eiger: high frame rate pixel detector for synchrotron and ... · •largest deployed detector...

WIR SCHAFFEN WISSEN – HEUTE FÜR MORGEN

EIGER: High frame rate pixel detector for synchrotron and electron microscopy applications

Gemma Tinti:: SLS Detector Group :: Paul Scherrer Institut

Vienna Conference on Instrumentation 2019

WIR SCHAFFEN WISSEN – HEUTE FÜR MORGEN

Detector development for Synchrotron and FEL applications

Erik Fröjdh M. Andrä, A. Bergamaschi, M. Brückner, S. Chiriotti Alvarez, R. Dinapoli, D. Greiffenberg, C. Lopez-Cuenca, A.

Mozzanica, M. Meyer, D. Mezza, S. Redford, C. Ruder, B. Schmitt, X. Shi, D. Thattil, G. Tinti, S. Vetter, J. Zhang

Vienna Conference on Instrumentation 2019

Paul Scherrer Institut

Neutron source

Muon source

Proton therapy

Proton accelerator

Nanotechnology

Radiochemistry

Radiopharmacy

Material sciences

Basel Zurich Germany Aarau/Bern

Hotlab

Particle physics

SwissFEL

Energy research

Biology

ESI Platform

Synchrotron Light Source

3

Staff: 2000

Users/year:

2300 people

5300 visits

What do we do in the detector group?

Bump and wire bonding

Lithography

Users support

Chips Sensors Electronics Firmware SoftwareMechanics

Assembly Commissioning

4

MYTHENII&III

EIGER GOTTHARDI & II

JUNGFRAU MÖNCH AGIPD

1D/2D Strip Pixel Strip Pixel Pixel Pixel

Working Mechanism

PhotonCounting

Photon Counting

Charge Integrating

Charge Integrating

Charge Integratin

g

Charge Integratin

g

Strip/Pixel size [µm]

50 75×75 25/50 75×75 25×25 200×200

Applications Powderdiffraction,

energy-dispersive

spectrometers, beam position.

Ptychography, coherentimaging,protein

crystallography.

@ FLASH,main energy-

dispersive detector for

EU-XFEL.

Spectroscopicapplications, high count

rateapplications at

XFELs & synchrotrons.

(Biological) imaging &

tomography, RIXS,

spectroscopy, Laue

diffraction.

Development for the EU-

XFEL.

Our detectors

5

• Single photon counting

1 global threshold

6 trimbits / pixel

• 75 x 75 μm2

• 256 x 256 pixels

• Noise 100-200* e- RMS

• Configurable: 4/8/12 bit counter depth

• Frame rate: 23/11/8 kHz

• Dead time free operation mode (3μs)

• Count rate dead time

EIGER: 200-600ns

Eiger

*Depending on gain setting

– fast frame rate, dead time free, photon counting

coun

ter

+1

E

I

Threshold VcmpAdj. Gain

6

• 2x4 chips

• Single 4x8 cm2 silicon sensor

• Sensor thickens 320 μm

• Dedicated read out system per half module

with 10Gb/s Ethernet for data output

Eiger: Module

Eiger module equipped with

ASICs but no sensor

2x pixel

4x pixel

7

• Modules can be tiled to large area detectors

• Due to the parallel design there is no penalty in performance when moving from a

single module to multi module systems

Eiger: Detector

8

24 x 23 cm

3072 x 3072 pixels

9

• Charge integrating

• 75 x 75 um2 pixel

• 256 x 256 pixels

• Noise: 55e- (HG0 10us RT )

• Dynamic gain switching with 3 gain stages

Single photon sensitivity (from ~2 keV)

Dynamic range 104 12keV photons

• 1.1 kHz frame rate (2.4 kHz)

Jungfrau – dynamic gain switching, charge integrating

500k single module systemSame as Eiger

10

Automatic gain switching scan:

• White visible light illumination

• Requires removing of Al top layer

• Increasing integration time• plots in unit of 12keV

photons

Gain switchGain switch

Poisson

statistical limit

~20 ɣ ~700 ɣ~700 ɣ ~10800 ɣ

Noise across dynamic range

11A. Mozzanica (PSI)

