Download - Telemark Product Training
Table of Contents
Fundamentals of Evaporation
Benefits/sizing of a cryochiller
Sheet Resistance Monitoring
UHV Sources/components
Spare Parts/Loyalty Pricing
Conclusion
Telemark Product Training J. H. Gurian 1/104
Table of ContentsFundamentals of Evaporation
Materials, Throw Distance, & Other ConsiderationsSelection of appropriate sourceSweeping the BeamIndexing/rotation of sourceSelection of a suitable power supplyIntegration of a QCM controllerAddition of an Ion Source for IAD/substrate cleaningWill an optical monitor be beneficial?
Benefits/sizing of a cryochillerSheet Resistance MonitoringUHV Sources/componentsSpare Parts/Loyalty PricingConclusion
Telemark Product Training J. H. Gurian 2/104
E-beam: Versatile Thin Film Technique
11.008 3, 6 1
HHydrogen
24.002602(2) 1, 2 1
HeHelium
3 6.94 3, 6 1
LiLithium
49.0121831(5) 1
BeBeryllium
510.81 3, 6 1
BBoron
6 12.011 6 1
CCarbon
7 14.007 6 1
NNitrogen
8 15.999 6 1
OOxygen
918.998403163(6) 1
FFluorine
1020.1797(6) 1, 3 1
NeNeon
1122.98976928(2) 1
NaSodium
1224.305 6 1
MgMagnesium
1326.9815385(7) 1
AlAluminium
1428.085 6 1
SiSilicon
1530.973761998(5) 1
PPhosphorus
16 32.06 6 1
SSulfur
1735.45 3, 6 1
ClChlorine
1839.948(1) 1, 2 1
ArArgon
1939.0983(1) 1
KPotassium
2040.078(4) 1
CaCalcium
2144.955908(5) 1
ScScandium
2247.867(1) 1
TiTitanium
2350.9415(1) 1
VVanadium
2451.9961(6) 1
CrChromium
2554.938044(3) 1
MnManganese
2655.845(2) 1
FeIron
2758.933194(4) 1
CoCobalt
2858.6934(4) 2 1
NiNickel
2963.546(3) 2 1
CuCopper
3065.38(2) 2 1
ZnZinc
3169.723(1) 1
GaGallium
3272.630(8) 1
GeGermanium
3374.921595(6) 1
AsArsenic
3478.971(8) 1
SeSelenium
3579.904 6 1
BrBromine
3683.798(2) 1, 3 1
KrKrypton
3785.4678(3) 1 1
RbRubidium
3887.62(1) 1, 2 1
SrStrontium
3988.90584(2) 1
YYttrium
4091.224(2) 1 1
ZrZirconium
4192.90637(2) 1
NbNiobium
4295.95(1) 1 1
MoMolybdenum
43 97 4 1
TcTechnetium
44101.07(2) 1 1
RuRuthenium
45102.90550(2) 1
RhRhodium
46106.42(1) 1 1
PdPalladium
47107.8682(2) 1 1
AgSilver
48112.414(4) 1 1
CdCadmium
49114.818(1) 1
InIndium
50118.710(7) 1
SnTin
51121.760(1) 1 1
SbAntimony
52127.60(3) 1 1
TeTellurium
53126.90447(3) 1
IIodine
54131.293(6) 1, 3 1
XeXenon
55132.90545196(6) 1
CsCaesium
56137.327(7) 1
BaBarium
57138.90547(7) 1 1
LaLanthanum
58140.116(1) 1
CeCerium
59140.90766(2)
PrPraseodymium
60144.242(3) 1
NdNeodymium
61 145 5
PmPromethium
62150.36(2) 1
SmSamarium
63151.964(1) 1
EuEuropium
64157.25(3) 1
GdGadolinium
65158.92535(2)
TbTerbium
66162.500(1) 1
DyDysprosium
67164.93033(2)
HoHolmium
68167.259(3) 1
ErErbium
69168.93422(2)
TmThulium
70173.054(5) 1
YbYtterbium
71174.9668(1) 1
LuLutetium
72 178.49(2)
HfHafnium
73180.94788(2)
TaTantalum
74 183.84(1)
WTungsten
75186.207(1)
ReRhenium
76190.23(3) 1
OsOsmium
77192.217(3)
IrIridium
78195.084(9)
PtPlatinum
79196.966569(5)
AuGold
80200.592(3)
HgMercury
81 204.38 6
TlThallium
82207.2(1) 1, 2
PbLead
83208.98040(1)
BiBismuth
84 209 4
PoPolonium
85 210 4
AtAstatine
86 222 4
RnRadon
87 223 4
FrFrancium
88 226 4
RaRadium
89 227 4
AcActinium
90232.0377(4) 1, 4
ThThorium
91231.03588(2) 4
PaProtactinium
92238.02891(3) 1, 3, 4
UUranium
93 237 4
NpNeptunium
94 244 4
PuPlutonium
95 243 4
AmAmericium
96 247 4
CmCurium
97 247 4
BkBerkelium
98 251 4
CfCalifornium
99 252 4
EsEinsteinium
100 257 4
FmFermium
101 258 4
MdMendelevium
102 259 4
NoNobelium
103 262 4
LrLawrencium
104 267 4
RfRutherfordium
105 270 4
DbDubnium
106 271 4
SgSeaborgium
107 270 4
BhBohrium
108 277 4
HsHassium
109 276 4
MtMeitnerium
110 281 4
DsDarmstadtium
111 282 4
RgRoentgenium
112 285 4
CnCopernicium
113 285 4, 5
UutUnuntrium
114 289 4, 5
FlFlerovium
115 289 4, 5
UupUnunpentium
116 293 4, 5
LvLivermorium
117 294 4, 5
UusUnunseptium
118 294 4, 5
UuoUnunoctium
Telemark Product Training J. H. Gurian 3/104
Process Drives Equipment Selection
How do process requirements and deposition materials driveequipment selection?
