electronic costing & technology experts · system plus consulting presents in two jointed...

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.

© 2014 by SYSTEM PLUS CONSULTING, all rights reserved. 1

Electronic Costing & Technology Experts

www.systemplus.fr21 rue la Nouë Bras de Fer44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected]

November 2014 – Version 1 – Written by Elena Barbarini & Romain Fraux

http://www.systemplus.fr/index.php?lang=ge&page=home.php

http://www.systemplus.fr/index.php?lang=ge&page=home.php

mailto:[email protected]

mailto:[email protected]

Apple iPhone 6 Plus – Rear Camera Module

Return to TOC


Glossary1. Overview / Introduction 4

– Executive Summary & Reverse Costing Methodology

2. Camera Module Supply Chain & Companies Profile 7– iPhone 6 Plus Camera Module Supply Chain– Companies Profile (Sony, LG Innotek)

3. iPhone 6 Plus Teardown 12

4. Physical Analysis 15– Synthesis of the Physical Analysis– Physical Analysis Methodology– Camera Module 18

– Camera Module View & Dimensions– Camera Module X-Ray– Camera Module Disassembly– Auto-Focus Driver– Hall Element

– Camera Module Cross-Section 41– Overview– Housing– Ceramic Substrate & IR Filter– Lenses, VCM & FPC

– CMOS Image Sensor 63– View & Dimensions– Pads, TSV Connections & Tungsten Grid– CIS Pixels– Logic Circuit (Main blocks, Transistors, SRAM)

– CMOS Image Sensor Cross-Section 78– Overview– Pixel Array Circuit– Logic Circuit– Pad Trenches & TSVs

– Comparison with iPhone 5S and Nokia Lumia 94

5. CIS Manufacturing Process Flow 97– Global Overview

– Logic Circuit Front-End Process

– Pixel Array Circuit Front-End Process

– BSI + TSV + Microlenses Process

– CIS Wafer Fabrication Unit

6. Cost Analysis 104– Synthesis of the cost analysis

– Main steps of economic analysis

– Yields Hypotheses

– CMOS Image Sensor Cost 109

– Logic Circuit Front-End Cost

– Pixel Array Front-end Cost

– BSI & TSV Front-End Cost

– Color Filters & Microlenses Front-End Cost

– Total Front-End Cost

– Back-End: Tests & Dicing

– CIS Wafer and Die Cost

– Camera Module Assembly Cost 121

– Lens Module Cost

– AFA/OIS Cost

– Final Assembly Cost

– Camera Module Cost 126

Contact 129


Return to TOC


System Plus Consulting presents in two jointed reports the technological innovation integrated in Apple’s

iPhone 6 & 6 Plus iSight camera modules and their differences.

• This full reverse costing study has been conducted to provide insight on technology data and

manufacturing cost of the iPhone 6 Plus rear-facing camera module.

• The iPhone 6 Plus camera module is equipped with the 8Mpixel resolution sensor and ƒ/2.2 aperture

and the “classical” 5-elements lens module.

• In comparison with the iPhone 6 camera module, the iPhone 6 Plus introduces the VCM auto-focus

actuator allowing Optical Image Stabilisation (OIS). The IOS is integrated in the packaging a

innovative way respect to Nokia Lumia camera module.

• The CMOS Image Sensor is still supplied by SONY and specifically made for Apple. It features a 1.5µm

pixel size and the Exmor-RS technology of SONY. This technology consists in a stacking of two

separate chips: a pixel array circuit and an Image Signal Processor (ISP) circuit. The circuits are

connected together by the use of copper Through Silicon Vias (TSV), thus making a real 3D device.

Since resolution and pixel size are unchanged compared to iPhone 5S, the CIS area of the iPhone 6 is

similar. But new functionalities, like “Focus Pixels”, require a more powerful ISP. To fit in the same

die area more functionalities, Apple designed the new ISP with a more advanced technology node

(45nm versus 65nm).


Return to TOC


Camera Module with Flex Top View

Camera Module with Flex Back View

Flex Marking

Camera Module with Flex Global View

Connector 2x19 Positions

Flex PCB

13

.3 m

m

17.0 mm


Return to TOC



Return to TOC


Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.

Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated)

These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:

electronic costing & technology experts · system plus consulting presents in two jointed...

Documents