• Charge integrating

• 25 x 25 μm2 pixel size

• 400 x 400 pixels

• Noise ~ 36e-/pixel

• Configurable but static gain

• Frame rate 3 kHz (6kHz)

• Two side buttable

Mönch

Mönch 03

– small pixels, low noise, charge integrating

12

Bump bonding

Hit map from Ge Kα fluorescence

Yield better than 99.95%

Pilatus 172 μm Eiger75 μm

x5.3

Mönch25 μm

x47

• Standard process

• Performed in-house at PSI

• Indium balls of diameter ~ 15 μm

13

High resolution imaging using interpolation

MÖNCH used as a photon counter (after clustering)

11 keV beam - Nanoscopium beamline, SOLEIL

No position interpolation

25 µm bins (pixels)

With position interpolation

1 µm bins

Measurement with: K. Medjoubi (SOLEI) Image processing: M. Ramilli (PSI)

Requires the primary track (ion, electron, photo electron) to be short

compared to pixel sizeFixed pattern due to that the charge sharing is position dependent

14

Sensors characterization with Jungfrau

Silicon CdTe GaAs

Sensor production Hamamastsu Acrorad Tomsk State University

Type p-on-n Schottky Cr compensated, Ohmic

Bump bonding PSI Advacam PSI

Thickness 320 um 750 um 500 um

Pixel size 75 x 75 um2 75 x 75 um2 75 x 75 um2

Bias voltage 200 V -500 V -300 V

Leakage current < 1uA 1.5uA 35uA

Si GaAsCdTe

4cm

8 cm

Silicon

Microscopes

Philips CM12 20-100 keV Geant4 pixel simulation framework

A. Schubel et al. A Geant4 based framework for pixel detector simulation, JINST 9, 2014

Simulation of lateral spread

Simulation of electron range

Energy [keV]

Cluster size – Silicon sensor

Sensor thickness: 320 um

MTF with single particle processing 100 keV

Energy response

GaAs 2us exposure time data with linearity correction applied

Silicon 10us no correction

CdTe 10us no correction

Energy response at 80 keV

Measured efficiency of CdTe and GaAs

Normalized using simulated Silicon efficiency, th 2.5keV

• SLS Detector group is developing strip and pixel detectors for photon science

applications

• Largest deployed detector system Jungfrau 16M Eiger 9M

• Working on larger area dynamic gain switching Mönch

• Electron detection with High Z sensors

• Thin entrance window sensor for low energy photon and electron detection

Summary

SLS Detector Group

Subpixel interpolation

T/(T+B)

R/(R+L)

• The signal is fully contained in

a 2x2 pixels cluster

• We analyze the ratio between

neighbors

η𝑥=0∙𝐿𝑒𝑓𝑡+1∙𝑅𝑖𝑔ℎ𝑡

𝑅𝑖𝑔ℎ𝑡+𝐿𝑒𝑓𝑡

η𝑦=0∙𝐵𝑜𝑡𝑡𝑜𝑚+1∙𝑇𝑜𝑝

𝐵𝑜𝑡𝑡𝑜𝑚+𝑇𝑜𝑝

• Custom algorithms must be

developed to correct for non

linear charge sharing

28A. Bergamaschi (PSI)

• The spatial resolution is higher in

the corner between pixels than in

the center of the pixels due to

limited charge sharing

• Energy dependent Higher energies, higher SNR

Lower energies, larger charge sharing

• Possible improvements Smaller pitch

Thicker sensors

Lower bias voltage

Spatial resolution

6 keVPencil beam scan

experiment

@ cSAXS beamline, SLS

29

25

0

Vertical resolution

0 25µm

3.3

1.4

µmµm

25

00 25µm

3.3

1.4

µmµm

Horizontal resolution

A. Bergamaschi (PSI)

Effect of removing top layer aluminum

• Measured with Eiger at the SIM beamline at the Swiss Light Source

• Improves energy response and efficiency

• Still energy straggling in the entrance window

MTF measurements with EIGER

Energy response GaAs 100 keV

Simulated efficiency - Silicon

1.5 um Aluminum as entrance window – Matched

energy response at 20keV

Clustering

eiger: high frame rate pixel detector for synchrotron and ... · •largest deployed detector...

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