Telemark Product Training J. H. Gurian 4/104
Typical process requirements
• Film Uniformity→ Drives Throw Distance
• Film Thickness→ Drives Pocket Size
• Deposition Rate→ Drives Power Supply Selection
Telemark Product Training J. H. Gurian 5/104
Calculating Distribution/Uniformity
Planetary?Single-spinner?Dome?Tri-Dome?Web?Masking?Uniformity can becomplicated. . . We’re happyto consult with you!
∫
(zp − zs)n
(
(xp − xs)2 + (yp − ys)2 + (zp − zs)2)n/2+1
Telemark Product Training J. H. Gurian 6/104
Different material have different concerns
• Sublimating materials(many metal oxides) aredifficult out of large pockets(>40cc)- use multiple smallpockets
• Metals often need largerpockets with a liner toachieve higher rates
Telemark Product Training J. H. Gurian 8/104
Different material have different concerns
• Sublimating materials(many metal oxides) aredifficult out of large pockets(>40cc)- use multiple smallpockets
• Metals often need largerpockets with a liner toachieve higher rates
• Aluminum• Refractory metals
Telemark Product Training J. H. Gurian 8/104
Material Consumption
5-6 micron per cc at 25 cm above source (static)Scales with r−2
(e.g. only 300 nm to 375 nm at 1 m)Don’t forget to consider crucible liner→ shrinks pocket
volume. . .
Also consider motion of parts (tooling factor)
Telemark Product Training J. H. Gurian 9/104
Pocket Filling
• Granular materials 0.6-0.8packing density
• Overfilling pocket can leadcross-contamination orliner cracking
• Don’t evaporate all ofpocket (striking bottom ofpocket)
• Leaves ≈50% of pocketvolume for evaporation
Telemark Product Training J. H. Gurian 10/104
Do I need a liner?
Liners:• Provide thermal isolation from
hearth• Keep e-beam source clean(er)• Keeps material from bonding
to the hearth
Telemark Product Training J. H. Gurian 11/104
Liner Selection
https://telemark.com/wp-content/uploads/Thin-Film-Evaporation-Guide.pdf
Telemark Product Training J. H. Gurian 12/104
Table of ContentsFundamentals of Evaporation
Materials, Throw Distance, & Other ConsiderationsSelection of appropriate sourceSweeping the BeamIndexing/rotation of sourceSelection of a suitable power supplyIntegration of a QCM controllerAddition of an Ion Source for IAD/substrate cleaningWill an optical monitor be beneficial?
Benefits/sizing of a cryochillerSheet Resistance MonitoringUHV Sources/componentsSpare Parts/Loyalty PricingConclusion
Telemark Product Training J. H. Gurian 13/104
Source Selection
VCR or 1.33 CFWater Fittings
Option
Self Sealing Cover*Optional
VCR or 1.33 CFWater Fittings
Ebeam Source
Decision Tree
Model 259
Model 218
Model 211
Model 244
Arc Suppressionand/or
Self Sealing Cover*Optional
Model 276
Model 246
Model 266
Model 296
Model 279
Model 249
Model 269
Model 575
Model 264
Model 294
Model 295
Model 263
Model 272Arc Suppression
Optional
Replaces Model 277
Replaces Model 281
Replaces Model 248
Replaces Model 241
Replaces Model 265
Replaces Model 267
Replaces Model 258
Model 274
Replaces Model 247
Replaces Model 268
Self Sealing Cover*Optional
VCR or 1.33 CFWater Fittings
2.2019
Single Pocket
Multi-Pocket
ElectronBeam
Source
High Vacuum
UHV
6kW, up to 15cc
High Vacuum(Side or Bottom Drive)
High VacuumNo rotary water to
vacuum seal(Quad-Ring Seal
Through BasePlate Drive)
UHVLinear
Near UHVNo rotary water to
vacuum seal(Magnetic Fluid Seal
Through BasePlate Drive)
Crucibleless SourceCustomer supplied crucible
14kW, up to 160cc
14kW, up to 160cc
6kW, up to 6x 7cc
10kW, up to 5x 15cc
6kW, up to 15cc
6kW, up to 6x 7cc
10kWup to 4x 25cc or 8x 7cc
6kW, up to 6x 7cc
Model 57810kW, up to 4x 40cc
10kW Max.
Model 29320kW Max.
