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Microelectronics(in)
Manufacturing
Dr. T-H. Joubert
NSTF Discussion Forum on AM and Automation: 11 September 2019
Carl and Emily Fuchs Institute for MicroelectronicsDepartment of Electrical, Electronic and Computer Engineering
University of Pretoria
1CEFIM
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Microelectronics in Memory
CEFIM
The transistor was invented at Bell Labs in 1947
1956 Nobel Prize in Physics toBardeen, Brattain and Shockley
wired.comcomputerhistory.org
Best Christmas present changed the course of history…
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Microelectronics in Memory
CEFIM
Invention of the integrated circuit in 1958
Texas Instruments oscillator with five components.
2000 Nobel Prize in Physics to Jack Kilby
wired.com ti.com
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Microelectronics in Memory
CEFIM
Planar integrated circuit in 1959
Fairchild produces ICs using a planar chip technology
Robert Noyce “Statesman of Silicon Valley”
intel.comedn.com
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Microelectronics in Memory
CEFIM
IC Processing
intel.comedn.com©2013 John Wiley & Sons, Inc. M P Groover, Principles of Modern Manufacturing 5/e
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Microelectronics in Memory
CEFIM
Moore’s Law
In 1965 Gordon Moore, Director of R&D at Fairchild "Cramming more components onto integrated circuits".
Gordon Moore in 2006
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Microelectronics in Memory
CEFIM
Some enabling factors and for Moore’s Law
• 1963, CMOS process, Frank Wanlass
• 1967, DRAM, Robert Dennard (IBM)
• 1982, UV excimer laser photolithography, Kanti Jain, IBM
• 2006, Deep UV excimer laser photolithography, IBM
• 2008, Memristor, HP Labs
• 2010, SiGe supercooled transistor, IBM, GeorgiaTech
• 2010, Nanowire transistor, Tyndall National Institute
• 2012, Single-atom transistor, University of New South Wales
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Microelectronics in Memory
CEFIM
The other side of Moore’s Law
16/14 nm 12/11 nm
?
?
? ?
TSMC
Globalfoundries
STMicroelectronics
Intel
Samsung22/20 nm
after IHS iSuppli 2011
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Microelectronics in Memory
CEFIM
More OF Moore technology nodes » nanoelectronics…
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Integrated Circuit Trends
“CMOS became the dominant fabrication technology for the VLSI era, with billions –
probably trillions – of chips produced using it. But most of these have been processors. Now, we are on the verge of a new CMOS era, but one in which
CMOS ICs are increasingly being developed for something quite different – sensing.”
[David Boothroyd, “CMOS technology is set to enable a new range of sensor devices,”
http://www.newelectronics.co.uk, 13 January 2015]
CEFIM
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Integrated Circuit Trends
“Heterogeneous components are devices that do not necessarily scale according to “Moore's Law,”
and provide additional functionalities, such as sensing and actuating ….. our prior ITRS roadmaps
have focused on MEMS in mobile devices ……. However, looking into the future, the greatest application growth areas are expected to be in
wearable devices, medical diagnostic devices, and the Internet of Things (IoT).”
[Extract form ITRS 2014 -White Paper on Heterogeneous Components]
CEFIM
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Appropriate technology
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Applications give technology relevanceCEFIM
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Challenges / Opportunities
CEFIM
Microelectronics?
http://mfeldstein.com/ Phil Hill
• Technology scale· nm → µm → mm → cm → m
• Interdisciplinary· electronics → chemistry → materials → biology
• Innovation· research → development → commercialization
Technology PUSHDemand PULL
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CEFIM
Founded in 1972: Institute for MicrostructuresSince 1982: Carl and Emily Fuchs Institute for Microelectronics
CEFIM
CEFIM
CEFIM CEFIM
Microelectronics in memory
Research focus areas:
• mixed signal integrated circuit design• novel electronic devices• RF microelectronics• micro electrical mechanical systems (MEMS)• silicon photonics and optoelectronics.
CEFIM
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CEFIM
CEFIM
More THAN Moore research focus areas:
• mixed signal integrated circuit design• novel electronic devices• micro/millimetre wave microelectronics• micro electrical mechanical systems (MEMS)• integrated microelectronics sensor systems• silicon photonics and optoelectronics.
