edp-2002 @iccad attendees bill bell, asic methodology/metrics, ti david hathaway, design tool...

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EDP-2002 @ICCAD Attendees Bill Bell, ASIC Methodology/Metrics, TI David Hathaway, Design Tool Integration, Incremental Integration, IBM Sandeep Shukla, High-Level Methodology, UC Irvine Naresh Sehgal, Intel-HP Alliance Mgr, Intel Dwight Hill, Physical Synthesis / PD, Synopsys Takahide Inouye, STARC / Oakland Margarida Jacome, UT Austin Gary Smith, Gartner/Dataquest Andrew Kahng, UC San Diego Stefanus Mantik, Metrics and Design Process Optimization, UCLA / Cadence

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Page 1: EDP-2002 @ICCAD Attendees Bill Bell, ASIC Methodology/Metrics, TI David Hathaway, Design Tool Integration, Incremental Integration, IBM Sandeep Shukla,

EDP-2002 @ICCAD Attendees• Bill Bell, ASIC Methodology/Metrics, TI• David Hathaway, Design Tool Integration, Incremental

Integration, IBM• Sandeep Shukla, High-Level Methodology, UC Irvine• Naresh Sehgal, Intel-HP Alliance Mgr, Intel• Dwight Hill, Physical Synthesis / PD, Synopsys• Takahide Inouye, STARC / Oakland• Margarida Jacome, UT Austin• Gary Smith, Gartner/Dataquest• Andrew Kahng, UC San Diego• Stefanus Mantik, Metrics and Design Process Optimization,

UCLA / Cadence

Page 2: EDP-2002 @ICCAD Attendees Bill Bell, ASIC Methodology/Metrics, TI David Hathaway, Design Tool Integration, Incremental Integration, IBM Sandeep Shukla,

EDP-2002 @ICCAD Agenda, I• Naresh Sehgal: Overview of history / culture of EDPS

and EDP– Not an ICCAD; should maintain workshop flavor; informality

• General Organization of EDP-2002– Dates: April 22-23, same hotel, same rates, same block /

guarantee sizes, same unpublished workshop notes, …

– Target audience: product groups (methodologists, integrators), not “corporate CAD”

• Target audience may change slightly from year to year (Bill)

• “Methodology” is like “Design” – many themes possible

Page 3: EDP-2002 @ICCAD Attendees Bill Bell, ASIC Methodology/Metrics, TI David Hathaway, Design Tool Integration, Incremental Integration, IBM Sandeep Shukla,

EDP-2002 @ICCAD Agenda, II• Gary Smith: TPC and Program Organization

– Typical Angles:• Who should supply? (one company / many? Designers/EDA/3rd party?)

– Topics (“Where is the pain?”) (blue = Gary’s preferences)• High-level modeling – raising level of design entry to ES-level (Sandeep Shukla (+Rajesh Gupta?) =

organizer?)– What’s the value proposition? What’s the methodology?

• Reuse – difficulties of “straight shrink”, and shift from hard to soft IP reuse– Can’t do at low level, so need to do it at higher level

• Codevelopment of software and hardware (microprocessors, platforms) (Margarida Jacome = organizer)

• The New Design Rules (David Hathaway, Takahide Inouye, Andrew Kahng)– Reusable design rules / process characterizations / parameterized device sizes / … (one level higher than GDSII design

description standard?)– More than just what is coming out of the foundry

• Design conversion / Design collaboration (both internal and external) (Naresh Sehgal + Dwight Hill)– Practices (access control, revision control, …) – Incremental design

• Cost-effective design environment (Bill Bell = organizer)– Non-topics: reuse/platform-based