10kWup to 4x 25cc or 8x 7cc
10kWup to 4x 40cc or 8x 7cc
12kWup to 6x 40cc or 8x 25cc
10/15kWup to 6x 100cc or 20x 15cc
10kWup to 4x 40cc or 8x 7cc
12kWup to 6x 40cc or 8x 25cc
10kWup to 4x 25cc or 8x 7cc
10kWup to 4x 40cc or 8x 7cc
*Self Sealing Coveronly available with
certain crucibleconfigurations
1801 SE Commerce Avenue Tel 360-723-5360 [email protected] Ground, WA 98604, USA Fax 360-723-5368 telemark.com
MADE IN USA
Model 221
Model 224
3kW, 4x 2cc
4kW, 4x 4cc
Replaces Model 271
Model 298
up to 12 x 100cc (15kW)up to 16 x 100cc (10kW)
Model 5283kW, up to 6x 1.5cc
Model 218
Model 2184kW, 4cc
Model 509
Model 2183kW, 1.5cc
Model 508
Model 299
12kWup to 6x 40cc or 8x 25cc
Model 287
10kWup to 9x 60cc or 15x 15cc
Model 285
10kWup to 12x 25cc or 14x 15cc
Replaces Model 297
https://telemark.com/wp-
content/uploads/telemark-e-beam-
source-model-tree.pdf
Telemark Product Training J. H. Gurian 14/104
General Source Selection Process
Single Pocket or Multipocket
Single Multi
UHV HV Near UHV
Pocket Size/Max. Power
Telemark Product Training J. H. Gurian 15/104
Multipocket Sources
HV Near UHV UHVRotary
Water-to-Vacuum
Seal
No RotaryWater-to-Vacuum
Seal
MagneticRotary
LinearBellows
221 528224244 246 249264 266 269 575274 276 279 578285287294 296295298
Telemark Product Training J. H. Gurian 16/104
Source Options
• Arc Resistant Emitter• Self Sealing Cover• In-Pocket Switch• VCR or 1.33CF water fittings• Flange mounted
Telemark Product Training J. H. Gurian 17/104
Arc Handling
Telemark primarily uses three methods to reduce arcs:• Power Supply Design• Arc Suppression Emitter Design
(264/266/269/273/274/276/279/294/296/299)• Arc Suppression Upgrade (264/271/272/273/274/294/295)
Telemark Product Training J. H. Gurian 18/104
Arc Resistant Emitter
• Can operate in hostile, high particulate environments• Do not react to ion sources or other discharges• Operate at vacuum levels of >5x10-3 Torr• Have longer crucible life and enable better evaporation of
material• Employ a durable emitter assembly for increased filament
life and simple maintenance
Telemark Product Training J. H. Gurian 19/104
Self-Sealing Cover
• No in-vacuum pneumatics or motor required• Protects materials from cross-contamination• Excellent for Gold or Indium deposition• Available on only certain crucible configurations of the
models 264, 266, 269, 271, 273, 274, 276, 279, 294, 295,and 296
Telemark Product Training J. H. Gurian 20/104
Periodic Maintenance
• Hearth cleaning• Filament
replacement• Seal
maintenance• Magnet gauss
Telemark Product Training J. H. Gurian 21/104
Hearth Cleaning
• Wire brush (brass orstainless) or scotch-brite padbetween runs
• Periodic bead blasting ofhearth
• Semi-annual Factory rebuild
Telemark Product Training J. H. Gurian 22/104
Emitter Removal
• In normal practice the emitter isextremely hot after operation
• Remove nuts and bolts holding HVleads
• Remove Allen screw holding Emitter• Pull the emitter assembly straight
out the front
Telemark Product Training J. H. Gurian 23/104
Emitter Cleaning
• Needed Equipment: Alcohol, Wire,Bead-blaster, Gloves
• Clean and vapor dry the parts afterbead-blasting
• Discard any cracked or brokenceramics
• Discard screws that hold down thefilament clamps and the beamformer
Telemark Product Training J. H. Gurian 24/104
Emitter Reassembly
• 90% of source problems relate tothe EB source emitter
• Close attention to the emitterassembly is of the utmostimportance to trouble free runs
• In particular, pay meticulousattention to the following:
• Length of screws• The relative position of the anode
plate, beam former, and filament• Filament leads• HV leads
Telemark Product Training J. H. Gurian 25/104
273 Emitter
1 Assemble the mounting bracket, the left
hand cathode block, and the left hand buss
using two #6 x 3/8" screws
2 Add the following to the assembly: the L
insulator, the right hand cathode block and
the right hand buss bar, using two #6
washers, two collar insulators, and two #6 x
1/2" screws
3 Mount the cross insulator and the beam
former using one #6 x 1/4"
Telemark Product Training J. H. Gurian 26/104
273 Emitter
4 Stand this assembly up on a flat surface,
with the buss bars facing away from you.
Gently tap the beam former into place, and
snug the screw down. Turn the assembly so
the buss bars are facing you. Press down
gently on the beam former, and gently snug
the screws on the right hand buss bar.
Check the gap between the two cathode
blocks, making sure that they are parallel.
Snug the left hand buss bar screws.
Telemark Product Training J. H. Gurian 27/104
273 Emitter
5 Install the new filament, making sure that the
filament orientation is correct. Using new #6
x 1/4" screws, loosely mount the filament
clamps in place. Gently tap the emitter
assembly on a flat surface to settle the
filament into place. Slide the filament clamp
on the right cathode block until it is flush with
the right side of the block. Snug the right #6
x 1/4" screws. Gently push the left hand
clamp into place. NOTE: Sliding this clamp
can cause the filament to warp or bow. Snug
the left #6 x 1/4" screws. Now check the
alignment of the filament to the beam former.
