Bi-Directional Active and PassiveMeandered Circularly Polarized CRLH-In-spired Leaky-Wave Antennas Based on Substrate Integrated Waveguide


TU4C-1: A Hands-on Approach for Engin-eering Students and Practitioners to An-alyze Electromagnetic Interactions onFlat Boundaries

TU4H-3: Two-dimensional Full-HemisphereFrequency Scanning Array Based on Meta-material Leaky Wave Antennas and FeedNetworks

15:55-16:1516:15-16:25

16:25-16:3516:35-16:55

16:55-17:0517:05-17:15

Chair: Paul Draxler, Qualcomm Technologies, Inc.

Co-Chair: Leo de Vreede, Delft Univ. of Technology

TU4B-2: A Pulse-Mode CMOS Power Amp-li�er for Multi-Band LTE Femtocell BaseStations

TU4B-3: Advanced Envelope Delta-SigmaTransmitter Architecture with PLM PowerAmpli�er for Multi-Standard Applications

TU4B-4: A Three-Level Class-G Modulated 1.85 GHz RF Power Ampli�er for LTE Appli-cations with over 50% PAE

TU4B-1: A 43% PAE Inverse Class-F PowerAmpli�er at 39-42 GHz with a Quarter-Wavelength Transformer Based HarmonicFilter in 0.13-um SiGe BiCMOS

Jin Yan, Purdue University, Dan Jiao, Purdue University Ali Pourghorban Saghati, Texas A&M University,

Jaskirat Singh Batra, Texas A&M University, Jun Kameoka, Texas A&M University, Kamran Entesari, Texas A&M University

Mustafa Sayginer, University of California at San Diego, Gabriel Rebeiz, University of California at San Diego

Tumay Kanar, University of California at San Diego, Gabriel Rebeiz, University of California at San Diego

Mehdi SalarKaleji, Wayne State University,Moham-mad Ashraf Ali, Wayne State University, Chung-Tse Michael Wu, Wayne State University

Dongyin Ren, Syracuse University, Hanseung Lee, Skyworks Solutions, Jun Choi, Syracuse University

Abbas Semnani, Purdue University, Hee Jun Yang, University of Illinois at Urbana-Champaign, Michael Sinanis, Purdue University, Sung-Jin Park, University of Illinois at Urbana-Champaign, Sergey Macheret, Purdue University, Dimitrios Peroulis, Purdue University, Gary Eden, University of Illinois at Urbana-Champaign

Tengda Mei, University of Electronic Science and Technology of China , Yuehang Xu, University of Electronic Science and Technology of China, Oupeng Li, University of Electronic Science and Technology of China, Yu Lan, University of Electronic Science and Technology of China, Yunqiu Wu, University of Electronic Science and Technology of China, Ruimin Xu, University of Electronic Science and Technology of China

Costas Sarris, University of Toronto, Shashwat Sharma, University of Toronto

Shucheng Zheng, University of Manitoba, Anton Menshov, University of Texas at Austin, Vladimir Okhmatovski, CEMWorks Inc.

Simone Battistutta, University of Pavia, Maurizio Bozzi, University of Pavia, Marco Bressan, University of Pavia, Marco Pasian, University of Pavia, Luca Perregrini, University of Pavia

TU4A: Advanced Passive Circuits TU4B: Switch-mode Techniques for RF / MM-Wave Power Ampli�ers

TU4C: Advances in Numerical and Analytical Electromagnetic Modeling

TU4D: Advanced CAD Algoritms and Techniques

TU4F: Advances and Applications of Time- and Frequency-Domain Numerical Techniques

TU4G: New Technologies for Micr-owave Applications - Sensors, Graph-ene Models, Tunable Resonators

TU4H: Integrated Phased Arrays and CRLH Beam Formers

Room: 307

Chair: Luca Roselli, Univ. of Perugia

Co-Chair: Kazuya Yamamoto, Mitsubishi Electric Corp.

TU4E-1: Chipless RFID Reading System Independent of Polarization

TU4E-2: A Novel Compact Harmonic RFIDSensor in Paper Substrate Based on a Var-iable Attenuator and Nested Antennas

TU4E-3: All-inkjet-printed Micro�uidics-Bas-ed Encodable Flexible Chipless RFID Sensors

TU4E-4: Inkjet-Printed Van-Atta Re�ect-Array sensors: A new paradigm for Long-Range Chipless Low Cost Ubiquitous Sma-rt Skin Sensors of the Internet of Things

TU4E-5: 3D Scanning and Sensing Technique for the Detection and Remote Reading of a Passive Temperature Sensor

TU4E: Advances in Chipless RFID Technology

Co-Chair: Qing He, Oracle Corporation

Jimmy Hester, Georgia Institute of Technology, Manos Tentzeris, Georgia Institute of Technology

Dominique Henry, LAAS-CNRS, Hervé Aubert, LAAS-CNRS, Patrick Pons, LAAS-CNRS

Wenjing Su, Georgia Institute of Technology, Qi Liu, Zhejiang University, Benjamin Cook,Texas Instruments, Inc., Manos Tentzeris, Georgia Institute of Technology

Valentina Palazzi, University of Perugia, Paolo Mezzanotte, University of Perugia

Marco Garbati, Grenoble Institute of Technology, Angel Ramos, Grenoble Institute of Technology, Romain Siragusa, Grenoble Institute of Technology, Etienne Perret, Grenoble Institute of Technology, Christophe Halope, Arjowiggins Security

Alex Wiens, Technische Universität Darmstadt, Sebastian Preis, Ferdin and-Braun-Institut, Leibniz-Institut fuer Ho, Christian Schuster, Technische Universität Darmstadt, Mohammad Nikfalazar, Technische Universität Darmstadt, Christian Damm, Technische Universität Darmstadt, Martin Schuessler, Technische Universität Darmstadt, Wolfgang Heinrich, Ferdinand-Braun-Insti-tut, Olof Bengtsson, Ferdinand-Braun-Institut, Rolf Jakoby,

Seyed Yahya Mortazavi, Virginia Polytechnic Institute and State University, Kwang-Jin Koh, Virginia Polytechnic Institute and State University

Walid Dyab, École Polytechnique de Montréal, Mohammad Abdallah, Syracuse University, Tapan Sarkar, Syracuse University, Magdalena Salazar-Palma, Universidad Carlos Iii De Madrid

Jose Chavez-Hurtado, ITESO - The Jesuit University of Guadalajara, Jose Rayas Sanchez, ITESO - The Jesuit University of Guadalajara

Ye Tao, Carleton University, Mina Adel, Carleton University, Behzad Nouri, Carleton University, Michel Nakhla, Carleton University, Ramachandra Achar, Carleton University

Slawomir Koziel, Reykjavik University, John Bandler, McMaster University

Daniel Lawrence, Technology Service Corporation

Tarek Mealy, Cairo University, Islam Eshrah, Cairo University, Tamer Abuelfadl, Cairo University

Carlos Carceller, Universitat Politècnica de València, Pablo Soto,Technical University of Valencia, Jordi Gil, Aurora Software and Testing, Vicente Boria, Universitat Politècnica de València

Nikolai Wol�, Ferdinand-Braun-Institut, Leibniz-Institut fuer Ho, Wolfgang Heinrich, Ferdinand-Braun-Institut, Manfred Berroth, University of Stut-tgart, Olof Bengtsson, Ferdinand-Braun-Institut

Maryam Jouzdani, University of Calgary, Mohamed Helaoui, University of Calgary, Fadhel Ghannouchi, University of Calgary

Hao-Shun Yang, National Taiwan University, Yi-Jan Chen, National Taiwan University, Jau-Horng Chen, National Taiwan University

Aditi Prasad, Colorado State University, Degen Zhou, Colorado State University, Sourajeet Roy, Colorado State University

Roberto Gomez-Garcia, University of Alcala, Dimitra Psychogiou, Purdue University, Dimitrios Peroulis, Purdue University

Christian Rave, Technical University of Hamburg, Arne Jacob, Technical University of Hamburg

Frederic Parment, University of Grenoble-Alpes, Anthony Ghiotto, University of Bordeaux, Tan-Phu Vuong, University of Grenoble-Alpes, Jean-Marc Duchamp, University of Grenoble-Alpes, Ke Wu, École Polytechnique de Montréal TU4H-4: A Series Feed Network Based on

a Distributed CRLH Stripline for Frequen-cy Scanning ApplicationsMichael Enders, Syracuse University, Jun Choi, Syracuse University


Room: 303 Room: 304 Room: 305 Room: 306 Room: 307 Room:308

Chair: Ian Gresham, ANOKIWAVECo-Chair: Mojgan Daneshmand,

Univ. of Alberta

Chair: Q.J. Zhang, Carleton Univ.Co-Chair: Peter Aaen, Univ. of Surrey

Chair: Miguel Laso, Public Univ. ofNavarre (UPNA)

Co-Chair: Vicente Boria, TechnicalUniv of Valencia

Chair: Zoya Popovic, Univ. of ColoradoCo-Chair: Paolo Mezzanotte, Univ.

of Perugia

Chair: Joseph Bardin, Univ. of Massachusetts, Amherst

Co-Chair: Theodore Reck, JetPropulsion Lab

WE1A-1: Same Side Dual SIL-Radar Systemfor Real-Time Vital Sign Monitoring withRandom Body Movement Cancellation

WE1D-1: A Compact Wideband UHF HelicalResonator Diplexer

WE1E-1: Radio Frequency Wireless Power Transfer to Chip-scale Apparatuses

WE1F-1: 500-750 GHz Submillimeter-WaveMEMS Waveguide Switch

WE1A-2: Enhanced Q Double Resonant Active Sensor for Humidity and Moisture E�ect Elimination

WE1C-2: Iso-thermal and Iso-dynamic Direct Charge Function Characterizationof GaN FET with Single Large-Signal Measurement

WE1D-2: Ka-band Surface-Mountable Pseudo-elliptic Filter in Multilayer Micromachined Tec-hnology for On-board Communication Systems

WE1E-2: Geometry Optimization of SlidingInductive Links for Position-independentWireless Power Transfer

WE1F-2: A Fully Encapsulated WaveguideCoupled Passive Imaging W-Band Radio-meter Module with RF Frontend IC in a SiGe-BiCMOS Technology

WE1A-3: High sensitivity, GHz OperatingSAW Pressure Sensor Structures Manufac-tured by Micromachining and Nano-proc-essing of GaN/Si

WE1A-4: Low-Power Planar Complex Diel-ectric Sensor with DC Readout Circuit in aBiCMOS Technology

WE1C-3: Non-Linear Electro-Thermal AlGaN/GaN Model Including Large-Signal DynamicThermal-Trapping e�ects

WE1D-3: Compact Triple-Band BandpassFilters Using Rectangular WaveguideResonators

WE1E-3: A Hybrid Heuristic Design Techn-ique for Real-time Matching Optimizationfor wearable near-�eld ambient RF ener-gy harvesters

WE1E-4: Class-E Power Converters for AC(50/60 Hz) Wireless Transmission

WE1E-5: High E�ciency GaN HEMT Synch-ronous Recti�er with an Octave Bandwi-dth for Wireless Power Applications

WE1E-6: A UHF Recti�er with One OctaveBandwidth Based On a Non-Uniform Transmission Line

WE1A-5: Application of Broadside-CoupledSplit Ring Resonator (BC-SRR) Loaded Tran-smission Lines to the Design of Rotary Enc-oders for Space Applications

WE1A-6: Wrist Location by Wearable Bracelet Belt Resonators

WE1C-4: Small signal modelling approachfor submillimeter wave III-V HEMTs with analysation and optimization possibilities

WE1C-4: Small-Signal Model Extraction of mm-wave N-polar GaN MISHEMT Exhibit-ing Record Performance: Analysis of Gain and Validation by 94 GHz Loadpull

WE1D-4: A Canonical Prototype for Coup-led-Resonator FIlters with Frequency-Dependent Couplings

WE1D-5: Mixed-Mode Resonator using TE101 Cavity Mode and TE01d DielectricMode

WE1D-6: Compact Bandpass Filters Basedon a New Substrate Integrated Wave-guide Coaxial Cavity

WE1F-4: A High-Q W Band Tunable Band-pass Filter

Wednesday Technical Sessions 08:00-09:40 Wednesday Technical Sessions 08:00-09:40

WE1C-1: Transient Gate Resistance Ther-mometry Demonstrated on GaAs andGaN FET

WE1F-3: BiCMOS Integrated Waveguidewith Arti�cial Dielectric at SubmillimeterWave Frequencies

Chair: George Duh, BAE Systems, Inc.Co-Chair: Shahed Reza, Sandia National

Laboratories

WE1B-2: Advances in the Super-Lattice Cast-ellated Field E�ect Transistor (SLCFET) for Wi-deband Low Loss RF Switching Applications

WE1B-3: Soldered Hot-via E-band and W-band Power Ampli�er MMICs for Millimet-er-wave Chip Scale Packaging

WE1B-4: A Fully Integrated High E�ciencyWideband Class EF2 PA for 5GHz WLAN 802.11ac Systems

WE1B-5: A GaN HEMT X-band Cavity Oscilla-tor with Electronic Gain Control

WE1B-6: Single-ended/di�erential 2.5-GS/s Do-uble Switching Track-and-Hold Ampli�er with 26GHz bandwidth in SiGe BiCMOS Technology

WE1B-1: A Single-Chip In-Band Full-DuplexLow-IF Transceiver with Self-InterferenceCancellation Liuqing Gao, Univ. of Illinois at Urbana-Champaign, Yansong Yang,

Univ. of Illinois at Urbana-Champaign, Brandon Arakawa, Univ. of Illinois at Urbana-Champaign, Justin Postma, Micron Technology, Inc., Songbin Gong, Univ. of Illinois at Urbana-Champaign

Alex Pacini, Alma Mater Studiorum - Università di Bologna, Riccar-do Trevisan, Univ. di Bologna, Franco Mastri, Univ. di Bologna, Die-go Masotti, Univ. di Bologna, Alessandra Costanzo, Univ. di Bologna

Umer Shah, KTH Royal Institute of Technology,The-odore Reck, Jet Propulsion Laboratory, Emmanuel Decrossas, Jet Propulsion Laboratory, Cecile Jung-Kubiak, Jet Propulsion Laboratory, Henrik Frid, KTH Royal Institute of Technology, Goutam Chattopadhyay, Jet Propulsion Laboratory, Imran Mehdi, Jet Propulsion Laboratory, Joachim Oberhammer, KTH Royal Institute of Technology

Andreas Strodl, University of Ulm, Václav Valenta, University of Ulm, Alina Bunea, IMT-Bucharest, Rolf Jonsson, Swedish Defence Research Agency (FOI), Shakila Reyaz, Uppsala University, Robert Malmqvist, Swedish Defence Research Agency (FOI), Hermann Schumacher, University of Ulm

Maria Alonso-DelPino, Jet Propulsion Laboratory, Harshitha Shivamurthy, Delft University of Technology, Daniele Cavallo, Delft University of Technology, Luca Galatro, Delft University of Technology, Marco Spirito, Delft University of Technology

James Do, University of California, Davis, Yusha Bey, University of California, Davis, Xiaoguang Liu, University of California, Davis

Jo Bito, Georgia Institute of Technology, Apostolos Georgiadis, Centre Tecnologic de Telecomunicacions de Cataluny, Manos Tentzeris, Georgia Institute of Technology

Jose-Ramon Perez-Cisneros, University of Zaragoza, Maria-Nieves Ruiz Lavin, University of Cantabria, Manuel Lobeira, University de Cantabria, Christian Brañas, University of Cantabria, Jesus de Mingo, University de Zaragoza, Jose Garcia, University of Cantabria

Thomas Johnson, University of British Columbia

Ferran Bolos, Centre Tecnologic de Telecomunicacions de Catalunya, Daniel Belo, University of Aveiro, Apostolos Georgiadis, Centre Tecnologic de Telecomunicacions de Catalunya

WE1A: Microwave Sensors for Practical Applications

WE1B: Latest Advancements in Semiconductor Technologies and

MMICs

WE1C: GaN HEMT Modeling and Characterization

WE1D: Non-Planar Microwave Filters and Multiplexers 1

WE1E: UHF and HF Components for Wireless Power Transfer

WE1F: Component Technologies from MM to Submm-Waves

Mu-Cyun Tang, National Sun Yat-sen University, Chao-Yun Kuo, National Sun Yat-sen University, Da-Cian Wun, National Sun Yat-sen University, Fu-Kang Wang, National Sun Yat-sen University, Tzyy-Sheng Horng, National Sun Yat-sen University

Xuebei Yang, Rice University, Aydin Babakhani, Rice University

Bryan Schwitter,M/A-COM Technology Solutions Holdings, Inc.,Anthony Parker,Macquarie University,Simon Mahon,M/A-COM Technology Solutions Holdings, Inc.,Michael Heimlich,Macqua-rie University

Ping Zhao, Chinese University of Hong Kong, Zhiliang Li, Chinese University of Hong Kong, Jianhua Wu, Huawei Tec-hnologies Co., Ltd., Ke-Li Wu, Chinese University of Hong Kong, Yanan Cui, Huawei Technologies Co., Ltd.

