cleaning composition containing anonionic rinse agent compositionto both wash and rinse.

CNIlOMAn POll ZINC. ZINC ALLOY.OIiCADMIUMU.S. Patent 5,876,517. Mar. 2, 1999E. Jeannier, assignor to AtatechDeutschland GmbH, GermanyA chromate bath, consisting es­sentially of an aqueous solutionhaving a pH between 1 and 2 andcontaining, per liter, 5 to 40 g ofhexavalent chromium ions, 5 to20 g of sulfate ions, 0.1 to 0.3 g ofcobalt ions, 0.1 to 0.65 g of silverions, and 50 to 150 ml of at leastOne organic acid.

DIVICI POIlIN-UNI PlCIWNGu.s. Patent 5,876,522. Mar. 2, 1999D. Figge et al., assignors toMannesmann AG, Dusseldorf,Germany

A process for pickling a strip,which is produced in a thin slabinstallation and subsequentlyhot-rolled, in a continuous processimmediately following a rollingprocess.

SOLVDIT IIICYCU_ SYSnMU.S. Patent 5,876,567. Mar. 2, 1999S. Yamamoto, Unionville, Ont., andJ·P. Pepin, Victoriaville, Que.A solvent recycling system com­prising evaporator means havingcontaminated liquid solvent inletmeans and solvent vapor outletmeans.

SPUnIIUN8 APPARATUSU.S. Patent 5,876,573. Mar. 2, 1999M.M. Moslehi et al., assignors toCVC Inc., Rochester, N. Y.

A high magnetic flux cathode ap­paratus for high productivityphysical vapor deposition.

..8Nn ...... POll A~IIIN8 CHAMa...U.S. Patent 5,876,574. Mar. 2, 1999R. Hofmann and Z. Xu, assignors toApplied Materials Inc., Santa Clara,Calif.A method of reducing resputter­ing of a sputtering target overwhich is mounted an opposingpair of magnets comprising moni­toring the target erosion trackfrom the centerline of the target;and revising the shape of the

magnets to provide a curved, sin­gle-turn, open-ended magnetshape about twice as thick nearthe open ends as in the center sothat the erosion pattern of thetarget during sputtering is mademore uniform.

SPUTnIII_ APPARATUSU.s. Patent 5,876,576. Mar. 2, 1999J. Fu, assignor to Applied MaterialsInc., Santa Clara. Calif.A sputtering system for sputter­ing particles from a magnetron­type target having a first surfaceand a second surface, where theparticles are sputtered from thefirst surface, comprising a movingmagnet assembly positioned adja­cent to the second surface of thetarget and including a ferro­magnetic pole piece assembly; anactuator for moving the pole pieceassembly parallel to the first sur­face of the target; and a magneticshunt, positioned in an annulartrough fonned in the second sur­face of the target, where the an­nular trough is located where a

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ATrAlr Technologies, Inc.205 West 17t1l St. 100 624·1739Ottawa, KS 66067 (7151 242·11U

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