Telemark Product Training J. H. Gurian 28/104
273 Emitter
6 Loosely mount two HV Insulatorsand two HV Shields to the emittersupport bracket with two #6 x 3/8screws.
7 Mount the Anode to the U Bracketusing two #6 x 1/4" screws.
Telemark Product Training J. H. Gurian 29/104
273 Emitter
8 Attach the emitter support bracket assembly
to the mounting bracket assembly, using two
#6 x 1/4" screws. Place this assembly on a
flat surface with the emitter support hanging
over an edge. Gently push down on the
support bracket and tighten the two #6 x 3/8
screws into the HV insulators. Next, carefully
reach around and tighten the two #6 x 1/4"
screws into the HV insulators. Now mount
the U bracket assembly to the support
bracket using two #6 x 1/4" screws. Gently
push down on the mounting bracket, and
tighten the two #6 x 1/4 screws.
Telemark Product Training J. H. Gurian 30/104
273 Emitter
9 Push down on the Anode and tighten the
last two #6 x 1/4 screws. Check the
alignment of the Anode to the beam former.
The rebuilt emitter assembly is now ready to
be installed back in the E-source.
Telemark Product Training J. H. Gurian 31/104
Arc-Resistant Emitter
1 Assemble the mounting bracket without cut
outs facing down, to the left hand cathode
block, and the left hand buss bar using two
#6 washers, and (1) #6x 3/8 screw (Ti) and
(1) #6-32 x 1/2 screw (Ti) to attach Ion Trap.
2 Add to the assembly the L insulator, the right
hand cathode block, and the right hand buss
bar, using two #6 washers, two collar
insulators, and one #6 x 3/8 screw (Ti) and
(1) #6-32 x 1/2 screw (Ti) to attach Ion Trap.
Adjust gap between the two cathode blocks
to Max. Allowed by the screws. Snug all the
screws down at this time.
Telemark Product Training J. H. Gurian 32/104
Arc-Resistant Emitter
3 Install the new filament making sure that the
filament orientation is correct (dog leg to the
right side, from the front view). Use (2) #6 x
1/4 (Ti) flat head screws, loosely mount the
filament clamps in place. Gently tap the
emitter assembly on a flat surface to settle
the filament into place. Slide the filament
clamp on the left cathode block until it is
flush with the left side of the block. Snug the
left #6 x 1/4 screw. Gently push the right
hand clamp into place. NOTE: Sliding this
clamp can cause the filament to warp or
bow. Snug the right #6 x 1/4 screw.
Telemark Product Training J. H. Gurian 33/104
Arc-Resistant Emitter
4 Next mount the cross insulator and the
beam former using one #6 x 1/4 (Ti) flat
head screw.
5 Now check the alignment of the filament to
the beam former. Adjust filament so as to be
centered in window, ie: left to right.
6 Loosely mount two HV Insulator and two HV
Shield, Inner to the emitter mounting bracket
cut-out side with two #6 x 3/8 (silver plated)
screws.
Telemark Product Training J. H. Gurian 34/104
Arc-Resistant Emitter
7 Next attach (2) HV Shields, Outer, and the
Emitter support bracket with (2) #6-32 x 3/8
(silver plated) screws.
8 Rotate the assembly 180 degrees, now snug
the remaining (4) #6-32 x 3/8 (silver plated)
screws.
Telemark Product Training J. H. Gurian 35/104
Magnet Gauss
• Permanent magnet is gaussed to center beam in pocket atfactory
• Heat or Impact will weaken magnet → shift beam center• Taking apart source can reduce magnet field strength by
20%
• Periodically check voltage that centers beam, haveregaussed if required
Telemark Product Training J. H. Gurian 36/104
Selecting a Gauss Value
• Metals: 10 kV → Better meltpenetration
• Dielectrics: <8 kV → Lessdissociation (e.g. SiO2→Si,SiO)
• Sources gaussed for higherenergies can be shuntedlower
Telemark Product Training J. H. Gurian 37/104
Secondary Electrons
• Electrons ejected from melt towards substrate, or reflectedoff melt surface
• Source permanent magnet helps capture these electrons
Telemark Product Training J. H. Gurian 38/104
Mitigating Secondary Electrons
Secondary electron problems:• Substrate damage• Resist hardening• "Pin-holes" and flakes
Solutions:• Longer throw distance (>20in)• Use optional rear-mounted trap• Maintain source gauss• Large rotary multi-pocket sources
have the longest magnet armextension
Telemark Product Training J. H. Gurian 39/104
Table of ContentsFundamentals of Evaporation
Materials, Throw Distance, & Other ConsiderationsSelection of appropriate sourceSweeping the BeamIndexing/rotation of sourceSelection of a suitable power supplyIntegration of a QCM controllerAddition of an Ion Source for IAD/substrate cleaningWill an optical monitor be beneficial?
Benefits/sizing of a cryochillerSheet Resistance MonitoringUHV Sources/componentsSpare Parts/Loyalty PricingConclusion
Telemark Product Training J. H. Gurian 40/104
Why Sweep the beam?