Paola Farinelli, RF Microtech, Luca Pelliccia, University of Perugia, Benno Margesin, Fondazione Bruno Kessler, Roberto Sorrentino, University of Perugia

Li Zhu, Com Dev Intl Ltd, Raafat Mansour, University of Waterloo, Ming Yu, Com Dev Intl Ltd

Agostino Benvegnu, XLIM Laboratory, Olivier Jardel, III-V Lab, Sylvain Laurent, XLIM Laboratory, Denis Barataud, University of LIMOGES - XLIM Laboratory, Matteo Meneghini, University of Padova, Enrico Zanoni, University of Padova, Raymond Quere, XLIM Laboratory

Daniel Niessen, University di Bologna, Gian Piero Gibiino, University of Bologna DEI "G. Marconi", Rafael Cignani, University of Bologna DEI "G. Marconi", Alberto Santarelli, University di Bologna, Dominique M. M.-P. Schreurs, ESAT-TELEMIC, Ku Leuven, Fabio Filicori, University di Bologna

Matthias Ohlrogge, Fraunhofer IAF, Rainer Weber, Fraunhofer IAF, Hermann Massler, Fraunhofer IAF, Matthias Seelmann-Eggebert, Fraunhofer IAF, Axel Tessmann, Fraunhofer IAF, Arnulf Leuther, Fraunhofer IAF, Michael Schlechtweg, Fraunhofer IAF, Oliver Ambacher, Fraunhofer IAF

Matthew Guidry, Univ. of California, Santa Barbara, Steven Wienecke, Univ. of California, Santa Barbara, Brian Rom-anczyk, Univ. of California, Santa Barbara, Haoran Li, Univ. of California, Santa Barbara, Xun Zheng, Univ. of California, Santa Barbara, Elaheh Ahmadi, Univ. of California, Santa Barbara, Karine Hestro�er, Univ. of California, Santa Barbara, Stacia Keller, Univ. of California, Santa Barbara, Umesh Mishra, Univ. of California, Santa Barbara

Mao Mengda, Nanyang Technological University, Chirn Chye Boon, Nanyang Technological University, Devrishi Khanna, Nanyang Technological University, Pilsoon Choi, Massachusetts Institute of Technology, Li-Shiuan Peh, Massachusetts Institute of Technology

Alexandre Bessemoulin, Macom, Melissa Rodriguez, Macom, Simon Mahon, M/A-COM Technology Solutions Holdings, Inc.

Mikael Horberg, Chalmers University of Technology, Dan Kuylenstierna, Chalmers University of Technology

Arnaud Meyer, Thales, Patricia Desgreys, Télécom ParisTech, Hervé Petit, Télécom ParisTech, Bruno Louis, Thales, Vincent Petit, Thales

Robert Howell, Northrop Grumman, Eric Stewart, Nor-throp Grumman, Ron Freitag, Northrop Grumman, Justin Parke, Northrop Grumman, Bettina Nechay, Northrop Grumman, Matthew King, Northrop Grum-man, Shalini Gupta, Northrop Grumman, Megan Snook, Northrop Grumman, Ishan Wathuthanthri, Northrop Grumman, Parrish Ralston, Northrop Grumman, George Henry, Northrop Grumman

Stefano Tamiazzo, Commscope Italy, Giuseppe Macchiarella, Politecnico di Milano

Cristiano Tomassoni, University of Perugia, Simone Bastioli, RS Microwave Company, Richard Snyder, RS Microwave Company, Inc.

Miguel Sanchez-Soriano, University of Alicante, Stefano Sirci, Technical University of Valencia, Jorge D. Martinez, Technical University of Valencia, Vicente Boria, Universitat Politècnica de València

Mohammad Abdolrazzaghi,University of Alberta, Mojgan Daneshmand, University of Alberta

Alexandru Muller, IMT Bucharest, Antonis Stavrinidis, FORTH IESL Heraklion, Ioana Giangu, IMT Bucharest, Alexandra Stefanescu, IMT Bucharest, George Stavrinidis, FORTH IESL Heraklion, Alexandros Pantazis, Foundation for Research and Technology Hellas, Adrian Dinescu, IMT Bucharest, George Boldeiu, IMT Bucharest, George Konstantinidis, FORTH IESL Heraklion

Mohamed Eissa, IHP Microelectronics, Farabi Jamal, IHP Microelectronics, Subhajit Guha, IHP Microelectronics, Cha�k Meliani,IHP Microelectronics, Dietmar Kissinger, IHP Microelectronics, Jan Wessel, IHP Microelectronics

Jordi Naqui, University Autònoma de Barcelona, Ferran Martín, University Autònoma de Barcelona

Chieh-Sen Lee, HTC Corporation,Chun-Yih Wu, HTC Corporation,Yen-Kiang Kuo, HTC Corporation

WE1F-5: Silicon Image Guide (SIG) Technol-ogy Platform for High Performance Sub Millimeter-Wave Passive Structures Aidin Taeb, Univ. of Waterloo, Luyao Chen, Univ. of Waterloo, Suren Gigoyan, Univ. of Waterloo, Mohamed Basha, Zewail City of Science and Technology, Sa�eddin Safavi-Naeini, Univ. of Waterloo

08:00-08:1008:10-08:20

08:20-08:4008:40-09:00

09:00-09:2009:20-09:30

09:30-09:40

08:00-08:1008:10-08:20

08:20-08:4008:40-09:00

09:00-09:2009:20-09:30

09:30-09:40


WEIF1-2: Metallic Air Cavities Integratedwith Surface Mount Tuning Componentsfor Tunable Evanescent-Mode Resonators

WEIF1-2: Characterization of BroadbandLow-NEP SiGe Square-Law Detectors for mm-wave Passive Imaging

WEIF1-2: Scalable Modeling of ResistiveLosses in On-Chip Interconnects at mm-Wave Frequencies

WEIF1-3: Recon�gurable Bandpass FilterTopology using Cul-de-sac Resonators with Adjustable Notches

WEIF1-1: The In�uence of Dielectric andConductor Losses on the Properties ofSpherical Resonators

WEIF1-3: High Sensitivity Tunable PowerDetector

WEIF1-4: Temperature-Compensated Lu-mped Element Tunable Bandpass Filter

WEIF1-2: Electrostatic Analysis of Multi-conductor Transmission Lines Using an Eigenmode Projection Technique

WEIF1-1: Analysis of self-injection locked oscillators for motion sensing applications

WEIF1-1: Development of a Double-Octave (7-??34 GHz), Highly Linear SingleBalanced Resistive HEMT Mixer Using Device Linearization Techniques

WEIF1-2: SiGe based Ka-band re�ectiontype phase shifter for integrated phasedarray transceivers

WEIF1-3: Backward Leaky-Wave Radiationof Microstrip Patterned With Sub-wavele-ngth Hole Array

WEIF1-2: Multi-Frequency Large-SignalAnalysis Using Describing Functions

WEIF1-4: Enhancement of point-sourceresolution via 2-D and 3-D electromagn-etic time-reversal

WEIF1-3: AM/PM Distortion Physical Originsin Si LDMOS Doherty Power Ampli�ers

WEIF1-1: Cheap Method for Accurate Cha-racterization of Orthomode Transducers

WEIF1-2: Parallel EM Optimization Appro-ach to Microwave Filter Design Using Fea-ture Assisted Neuro-Transfer Functions

WEIF1-3: Low-Cost Multi-Objective Designof Compact Microwave Structures Using Domain Patching

WEIF1-4: Fast Yield Estimation and Optimiza-tion of Microwave Filters Using a Cognition-Driven Formulation of Space Mapping

WEIF1-5: Accurate Simulation-DrivenModeling and Design Optimization ofCompact Microwave Structures

WEIF1-1: A Hybrid Topology OptimizationMethod Based on Sensitivity Analysis

Lei Zheng, Oregon State University, Andrew Ferrara, Oregon State University, Andreas Weisshaar, Oregon State University

INTERACTIVE FORUMWednesday | Time: 09:00-11:00 | Room: 301 & 302

WEIF1-1: Novel Remote Controlled Dual ModeFilter Providing Flexible Re-Allocation of Cent-er Frequency and Bandwidth

WEIF1-3: An N-Path Bandpass Filter with aTuning Range of 0.1-12 GHz and StopbandRejection > 20 dB in 32 nm SOI CMOS

WEIF1-1: A Single Input Transformer-lessPush-Pull Microwave Power Ampli�er

WEIF1-1: Noise Measurement of CryogenicLow Noise Ampli�ers Using a Tunnel-Jun-ction Shot-Noise Source

WEIF1-1: Cascaded Splitter/Combiner Mic-rostrip Sections Loaded with Complemen-tary Split Ring Resonators (CSRRs): Model-ing, Analysis and Applications


Uwe Rosenberg, Mician Global Engineering GbR, Ralf Beyer, Mician GmbH, Peter Krauss, Mician GmbH, Thomas Sieverding, Mician GmbH, Andreas Papanastasiou, Com Dev International, Marcos Pueyo-Tolosa, Com Dev International, Petronilo Martin Iglesias, ESA, Christoph Ernst, ESA

Kerim Kibaroglu, University of California at San Diego, Gabriel Rebeiz, University of California at San Diego

Gavin Watkins, Toshiba Research Europe LimitedSu-Wei Chang, University of Massachusetts, Amherst, Jose Aumentado, National Institute of Standards and Technology, Joseph Bardin, University of Massachusetts, Amherst

Eduard Malotaux, Delft University of Technology, Marco Spirito, Delft University of Technology

Muh-Dey Wei, RWTH Aachen University, Saad Qayyum, RWTH Aachen University, Renato Negra, RWTH Aachen University

Mabel Ponton, University de Cantabria, Almudena Suarez, University of Cantabria

Scott Schafer, University of Colorado, Zoya Popovic, University of Colorado

Luis Nunes, Universidade de Aveiro, Pedro Cabral, Universidade de Aveiro, Jose Pedro, Instituto de Telecomunicacoes - Universidade de Aveiro

Matteo Oldoni, SIAE Microelettronica SpA, Dario Tresoldi, SIAE Microelettronica SpA

Ingo Wol�, IMST GmbH

Islam Eshrah, Cairo University, Tamer Abuelfadl, Cairo University

Xinru Li, Tianjin University, Clive Tzuang, Tianjin University, Qianru Weng, Tianjin University, Chang Lu, Tianjin University, Hsien-Shun Wu, Tianjin University

Huilin TU, University of Electronic Science and Technology of China, Shaoqiu XIAO, University of Electronic Science and Technology of China , Bingzhong WANG, University of Electronic Science and Technology of China

Jian Wang, University of Electronic Science and Technology of China, Xue-Song Yang, University of Electronic Science and Technology of China

Feng Feng, Carleton University, Venu-Madhav-Reddy Gongal-Reddy, Carleton University,Chao Zhang, Carleton University, Shunlu Zhang, Carleton University, Qijun Zhang, Carleton University

Adrian Bekasiewicz, Reykjavik University, Slawomir Koziel, Reykjavik University, John Bandler, McMaster University

Chao Zhang, Carleton University, Weicong Na, Carleton University, Qijun Zhang, Carleton University, John Bandler, McMaster University

Slawomir Koziel, Reykjavik University, Adrian Bekasiewicz, Reykjavik University

Xiaoguang Liu, University of California, Davis

Seunggoo Nam, Korea University, Boyoung Lee, Korea University, Juseop Lee, Korea University

Mohammad Abu Khater, Purdue University, Kaiyuan Zeng, Purdue University, Dimitrios Peroulis, Purdue University

Thuy Nguyen, University of California, Davis, Anh-Vu Pham, University of California, Davis, Kohei Fujii, M/A-COM Technology Solutions, Alfy Riddle

Nadav Mazor, IBM Research - Haifa, Oded Katz, IBM Research - Haifa, Roee Ben Yishay, IBM Research - Haifa, Duixian Liu, IBM Research, Alberto Valdes Garcia, IBM Research, Danny Elad, IBM Research - Haifa

WEIF1-2: Hybrid Cylindrical Radial Super-lattice Conductor-based Air-Lifted RF Ind-uctors with Ultra-High Quality Factor for UWB and K-bands

WEIF1-3: An Electrically Actuated Liquid-Metal Switch With Metastable SwitchingStates

WEIF1-1: Online Spectral Estimation of Phase Noise in FMCW Radar Transceiver MMICs

WEIF1-2: Ka-Band Metamaterial MöbiusOscillator (MMO) Circuit

WEIF1-3: A 90 nm CMOS Low Phase Noise Sub-harmonically Injection-locked Voltage-Controlled Oscillator with FLL Self-alignmentTechnique

WEIF1-1: Tunable RF MEMS-based Freque-ncy Dependent Power LimiterDesireh Shojaei-Asanjan, University of Waterloo, Sara Attar, University of Waterloo, Raafat Mansour, University of Waterloo Lijuan Su, University Autònoma de Barcelona, Jordi

Naqui, University Autònoma de Barcelona, Javier Mata, University Autònoma de Barcelona, Ferran Martin, University Autònoma de Barcelona

Arian Rahimi, University of Florida, Yong-Kyu Yoon, University of Florida

George Zhang, University of Hawaii, Ryan Gough, University of Hawaii, Matthew Moore�eld, University of Hawaii, Aaron Ohta, University of Hawaii, Wayne Shiroma, University of Hawaii

Alexander Melzer, Johannes Kepler University of Linz, Alexander Onic, DICE GmbH & Co. KG, Mario Huemer, Johannes Kepler University of Linz

Ajay Poddar, Synergy Microwave, Ulrich Rohde, Brandenburg University of Technology Cottbus, Anisha Apte, Brandenburg University of Technology, Shiban Koul, Indian Institute of Technology Delhi

Yen-Liang Yeh, National Central University, Shu-Yan Huang, National Central University, Yi-En Shen, National Central University, Hong-Yeh Chang, National Central University



Chair: Douglas Teeter, QORVO, Inc.

Co-Chair: Wolfgang Heinrich, Ferdinand-Braun-Institut

Chair: Clemens Ruppel, TDKCo-Chair: Chengjie Zuo, Qualcomm

Technologies, Inc.

Chair: Magdalena Salazar Palma,Charles Univ.

Co-Chair: Clark Bell, HF Plus

Chair: Richard Snyder, RS MicrowaveCo-Chair: Steven Reising, Colorado

State Univ.

Chair: Imran Mehdi, Jet Propulsion LabCo-Chair: Jae-Sung Rieh, Korea Univ.

WE2A-1: Linear Doherty Power Ampli�er with Adaptive Bias Circuit for Average Power-Tracking

WE2D-1: Novel Microstrip Realization andStraightforward Design of Fully Canonical Cul-de-Sac Coupling Bandpass Filters

WE2E-1: Kiyo Tomiyasu: A Lifetime of Ex-ceptional Service and Generosity to IEEE

WE2F-1: Cross-Polarized Multi-ChannelW-Band Radar for Turbulent Flow Velo-city Measurements

WE2A-2: A 80W High Gain and BroadbandDoherty Power Ampli�er for 4/5G Wire-less Communication Systems

WE2C-2: Investigations on Design Techn-ologies for SAW Quadplexer with NarrowDuplex Gap

WE2D-2: Multilevel Aggressive Space Mapping Applied to Coupled-ResonatorFilters

WE2E-2: Kiyo Tomiyasu: One of the MTT-S Fathers

WE2F-2: Multi-Section Auto-Focus Mill-imeter-Wave Holography

WE2A-3: Current Scaled Doherty Ampli�erfor High E�ciency and High Linearity

WE2A-4: A Concurrent 2.15/3.4 GHz Dual-Band Doherty Power Ampli�er with Exte-nded Fractional Bandwidth

WE2C-3: Low Loss and High Isolation Techniques for High Power RF AcousticDevices

WE2D-3: Direct Synthesis and Design of High Degree Lowpass Filters with Ultra-Wide Stopband

WE2E-3: Kiyo Tomiyasu: Key Contributorto the IEEE Geoscience and Remote Sens-ing Society (GRSS) from 1981 to 2013

WE2E-4: Re�ections on Kiyo Tomiyasuand his Connections to Modern Trends in Interferometric SAR for Earth Science

WE2E-5: Kiyo Tomiyasu: The Mentor

WE2E-6: My Friend and Mentor, Kiyo Tomiyasu

WE2A-5: Novel Design of Highly-E�cient Conc-urrent Dual-band GaN Doherty Power Ampli�erUsing Direct-Matching Impedance Transformers

WE2A-6: Deign of Broadband Highly E�cienct Doherty Power Ampli�ers By Using Series Of Continuous Modes

WE2A-7: A 112W GaN Dual Input Doherty-Outphasing Power Ampli�er

WE2C-4: Multiplexers as a Method of Supporting Same-Frequency-Range Down Link Carrier Aggregation

WE2C-5: Multiplexers: a Necessary Exten-sion for 4G/5G Systems

WE2D-4: First-Order Re�ectionless lump-ed-Element Lowpass Filter (LPF) and Bandpass Filter (BPF) Design

WE2D-5: Two-Branch Channelized Passive Fi-lters for Lowpass and Bandpass Applications

WE2D-6: Coupling Matrix and Admittance Fu-nction Synthesis for Mixed Topology Filters

WE2F-4: A Spectral Pro�ling Method of MM-Wave and Terahertz Radiation Sources


WE2C-1: Carrier Aggregation and its Challenges – or: The Golden Age for Acoustic Filters

WE2F-3: An Integrated 100-Element Sch-ottky Varactor Diode Array for Sideband Generation at 1.6 THz