CEFIM/CSIR
Microelectronics in this moment
350nm
CMOS
(Europe)
130nm
SiGe BiCMOS
(USA)
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CEFIM
Moore Plus microelectronics in this moment
CEFIM
Optoelectronic device (Germany)Bolometric IR Sensor (SA)
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CEFIM
Microwave microelectronics in this moment
CEFIM
CommunicationsRadiometryCloud RADARAutomotive RADAR Airport security screeningRadio astronomySynthetic Aperture RADAR ImagingSeeker headsNaval fire control
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• Point-of-need sensor systems:
- Portability
- Flexible
- Size
- Fast response
- Low power
- Stability
- Durability
- Refreshable
• Smart, simple, low-cost, green
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CEFIM
Printed microelectronics in this moment
CEFIM
CSIR
CSIR
CEFIM/CSIR
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CEFIM
Meeting the future: Microelectronics in the Mind
CEFIM
CEFIM / MMM
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National Association
DSI SARIR : Nano and MicroManufacturing Facility (NMMF)
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Concluding recommendations
• “More THAN Moore” to use “More OF Moore” nanoelectronics
• Design solutions to local problems with global relevance
• Manufacture in decreasing number of global fabs
• Invest in research, development, and skilled workforce
• Additive manufacturing is becoming microelectronics
• Printed electronics
• Heterogeneous integration
• Small-scale and low-cost automated fabrication facility
• Rigorous design and process modelling
• Geographically close to grassroots communities
Microelectronics (in) manufacturing
CEFIM
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“Prediction is very difficult – especially if it is about the future.”
Niels Bohr
Thank you!
CEFIM
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23CEFIM IMSS Research Group
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Discussion:Enabling Ecosystemfor Manufacturing
Dr. T-H. Joubert
NSTF Discussion Forum on AM and Automation: 11 September 2019
Carl and Emily Fuchs Institute for MicroelectronicsDepartment of Electrical, Electronic and Computer Engineering
University of Pretoria
24CEFIM
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Microelectronics in Memory
CEFIM
Moore’s Law
In 1965 Gordon Moore, Director of R&D at Fairchild "Cramming more components onto integrated circuits".
Gordon Moore in 2006
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Microelectronics in Memory
CEFIM
The other side of Moore’s Law
16/14 nm 12/11 nm
?
?
? ?
TSMC
Globalfoundries
STMicroelectronics
Intel
Samsung22/20 nm
after IHS iSuppli 2011
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Applications2012/pretoria-news-squatters-live-among-rich
Plastic View, Moreleta Park
Medicinal residue in drinking waterAcid mining drainage, Tweelopies River
http://www.alfalaval.com//mg.co.za/article/2015-07-30 http://www.infrastructurene.ws
Waste water
Jukskei River
CEFIM
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CEFIM
Microwave microelectronics in this moment
CEFIM
CommunicationsRadiometryCloud RADARAutomotive RADAR Airport security screeningRadio astronomySynthetic Aperture RADAR ImagingSeeker headsNaval fire control
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• Point-of-need sensor systems:
- Portability
- Flexible
- Size
- Fast response
- Low power
- Stability
- Durability
- Refreshable
• Smart, simple, low-cost, green
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CEFIM
Printed microelectronics in this moment
CEFIM
CSIR
CSIR
CEFIM/CSIR
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Concluding recommendations
• “More THAN Moore” to use “More OF Moore” nanoelectronics
• Design solutions to local problems with global relevance
• Manufacture in decreasing number of global fabs
• Invest in research, development, and skilled workforce
• Additive manufacturing is becoming microelectronics
• Printed electronics
• Heterogeneous integration
• Small-scale and low-cost automated fabrication facility
• Rigorous design and process modelling
• Geographically close to grassroots communities
Microelectronics (in) manufacturing
CEFIM
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Additive Manufacturing
Point-of-need sensor systems & m/mm Wave Communications
Alignment:• Global goals: data in smart cities, energy, water, minerals
and beneficiation
• DST / NRF Objectives – SARIR, SKA, SALT, Nano
• TIA Portfolio – advanced manufacturing, agriculture, energy, health, ICT, natural resources
• AU STISA
• International Roadmap for Devices and Systems
• UN / WHO SDGs
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DSI SARIR : NMMF
Planning hub-and-nodes model