If the evaporant cannot dissipate the beam energy byevaporation, conduction, or radiation, spitting occurs
Sweep the beam to distribute the power and avoid spitting
Telemark Product Training J. H. Gurian 41/104
Sweep Comparison
Digital Programmable
8 Memory Slots 32 Memory Slots5 Pt. Pocket Setup 9 Pt. Pocket Setup5 Preset Shapes 6 Preset Shapes
32 Custom ShapesPattern Rotation
ProfilingPatternMaker Software
Telemark Product Training J. H. Gurian 42/104
Sweep Suggestions
For metals or melting materials:• Small sweep amplitude during deposition• Use sweep to precondition material to avoid
explosions/spitting• Telemark Digital Sweep is an excellent economical choice
For Dielectrics or sublimating materials:• Sweep the entire crucible• Sweep Profiling can greatly improve evaporant utilization in
the crucible (avoid digging)• The Telemark Programmable Sweep’s advanced features
allow for longer runs and better material utilization
Telemark Product Training J. H. Gurian 43/104
Table of ContentsFundamentals of Evaporation
Materials, Throw Distance, & Other ConsiderationsSelection of appropriate sourceSweeping the BeamIndexing/rotation of sourceSelection of a suitable power supplyIntegration of a QCM controllerAddition of an Ion Source for IAD/substrate cleaningWill an optical monitor be beneficial?
Benefits/sizing of a cryochillerSheet Resistance MonitoringUHV Sources/componentsSpare Parts/Loyalty PricingConclusion
Telemark Product Training J. H. Gurian 44/104
Source Indexing
• Manual rotation (knob)→ prone to errors• Rotary sources → 396/398
• 396 for smaller sources (24x and below)• 398 for larger sources (26x and above)
• Linear sources → 397• Source Mounted in-pocket switch prevents mis-rotation
Telemark Product Training J. H. Gurian 45/104
Feedthroughs
Telemark offers a wide variety of power, rotation, andinstrumentation feedthroughs with o-ring or metal seal as well
as an excellent line of cost-competitive ferrofluidic feedthroughs
Telemark Product Training J. H. Gurian 46/104
Table of ContentsFundamentals of Evaporation
Materials, Throw Distance, & Other ConsiderationsSelection of appropriate sourceSweeping the BeamIndexing/rotation of sourceSelection of a suitable power supplyIntegration of a QCM controllerAddition of an Ion Source for IAD/substrate cleaningWill an optical monitor be beneficial?
Benefits/sizing of a cryochillerSheet Resistance MonitoringUHV Sources/componentsSpare Parts/Loyalty PricingConclusion
Telemark Product Training J. H. Gurian 47/104
Power Supply Selection
How do I select an appropriate Power Supply?
Telemark Product Training J. H. Gurian 48/104
Material Evaporation Rates
100 101
101
102
103
Ag
Al
Al2O3 Au
Au (Liner)
Co
Cr
Cu
Cu (Liner)
Ge
Mo
Nb
Ni
Pt
SiSiO2
Sn(Liner)
Ta
Ta3O5
Ti
V
W
Zr
Power (kW)
Dep
ositi
onR
ate
(Ås−
1at
25cm
)
Process/through-put drives power requirement
Telemark Product Training J. H. Gurian 49/104
TT vs ST
TT
• Easier Serviceability• Higher Power Available
ST
• Lower Ripple• Higher Efficiency• Smaller Footprint• Better Arc Handling
Power TT-1 TT-2 TT-3 ST-1 ST-24 kW
6 kW •
8 kW • •
10 kW • • • • •
12 kW • •
15 kW • • •
20 kW • • •
Telemark Product Training J. H. Gurian 50/104
Table of ContentsFundamentals of Evaporation
Materials, Throw Distance, & Other ConsiderationsSelection of appropriate sourceSweeping the BeamIndexing/rotation of sourceSelection of a suitable power supplyIntegration of a QCM controllerAddition of an Ion Source for IAD/substrate cleaningWill an optical monitor be beneficial?
Benefits/sizing of a cryochillerSheet Resistance MonitoringUHV Sources/componentsSpare Parts/Loyalty PricingConclusion
Telemark Product Training J. H. Gurian 51/104
How do I control rate and process?
Time and Power?• Inconsistent• Operator intensive• Error-prone
Better: Deposition Controller with Quartz Crystal Microbalance
Telemark Product Training J. H. Gurian 52/104
Quartz Crystal Monitoring
• Small piece of driven quartz oscillates via piezeoelectriceffect
• As thin film deposits on crystal face → mass increases• As mass increases → oscillation frequency decreases• By measuring oscillation frequency we can infer deposited
film thickness
Telemark Product Training J. H. Gurian 53/104
Process Management
• A Process is one or more Layers
• Each Layer is defined as a Material with a definedthickness
• Each Material has a set of material properties (density,acoustic impedance, crucible number, rate, ramp/soak,etc.)
Telemark Product Training J. H. Gurian 54/104
Advanced Process Management
Programmable and expandable I/O allows for integrating otherprocess equipment (such as shutters, heaters, SCRs, MFCs,
Ion Source, etc.)