Chair: Dietmar Kissinger, IHP Micro-electronics

Co-Chair: Anand Gopinath, Univ.of Minnesota

WE2B-2: Low Cost Inkjet Printed Smart Bandage for Wireless Monitoring of Chronic Wounds

WE2B-3: Full Mutual Coupling Suppressionin NMR Transmit Arrays in the Presence of High-Permittivity Pads

WE2B-4: New MRI-safe Implant Electr-ode Design

WE2B-5: Characterization of a Novel Microwave Heater for Continuous Flow Micro�uidics Fabricated on High-Resist-ivity Silicon

WE2B-1: Microwave System and Methodsfor Combined Heating and Radiometric Sensing for Blood Perfusion Measurement of Tissue

Michael Deering, IEEE

Jozef Modelski, Warsaw University of Technology

Timo Jaeschke, Ruhr University Bochum, Christian Bredendiek, Ruhr-University Bochum, Simon Kueppers, Ruhr-University Bochum, Christian Schulz, Ruhr-University Bochum, Christoph Baer, Ruhr-University Bochum, Nils Pohl, Ruhr-University Bochum

Hang Cheng, Beijing Institute of Technology, Jane Gu, University of California, Davis, Yu Cheng, Beijing Institute of Technology, Shiyong Li, Beijing Institute of Technology, Houjun Sun, Beijing Institute of Technology

Sami Hawasli, University of Virginia, Souheil Nadri, University of Virginia, Linli Xie, University of Virginia, Robert Weikle, University of Virginia

Richard Al Hadi, University of California, Los Angeles, Yan Zhao, University of California, Los Angeles, Yilei Li, University of California, Los Angeles, Yuan Du,University of California, Los Angeles, Christopher Curwen, University of California, Los Angeles, Benjamin Williams, University of California, Los Angeles, Mau-Chung Chang, University of California, Los Angeles

Steven Reising, Colorado State University

Paul Rosen, California Institute of Technology

Jón Atli Benediktsson, University of Iceland

Richard Snyder, RS Microwave

WE2A: Doherty Ampli�ers are Aive and Well After 80 Years

WE2B: RF Systems and Instru-mentation for Healthcare

Applications

WE2C: Acoustic Multiplexers for Carrier Aggregation

WE2D: New Theory and Synthe-sis Techniques for Planar Filters

WE2E: Memorial Session in Honor of Dr. Kiyo Tomiyasu

WE2F: Emerging MM & Submm-Wave Applications

Yunsung Cho, POSTECH University, Kyunghoon Moon, POSTECH University, Jooseung Kim, POSTECH University, Byungjoon Park, POSTECH University, Bumman Kim, POSTECH University

Mohammad-Reza To�ghi, Pennsylvania State University, Harrisburg, Jayendrasingh Pardeshi, Pennsylvania State University, Harrisburg, Brian Maicke, Pennsylvania State University, Harrisburg

Gernot Fattinger, QORVO, Inc., Alexandre Volatier, QORVO, Inc., Mudar Al-Joumayly, QORVO, Inc.,Yazid Yusuf, University of Central Florida, Robert Aigner, QORVO, Inc., Nadim Khlat, QORVO, Inc., Marcus Granger-Jones, QORVO, Inc.

Masataka Ohira, Saitama University, Toshiki Kato, Saitama University, Zhewang Ma, University of Tsukuba

Alejandro Garcia-Lamperez, Universidad Carlos Iii De Madrid, Magdalena Salazar-Palma, Universidad Carlos Iii De Madrid

Zhiliang Li, Chinese University of Hong Kong, Ke-Li Wu, Chinese University of Hong Kong

Masanori Ueda, TAIYO YUDEN Co., Ltd., Osamu Kawachi, TAIYO YUDEN Mobile Technology Co., Ltd., Tokihiro Nishihara, TAIYO YUDEN Co., Ltd., Jun Tsutsumi, TAIYO YUDEN Co., Ltd.

Yuichi Takamine, Murata Manufacturing Co., Ltd., Hideki Iwamoto, Murata Manufacturing Co., Ltd., Masayoshi Koshino, Murata Manufacturing Co., Ltd., Masahiro Hiramoto, Murata Manufacturing Co., Ltd., Takaya Wada, Murata Manufacturing Co., Ltd., Norio Nakajima, Murata Manufacturing Co., Ltd.

William Mueller, Avago Technologies, Richard Ruby, Avago Technologies

Edgar Schmidhammer, EPCOS AG, Thomas Metzger, EPCOS AG, Christian Ho�mann, EPCOS AG

Steven McCabe, University of Waikato, Jonathan Scott, University of Waikato

Atefeh Kordzadeh, University of Alberta, Nicola DeZanche, University of Alberta

Tomislav Markovic, KU Leuven, div. ESAT-TELEMIC, Ilja Ocket, IMEC, Paolo Fiorini, Imec, Bart Nauwelaers, KU Leuven, div. ESAT-TELEMIC

Muhammad Fahad Farooqui, King Abdullah University of Science and Technology, Atif Shamim, King Abdullah University of Science and Technology

Tae-Hak Lee, Korea University, Boyoung Lee, Korea University, Juseop Lee, Korea University

Roberto Gomez-Garcia, University of Alcala, Andrew Guyette, Naval Research Laboratory

Yuxing He, Univ. of Science and Technology of China, Gang Wang, Univ. of Science and Technology of China, Liguo Sun, Univ. of Science and Technology of China, Gerard Rushingabigwi, Univ. of Science and Technology of China

Chaoyi Huang, Univ. of Electronic Science and Technology of China, Songbai He, Univ. of Electronic Science and Technology of China, Zhijiang Dai, Univ. of Electronic Science and Technology of China, Jingzhou Pang, Univ. of Electronic Science and Technology of China, Zhebin Hu, Univ. of Electronic Science and Technology of China

William Hallberg, Chalmers Univ. of Technology, Mustafa Ozen, Chalmers Univ. of Technology, Christian Fager, Chalmers Univ. of Technology

Mingming Liu, University of Waterloo, Hamed Golestaneh, University of Waterloo, Slim Boumaiza, University of Waterloo

Jingzhou Pang, Univ. of Electronic Science and Technology of China, Songbai He, Univ. of Electronic Science and Technology of China, Zhijiang Dai, Univ. of Electronic Science and Technology of China, Chaoyi Huang, Univ. of Electronic Science and Technology of China, Jun Peng, Univ. of Electronic Science and Tec-hnology of China, Fei You, Univ. of Electronic Science and Technology of China

Weimin Shi, Univ. of Electronic Science and Technology of China, Songbai He, Univ. of Electronic Science and Technology of China, Qiang-an Liu, Univ. of Electronic Science and Technology of China

Abdul Qureshi, Delft Univ. of Technology, Mustafa Acar, Ampleon, Jawad Qureshi, Ampleon, Robin Wesson, Ampleon, Leo C. N. de Vreede, Delft Univ. of Technology

10:10-10:3010:30-10:40

10:50-11:1011:10-11:20

11:20-11:3011:30-11:40

10:40-10:5011:40-11:50

10:10-10:3010:30-10:50

10:50-11:1011:10-11:30

11:30-11:4011:40-11:50



Chair: Glenn Hopkins, Georgia Instituteof Technology

Co-Chair: Aly Fathy, Univ. of Tennessee

Chair: Debabani Choudhury, Intel Corp.Co-Chair: Olga Boric-Lubecke, Univ.

of Hawaii

Chair: Andrew Guyette, Naval Research Laboratory

Co-Chair: Roberto Gomez-Garcia, Univ.of Alcala

Chair: George Ottman, Retired: Hughes Air-craft Co., Past President MTT Society

Co-Chair: Jerry Hausner, Retired: Owner, Electro Science Technologies

Chair: Farshid Aryanfar, Straight PathCommunications

Co-Chair: Jim Buckwalter, Univ. of California, Santa Barbara

WE3A-1: Recon�gurable X-Band 4x4 But-ler Array in 32nm CMOS SOI for Angle-Reject Arrays

WE3D-1: A High Dynamic Range 4th-order4-8 GHz Q-Enhanced LC Band-Pass Filter with 2-25% Tunable Fractional Bandwidth

WE3E-1: Honoring Seymour Cohn, 1920 --2015 His Impact on Mid-20th Century Microwave Technology

WE3F-1: Miniaturized 122 GHz System-on-Chip Radar Sensor with On-Chip Ant-ennas Utilizing a Novel Antenna DesignApproach

WE3A-2: A Broadband Compact Low-Loss 4×4 Butler Matrix in CMOS with StackedTransformer Based Quadrature Couplers

WE3C-2: A Fully Integrated Ka-Band Front End for 5G Transceiver

WE3D-2: Tunable Blocker-Tolerant RF Front-end Filter with Dual Adaptive Not-ches for Recon�gurable Receivers

WE3F-2: A W-Band 65nm CMOS/InP-Hy-brid Radiometer & Passive Imager

We2A-3: A Planar Recon�gurable Focal Plane Array Antenna for 24 GHz

WE3A-4: An F-Band Re�ection Ampli�er Using 28 nm CMOS FD-SOI Technology forActive Re�ectarrays and Spatial Power Combining Applications

WE3C-3: A 60 GHz 64-Element Phased-Array Beam-Pointing Communication System for 5G 100 meter Links up to 2 GBps

WE3D-3: Tunable RF Multiferroic Band-Pass Filters Based on NEMS Magneto-electric Resonators

WE3A-5: Dual-Band Millimeter-Wave Interlea-ved Antenna Array Exploiting Low-Cost PCB Technology for High Speed 5G Communication

WE3A-6: A Coupled-Resonator Decoupling Net-work for Full-Duplex Radios

WE3C-4: Broadband Parametric Circulat-or with Balanced Monolithic Integrated Distributedly Modulated Capacitors(DMC)

WE3C-5: A 2.59-GHz RF Self-Interference CancellationCircuit with Wide Dynamic Range for In-Band Full-Duplex Radio

WE3C-5: Improving Phaseless DoA Estim-ation in Multipath-Impaired Scenarios byExploiting Dual-Band Operations

WE3D-4: Super Compact and Ultra-Wide-band Bandpass Filter using Bridged-T Coils

WE3D-5: On-Chip Bandpass Single-Pole-Double-Throw Switch Based on Multi-coupled Line

WE3F-4: The V-Band CMOS Multi-Frequ-ency Transmitter for Plasma Imaging Radar Re�ectometric Diagnostics


WE3C-1: Mobile Station Radio FrequencyUnit for 5G Communications at 28GHz

WE3F-3: A Low-Power SiGe D-Band TotalPower Radiometer with NEPmin of 1.4 fW/Hz1/2 and NETD of 0.25K

Chair: Phillip Smith, BAE Systems, Inc. Co-Chair: Luciano Boglione, Naval Research

Laboratory

WE3B-2: A 12.7dBm IIP3, 1.34dB NF, 4.9GHz-5.9GHz 802.11a/n LNA in 0.13µmPD-SOI CMOS with Body-Contacted Transistor

WE3B-3: Co-Design of a SiGe BiCMOS X-Band, Asymmetric, Low Insertion Loss, High Power Handling SPDT Switch and anUltra Low Noise LNA for Next-GenerationT/R Modules

WE3B-4: Q-Band InAlGaN/GaN LNA UsingCurrent Reuse Topology

WE3B-5: A Millimeter-Wave Low-NoiseAmpli�er MMIC with Integrated PowerDetector and Gain Control Functionality

WE3B-1: 100-mV 44-uW 2.4-GHz LNA in 16 nm FinFET Technology

H Clark Bell, HF Plus, Alvin Clavin, Retired: Hughes Aircraft Company, Jerry Hausner, Retired: Owner, Electro Science Technologies, George Oltman,Retired, Hughes Aircraft Company

Herman Ng, IHP Microelectronics, Jan Wessel, IHP Microelectronics, Dieter Genschow, IHP Microelectronics, Ruoyu Wang, IHP Microelectron-ics,Yaoming Sun, IHP Microelectronics, Dietmar Kissinger, IHP Microelectronics

Adrian Tang, Jet Propulsion Laboratory, Theodore Reck, Jet Propulsion Laboratory, Ran Shu, Univ. of California, Davis, Lorene Samoska, Jet Propulsion Laboratory, Yangyho Kim, Univ. of California, Los Angeles,Yu Ye, Univ. of California, Davis, Qun Gu, Univ. of California, Davis, Brian Drouin, Jet Propulsion Laboratory, Richard Al Hadi,University of Cali- fornia, Los Angeles,Yinuo Xu,Univ. of California, Davis, Steve Sarkozy, Northrop Grumman Space Technology, Richard Li, Northrop Grumman Space Technology, Mau-Chung Chang, Univ. of California, Davis, Imran Mehdi, Jet Propulsion Laboratory

Tumay Kanar, University of California at San Diego, Gabriel Rebeiz, University of California at San Diego

Yu-Ting Chang, University of California, Davis, Yu Ye, University of California, Davis, Jane Gu, University of California, Davis, Calvin Domier,University of California, Davis, Neville Luhmann, University of California, Davis

WE3A: Integrated Beam Formers and Communications Antennas

WE3B: Advances in LNA Technologies

WE3C: Enabling Technologies for 5G

WE3D: New Advances on Active and Integrated Filters

WE3E: A Memorial Recognizing "Mr Microwave" -- Seymour Cohn, 1920 -

2015

WE3F: MM-Wave ICs for Radar and Imaging

Arun Natarajan, Oregon State University, Amro Tork, Oregon State University

Jun-De Jin,Taiwan Semiconductor Manufacturing Co., Ltd.

Dimitris Psychoudakis, Samsung Research America, Hongyu Zhou, Facebook, Behzad Biglarbegian, SiBeam, Thomas Henige, Samsung Research America, Farshid Aryanfar, Samsung Research America

Farooq Amin, Virginia Polytechnic Institute and State Universit, Sanjay Raman, Virginia Polytechnic Institute and State University, Kwang-Jin Koh, Virginia Polytechnic Institute and State University

Md Naimul Hasan, University of California, Davis, Jane Gu, University of California, Davis, Xiaoguang Liu, University of California, Davis

Hwaider Lin, Northeastern Univ., Tianxiang Nan, Univ. of Wisconsin, Zhenyun Qian, Northeastern Univ., Yuan Gao, Northeastern Univ., Yu Hui, Northeastern Univ., Xinjun Wang, Northeastern Univ., Matteo Rinaldi, Northeastern Univ.,Nian-Xiang Sun, Northeastern Univ., Rongdi Guo, Northeastern Univ., Wei Shi, Inner Mongolia Univ. of Science and Technology, Amine Belkessam, Northeastern Univ.

Samet Zihir, University of California at San Diego, Gabriel Rebeiz, University of California at San Diego

Je�ery Curtis, Samsung Research America, Hongyu Zhou, Facebook, Farshid Aryanfar, Samsung Research America

Shihan Qin, University of California, Los Angeles, Yuanxun Ethan Wang, University of California, Los Angeles

Seunghyeon Kim, Kwangwoon Univ., Youngil Jeon, Kwangwoon Univ., Gosan Noh, Electronics and Telecommunications Research Institute, Youn-Ok Park, Electronics and Telecommunications Research Institute, Ilgyu Kim, Electronics and Telecommunications Research Institute, Hyunchol Shin, Kwangwoon Univ.

Alessandro Cidronali, Univ. of Florence, Giovanni Collodi, Univ. of Florence, Stefano Maddio, Univ. of Florence, Marco Passa�ume, Univ. degli Studi di Firenze, Giuseppe Pelosi, Univ. of Florence, Stefano Selleri, Univ. of Florence

Masaru Sato,Fujitsu Laboratories Ltd., Yoshitaka Niida, Fujitsu Laboratories Ltd., Yoichi Kamada, Fujitsu Laboratories Ltd., Kozo Makiyama, Fujitsu Laboratories Ltd., Shiro Ozaki, Fujitsu Laboratories Ltd., Toshihiro Ohki, Fujitsu Laboratories Ltd., Naoya Okamoto, Fujitsu Laboratories Ltd., Kazukiyo Joshin, Fujitsu Laboratories Ltd.

Inchan Ju, Georgia Institute of Technology, Robert Schmid, Johns Hopkins Applied Physics Lab, Moon-Kyu Cho, GGeorgia Institute of Technology,-Saeed Zeinolabedinzadeh, Georgia Institute of Technology, Mark Mitchell, Georgia Tech Research Institute, John Cressler, Georgia Institute of Technology

Axel Tessmann, Fraunhofer IAF, Arnulf Leuther, Fraunhofer IAF, Hermann Massler, Fraunhofer IAF, Sandrine Wagner, Fraunhofer IAF, Fabian Thome, Fraunhofer IAF, Michael Schlechtweg, Fraunhofer IAF, Oliver Ambacher, Fraunhofer IAF

Raphaël Paulin, STMicroelectronics, Philippe Cathelin, STMicroelectronics

Tze-Hao Tseng, National Central University, Yo-Shen Lin, National Central University

Jian-Fong Wu, National Central University, Yo-Shen Lin, National Central University

Fei Wang, Georgia Institute of Technology, Hua Wang, Georgia Institute of Technology

Michael Sporer, University of Erlangen-Nuremberg, Robert Weigel, University of Erlangen-Nuremberg, Alexander Koelpin, University of Erlangen-Nurem-berg

Naftali Landsberg, Tel Aviv University, Eran Socher, Tel Aviv University

Wenyao Zhai, Huawei Technologies Co., Ltd., Vahid Miraftab, Huawei Technologies Co., Ltd., Morris Repeta, Huawei Technologies Co., Ltd., David Wessel, Huawei Technologies Co., Ltd., Wen Tong, Huawei Technologies Co., Ltd.

Ping Zhao, Chinese University of Hong Kong, Kewei Qian, University of Electronic Science and Technology of China, Ke-Li Wu, Chinese University of Hong Kong

13:30-13:5013:50-14:10

14:10-14:3014:30-14:50

14:50-15:0015:00-15:10

13:30-13:5013:50-14:10

14:10-14:3014:30-14:50

14:50-15:10

Room:310

Chair: Chinchun Meng, National ChiaoTung Univ.

Co-Chair: Hiroshi Okazaki, NTT DoCoMo, Inc.

WE3H-1: A Novel 30-90 GHz Singly Balan-ced Mixer with Broadband LO/IF

WE3H-2: A 57-66 GHz Re�ection-TypePhase Shifter with Near-Constant Insertion Loss

WE3H-4: A Low Phase and Gain Error Passive Phase Shifter in 90 nm CMOS for 60GHz Phase Array System Application

WE3H-5: Method to Improve the Linear-ity of Active Communtating Mixers UsingDynamic Current Injection

WE3H-3: A 2-to-67 GHz 0-dBm LO PowerBroadband Distributed NMOS-HBT Darl-ington Mixer in 0.18 µm SiGe Process

Yi-Ching Wu, National Taiwan University, Chau-Ching Chiong, Academia Sinica and National Taiwan University, Huei Wang, National Taiwan University

Danny Elad, IBM Research - Haifa

Yi-Wei Chang, National Central University, Ya-Che Yeh,National Central University, Shou-Hsien Weng, National Central University, Hong-Yeh Chang, National Central University

Yu-Hsuan Lin, National Taiwan University, Huei Wang, National Taiwan University

Mohammad Mahdi Mohsenpour, Queen's University, Carlos Saavedra, Queen's University

WE3H: Advances in Mixer and Phase-Shifter Circuits and

Techniques


WEIF2-1: Wideband All-digital Transmit-ter Based on Multicore DSM

WEIF2-2: A Novel Method to Design Triple-mode SIW Filter Based on the Complemen-tary Split Ring Resonators (CSRRs)

WEIF2-2: Rigorous simulation of ballistic graphene-FET

WEIF2-2: An FPGA-based All-Digital Tran-smitter with 28-GHz Time-Interleaved Delta-Sigma Modulation

WEIF2-3: Involving Source-Load LeakageE�ects to Improve Isolation in Ladder Acoustic Wave Filters

WEIF2-3: A New Class of Microwave Dual-Band Filter Based on Hybrid ChebyshevPolynomials

WEIF2-3: Tunable Delta-Sigma Modulatorfor Agile All-Digital Transmitters

WEIF2-4: Study of a low-loss self-biasedcirculator at 40 GHz: in�uence of temper-ature

WEIF2-1: A four-pole parallel-coupled dual-mode resonator bandpass �lter

WEIF2-4: Modeling and Predistortion forDigital Transmitters Based on Delta-Sigma and Pulse-Width Modulation

WEIF2-1: An Ultra-Compact Folded Indu-ctor Based Mm-Wave Rat-Race Coupler in CMOS

WEIF2-5: 60GHz Substrate Integrated Waveguide Resonance Isolator

WEIF2-2: A Dual-Band Bandpass Filter Based on Hybrid Structure of Substrate Integrated Waveguide and Substrate Integrated Coaxial Line

WEIF2-6: A Ferrite Nanoparticle BasedPrinting Process for Tunable MicrowaveComponents

WEIF2-3: A V-band CPW Bandpass Filter withControllable Transmission Zeros in Integrat-ed Passive Devices (IPD) Technology

WEIF2-2: A Co-Designed Band 1-Band 3 Ca-rrier Aggregation Power Ampli�er Quadpl-exer in GaAs-HBT and BAW Technologies

WEIF2-4: A Recon�gurable Filtering PowerDivider

WEIF2-5: A Compact Branch Line CouplerUsing Novel Periodically Grounded Slow-Wave Structure

WEIF2-6: Wideband Filters using Via-Less End-Connected Broadside Coupled Asym-metric Coplanar Striplines

WEIF2-7: SIW/HMSIW-to-Microstrip Tran-sitions Using Lumped-Elements and TheirQuadrature Power Divider Application

WEIF2-3: A Compact Self-Packaged Lump-ed-Element Coupler Using Substrate Inte-grated Suspended Line Technology

Abbas Semnani, Purdue University, Michael Sinanis, Purdue University, Garrett Sha�er, Purdue University, Dimitrios Peroulis, Purdue University

Davide Mencarelli, Università Politecnica Delle Marche, Luca Pierantoni, Università Politecnica Delle Marche


WEIF2-1: 3D Printed Low-Cost, Low-Loss Microwave Components up to 40GHz

WEIF2-2: Lossy Resonators as Decoupling Elements in Densely Packed Arrays

WEIF2-1: Lateral-Wave Spurious-ModesElimination in Switchable Ferroelectric BST-on-Si Composite FBARs

WEIF2-1: Design of Integrated Diplexer-Power Divider

WEIF2-1:Field Emission Mitigation in X-Band Silicon-Etched Cavity Resonators


Benjamin Rohrdantz, Technical University of Hamburg, Christian Rave, Technical University of Hamburg, Arne Jacob, Technical University of Hamburg,

Umair Naeem, COMSATS Institute of Information Technology, Muhammad Farhan Sha�que, COMSATS Institute of Information Technology, Stéphane Bila, XLIM UMR 6172, Université de Limoges/CNRS

Seungku Lee, University of Michigan, Milad Zolfagharloo Koohi, University of Michigan, Amir Mortazawi, University of Michigan

Milad Shari� Sorkherizi, Concordia University, Abbas Vosoogh, Chalmers University of Technology, Ahmed Kishk, Concordia University, Per-Simon Kildal, Chalmers University of Technology

Zheng Liu, Shanghai Jiao Tong University, Gaobiao Xiao, Shanghai Jiao Tong University, Lei Zhu, University of Macau

Peng Wen Wong, University Teknologi Petronas, Socheatra Soeung, Universiti Teknologi Petronas, Elden Chien Pheng Zee, Universiti Teknologi Petronas, Sovuthy Cheab, Universiti Teknologi Petronas

Chih-Jung Chen, National Taiwan Ocean University

Zhaosheng He, University of Electronic Science and Technology of China, Zhenhai Shao, University of Electronic Science and Technology of China, Xiang Li, University of Electronic Science and Technology of China, Mengkui Shen, University of Electronic Science and Technology of China

Yin-Cheng Chang, National Chip Implementation Center, Ping-Yi Wang, National Tsing Hua University, Shawn Hsu, National Tsing Hua University, Ta-Yeh Lin, National Chip Implementation Center, Chao-Ping Hsieh, National Chip Implementation Center, Da-Chiang Chang, National Chip Implementation Center

Mingdong Li, QORVO, Inc., Christian Bildl, QORVO, Inc., Bernd Schleicher, QORVO, Inc., Tatyana Purtova, QORVO, Inc., Bernd Schleicher, QORVO, Inc., Andreas Link, QORVO, Inc.

Alfred Gimenez, University Autònoma de Barcelona, Pedro de Paco, University Autònoma de Barcelona

Vincent Laur, Lab-STICC, Richard Lebourgeois, Thales Research & Technology, Eric Laroche, Chelton Telecom & Microwave trading as Cobham Microwave, Jean-Luc Mattei, Lab-STICC, Patrick Que�elec, Lab-STICC, Jean-Pierre Ganne, Thales Research & Technology, Gilles Martin, Chelton Telecom & Microwave trading as Cobham Microwave

Qiao Li, University of Minnesota, Twin Cities, Xiaomei Guo, Boston Applied Technologies Inc, Huihong Song, Boston Applied Technologies Inc, Kewen Li, Boston Applied Technologies Inc, Yingyin Zou, Boston Applied Technologies Inc, Hua Jiang, Boston Applied

Farhan Abdul Gha�ar, King Abdullah University of Science and Technology, Mohammad Vaseem, King Abdullah University of Science and Technology, Muhammad Fahad Farooqui, King Abdullah University of Science and Technology, Atif Shamim, King Abdullah University of Science and Technology

Yongqiang Wang, University of Electronic Science and Technology of China, Kaixue Ma, University of Electronic Science and Technology of China, Shouxian Mou, University of Electronic Science and Technology of China

Shih-Fong Chao, National Kaohsiung Marine University, Kun-Rong Lin, National Kaohsiung Marine University, Yen-Yu Chen, National Kaohsiung Marine University

Yasuo Morimoto, University of California, Los Angeles, Amogh Waghmare, University of California, Los Angeles, Kirti Dhwaj, University of California, Los Angeles, Tatsuo Itoh, University of California, Los Angeles,

Azadeh Taslimi, National University of Singapore, Koen Mouthaan, National University of Singapore

Dong-Sik Eom, Ajou University, Hai-Young Lee, Ajou University

Rui Cordeiro, Instituto de Telecomunicações, Arnaldo Oliveira, Universidade de Aveiro - DETI / IT - Aveiro, José Vieira, Universidade de Aveiro, Tomás Silva, Universidade de Aveiro

Masaaki Tanio, NEC Corporation, Shinichi Hori, NEC Corporation, Noriaki Tawa, NEC Corporation, Tomoyuki Yamase, NEC Corporation, Kazuaki Kunihiro, NEC Corporation

Daniel Dinis, Universidade de Aveiro, Rui Cordeiro, Instituto de Telecomunicações, Arnaldo Oliveira, Universidade de Aveiro - DETI / IT - Aveiro, José Vieira, Universidade de Aveiro

Lei Ding, Texas Instruments, Inc., Rahmi Hezar, Texas Instruments, Inc., Shai Erez, Texas Instruments, Inc.

Min-Yu Huang, Georgia Institute of Technology, Hua Wang, Georgia Institute of Technology

WEIF2-5: Compact Parallel-Coupled Sext-Band Bandpass Filter Using Semi-LumpedResonators

WEIF2-6: Dual-band Filter Design with Pole-Zero Distribution in the Complex Fre-quency Plane

WEIF2-1: Fast and Precise Ranging Basedon Stepped-Frequency Continuous Wave Radar Measurements Using Compressive Sensing Algorithms

WEIF2-2: Demonstration of 20-Gbps Wireless DataTransmission at 300 GHz for KIOSK Instant Data Downloading Applications with InP MMICs

WEIF2-3: Spatial-Domain Technique to Overcome Grating Lobes in Sparse Mono-static mm-Wave Imaging Systems

WEIF2-4: Miniaturized Dual-wideband Bandpass Filter Using Coupled Slotted Open StubsAbdullah Alburaikan, University of Manchester Institute of Science and Technology, Mohammed Aqeeli, University of Manchester Institute of Science and Technology, Zhirun Hu, University of Manchester Institute of Science and Technology

Ko-Wen Hsu, National Chung-Shan Institute of Science and Technology, Hong-Yeh Chang, National Central University, Wen-Hua Tu, National Central University

Xiaofeng Sun, Nanyang Technological University, Eng Leong Tan, Nanyang Technological University

Haofei Wang, Beijing Institute of Technology, Linyun Ren, University of Tennessee, Ozlem Kilic, The Catholic University of America, Aly Fathy, University of Tennessee

Ho-Jin Song, NTT Device Technology Labs., Toshihiko Kosugi, NTT Device Technology Labs., Hiroshi Hamada, NTT Device Technology Labs.,Takuro Tajima, Nippon Telegraph and Telephone Corp., Amine El Moutaouakil, NTT Device Technology Labs., Hideaki Matsuzaki,NTT Device Technology Labs., Makoto Yaita, NTT Device Technology Labs., Yoichi Kawano, Fujitsu Limited, Tsuyoshi Takahashi, Fujitsu Limited, Yasuhiro Nakasha, Fujitsu Limited, Naoki Hara, Fujitsu Limited, Katsumi Fujii, National Institute of Information and Communications Technology, Issei Watanabe, National Institute of Information and Communications Technology, Akifumi Kasamatsu, National Institute of Information and Communications Technology

Babak Mamandipoor, University of California, Santa Barbara, Mojtaba Fallahpour, Stanford University, Greg Malysa, Stanford University, Karam Noujeim, Upamanyu Madhow, University of California, Santa Barbara, Amin Arbabian, Stanford University



Chair: Charles Baylis, Baylor Univ.Co-Chair: Dimitrios Peroulis, Purdue Univ.

Chair: Fabrizio Bonani, Politecnico di TorinoCo-Chair: David Root, Keysight Technologies

Chair: Xiaoguang Liu, Univ. ofCalifornia, Davis

Co-Chair: Xun Gong, Univ. of Central Florida

Chair: Robert Caverly, Villanova Univ.Co-Chair: Frank Sullivan, Raytheon Company

Chair: Goutam Chattopadhyay, NASA’s Jet Propulsion Lab

Co-Chair: Joe Qiu, U.S. ARMY Research O�ce

WE4A-1: Tuning Technology for Adapt-able Radar Bandwidth

WE4D-1: Octave-Tunable Constant Absol-ute Bandwidth Bandstop Filter Utilizing a Novel Passively-Compensated Coupling Method

WE4E-1: 650-W High-E�ciency Ampli�erfor 704 MHz

WE4E-2: Transmission-Line BroadbandGaN FET Class-E Power Ampli�er

WE4E-3: An Octave High Power Push-Pull Doherty Ampli�er With Broadband 2nd Harmonic Termination Control

WE4E-4: Constant-Gain Envelope Track-ing in a UHF Outphasing Transmitter Bas-ed on Continuous-Mode Class-E GaN HEMT PAs

WE4F-1: 90-Degree Hybrid-Coupler Bas-ed Phase-Interpolation Phase-Shifter for Phased-Array Applications at W-Bandand Beyond

WE4A-2: A Simplex Optimization Tech-nique for Real-Time, Recon�gurable Power Ampli�ers

WE4C-2: A Novel Approach to MicrowaveCircuit Large-Signal Variability AnalysisThrough E�cient Device Sensitivity-Based Physical Modeling

WE4D-2: Adaptive-Transfer-FunctionBandpass Filters Using Recon�gurableEvanescent-Mode-Cavity Resonator Cascades

WE4F-2: Wideband mm-Wave Phase Shifters Based on Constant-Impedance Tunable Transmission Lines

We4A-3: E�cient Radar Transmitters forAmplitude-Tapered Pulses with Improved Spectral Con�nement

WE4A-4: A Constant-Transfer-Function Widely-Tunable VHF Modular Field-Progr-ammable Filter Array (FPFA) with IIP3 of38-52 dBm

WE4C-3: Substrate Network Modeling ofRF Power LDMOS Devices Including Non-linear E�ects

WE4D-3: A High-Q and Octave Tunable All-Silicon Cavity Filter Using Magneto-static Actuation

WE4C-4: Investigation of TSV NoiseCoupling in 3D-ICs Using an Experiment-al Validated 3D TSV Circuit Model Includ-ing Si Substrate E�ects and TSV Capacit-ance Inversion Behavior After Wafer Thinning

WE4D-4: An Evanescent-Mode TunableDual-Band Filter with Independently-Controlled Center Frequencies

WE4F-4: An Investigation of Millimeter WaveSwitches Based on Shunt Transistors Includ-ing SPDT Switch MMICs up to 300 GHz

WE4F-5: A 219-GHz Fundamental Oscillatorwith 0.5 mW Peak Output Power and 2.08% DC-to-RF E�ciency in a 65 nm CMOS


WE4C-1: Circuit Envelope Physical Semi-conductor Device Simulation

WE4F-3: Quintic Mixer: An LO-less Sub-harmonic Up-Conversion Mixer for THz Transmitter Supporting Complex DigitalModulation

Chair: Jose Rayas Sanchez, IITESO, TheJesuit Unvi. of Guadalajara

Co-Chair: Roni Khazaka, McGill Univ.