Telemark Product Training J. H. Gurian 55/104
PLC Integration
A variety of protocols for integrating 861 with system controller:• Telemark standard protocol• 360C protocol• ASCII Checksum protocol• ASCII No Checksum protocol• Mixed ASCII protocol
Allows user to remotely:• Update process/material properties• Remotely operate 861 controller (start/stop process)• Stream thickness/rate data
Telemark provides DCM software for easy remote interface, aswell as material/process management and backup/restore
Telemark Product Training J. H. Gurian 56/104
Table of ContentsFundamentals of Evaporation
Materials, Throw Distance, & Other ConsiderationsSelection of appropriate sourceSweeping the BeamIndexing/rotation of sourceSelection of a suitable power supplyIntegration of a QCM controllerAddition of an Ion Source for IAD/substrate cleaningWill an optical monitor be beneficial?
Benefits/sizing of a cryochillerSheet Resistance MonitoringUHV Sources/componentsSpare Parts/Loyalty PricingConclusion
Telemark Product Training J. H. Gurian 57/104
Common process problems
• "Why doesn’t my film index match the bulk material index?"• "Why does my film drift out of spec overnight?"• "Why does my film not stick to or pop off my substrate?"• "How do I get rid of these pin-holes in my film?"• "How do I remove this native oxide layer on my substrate?"
Telemark Product Training J. H. Gurian 58/104
Bad Film Index or Drifting film
• Film is not dense enough• Film can absorb humidity• Solutions:
• Heat• Parts have to cool before handling• Chamber has to cool for worker safety• Incompatible with some materials (e.g. plastics, resist)
• Ion Assisted Deposition (IAD) via Ion Source
Telemark Product Training J. H. Gurian 59/104
Bad Film Adhesion or Pin-Holes
• Substrates not clean• Improve cleaning practices• Improve Cleanroom• Ion Source Pre-clean
• Excessive film stress causes delamination• Change process materials to balance coating stress
(usually not an option)• Heat• Ion-Assisted Deposition with Ion Source
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Native Oxide Removal
• Use separate ion etch tool and keep under vacuum or N2
• In-situ Ion Etch using Ion Source
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ST Ion Sources
Model Mini UHV XIAD ST-55 ST-3000Power 800 W 1 kW 1.5 kW 2.5 kW
Beam Current 3 A 4 A 7 A 15 AEnergy 200 eV 225 eV 225 eV 300 eV
Telemark Product Training J. H. Gurian 62/104
Sizing Ion Source
θ
YIS
XIS
YES
XES
−120−100−80 −60 −40 −20 0 20 40 60 80 1000
200
400
600
800
Angle (Degrees)
Bea
mF
lux
(µA
cm−
2)
Beam Flux vs Angle at 400 mm
ST-3000 (10 A)ST-55 (5 A)
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Ion Assisted Deposition
• Coating densification• Improved index of refraction• Better environmental stability• Lower coating stress• Higher Throughput than IBS
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Proper Dosing
• Low Power → Low Dose• High Power + High Pressure → Short MFP → Low Dose• High Power + Low Pressure → High Dose → Substrate
Damage
ICM allows proper dosing without substrate damage
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Table of ContentsFundamentals of Evaporation
Materials, Throw Distance, & Other ConsiderationsSelection of appropriate sourceSweeping the BeamIndexing/rotation of sourceSelection of a suitable power supplyIntegration of a QCM controllerAddition of an Ion Source for IAD/substrate cleaningWill an optical monitor be beneficial?
Benefits/sizing of a cryochillerSheet Resistance MonitoringUHV Sources/componentsSpare Parts/Loyalty PricingConclusion
Telemark Product Training J. H. Gurian 70/104
Physical Thickness vs Optical Thickness
91
92
93
94
95
96
97
98
99
100
0 20 40 60 80 100
Tran
smis
sion
(%)
Physical Thickness (nm)
SLAR at 500nm
n=1.5n=1.4
Telemark Product Training J. H. Gurian 71/104
Single Layer Anti-Reflection Example
0 50 100 150 200Physical Thickness (nm)
200300400500600700800900
10001100
Wav
elen
gth
(nm
)
919293949596979899100
Tran
smis
sion
(%)
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Table of Contents
Fundamentals of Evaporation
Benefits/sizing of a cryochiller
Sheet Resistance Monitoring
UHV Sources/components
Spare Parts/Loyalty Pricing
Conclusion
Telemark Product Training J. H. Gurian 74/104
Cryochiller Sizes
Telemark provides 5 Cryochiller sizes, with cooling capacitiesfrom 1200W to 3600W
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Which one?
How do I select the right sizeCryochiller for my process?
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Why do I need a cryochiller?
• Most processes require a minimum background vacuumpressure for success
• 90% of species in chamber is H2O• Initial Capital Costs:
• Turbopump: ∼$8/L/s• Cryopump: ∼$2/L/s• TVP: ∼$0.2/L/s
Telemark Product Training J. H. Gurian 77/104
Water Vapor Pressure vs Temperature
−150 −140 −130 −120 −110−110 −100
10−9
10−8
10−7
10−6
10−5
10−4
10−3
Temperature (Celsius)
Par
tialP
ress
ure
(Tor
r)
Telemark Product Training J. H. Gurian 78/104
Water Vapor Pressure vs Temperature
ProcessRequirementdrives requiredcoil temp...
−150 −140 −130 −120 −110−110 −100
10−9
10−8
10−7
10−6
10−5
10−4
10−3
Temperature (Celsius)
Par
tialP
ress
ure
(Tor
r)
Telemark Product Training J. H. Gurian 79/104
Heat Load
The other important question:What’s the heat load on the system?