WE4B-2: Advanced Parametric ModelingUsing Neuro-Transfer Function for EMBased Multiphysics Analysis of Micro-wave Passive Components

WE4B-3: Parallel Matrix Neural NetworkTraining on Cluster Systems for DynamicFET Modeling from Large Datasets

WE4B-4: Surrogate-Based Miniaturiza-tion-Oriented Design of Two-Section Branch-Line Couplers

WE4B-1: Optimization Procedure for Re-movable EBG Common Mode Filter Design

Frederick Raab, Green Mountain Radio Research

Ramon Beltran, Skyworks Solutions

Ayman Jundi, University of Waterloo, Kasyap Patel, University of Waterloo, Slim Boumaiza, University of Waterloo

Maria-Nieves Ruiz Lavin, University of Cantabria, Adan Benito, University of Cantabria, Jose-Ramon Perez-Cisneros, University of Zaragoza, Pere Gilabert, Universitat Politècnica de Catalunya, Gabriel Montoro, Universitat Politècnica de Catalunya, Jose Garcia, University of Cantabria

Sadia Afroz, Virginia Polytechnic Institute and State University, Kwang-Jin Koh, Virginia Polytechnic Institute and State University

Pingyue Song, University of Southern California, Hossein Hashemi, University of Southern California

Kyoya Takano, Hiroshima City University, Shinsuke Hara, National Institute of Information and Communications Technology, Kosuke Katayama, Hiroshima University, Shuhei Amakawa, Hiroshima University, Takeshi Yoshida, Hiroshima University, Minoru Fujishima, Hiroshima University

YFabian Thome, Fraunhofer IAF,Matthias Ohlrogge, Fraunhofer IAF, Arnulf Leuther, Fraunhofer IAF, Michael Schlechtweg, Fraunhofer IAF, Oliver Ambacher, Fraunhofer IAF

Hyeok-Tae Kwon, Chungbuk National University, Dat Nguyen, Chungbuk National University, Jong-Phil Hong, Chungbuk National University

WE4A: Focus Session: Spectrum-Aware and Frequency-Agile

Circuits

WE4B: Advaced Optimization Techniques

WE4C: Physics-Based Modeling of Active and Passive Compo-

nents

WE4D: Recon�gurable 3-D High- Q �lters

WE4E: Advances in High Power, High E�ciency HF-VHF-UHF Power

Ampli�ers

WE4F: Novel CMOS THz/MMW Signal Generation Circuits

Anthony Martone, U.S. Army Research Laboratory, Charles Dietlein, OSD, Kelly Sherbondy, U.S. Army Research Laboratory, Mark Govoni, U.S. Army Communications-Electronics Research, Development And Engineering Center, Je�rey Pulskamp, U.S. Army Research Laboratory

Carlo Olivieri, University of L'Aquila, Francesco De Paulis, University of L'Aquila, Antonio Orlandi, University of L'Aquila, Riccardo Ceccheti, INTECS, Slawomir Koziel, Reykjavik University

Chris Morton, Self-Employed

Mark Hickle, Purdue University, Dimitrios Peroulis, Purdue University

Dimitra Psychogiou ,Purdue University, Roberto Gomez-Garcia, University of Alcala, Dimitrios Peroulis, Purdue University

Muhammad Arif, National University of Science and Technology, Dimitrios Peroulis,Purdue University

Olof Tornblad, In�neon Technologies Americas, Lyle Gi�n, In�neon Technologies Americas, Cindy Blair, In�neon Technologies Americas

Simona Donati Guerrieri, Politecnico di Torino, Fabrizio Bonani, Politecnico di Torino, Giovanni Ghione, Politecnico di Torino

Martin Rack, University Catholiqué de Louvain, Geert Van der Plas, IMEC, Michele Stucchi, IMEC, Phillippe Absil, IMEC, Jean-pierre Raskin, University Catholiqué de Louvain, Eric Beyne, IMEC, Xiao Sun, IMEC, Joeri De vos, IMEC

Piotr Kurgan, Reykjavik University, Slawomir Koziel, Reykjavik University, John Bandler, McMaster University

Shunlu Zhang, Carleton University, Jianjun Xu, Keysight Technologies, Qijun Zhang, Carleton University, David Root, Keysight Technologies

Wei Zhang, Carleton University, Feng Feng, Carleton University, Jianan Zhang, Carleton University, Venu-Madhav-Reddy Gongal-Reddy, Carleton University, Qijun Zhang, Carleton University, Shunlu Zhang, Carleton University

James Chen, University of California, Davis, James Chen, University of California, Davis, Akash Anand, University of California, Davis, Hjalti Sigmarsson, Advanced Radar Research Center, School of Electrical and Computer Engineering, University of Oklahom, Xiaoguang Liu, University of California, Davis

Alexander Tsatsoulas, Baylor University, Joseph Barkate, Baylor University, Charles Baylis, Baylor University, Robert Marks II, Baylor University

Andrew Zai, University of Colorado, Corrado Florian, University di Bologna, Tommaso Cappello, University di Bologna, Zoya Popovic, University of Colorado

Kaiyuan Zeng, Purdue University, Dimitra Psychogiou, Purdue University, Wesley Allen, Purdue University, Dimitrios Peroulis, Purdue University

15:55-16:1516:15-16:35

16:35-16:5516:55-17:15

15:55-16:1516:15-16:35

16:35-16:5516:55-17:05

17:05-17:15

Room:310

Chair: J.-C. Chiao, Univ. of Texas at ArlingtonCo-Chair: Yanzhu Zhao, Medtronic, Inc.

WE4H-1: Microwave Dielectric Spectro-scopy for Single Cell Irreversible Electro-poration Monitoring

WE4H-2: High-Frequency Continuous-Wave Electroporation of Jurkat HumanLymphoma Cells

WE4H-4: 14.5GHz Energy for Dermatolo-gical Applications – Initial in-vivo Data with Histology

WE4H-5: Low-Intensity Microwave Auto-hemotherapy as a Feasible AlternativeDrug-Free Technique

WE4H-3: What the Deep Sea Can Tell UsAbout Microwaves

Amar TAMRA, Laboratoire d'analyse et d'architecture des systèm, David DUBUC, LAAS CNRS, Marie-Pierre ROLS , Institut de pharmacologie et de biologie structurale, Katia Grenier, LAAS-CNRS

Hang Li, Lehigh University, Xiao Ma, Lehigh University, Xiaotian Du, Lehigh University, Xuanhong Cheng, Lehigh University, James Hwang, Lehigh University

Catrin Williams, Cardi� University, David Lloyd, Cardi� University, Jonathan Lees, Cardi� University, Adrian Porch, Cardi� University

Christopher Hancock, NA

Kateryna Arkhypova, O.Ya. Usikov Institute for Radiophysicas and Electronics NAS of Ukraine, Anatoliy Fisun,O.Ya. Usikov Institute for Radiophysicas and Electronics NAS of Ukraine, Oleg Bilous, O.Ya. Usikov Institute for Radiophysicas and Electronics NAS of Ukraine, Andriy Nosatov, Kharkiv City Clinical Hospital No 7, Volodymyr Malakhov, Kharkiv Medical Academy of Post-Graduate Education

WE4H: Microwave Biological E�ects


Room: 303 Room: 304 Room: 305 Room: 306 Room: 309Room: 308

Co-Chair: Gerald DeJean, Microsoft ResearchCo-Chair: Ed Niehenke, Niehenke Consulting

Co-Chair: Irfan Ashiq, National Instruments Corp.

Co-Chair: Peter Russer, Technische Univ. München

08:00--08:20

TH1A-1: Adaptive Harmonics Comb NotchFilter for Measuring Heart Rate ofLaboratory Rat Using a 60-GHz Radar

TH1D-1: Compact Size Cellular / GSM Band Pass Filter with High Resistivity Thin Film Silicon Integrated Passive Device (IPD) Technology

TH1F-1: Advances in Electromagnetics-based Design Optimization

TH1G-1: High Bandwidth of 8GHz Active Quasi-Circulator with Integrated Digital Leakage Canceler in SiGe BICMOS Technology for Automotive Radar Systems

08:20-08:3008:30-08:40

TH1A-2: Noncontact Vital-Sign Radar SensorUsing Metamaterial-Based Scanning Leaky-Wave Antenna

TH1C-2: High Gain 220GHz Power Ampli�er MMICs with Minimal Footprint

TH1D-2: An Ultra-Compact Integrated Millimeter-Wave Coupled-Line Resonator and a Bandpass Filter in Silicon-Germanium Technology

TH1G-2: Interference-Tolerant Multi-User Radar System Using One-Coincidence Frequency Hopping Code with 1GHz Bandwidth at 24GHz

08:40-08:5008:50-09:00

TH1A-3: A Portable 24-GHz Auditory Radar for Non-contact Speech Sensing with Background Noise Rejection and Directional Discrimination

TH1C-3: 71-95 GHz (23-40% PAE) and 96-120 GHz (19-22% PAE) High E�ciency 100-130 mW Power Ampli�ers in InP HBT

TH1D-3:A Compact Millimeter-Wave Dual-Mode Ring Filter using Loaded Capacitances in CMOS 0.25µm technology

TH1G-3: A Frequency Synchronization Scheme for Time Varying Doppler-shiftCompensation using the Direct Return Signal

Yu-Hsiu Wu,University of California, Yen-Cheng Kuan, University of California, Mau-Chung Frank Chang,University of California

TH1G-4: Concatenated-Code Based Phase-Coded CW MIMO Radar

09:00-09:1009:10-09:20

TH1A-4: Barcode Based Hand Gesture Classi�cation using AC Coupled Quadrature Doppler Radar

TH1C-4: A W-Band Wireless CommunicationTransmitter Utilizing a Stacked-FET Oscillator for High Output Power Performance

TH1D-4: Compact Multi-layered Wideband Bandpass Filter with Multiple Transmission Zeros

Thursday Technical Sessions 08:00-09:40 Thursday Technical Sessions 08:00-09:40

TH1C-1: 7kW GaN W-Band Transmitter

Co-Chair: Allen Katz The College of New Jersey

TH1B-2: A 1.1GHz Bandwidth, 46%-62% E�ciency Continuous Mode Doherty Power Ampli�er

TH1B-4: A Multi-Stage Concurrent Dual-Band DPD Architecture for Closely Spaced Carriers using a Low Bandwidth Feedback Loop

TH1B-1: A 100 W Multi-Band Four-Way Integrated Doherty Ampli�er

John Bandler,McMaster University,Slawomir Koziel,Reykjavik University

Matthias Porranzl,University of Linz,Christoph Wagner,DICE GmbH & Co. KG,Herbert Jaeger,DICE GmbH & Co. KG,Andreas Stelzer,Johannes Kepler University of Linz

Keisuke Nakamura,Mitsubishi Electric Corporation,Kenichi Tajima,Mitsubishi Electric Corporation,Morishige Hieda,Mitsubishi Electric Corporation

Heinz Haderer,Johannes Kepler University of Linz,Reinhard Feger,Johannes Kepler University of Linz,Andreas Stelzer,Johannes Kepler University of Linz

Johannes Russer,Technische Universität München,Andreas Cangellaris,University of Illinois at Urbana-Champaign,Peter Russer,Technische Universität München

TH1A: Biomedical Radar Technologies

TH1B: E�ciency, Linearity Enhancement Techniques

TH1C: Advances in III-V THz/Mm-wave Transmitters &

Components

TH1D: Compact multilayer and integrated planar �lters

TH1F: Field Modeling and Applications - Retrospective and Outlook: in celebration of Prof.

Wolfgang J. R. Hoefer's 75th birthday

TH1G: Advances in Wideband Radar Systems

Room: 307

Co-Chair: Li Yang, Texas Instruments, Inc.

TH1E-2: Miniaturized Stub-Loaded Resonator Bandpass Filter Fabricated Using Multilayer Inkjet Printing Technology

TH1E5: A 24 GHz CMOS Oscillator Transmitter with an Inkjet Printed On-chip Antenna

TH1E: 3D Printed Microwave Components and Systems

Eduardo Rojas-Nastrucci,University of South Florida,Justin Nussbaum,University of South Florida,Tom Weller,University of South Florida,Nathan Crane,University of South Florida

Farhan Abdul Gha�ar,King Abdullah University of Science and Technology,Shuai Yang,King Abdullah University of Science and Technology,Hammad M Cheema,National University of Science and Technology,Atif Shamim,King Abdullah University of Science and Technology

Hsuan-ling Kao,Chang Gung University,Cheng-Lin Cho,National Tsing Hua University,Li-Chun Chang,Ming Chi University of Technology,Yung-Hsien Wu,National Tsing Hua University,Hsien-Chin Chiu,Chang Gung University

Mahdi Haghzadeh,University of Massachusetts, Lowell, Craig Armiento, University of Massachusetts, Lowell, Alkim Akyurtlu, University of Massachusetts, Lowell

Tien-Yu Huang,University of Florida,Linda Hayward,University of Florida,Jenshan Lin,University of Florida

Xavier Moronval,NXP Semiconductors,John Gajadharsing,Ampleon

Kenneth Brown,Raytheon Company,Andrew Brown,Raytheon Company,Travis Feenstra,Raytheon Company,Darin Gritters,Raytheon Company,Shane O'Connor,Raytheon Company,Mike Sotelo,Raytheon Company,Nicholas Kolias,Raytheon Company,K. C. Hwang,Raytheon Company,Je� Kotce,Raytheon Company,Ed Robinson,US Army ARDEC

Ki Shin,ON Semiconductor,Kim Eilert,ON Semiconductor,Neal Mellen,ON Semiconductor

Xi Zhu,Macquarie University,YANG YANG,Macquarie University, Sudipta Chakraborty,Macquarie University, Oya Sevimli, Macquarie University,Karu Esselle,Macqua-rie University, Michael Heimlich,Macquarie University, Quan Xue,City University of Hong Kong

Pedro Rynkiewicz,University de Toulouse, Fabio COCCETTI, Centre National de la Recherche Scienti�que , Matthias Wietstruck, IHP Microelectronics, Mehmet Kaynak, IHP Microelectronics, Anne-Laure Franc, University de Toulouse, Gaëtan Prigent, LAPLACE-ENSEEIHT

Zach Gri�th,Teledyne Scienti�c and Imaging,Miguel Urteaga,Teledyne Scienti�c and Imaging,Petra Rowell,Teledyne Scienti�c and Imaging,Richard Pierson,AMTI

Jerome Cheron,National Institute of Standards and Technology,Erich Grossman,Nist

Fabian Thome,Fraunhofer IAF,Oliver Ambacher,-Fraunhofer IAF

TH1C-5: E�cient Linear Transmission of Complex Waveforms at 216 GHz Using Nonlinear Multiplier ChainsAli Darwish,Army Research Lab.,Joe Qiu,Army Research O�ce,Edward Viveiros,Army Research Laboratory,Alfred Hung,Army Research Laboratory

Andrew Kwan,University of Calgary,Mayada Younes, University of Calgary, Oualid Hammi, University of Calgary, Abubakr Abdelha�z, University of Calgary, Fadhel Ghannouchi, University of Calgary

Haedong Jang,In�neon Technologies Americas,Richard Wilson,In�neon Technologies Americas,Timothy Canning,In�neon Technologies Americas,David Seebacher,In�neon Technologies AG,Christian Schuberth,In�neon Technologies AG,Bayaner Arigong,In�neon Technologies Americas

Xiaofan Chen,Tsinghua University, Wenhua Chen,Tsinghua University, Uni, Fadhel Ghannouchi,iRadio Lab, Department of Electrical and Computer Engineering, Schulich School of Engineering, Uni, Zhenghe Feng,Tsinghua University

DeCheng Gan,University of Electronic Science & Technology of China,Songbai He,University of Electronic Science and Technology of China ,Tian Qi,University of Electronic Science & Technology of China

Chao-Hsiung Tseng,National Taiwan University of Science and Technology,Chia-Hung Chao,National Taiwan University Science and Technology

Heng Zhao,Nanjing University of Science and Technology,Zhengyu Peng,Texas Tech University,Hong Hong,Nanjing University of Science and Technology,Xiaohua Zhu,Nanjing University of Science and Technology,Changzhi Li,Texas Tech University

Xiaomeng Gao,University of Hawaii,Jia Xu,University of Hawaii,Ashikur Rahman,University of Hawaii,Ehsan Yavari,University of Hawaii,Alexander Lee,University of Hawaii,Olga Boric-Lubecke, University of Hawaii

TH1G-5: Compact Bistatic FMCW Radar MMIC with a Mixer-based Synthesizer Concept at 160 GHz

09:20-09:3009:30-09:40

08:00--08:2008:20-08:30

08:30-08:4008:40-08:50

08:50-09:0009:00-09:10

09:10-09:2009:20-09:30

09:30-09:40

TH1A-5: A Di�erential MiniatureTransponder for 9.4/18.8 GHz Harmonic Bee Searching Radar with Low Gain Degradation from Bee’s Body

TH1C-6: A 330 GHz Active Frequency Quadrupler in InP DHBT Transferred-Substrate Technology

TH1D-5: A Design of the Compact Microstrip Bandpass Filter With a Wide Passband and Broad Stopband

TH1F-8: Tracking Impulsive Sources in Space-Time by TLM Time Reversal

Martin Hitzler,University of Ulm,Stefan Saulig, University of Ulm,Linus Boehm,University of Ulm, Winfried Mayer, Endress+Hauser GmbH+Co. KG, Wolfgang Winkler,Silicon Radar GmbH,Christian Waldschmidt, University of Ulm

TH1G-6: Compact 340 GHz homodyne transceiver modules for FMWC imaging radar arrays.Robin Dahlbäck,Chalmers University of Technology, Göran Granström,Gotmic AB,Mattias Frendahl,Gotmic AB,Tomas Bryllert,Chalmers University of Technology

Wolfgang Hoefer,University of Victoria

Bijan Tehrani,Georgia Institute of Technology,Benjamin Cook,Texas Instruments, Inc.,Manos Tentzeris,Georgia Institute of Technology

Maruf Hossain,Ferdinand-Braun-Institut (FBH),Ksenia Nosaeva,Ferdinand-Braun-Institut, Leibniz-Institut fuer Ho,Nils Weimann,Alcatel-Lucent,Viktor Krozer, Ferdinand-Braun-Institut (FBH),Wolfgang Heinrich, Ferdinand-Braun-Institut

TH1C-7: H-band Down-conversion and Up-conversion Mixers with Wide IF Bandwidth Iljin lee,Korea University,Sooyeon Kim,Korea University,Sanggeun Jeon,Korea University

Toshifumi Nakatani, Jonmei Yan, Paul Theilmann, Hamed Gheidi, Donald Kimball, University of California at San Diego

Po-Lin Huang,National Chung Cheng University,Tung-Yi Hsieh,National Chung Cheng University

TH1D-6: Size Reduction and Spurious Suppressionin Microstrip Coupled Line Bandpass Filters by means of Capacitive Electromagnetic BandgapJordi Selga,Univ. Autònoma de Barcelona,Paris Vélez, Univ. Autònoma de Barcelona,Marco Orellana,Univ. Autònoma de Barcelona,Marc Sans,Univ. Autònoma de Barcelona,Ana Rodriguez,Univ. Politècnica de València,Vicente Boria,Univ. Politècnica de València,Ferran Martín,Univ. Autònoma de Barcelona

Yu-ting Liu,National Chung Cheng University,-Mioa-lin Hsu,National Chung Cheng University,Huei Wang,National Taiwan University ,Zuo-min Tsai,National Chung Cheng University

Chair: H. Alfred Hung, Army Research LabChair: H. John Kuno, Quinstar

Chair: Christopher Galbraith Massachusetts Institute of Technology,

Lincoln Laboratory Chair: Jens Bornemann, Univ. of Victoria

Chair: Rudy Emrick, Orbital ATKChair: Telesphor Kamgaing, Intel Corp.Chair: Joseph Staudinger,NXP Semiconductors Co-Chair: Chris Rodenbeck,

Naval Research Laboratory

TH1E1: Fully Printed Varactors and PhaseShifters Based on a BST/Polymer Ink for Tunable Microwave Applications

TH1E-4: Meshed Rectangular Waveguide for High Power, Low Loss and Reduce Weight Applications

TH1E-3: Inkjet-Printed Substrate Integrated Waveguide (SIW) with Drill-less Vias on Paper SubstratesSyed Abdullah Nauroze,Georgia Institute of Technology,Jimmy Hester,Georgia Institute of Technology,Wenjing Su,Georgia Institute of Technology,Manos Tentzeris,Georgia Institute of Technology

TH1E6: Inkjet-Printed 3D Interconnects for Millimeter-Wave System-on-Package Solutions

George Eleftheriades,University of Toronto

Ingo Wol�,IMST GmbH

TH1F-7: Multi-Domain Modeling of 3D Printed, Nanotechnology and Morphing/Origami-based RF Modules

Wei Fan,Department of Electrical and Computer Engineering, Dalhousie University,Zhizhang Chen,School of Electronic Engineering, The University of Electronic Science and Technology of China

Manos Tentzeris,Georgia Institute of Technology,Aristeides Papadopoulos,Georgia Institute of Technology

TH1F-2: Substrate Integrated Waveguide Mode Coupler for Tracking ApplicationsUwe Rosenberg, Mician Global Engineering GbR,Jens Bornemann,University of Victoria,Jan Schorer,University of Victoria

TH1F-3: Correlation Transmission Line Matrix(CTLM) Modeling of Stochastic Electromagnetic Fields

TH1F-4: Transmission-line Metamaterials and their Relation to the Transmission-Line Matrix Method

TH1F-5:Recent Improvements of Finite Di�erence Time Domain Simulation Techniques

TH1F-6: A Condition for Multiple Source Reconstructions with the Time-Reversal Methods

TH1B-3: Self-Outphasing Chireix PowerAmpli�er Using Device Input Impedance Variation

TH1B-5: An Envelope Linearization Algorithm for An Open-Loop Multi-Switcher Envelope Tracking Power Ampli�er


THIF1-2: A Fully Monolithically Integrated4.6 GHz DC-DC Converter

THIF1-1: SDR Based RFID Reader for Pas-sive Tag Localization Using Phase Di�er-ence of Arrival Techniques

THIF1-3: A Hybrid-Coded Architecture forGlitch-Free Performance

THIF1-1: Open-Ended Waveguide Measure-ment of Liquids at Millimeter Wavelengths

THIF1-2: Characterization of Three-dimen-sional Near-�eld Microwave Imaging Alg-orithms for Stationary and Moving Objects

THIF1-2: Passive RFID-enabled ProximitySensor

THIF1-2: Comprehensive One-Dimensio-nal Mathematical Model of Microwave Sintering

THIF1-3: A Preliminary Evaluation of Act-ive Millimeter-Wave Radiometry at W-Band for Enhancement of Material Contrasts

THIF1-3: Spectral Signature Barcodes Impl-emented by Multi-State Multi-ResonatorCircuits for Chipless RFID Tags

THIF1-1: Nondestructive Re�ection Imag-ing in the W-band Using Photonics-Based Incoherent Signal Source

THIF1-2: Integrating Baseband-over-Fiber and Six-Port Direct Modulation forHigh-Speed High-Frequency Wireless Communications

THIF1-1: In-Package Harmonic Termina-tion Design for Improving Active Device E�ciency

THIF1-4: An Optically Transparent AnalogFrontend for a Solar Powered 24 GHz RFIDTransponder

THIF1-2: MMIC-to-Waveguide Transitionat 160 GHz with Galvanic Isolation

THIF1-1: Study of SOI CMOS Tunable Capa-citor Architectures and Application to Ant-enna Aperture Tuning

THIF1-1: High Resolution RFID LiquidSensing Using a Passive Tag

THIF1-5: Active Imaging with IncoherentSub-Terahertz Radiation from a Photomi-xer array in a severe smoke

THIF1-6: Frequency Chirp Modulation by El-ectro-Optic Modulator Integrated with Mic-rowave Rat-Race Circuit and Measurement of Chirp Parameter by Using Optical Fiber Dispersion

THIF1-7: Frequency Tunable Two-Tone Signal Generation Based on Polarization Multiplexed Optoelectronic Oscillator

THIF1-8: Electrically Controlled TerahertzSpatial Light Modulators with GrapheneArrays

THIF1-4: Integrated Implementation ofUltra Stable VCO using Optical Self-ILPLLTechniques Shawn Bawell, Integrated Device Technology, Inc.

Tomoyuki Yamase, NEC Corporation, Shinichi Hori, NEC Corporation, Masaaki Tanio, NEC Corporation, Tomoya Kaneko, NEC Corporation, Noriaki Tawa, NEC Corporation, Keiichi Motoi, NEC Corporation, Kazuaki Kunihiro, NEC Corporation

INTERACTIVE FORUMThursday | Time: 09:00-11:00 | Room: 301 & 302

THIF1-1: An E�cient Power Recycling Me-thod for Multi-Port Receivers

THIF1-3: Modeling and Digital Predistor-tion Based on Zernike Polynomial Funct-ions for LTE-RoF System

THIF1-9: Terahertz Polarization ModulatorBased on Metasurface

THIF2-3: Cryogenic Microwave Characteri-zation of Kapton Polyimide Using Super-conducting Resonators

THIF1-2: A Digital Radio-over-Fiber Down-link System based on Envelope Delta-sigma Modulation for Multi-band/mode Operation


Rashid Mirzavand Boroujeni, University of Alberta, Mohammad Mahdi Honari, University of Alberta, Pedram Mousavi, University of Alberta

Carlos Mateo, University de Zaragoza, Pedro L. Carro, University de Zaragoza, Paloma Garcia-Ducar, University de Zaragoza, Jesus de Mingo, University de Zaragoza, Jose-Ramon Perez-Cisneros, University de Zaragoza

Yan Zhang, Capital Normal University, Tahsin Akalin, Lille University France Rujun Bai, Auburn University, George Hernandez,

Auburn University, Yang Cao, Auburn University, Drew Sellers, Auburn University, Charles Ellis, Auburn University, David Tuckerman,Tuckerman and Associates, Michael Hamilton, Auburn University

Lukas Görtschacher, Graz University of Technology, Jasmin Grosinger, Graz University of Technology, Hasan Khan, Graz University of Technology, Dominik Amschl, Graz University of Technology, Wolfgang Bösch, Graz University of Technology

Gianfranco Andia Vera, Grenoble Institute of Technology, Abanob Abdelnour, Grenoble Institute of Technology, Apostolos Georgiadis, Centre Tecnologic de Telecomunicacions de Cataluny, Mira Sarkis, Télécom ParisTech, Darine Kaddour, Grenoble Institute of Technology, Smail Tedjini, Grenoble Institute of Technology

Cristian Herrojo Prieto, University Autònoma de Barcelona, Jordi Naqui, University Autònoma de Barcelona, Ferran Paredes Marco, University Autònoma de Barcelona, Ferran Martín, University Autònoma de Barcelona

Quang Huy Dao, Leibniz University of Hannover, Bernard Lüers, Leibniz University of Hannover, Tri Tan Ngo, Leibniz University of Hannover, Bernd Geck, Leibniz University of Hannover

Dominique Nicolas, CEA-LETI Minatec, Alexandre Giry, CEA-LETI Minatec, Essia Ben Abdallah, CEA-LETI Minatec, Serge Bories, CEA-LETI Minatec, Thierry Parra, LAAS-CNRS, Pierre Vincent, CEA-LETI Minatec

Mohammad Hossein Zari�, University of Alberta, Mojgan Daneshmand, University of Alberta

Simon Scott, University of California, Berkeley,John Wawrzynek, University of California, Berkeley

Adrian Tang, Jet Propulsion Laboratory

Sushians Rahimizadeh, University of Colorado, Jerome Cheron, University of Colorado, Qianli Mu, In�neon Technologies Americas, Zoya Popovic, University of Colorado

Martin Hitzler, University of Ulm, Stefan Saulig, University of Ulm, Linus Boehm, University of Ulm, Winfried Mayer, Endress+Hauser GmbH+Co. KG, Christian Waldschmidt, University of Ulm

JTianchi Sun, Drexel University, Li Zhang, Synergy Microwave Corp, Kevin Receveur, Drexel University, Ajay Poddar, Synergy Microwave, Ulrich Rohde, Synergy Microwave Corp, Afshin Daryoush, Drexel University

Naofumi Shimizu, Nippon Telegraph and Telephone Corp., Ken Matsuyama, Tokyo University of Science, Seiji Okinaga, Tokyo University of Science

Tadashi Kawai, University of Hyogo, Ryota Nakamura, University of Hyogo, Naokatsu Yamamoto, National Institute of Information and Communications Technology, Tetsuya Kawanishi, Waseda University

Bindong Gao, Nanjing University of Aeronautics and Astronautics, Fangzheng Zhang, Nanjing University of Aeronautics and Astronautics, Shilong Pan, Nanjing University of Aeronautics and Astronautics, Pei Zhou, Nanjing University of Aeronautics and Astronautics

Nurbek Kakenov, Bilkent University, Taylan Takan, Middle East Technical University, Vedat Ali Ozkan, Middle East Technical University, Osman Balci, Bilkent University, Hakan Altan, Middle East Technical University, Coskun Kocabas, Bilkent University

Ignacio Ramos, University of Colorado, Zoya Popovic, University of Colorado

Tomasz Karpisz, Warsaw University of Technology, Pawel Kopyt, Warsaw University of Technology, Bartlomiej Salski,Warsaw University of Technology, Jerzy Krupka, Warsaw University of Technology

Erin Kiley, Worcester Polytechnic Institute, Vadim Yakovlev, Worcester Polytechnic Institute

Atsushi Kanno, National Institute of Information and Communications Technology, Norihiko Sekine, National Institute of Information and Communica-tions Technology, Akifumi Kasamatsu, National Institute of Information and Communications Technology, Naokatsu Yamamoto, National Institute of Information and Communications Technology, Mitsuru Yoshida, NEC Network and Sensor Systems, Ltd., Norio Masuda, NEC Network and Sensor Systems, Ltd.

Xiaoxiong Song, Beijing University of Posts and Telecommunications, Jianqiang Li, Beijing University of Posts and Telecommunications,Yuting Fan, Beijing University of Posts and Telecommunications, Yi Lei, Beijing University of Posts and Telecommunications, Feifei Yin, Beijing University of Posts and Telecommunications, Yitang Dai, Beijing University of Posts and Telecommunications, Kun Xu, Beijing University of Posts and Telecommunications

THIF1-3: The Impact of Layout DependentE�ects on Mobility and Flicker Noise in Nanoscale Multi�nger nMOSFETs for RF and Analog Design

THIF1-4: Ka band 0.5W TR chip with a novel high power handling switch

THIF1-5: A 30 GSample/s InP/CMOS Sample-Hold Ampli�er with Active Droop Correction

THIF1-1: A Compact Switched Beam-Form-ing Network using Silicon IPD Technologyfor Low-Cost 5G Communication

THIF1-1: A Multi-mode 30 GHz 2 DegreeRMS Power E�cient Phase-Locked Loop Frequency Synthesizer

THIF1-2: Active SPDT Switches for D-BandApplicationsDaniel Mueller, Karlsruhe Institute of Technology, Ulrich Lewark, Karlsruhe Institute of Technology, Axel Tessmann, Fraunhofer IAF, Arnulf Leuther, raunhofer IAF, Thomas Zwick, Karlsruhe Institute of Technology, Ingmar Kallfass, University of Stuttgart

Jyh-Chyurn Guo, National Chiao Tung University, Yi-Zen Lo, National Chiao Tung University, Jun-Rong Ou, National Chiao Tung University

Ye Yuan, University of Electronic Science and Technology of China, Yong Fan, University of Electronic Science and Technology of China

Seong-Kyun Kim, University of California, Santa Barbara, Saeid Daneshgar, Intel Corporation, Myung-Jun Choe, Teledyne Scienti�c and Imaging, Miguel Urteaga, Teledyne Scienti�c and Imaging, Andrew Carter, Teledyne Scienti�c and Imaging, Mark Rodwell, University of California, Santa Barbara

Won-Cheol Lee, Korea Electronics Technology Institute

Nagarajan Mahalingam, Nanyang Technological University, Yisheng Wang, Nanyang Technological University, Bharatha Kumar Thangarasu, Singapore University of Technology and Design, Kaixue Ma, University of Electronic Science and Technology of China, Kiat Seng Yeo, Singapore University of Technology and Design


Room: 303 Room: 304 Room: 305 Room: 306 Room: 309Room: 308

Co-Chair: Peter Burke, Univ. of California

Co-Chair: Ed Niehenke, Niehenke Consulting Co-Chair: Ming Yu, COM DEV InternationalCo-Chair: Andrea Ferrero, Keysight

Technologies

10:10--10:2010:20--10:30

TH2A-1: Broadband Near-Field Microwave Microscopy Investigation of Fullerene Exposure on Breast Cancer Cells

TH2D-1: Design of a Low Loss Substrate Mounted Waveguide (SMW) Filter Employing Individual Resonators TH2G-1: Design of Dispersion-free Phase-

Shifting Non-reciprocity in Composite Right/Left Handed Metamaterials

10:30-10:50

TH2C-2: Sub-picosecond Wireless Synchronization Based on a Millimeter-Wave Impulse Receiver with an On-chip Antenna in 0.13µm SiGe BiCMOS

TH2G-2: Blazed Metasurface Grating: The Planar Equivalent of a Sawtooth Grating

10:50-11:0011:00-11:10

TH2A-3: Near-Field Microwave Microscopy of One-Dimensional Nanostructures

TH2C-3: An F-Band Dual Band 12+12Gbps Packaged CMOS Bi-Directional Transceiver

TH2D-3: Direct Optimal Synthesis of Microwave Dual Band Filters with Parallel-Connected Topology

TH2G-3: Arti�cial Gradient-Index Lens for Ka-Band using a Single Layer Fishnet Metamaterial

Xiaoqiang Li,University of California, Mohammad Memarian,University of California, Kirti Dhwaj,University of California,Tatsuo Itoh,University of California

TH2G-4: A Quantitative Statistical Analysis of In-Situ IC and Electronics in Complex and Wave-Chaotic Enclosures

11:10-11:2011:20-11:30

TH2A-4: Sensitivity and Accuracy Analysis in Scanning Microwave Microscopy

TH2C-4: CMOS 300-GHz 64-QAM Transmitter

TH2D-4: Advanced Synthesis Technique for Extracted Pole and NRN Filters


Co-Chair: Gayle Collins, Intel Corp.