Telemark Product Training J. H. Gurian 80/104
Heat Load
The other important question:What’s the heat load on the system?
• Distance between Cryochiller and Chamber (26 W m−1 ofinsulated piping)
Telemark Product Training J. H. Gurian 80/104
Heat Load
The other important question:What’s the heat load on the system?
• Distance between Cryochiller and Chamber (26 W m−1 ofinsulated piping)
• Cryocoil surface area (375 W m−2)• Additional radiant heat on coil (IR heaters, etc.)
Telemark Product Training J. H. Gurian 80/104
Heat Load
The other important question:What’s the heat load on the system?
• Distance between Cryochiller and Chamber (26 W m−1 ofinsulated piping)
• Cryocoil surface area (375 W m−2)• Additional radiant heat on coil (IR heaters, etc.)
Telemark can help estimate this!
Telemark Product Training J. H. Gurian 80/104
Elevated Temp. Heat Load
0 50 100 150 200 250 3000
2,000
4,000
6,000
P = ǫAσT 4
Temperature (C)
Rad
iant
Em
ittan
ce(W
m−
2)
Telemark Product Training J. H. Gurian 81/104
Elevated Temp. Heat Load
0 50 100 150 200 250 3000
2,000
4,000
6,000
P = ǫAσT 4
Temperature (C)
Rad
iant
Em
ittan
ce(W
m−
2)
Radiation Shielding is very important for hot processes!Telemark can assist with design and consultation.
Telemark Product Training J. H. Gurian 81/104
Heat Load vs Cryochiller
0 500 1,000 1,500 2,000 2,500 3,000 3,500−140
−130
−120
−110
−100
Heat Load (W)
Tem
pera
ture
(C
)
12001800240030003600
Telemark Product Training J. H. Gurian 82/104
Heat Load vs Cryochiller
Custom gasmixtures canreach −160 C,with reducedcapacity
0 500 1,000 1,500 2,000 2,500 3,000 3,500−140
−130
−120
−110
−100
Heat Load (W)
Tem
pera
ture
(C
)12001800240030003600
Telemark Product Training J. H. Gurian 83/104
High Temperature Applications
Telemark Cryochillers can also be used for higher temperatureapplications:
• Food Processing• Essential Oil extraction• Cannabis processing
As well as more classic applications:• Fast-cycle batch coating• Large area/web coating• In-line processing
Telemark Product Training J. H. Gurian 84/104
Table of Contents
Fundamentals of Evaporation
Benefits/sizing of a cryochiller
Sheet Resistance Monitoring
UHV Sources/components
Spare Parts/Loyalty Pricing
Conclusion
Telemark Product Training J. H. Gurian 85/104
Increasing TCO Market
Grand View Research GVR-1-68038-820-6Etan J. Tal
Ashley Pomeroy
Telemark Product Training J. H. Gurian 86/104
In-Situ Sheet Resistance Monitoring
• 4-point probetechnique
• 200 kΩ to 0.2Ωrange
• ±0.5% accuracy• FR4-based
sensor card
Telemark Product Training J. H. Gurian 87/104
4-Point Sensing
• Outer electrodes supplycurrent I
• Inner electrodes sensevoltage V
• Ohm’s Law Ω = VI provides
accurate film resistance• Eliminates wire lead and
contact resistance frommeasurement
Telemark Product Training J. H. Gurian 88/104
Electron Beam Advantages
• High Deposition Rates• Excellent Material
Utilization• Easily incorporate
multiple materials formultilayer coatings
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Electron Beam ITO Difficulties
• Difficult ITOstoichiometry control
• In2O3 & SnO2evaporate at individualvapor pressures
• Post-deposition250-400 C air bakerecommended
Telemark Product Training J. H. Gurian 91/104
ITO Ω/ vs Thickness
Benoy, M.D. et al Braz. J. Phys. (2009)
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Deposition Equipment
• CA-50 Chamber• Telemark Model 274 4x40cc• Telemark 861 Dep Controller• 6MHz Quartz Crystal Sensor• Sheet Resistance Monitor
Telemark Product Training J. H. Gurian 93/104
Experimental Approach
• Evaporate ITO (In2O3/SnO2 90/10 WT%) at 5 Å s−1
• Stop via QCM at 1.5 kÅ• 5 × 10−5 Torr O2 partial pressure• 1 h in-air post-deposition bake at 300 C• Measure sheet resistance & optical transparency• Repeat for (3) runs to establish run-to-run variation• Repeat procedure using Sheet Resistance Monitor as stop
criteria
Telemark Product Training J. H. Gurian 94/104
Resistivity Results
0.8 0.9 1 1.1 1.2 1.3 1.4 1.5150
200
250
Thickness (kÅ)
She
etR
esis
tanc
e(Ω
/)
QCM MethodSRM Method
Telemark Product Training J. H. Gurian 95/104
380-780 nm Optical Transmittance Results
150 160 170 180 190 200 210 220 230 240 250 260
20
40
60
80
Sheet Resistance (Ω/)
Ave
rage
Tran
smitt
ance
(%)
QCM MethodSRM Method
Measuring using a Telemark Model 833 Optical Monitor
Telemark Product Training J. H. Gurian 96/104
Conclusions
• In-situ sheet resistancemonitoring improvedresistance run-to-runvariation from 20% to 5%
• Currently developing hightemperature SRM sensorcards for >150 C
Telemark Product Training J. H. Gurian 97/104
Table of Contents
Fundamentals of Evaporation
Benefits/sizing of a cryochiller
Sheet Resistance Monitoring
UHV Sources/components
Spare Parts/Loyalty Pricing
Conclusion
Telemark Product Training J. H. Gurian 98/104
FEATURES
Mounted on 10” CFF (DN200CF) flange (575)or 12” CFF flange (578) with all feedthroughs(optional CF flange configurations available)
-11
Pumps down to 10 torr
Automatic motorizedindexer available as an option
Electro-pneumatic shutter available as an option
Water-cooled cryo-shield available as an option
Integral sealed XY Sweep coils
Designed for ease of use and maintainability
Long filament life with 270° beam
deflection
Emitter assembly secured by single screw for easy filament replacement
APPLICATION
The 575/578 are precise, efficient UHV multi-pocket electron beam sources, ideal for research and development, as well as for small production applications.The models 575/578 are unique for their compact size and the capability to take up to five 15cc or four 40cc crucibles. This, combined with a 8/10kW power rating, makes the 575 and 578 the most versatile multi-pocket UHV electron beam sources available in the market place.These models also incorporate all the unique design features that have made the Telemark electron beam sources the most widely used E-beam evaporation sources in the world.