TH2B-3: A 100 W GaN HEMT SPA-D with 57% Fractional Bandwidth for DVB-T Applications

TH2B-4: A 40 dBm AlGaN/GaN HEMT Power Ampli�er MMIC for SatCom Applications at K-Band

TH2B-1: 37 W, 75-100 GHz GaN Power Ampli�er

Corrado Florian,University di Bologna,Daniel Niessen, University di Bologna,Tommaso Cappello, University di Bologna, Alberto Santarelli, University di Bologna,Fabio Filicori,University di Bologna, Zoya Popovic, University of Colorado

Tetsuya Ueda,Kyoto Institute of Technology, Keisuke Ninomiya,Kyoto Institute of Technology, Kazuhiro Yoshida,Kyoto Institute of Technology, Tatsuo Itoh,University of California

Matthias Maasch,Technische Universität Darmstadt, Prithvi Bhat, Technische Universität Darmstadt, Matthias Nickel, Technische Universität Darmstadt, Rolf Jakoby, Technische Universität Darmstadt, Christian Damm, Technische Universität Darmstadt

Shen Lin, University of New Mexico, Zhen Peng, University of New Mexico, Thomas Antonsen, University of Maryland

TH2A: Microwaves and Millimeter Waves in Scanning

Probe Microscopy (Focus Session)

TH2B: Millimeter Wave and Satcom/Terrestial Power

Ampli�ers

TH2D: Non-Planar Microwave Filters and Multiplexers 2

TH2F: Novel Nonlinear Measurement Techniques

TH2G: Recent developments and applications in waveguiding and

radiating structures

Room: 307

Co-Chair: Manos Tentzeris, Georgia Institute of Technology

TH2E-2: E-Band RF-to-DC Converter Using Schottky Diode in 0.18-um CMOS Technology

TH2E: Low-power CMOS components for wireless power

reception

Alice Jou, Purdue University, Reza Azadegan, University of Michigan, Hossein Pajouhi, Purdue University, Saeed Mohammadi, Purdue University

Rupam Das,University of Ulsan,Hyoungsuk Yoo,Univ. of Minnesota

Wei Ling Chang, National Chiao Tung University,Chinchun Meng, National Chiao Tung University, Tzu Chien Fu, National Chiao Tung University, Guo-Wei Huang,National Nano Device Laboratories

Soroush Dehghani,University of British Columbia,Thomas Johnson,University of British Columbia

Marco Farina,Univ. Politecnica delle Marche,Francesco Piacenza, National Institute of Health and Science on Aging (INRCA), Francesca De Angelis,Univ. Politecnica delle Marche,Davide Mencarelli, Univ. Politecnica delle Marche,Antonio Morini,Univ. Politecnica delle Marche,Giuseppe Venanzoni,Univ. Politecnica delle Marche,Tiziana Pietrangelo,Univ. "G. D'Annunzio" di Chieti e Pescara,Marco Malavolta,National Inst. of Health and Science on Aging (INRCA),Andrea Basso,National Inst. of Health and Science on Aging (INRCA),Mauro Provinciali,National Inst. of Health and Science on Aging (INRCA),Andrea Di Donato,Univ. Politecnica delle Marche,Xin Jin,Lehigh Univ.,James Hwang,Lehigh Univ.

James Schellenberg,QuinStar Technology, Inc., Edmar Camargo,Quinstar Technology, Inc.,Lani Bui,QuinStar Technology, Inc.,James Schellenberg,Quinstar Technology, Inc.,Edmar Camargo,Quinstar Technology, Inc.

Jan Schorer,University of Victoria,Jens Bornemann,University of Victoria,Uwe Rosenberg, Mician Global Engineering GbR

Fernando Teberio,Public Univ. of Navarre,Ivan Arregui,Public Univ. of Navarre,marco guglielmi,Univ. Politècnica de València,Adrian Gomez-Torrent,Public Univ. of Navarre,Pablo Soto,Tech Univ. of Valencia,Miguel Laso,Universidad Pública de Navarra (UPNA),Vicente Boria,Univ. Politècnica de València

Huan Meng,Chinese University of Hong Kong,Ke-Li Wu,Chinese University of Hong Kong

Nir Weissman,Tel Aviv University,Samuel Jameson,Tel Aviv University,Eran Socher,Tel Aviv University

Babak Jamali,Rice University,Aydin Babakhani,Rice University

Kosuke Katayama,Hiroshima University,Kyoya Takano,Hiroshima City University,Shuhei Amakawa,Hiroshima University,Shinsuke Hara,National Institute of Information and Communications Technology,Takeshi Yoshida,Hiroshima University,Minoru Fujishima,Hiroshima University

Yu Ye,University of California ,Bo Yu,University of California,Jane Gu,University of California

Christian Friesicke,Fraunhofer IAF,Philip Feuerschütz,Technical University of Hamburg, Ruediger Quay,Fraunhofer IAF,Oliver Ambacher,Fraunhofer IAF,Arne Jacob,Technical University of Hamburg

Xuan Anh Nghiem,RWTH Aachen University,Renato Negra,RWTH Aachen University

Yimin Yang, University of Waterloo, Ming Yu, Com Dev

Manuel Kasper,Keysight Technologies,Georg Gramse,Johannes Kepler University of Linz,Ferry Kienberger,Keysight Technologies

Samuel Berweger,National Inst. of Standards and Technology, Paul Blanchard,NIST,Rebecca Quardokus,NIST,Frank DelRio, NIST,Thomas Wallis,National Inst. of Standards and Technology, Pavel Kabos,NIST,Sergiy Krylyuk,NIST,Albert Davydov,NIST

Kamel Haddadi,Universite Lille,Charlene Brillard,Universite Lille,Gilles Dambrine,Institute of Electronics, Microelectronics and Nanotechnology,Didier Theron,Institute of Electronics, Microelectronics and Nanotechnology

TH2G-5: On the Use of Corrugations in Mode Filters for Oversized Rectangular Waveguides

11:30-11:4011:40-11:50

10:10--10:2010:20--10:30

10:30-10:5010:50-11:00

11:00-11:1011:10-11:20

11:20-11:3011:30-11:40

11:40-11:50

TH2A-5: Characterizing Non-Linear Microwave Behavior of Semiconductor Materials with Scanning Microwave Impedance Microscopy

TH2D-5: A New Class of Compact Dual-Mode Dielectric Resonator Filters

Silvio Ceccuzzi,Roma Tre University,Cristina Ponti,Roma Tre University,Gian Luca Ravera,Enea,Giuseppe Schettini,Roma Tre University

TH2G-6: Multipactor Threshold Sensitivity to Total Electron Emission Yield in Parallel-plate Waveguide and TEEY Models Accuracy.Nicolas FIL, Cea, Mohamed Belhaj, ONERA, Julien Hillairet, CEA, Jérôme Puech, CNES

Payman Rezaee,University of Kiel,Michael Höft,University of Kiel

Stuart Friedman,Prime Nano Inc.,Yongliang Yang,Prime Nano Inc.,Fred Stanke,Prime Nano Inc.

TH2A-6: Noninvasive Conductivity Imaging of 2D Materials and Devices by Microwave Impedance MicroscopyKeji Lai,University of Texas at Austin, Di Wu, University of Texas at Austin

Chair: Marco Farina, Univ. Politecnica delle Marche

Chair: H. John Kuno, Quinstar Chair: Simone Bastioli, RS Microwave Chair: Nuno Carvalho, Instituto De Telecomunicacoes Chair: Jan Machac, Czech Technical

Unv. in PragueChair: Alessandra Costanzo, Univ. di Bologna

Co-Chair: Tapan Sarkar, Syracuse Univ.

TH2E-1:Transconductance Mode CMOS Synchronous Recti�er Circuits

Yuxiang Sun, Rice University, Aydin Babakhani, Rice University

Chair: James Kodiak, BAE Systems, Inc.

TH2A-2: An Advanced Impedance Calibration Method for Nanoscale Microwave Imaging

TH2C: Silicon-based THz / MMW Broadband Systems

Peiyu Chen,Rice University,Yiqiu Wang,Rice University,Aydin Babakhani,Rice University

TH2C-1: A 4ps Amplitude Recon�gurable Impulse Radiator with THz-TDS Characterization Method in 0.13µm SiGe BiCMOS

TH2C-5: A 165GHz OOK Transmitter with 10.6% Peak DC-to-RF E�ciency in 65nm Bulk CMOS

TH2D-2: Compact Broadband Waveguide Diplexer for Satellite Applications

TH2E-3: A Wirelessly Powered Injection-Locked Oscillator with On-Chip Antennas in 180nm SOI CMOS

TH2E-4: A CMOS Integrated Rectenna for Implantable Applications

TH2E-5: High E�ciency Unidirectional Wireless Power Transfer by a Triple Band Deep-Tissue Implantable Antenna

TH2F-2: Generation and Measurement of a Millimeter-Wave Phase Dispersion Reference Signal based on a Comb Generator Jan Verspecht, Keysight Technologies

Marwen Ben Rejeb, University of Waterloo, Ahmed Raslan, University of Waterloo, Slim Boumaiza, University of Waterloo

Ali Al-Ziayree, Cardi� University UK, Steve Cripps, Cardi� Univeristy, Richard Perks, Cardi� University

TH2F-3: Phase Calibration for Coherent Multi-Harmonic Modulated Signal Measurements Using Nonlinear Vector Network Analyser

TH2F-4: A Novel Microwave Non-Contact Current Probe with High Spatial Resolution

TH2F-1: Pre-Pulsing Characterization of GaN PAs with Dynamic Supply

Andrei Meller,Universitat Politècnica de València,Alin Moldoveanu,Univ Politehnica Bucharest,Victor Asavei,Politehnical Univ. Bucharest,Esther Codesal,Universitat Politècnica de València,Jean Francois Favennec,Universite de Brest

TH2D-6: Lossy Coupling Matrix Filter Synthesis Based on Hyperbolic Re�ections


THIF2-2: High Power, Broadband Class-JPA with Internally Pre-matched FET

THIF2-3: Stando� Tracking of MedicalInterventional Devices using Non-ContactMicrowave Thermoacoustic Detection

THIF2-3: Broadband RF Energy HarvestingSystem covering CDMA, GSM900, GSM1800, 3G Bands with Inherent Impedance Matching

THIF2-3: A 6-18 GHz Integrated HPA-DPDT GaN MMIC

THIF2-6: A Broadband Three-device Doh-erty Power Ampli�er based on a Modi�-ed Load Modulation Network

THIF2-4: Subcutaneous Fat ThicknessMeasurement Using Rectangular Wave-guide by Approximation of Waveguide

THIF2-4: Design of Broadband High-E�ci-ency Power Ampli�ers Based on the Hybr-id Continuous Inverse Mode

THIF2-1: Dual-band Linear Filter AssistedEnvelope Memory Polynomial for Linea-rizing Multi-band Power Ampli�ers

THIF2-5: A 5.8 GHz Phase- and Self-Inject-ion-Locked CMOS Radar Sensor Chip for Vital Sign Detector Miniaturization

THIF2-5: A 200 mW InP DHBT W-band PowerAmpli�er in Transferred-Substrate Technolo-gy with Integrated Diamond Heat Spreader

THIF2-1: Broad-Band Poly-Harmonic Wi-ener Modeling of Mixers Based on Large-Signal Vector Measurements

THIF2-2: A 500-W High E�ciency LDMOSClassical Three-way Doherty Ampli�er forBase-Station Applications

THIF2-1: Sub-terahertz Integrated Rece-ivers and Spectrometers

THIF2-1: FMCW Radar Fall Detection basedon ISAR Processing Utilizing the Propertiesof RCS, Range, and Doppler

THIF2-2: Wireless Data Transmission of 30Gbps at a 500-GHz Range Using Resonant-Tunneling-Diode Terahertz Oscillator

THIF2-5: Drive-Characteristic Design for Dual-Input Doherty Power Ampli�ers

THIF2-3: A Compact, Tethered E-Band VNARe�ectometer

THIF2-1: Enhanced Instantaneous Band-width LDMOS RF Power Transistor UsingIntegrated Passive Devices

THIF2-2: A 20 GHz Power Amplifer withIM3 Distortion Cancellation by Load-Split Derivative Superposition

THIF2-3: Optimal Fundamental Load Modulation for Harmonically Tuned Switch Mode Power Ampli�er

THIF2-2: Terahertz Quanti�cation of Etha-nol and Sugar Concentrations in Water andits Application for Noninvasive Real-time Monitoring of Fermentation Mahima Arrawatia, Indian Institute of Technology,

Maryam Baghini, Indian Institute of Technology, Girish Kumar, Indian Institute of Technology

Zhongtao Liu, National University of Singapore, Zheng Zhong, National University of Singapore, Yongxin Guo, National University of Singapore


THIF2-1: Digital Microwave Power Ampli-�er with Energy Recovery

THIF2-1: Cryogenic Temperature, 2-Port, on-Wafer Characterization at WR-5.1 Frequencies

THIF2-4: Stability Analysis of Multi-FingerGaN FET Cells for High Power MMIC Design

THIF2-2: 2-D Wireless Positioning on Mini-mally Invasive Surgical Instruments

THIF2-2: Intermodulation HarvestingRecti�er Design for High E�ciency Multi-sine Wireless Power Transfer


Wolfgang Heinrich, Ferdinand-Braun-Institut, Andreas Wentzel, Ferdinand-Braun-Institut

David Daughton, Lake Shore Cryotonics, Matthew Bauwens, University of Virginia, Jeremy Bluestein, Lake Shore Cryotronics, Emile de Rijk, Swissto12 SA, Mirko Favre, Swissto12 SA, Arthur Lichtenberger, DMPI, Inc., N. Scott Barker, DMPI, Inc., Robert Weikle, University of Virginia, Je�rey Hesler, Virginia Diodes, Inc., Cli� Rowland, Virginia Diodes, Inc., Eric Bryerton, Virginia Diodes, Inc., Doug McLean, Lake Shore Cryotronics, Scott Yano, Lake Shore Cryotronics

Valiallah Zomorrodian, QORVO, Inc., Michael Roberg, QORVO, Inc., Tuong Nguyen, QORVO, Inc., Warren Gaiewski, QORVO, Inc.

Yen-Chih Chang, National Chung Cheng University, Peng Yu Chen, National Chung Cheng University, Cheng Ting Hsieh,National Chung Cheng University, Chia-Chan Chang, National Chung Cheng University, Sheng-Fuh Chang, National Chung Cheng University

George Alexopoulos, Stanford University, Kevin Boyle, Stanford University, Nemat Dolatsha, Stanford University, Hao Nan, Stanford University, Butrus Khuri-Yakub, Stanford University, Amin Arbabian, Stanford University

Byeongdeok Park, University of Seoul, Rae-Seoung Park, University of Seoul, Sangbok Park, University of Seoul

Ping-Hsun Wu, Industrial Technology Research Institute, Feng-Hsu Chung, Industrial Technology Research Institute, Powen Hsu, National Taiwan University

Valery Koshelets, Kotel'nikov Institute of Radio Engineering and Ele

Naoto Oshima, Tokyo Institute of Technology, Kazuhide Hashimoto, Tokyo Institute of Technology, Daisuke Horikawa, Tokyo Institute of Technology, Safumi Suzuki, Tokyo Institute of Technology, Masahiro Asada, Tokyo Institute of Technology

Peter Singerl, In�neon Technologies AG, Thomas Magesacher, Lund University

Shichang Chen, Hangzhou Dianzi University, Pengfei Qiao, Hangzhou Dianzi University, Gaofeng Wang, Hangzhou Dianzi University, Quan Xue, City University of Hong Kong, Zhiqun Cheng, Hangzhou Dianzi University

Jingjing Xia, University of Waterloo, Hai Huang, University of Waterloo, Paul Chen, University of Waterloo, Slim Boumaiza, University of Waterloo

Jingchu He, NXP Semiconductors, Yong Zhang, NXP Semiconductors, Binghui Zhang, NXP Semiconductors, Yinan Wang, NXP Semiconductors, John Gajadharsing, Ampleon, Tao Zhang, Ampleon

Zhengyu Peng, Texas Tech University, Jose-Maria Munoz-Ferreras, University of Alcala, Roberto Gomez-Garcia, University of Alcala, Changzhi Li, Texas Tech University

Olutosin Fawole, University of Utah, Massood Tabib-Azar, University of Utah

Karam Noujeim,Tom Roberts, Anritsu Company

Richard Wilson, In�neon Technologies Americas, Bayaner Arigong, In�neon Technologies Americas, Haedong Jang, In�neon Technologies Americas

Hung-Yu Lin, National Taiwan University, Kun-Yao Kao, National Taiwan University, Kun-You Lin, National Taiwan University

Xiang Li, University of Calgary, Mohamed Helaoui, University of Calgary, Fadhel Ghannouchi, University of Calgary

Eun-Jae Lim, Dept. of Information and Communication Engineering of Kyungnam Univ., Young-Chul Rhee, Dept. of Information and Communication Engineering of Kyungnam Univ., Chan-Sei Yoo, Korea Electrics Technology Institute

Diego Palombini, Elettronica S.p.A., Andrea Bentini, Elettronica S.p.A., Daniele Rampazzo, Elettronica S.p.A.

Qirong Li, University of Electronic Science and Technology of China, Songbai He, University of Electronic Science and Technology of China, Zhijiang Dai, University of Electronic Science and Technology of China

Thual�qar Al-Sawaf, Ferdinand-Braun-Institut, Leibniz-Institut fuer Ho, Ksenia Nosaeva, Ferdinand-Braun-Institut, Leibniz-Institut fuer Ho, Nils Weimann, Ferdinand-Braun-Institut, Viktor Krozer, Ferdinand-Braun-Institut (FBH), Wolfgang

Alessandro Cidronali, University of Florence

THIF2-4: Miniature Packaging Conceptfor LNAs in the 200-300 GHz Range

THIF2-5: Double-Beam CW THz Systemwith Photonic Phase Modulator for Sub-THz Glucose Hydration Sensing

THIF2-6: A planar Schottky diode based int-egrated THz detector for fast electron pulsediagnostics

THIF2-7:A Fully Packaged D-Band MIMOTransmitter Using High-Density Flip-ChipInterconnects on LCP Substrate

THIF2-1: C Band GaN Diode Recti�er with3W DC Output for High Power Microwave Power Transmission Applications

THIF2-3: Non-Contact Di�erential-ModeOn-Wafer Device Characterization in themmW and THz BandsCosan Caglayan, Ohio State University, Kubilay Sertel, Ohio State University

Lorene Samoska, Jet Propulsion Laboratory, Andy Fung, Jet Propulsion Laboratory, Mikko Varonen, Aalto University, Robert Lin, Jet Propulsion Laboratory, Alejandro Peralta, Jet Propulsion Laboratory, Mary Soria, Jet Propulsion Laboratory, Choonsup Lee, Jet Propulsion Laboratory, Sharmila Padmanabhan, Jet Propulsion Laboratory, Richard Lai, Northrop Grumman Space Technology,Stephen Sarkozy, Northrop Grumman Space Technology

Takuro Tajima, Nippon Telegraph and Telephone Corp., Masahito Nakamura, Nippon Telegraph and Telephone Corp., Keiichiro Shiraga, Kyoto University, Yuichi Ogawa, Kyoto University, Katsuhiro Ajito, NNippon Telegraph and Telephone Corp., Hiroshi Koizumi, Nippon Telegraph and Telephone Corp.

Mario Schiselski, Technische Universitaet Dresden, Niels Neumann, Technische Universitaet Dresden, Martin Laabs, Technische Universitaet Dresden, Sergey Kovalev, Helmholtz-Zentrum Dresden-Rossendorf, Michael Gensch, Helmholtz-Zentrum Dresden-Rossen-dorf, Bertram Green, Helmholtz-Zentrum Dresden-Rossendorf

Sensen Li, Georgia Institute of Technology, Taiyun Chi, Georgia Institute of Technology, Jong Seok Park, Georgia Institute of Technology, Hua Wang, Georgia Institute of Technology, John Papapolymerou, Michigan State University

Satoshi Yoshida, Kagoshima Univ., Akihira Miyachi, Japanese Aerospace Exploration Agency (JAXA), Ryoko Kishikawa, Advanced Industrial Science and Technology, Masahiro Horibe, Advanced Industrial Science and Technology, Motoaki Nakatsuka, Mitsubishi Heavy Industries, Ltd, Kenichi Anma, Mitsubishi Heavy Industries, Ltd, Makoto Matsunoshita, Japanese Aerospace Exploration Agency (JAXA), Kenjiro Nishikawa, Kadir Has University, Makoto Kasu, Saga University, Shigeo Kawasaki, Japanese Aerospace Exploration Agency (JAXA)


Room: 303 Room: 304 Room: 305 Room: 306 Room: 308

Co-Chair: Stephen Goodnick, Arizona StateUniv.

Co-Chair: Je�rey Nanzer, Johns Hopkins Univ.

Co-Chair: Vijay Nair, Intel Corp.

Co-Chair: Leonard Hayden, QORVO, Inc.

13:30-13:5013:50-14:10

TH3C-2: A 40 Gbaud SiGe:C BiCMOS Driver for InP Segmented MZMs with Integrated DAC Functionality for PAM-16 Generation

14:10-14:2014:20-14:30

TH3A-3: A 200 GHz CVD Graphene FET based Resistive Subharmonic Mixer

TH3C-3: Quantum Well Mach-Zehnder Intensity Modulator with Enhanced Linearity

TH3D-1: A Novel Carbon Nanotube LoadedPassive UHF RFID Sensor Tag with Built-in Reference for Wireless Gas Sensing

14:30-14:4014:40-14:50


Co-Chair: John Wood, Obsidian Microwave, LLC.

TH3B-3: Stability Analysis of Multistage Power Ampli�ers Using Multiple-Input Multiple-Output Identi�cation

TH3B-4: A Channelized Sideband Distortion Model for Suppressing Unwanted Emission of Q-band Millimeter Wave Transmitters

Kazuaki Yazawa,Purdue University,Dustin Kendig,Microsanj LLC.,Justin Rieter, Analog Devices, Inc.,Ali Shakouri, Purdue University

TH3A: Advances in Passive and Active RF Nanotechnology

Applications

TH3B: Nonlinear Circuit Analysis and Modeling

TH3D: Wearable and sensor technologies for Internet of

Things (IOT)

TH3F: Novel and Diverse Measurement Techniques

Room: 307

Co-Chair: Norman CHIANG, SSL

TH3E-2: Development of a CMOS Receiver fora Radio-Telescope Phased-Array Feed

TH3E: New Results in Low Noise Temperature Ampli�ers

Kevin O'Brien,University of California, Chris Macklin,University of California, David Hover, Massachusetts Institute of Technology, Lincoln Laboratory, Mollie Schwartz,University of California, Vladimir Bolkhovsky,Massachusetts Institute of Technology, Lincoln Laboratory, Xiang Zhang, University of California, William Oliver, Massachusetts Institute of Technology, Lincoln Laboratory, Irfan Siddiqi, University of California

Aaron Beaulieu, University of Calgary, Ge Wu, University of Calgary, Leonid Belostotski, University of Calgary, Tom Burgess, National Research Council, Herzberg, Bruce Veidt, National Research Council, Herzberg, James Haslett, University of Calgary

Joel Schleeh,Low Noise Factory, Per-Ake Nilsson, Chalmers University of Technology, Jan Grahn, Chalmers University of Technology, Niklas Wadefalk, Low Noise Factory

Franco Ramirez,University of Cantabria, Almudena Suarez, University of Cantabria,Sergio Sancho, University of Cantabria

Jasmin Grosinger,Graz University of Technology,Lu-kas Görtschacher,Graz University of Technology,Wolfgang Bösch,Graz University of Technology

Ajith Adhur Kutty,Tampere University of Technology,Toni Björninen,Tampere University of Technology,Lauri Sydänheimo,Tampere University of Technology,Leena Ukkonen,Tampere University of Technology

Shilei Jin,University of Massachusetts, Longtao Xu,University of Massachusetts, Yifei Li,University of Massachusetts

Iria Garcia Lopez, IHP Microelectronics, Pedro Rito, IHP Microelectronics, Lars Zimmermann, IHP Microelectronics, Dietmar Kissinger, IHP Microelectronics, Ahmet Cagri Ulusoy, IHP Microelectronics

Ran Zhu,Concordia University, Xiupu Zhang, Concordia University,Dongya Shen,Concordia University

Daniel Onori,CNIT, National Laboratory of Photonic Networks, Francesco Laghezza, CNIT, National Laboratory of Photonic Networks, Filippo Scotti, CNIT National Laboratory of Photonic Networks, Marco Bartocci, Elettronica S.p.A., Antonio Zaccaron, Elettronica S.p.A., Antonio Tafuto, Elettronica S.p.A., Antonella Bogoni, Sant'Anna School of Advanced Studies, Alessandro Albertoni, Elettronica S.p.A., Paolo Ghel�, CNIT National Laboratory of Photonic Networks

Chao Yu, Southeast University, Honglei Sun, Southeast University, Xiao-Wei Zhu, Southeast University, Wei Hong, Southeast University, Anding Zhu, University College Dublin

Libe Mori,University of the Basque Country, UPV/EHU,Aitziber Anakabe,University of the Basque Country, UPV/EHU,Ibone Lizarraga,University of the Basque Country, UPV/EHU,Nerea Otegi,University of the Basque Country, UPV/EHU,Juan-Mari Collantes,UPV/EHU,Vincent Armengaud,French Space Agency (CNES),Geo�roy Soubercaze-Pun,-French Space Agency (CNES)

Bauyrzhan Krykpayev,King Abdullah University of Science and Technology,Muhammad Fahad Farooqui,King Abdullah University of Science and Technology,Rana Muhammad Bilal ,King Abdullah University of Science and Technology,Atif Shamim,King Abdullah University of Science and Technology

Arian Rahimi,University of Florida,Yong-Kyu Yoon,University of Florida

Yaxin Zhang,Chalmers University of Technology,Michael Andersson,Chalmers University of Technology,Jan Stake,Chalmers University of Technology

Xi Luo,Lehigh University,Kuanchen Xiong,Lehigh University,James Hwang,Lehigh University,Yuchen Du,Purdue University,Peide Ye,Purdue University

14:50-15:10

13:30-13:5013:50-14:10

14:10-14:2014:20-14:30

14:30-14:4014:40-14:50

14:50-15:10

TH3A-5: Uncooled Radio Frequency Bolometer based on Carbon Nanotube Thin Films

TH3D-4: Powering Smart Jewelry Using an RF Energy Harvesting NecklaceSon Nguyen,University of California, Nathan Ellis, University of California, Rajeevan Amirtharajah, University of California

Michael Gasper,University of Akron,Ryan Toonen,University of Akron,Samuel Hirsch,U.S Army Research Laboratory,Mathew Ivill,U.S Army Research Laboratory,Henning Richter,Nano-C Inc.,Ramesh Sivarajan,Nano-C Inc.

TH3A-6: Microwave Gas Sensor based on Graphene-loaded Substrate Integrated Waveguide Cavity Resonator Mohammad Ashraf Ali,Wayne State University,Mark Ming-Cheng Cheng,Wayne State University,Jimmy Ching-Ming Chen,Wayne State University,Chung-Tse Michael Wu,Wayne State University

Chair: Luca Pierantoni, Univ. Politecnica delle Marche

Chair: John Xiupu ZHANG, Concordia Univ.Chair: Kavita Goverdhanam,

US Army CERDEC

Chair: Jon Martens, AnritsuChair: Terry CISCO, CAED

TH3E-1: 10 K Room Temperature LNA for SKA Band 1

Wei-Ting Wong,University of Massachusetts, Prasana Ravindran, University of Massachusetts, Su-Wei Chang, University of Massachusetts, Joseph Bardin, University of Massachusetts

Chair: Christopher Silva, The Aerospace Corp.

TH3A-2: Magnetically Tunable Nano-Superlattice Metaconductors for RF Applications

Pierre Franck,Centre National de la Recherche Scienti�que ,Dominique Baillargeat,XLIM CNRS/University of Limoges

TH3A-1: Carbon-Nanotube-Based Wireless On-chip Interconnects

TH3C: Advances in Microwave Photonicss

Pedro Rito, IHP Microelectronics, Iria Garcia Lopez, IHP Microelectronics, Despoina Petousi, IHP Microelectronics, Lars Zimmermann, IHP Microelectronics, Marcel Kroh,IHP Microelectronics, Stefan Lischke, IHP Microelectronics, Dieter Knoll, IHP Microelectronics, Dietmar Kissinger, IHP Microelectronics, Ahmet Cagri Ulusoy, IHP Microelectronics

TH3C-1: A Monolithically Integrated Segmented Driver and Modulator in 0.25 µm SiGe:C BiCMOS with 13 dB Extinction Ratio at 28 Gb/s

TH3C-6: A Direct-Conversion RF Scanning Receiver based on Photonics

Zhenzhou Tang,Nanjing University of Aeronautics and Astronautics,Shilong Pan,Nanjing University of Aeronautics and Astronautics

TH3C-5: Photonic Microwave Image-Reject Mixer with Large Suppression of Mixing Spurs

TH3E-3: A SiGe Ka-Band Cryogenic Low-Noise Ampli�er

TH3E-4: Towards Quantum-Noise Limited Multiplexed Microwave Readout of Qubits

TH3F-2: Kelvin Inductance and Resistance Measurements Using an AC Source and DC VoltmetersWooyeol Choi, University of Texas at Dallas, Kenneth O, University of Texas at Dallas

Wei-Yang Chen, National Chung Cheng University, Yue-Fong Yang, National Chung Cheng University, Pei-Yu Lyu, National Chung Cheng University, Sheng-Fuh Chang, National Chung Cheng University, JanneWha Wu, National Chung Cheng University

Chien-Chang Huang,Yuan Ze University

TH3F-3: An Enhanced Phasor-Sum Method for Accurate Built-In Relative Phase and Amplitude Detection in Beamforming Phased Arrays

TH3F-4: A Fixed Probe Position Self-Calibration Algorithm of Broadband On-Wafer Scattering Parameter Measurements without Impedance-Standard Substrate for RFIC Production Test Applications

TH3F-1: Intrinsic Transient Thermal Response of GaN HEMT

Robert Nakata, University of Hawaii

TH3D-5: RF Techniques for Motion Compensation of an Unmanned Aerial Vehicle for Remote Radar Life Sensing

TH3A-4: Continuous-wave and Transient Characteristics of Phosphorene Microwave Transistors

TH3B-1: Analysis of Oscillation Modes in Free-running Oscillators

Almudena Suarez,University of Cantabria,Sergio Sancho,University of Cantabria,Franco Ramirez,University of Cantabria

TH3B-2: Growth-rate Function for the Nonlinear Analysis of the Transient Dynamics of Microwave Oscillators

TH3C-4: Linearization of Radio-over-Fiber Systems Using Directly Modulated and Electro-Absorption Modulator Integrated Lasers

TH3D-2: Sensor Add-On for Batteryless UHF RFID Tags Enabling a Low Cost IoT Infrastructure

TH3D-3: A WiFi Tracking Device Printed Directly on Textile for Wearable Electronics Applications

WORKSHOPS Sunday | Time: 08:00 – 17:00

WSA | 08:00-12:00Millimeter-wave R&D for 5G: Systems, Phased Arrays, and Handset TransceiversHalf-day

WSB | 13:00-17:00

Half-day

WSC

| 08:00-17:00

Full-day

WSD

| 13:00-17:00 Circuit Techniques and System Architectures for Carrier Aggre-gation and Multi-band Radios

Half-day

WSE

| 08:00-12:00

Half-day

WSF

| 08:00-17:00 Advanced ICs and Systems for Wireless Charging and Energy Harvesting

Full-day

WSG | 08:00-17:00 Frequency Synthesizers of Multi-Band, Multi-Standard Radios and Internet of Things (IoT)Full-day

WSH | 13:00-17:00 RF/Analog IC Design Challenges in Advanced CMOS TechnologyHalf-day

WSI

| 08:00-12:00 High-E�ciency Broadband Multimode Multi Standards Ampl-i�er Design, High E�ciency TransmittersHalf-day

WSJ

| 13:00-17:00 Millimeter-Wave Electronics: from Applications to Manufacturing

Half-day

WSK

| 08:00-17:00 e-Health: Implantable Systems and Communications in theHuman BodyFull-day

WORKSHOPS

WORKSHOPS Monday | Time: 08:00 – 17:00

WMA | 08:00-17:00 Millimeter-wave PAs: Where are We and Where are We Headed? Full-day

WMB

| 08:00-12:00 Advances in High-Power SSPA Technology for KW-Operation at Microwave FrequenciesHalf-day

WMD

| 08:00-17:00Radio Miniaturization, Terahertz Nano-sized Radios and PotentialApplications

Full-day

WME

| 08:00-17:00 Large Signal Network Analysis: from instrumentation architectures to software applications for your RF design �ow

Full-day

WMF | 08:00-17:00 Tunable and Recon�gurable Front Ends for Multiband Communi-cation Systems

Full-day

WMH

| 08:00-17:00 E-Band Communications: Market, Technology and IC designFull-day

WMI

| 08:00-17:00 Autonomous VehiclesFull-day

WFK

| 13:00-17:00 Startups 101Half-day

WORKSHOPS

Highly E�cient 5G PA Design

How mm-wave Systems Reshape the Future of Telecom and SensingApplications

Calibration and Correction Techniques for CMOS Radios

WMG | 0800-17:00Heterogeneous integration of silicon RFIC with III-VFull-day

WMC

| 13:00-17:00 Power and Signal Integrity Characterization TechniquesHalf-day

WORKSHOPS Friday | Time: 08:00 – 17:00

WFA | 08:00-17:00 RF Design and Packaging for wireless wearable and implants

Full-day

WFB | 08:00-12:00 Advanced Millimeter-wave 3D/Multilayer MCM/SoP and PrintingTechnologies

Half-day

WFC | 13:00-17:00 Antenna and Packaging Integration Technologies for mmWaveand Terahertz-Wave Applications

Half-day

WFD | 13:00-17:00 mm-waves Measurement Needs for 5G

Half-day

WFE

| 13:00-17:00 Phase Change Material Switches for a New Class of MicrowaveControl Components

Half-day

WFH | 08:00-17:00Microwave and Photonics Techniques for Terahertz Applicationsin Science and Technology

Full-day

WFI | 08:00-17:00Theory and Applications of Wireless Power Transfer

Full-day

WFJ

| 08:00-17:00 Power Ampli�ers with Variable Loads

Full-day

WORKSHOPSWFF | 08:00-17:00 Emerging Devices for Microwave Circuits and Systems/Beyond Graphene Electronic Devices and their Potential for High-Frequency Applications

Full-day

WFG | 08:00-17:00 Digital Signal Generation With Focus on Direct Digital SynthesisDDS

Full-day

SFA | 08:00-12:00 Fundamental advances on 2D nano-materials and devices

Half-day

SFB | 08:00-17:00 Principles of RF and Microwave Imaging Technology: From Radarto MRI

Full-day

SHORT COURSES

SUNDAY Time: 08:00 – 17:00

FRIDAY Time: 08:00 – 17:00

MONDAY Time: 08:00 – 17:00

| 1300-1700 SSA | 08:00-17:00 Technologies for 5G

Full-day

SSB | 08:00-17:00Power Ampli�ers

Full-day

SMA | 08:00-17:00 High-Speed Optical Transceiver Fundametals

Full-day

SMB | 1300-17:00Multi-Beam Antennas and Beam-Forming Networks

Half-day

PANEL AND RUMP SESSIONS:“Bio-electronics: Silicon in MY body?!” (RFIC Panel) Monday, 12:00-13:15

“Patents – The Good, the Bad and the Ugly” (Joint RFIC/IMS Panel) Tuesday, 12:00-13:15

“The Internet of Space – Technological and Economic Challenges for the Future Space-based Internet” Tuesday, 18:30-21:00

“Are S-parameters Dying?”

“Doing Business in China”

Wednesday, 12:00-13:15

Thursday, 12:00-13:15

ims technical program preview 2016 international...

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