SPECIFICATIONS
Electron Beam . . . . . . . . . . . 270° hidden filament
Power Rating . . . . . . . . . . . . 8kW (575), 10kW (578)
Max High Voltage . . . . . . . . . -10kV
Cooling Water. . . . . . . . . . . . 1.5 gpm (6l/min)
Bake Out Temperature . . . . . 220°C
Distance from flange to center of the pocket575-01, 575-02, 575-03 . . . . 11”(280mm)All other models . . . . . . . . . . 14.5”(356mm)(custom lengths available as an option)
MODELS
Model 575/578 UHV Linear Multi-pocket
Electron Beam Sources
575-01 5 pocket 4cc
575-02 4 pocket 7cc
575-03 3 pocket 15cc
575-04 7 pocket 4cc
575-05 6 pocket 7cc
575-06 4 pocket 15cc
575-07 9 pocket 4cc
575-08 7 pocket 7cc
575-09 5 pocket 15cc
578-01 2 pocket 40cc
578-02 3 pocket 25cc
578-03 4 pocket 40cc
578-04 4 pocket 25cc
1801 SE Commerce Avenue Tel 360-723-5360 [email protected] Ground, WA 98604, USA Fax 360-723-5368 telemark.com
MADE IN USA
Optional Source RailGuide Assembly
The 6kW model 568 source is available for applications where a 8” CF flange mountedsource is required.
Model 528 UHV Compact 3kW Linear Multi-pocket
Electron Beam SourceThe model 528 is mounted on a 2.75 inch CF flange with 1.5cc pockets, no sweep coils, available in 3, 4, 5, and 6 pocket configurations.
2.2018
Near UHV Multi-Pocket and UHV Single Pocket
Electron Beam Sources
Model 218
UHV Single pocket
6kW 10kWModel 259
UHV Single pocket up to 160cc
Model 249
Near UHV Multi-pocket Capacity up to 6x 7ccMagnetic Fluid Rotary Feedthru to pump into -10 torr Range
Model 269/279
Near UHV Multi-pocketup to 6x 15cc pocket (269)up to 6x 25cc (279)Magnetic Fluid Rotary Feedthru to pump into -10 torr Range
Large Capacity SourcePerformance Proven inHigh-Power Production and MBE Applications
– Available in crucible volumes up to 160cc for long, uninterrupted evaporation, for long intervals between breaking vacuum, or processes requiring large area source
High Performance in a Small Package with Crucible Volumes up to 15cc.
– Rated at 6kW of power when operated at voltages from -6 to -10kV.
– Compact design for use in small research and development systems or wherever space is an important consideration.
– Sweep coils sealed in stainless steel cans are standard.
Model 259
UHV Single pocket up to 160cc
15kW
4kWModel 509
Ultra compact UHV Single pocket source
– Mounted on 4.5” or 6” CFF for direct replacement of K-cells
– No beam sweep
– 4cc pocket
– 5kV max.
– Integrated Dual HV feedthrough option
1801 SE Commerce Avenue Tel 360-723-5360 [email protected] Ground, WA 98604, USA Fax 360-723-5368 telemark.com
MADE IN USA
– ROTATABLE HEARTH IS REMOVABLE FOR EASY CLEANING OR CHANGING OF CRUCIBLES
– 270° beam deflection (Hidden Filament)
– Proprietary water cooling design means longer crucible life and more consistent evaporation of material
3kWModel 508
Ultra compact UHV Single pocket source
– Unmounted or mounted 2.75” CF flange
– No beam sweep
– 1.5cc pocket
– 5kV max.
Table of Contents
Fundamentals of Evaporation
Benefits/sizing of a cryochiller
Sheet Resistance Monitoring
UHV Sources/components
Spare Parts/Loyalty Pricing
Conclusion
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Table of Contents
Fundamentals of Evaporation
Benefits/sizing of a cryochiller
Sheet Resistance Monitoring
UHV Sources/components
Spare Parts/Loyalty Pricing
Conclusion
Telemark Product Training J. H. Gurian 103/104