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Product Bulletin

EPI-REZ™ Waterborne Epoxy Resin SystemsFor Traditional Epoxy Structural Applications PLUS Textiles and Non-Wovens

2

Table of Contents

Introduction 3

The Formulator’s Choice 3

Technology 4

Definitions 4

Product Nomenclature 4

Product Characteristics 5

Formulating and Curing Waterborne Systems 7

Additives and Modifiers 10

Application Data 11

Adhesives 11

Non-Wovens 12

Prepreg and Laminates 14

Summary 15

Figures and Tables

Figure 1/Effect of Dilution and Shear on Viscosity of EPI-REZ™ Resin 3522-W-60 4

Table 1/Typical Properties of EPI-REZ Resins 5

Table 2/Uncured Film Properties 6

Table 3/Typical Properties of EPIKURE™ Curing Agents 7

Table 4/System Viscosity of EPI-REZ Resins 3522-W-60 and 5520-W-60 with EPIKURE Curing Agents 7

Table 5A/Flexibility of BPA Epoxy Resins with 2-MI Cure at 250°F for 10 Minutes 8

Table 5B/Flexibility of EPI-REZ Resin 3522-W-60 Cured with EPIKURE Curing Agents at 250°F for 10 Minutes 8

Table 6/Solvent Resistance and Tg Data for EPI-REZ Resins with EPIKURE Curing Agents 8

Table 7/Chemical Resistance for EPI-REZ Resin 3515-W-60 with EPIKURE Curing Agents 8

Table 8/Typical Properties of Select HELOXY™ Modifiers 10

Table 9/Automotive Substrates—Tensile Shear Data 11

Table 10/DICY/2-MI Cured Epoxy Dispersions—Tensile Shear Data 12

Table 11/Non-Woven Applications—Tensile Strength 13

Table 12/Paper Saturants Study—Burst Strength 13

Table 13/Latex-Epoxy Hybrids 13

Table 14/Prepreg and Laminates—Various Waterborne Resins Cured with DICY/2-M 14

3

Introduction

Hexion™ Specialty Chemicals offers a series of EPI-REZ™ Waterborne Epoxy Resin dispersions for civil engineering, adhesive and structural applications. These dispersions offer unique application opportunities and handling characteristics while maintaining the high performance expected of epoxy resin systems.

Traditionally, in order to handle, formulate and apply epoxy resins, formulators have had to employ solventborne resins. With increasing government regulations, associated costs, and environmental consciousness, the use of organic solvents has become far less desirable. With “high-solids,” solventborne resins, the choices of molecular weight and resin and curing agent types are severely limited, and compromises in processing and performance often have to be made.

Commercially available waterborne products are offered in the following traditional classes and molecular weights of epoxy resins (see Table 1):

Bisphenol A-based epoxy resins■■

Epoxy novolac resins■■

Epoxy hybrid resins■■

Hexion’s unique waterborne technology is based on over 35 years of research, development, and technical service, and provides the high-performance properties of epoxy resins with no or minimal VOC or formaldehyde concerns. Some of the notable advantages and benefits of these waterborne products are:

Low VOC■■

Zero formaldehyde content■■

Easy cleanup with water■■

Easy blending with various EPI-REZ ■■

Waterborne Resins for optimum performance

Completely water-reducible■■

Minimum one-year shelf life■■

Compatability with other types of ■■

waterborne resins and polymers

Compatibility with reactive and ■■

non-reactive modifiers

Hexion’s waterborne resins perform as well as traditional solventborne epoxy resins in most applications, and can be cured with many of the same curing agents and hardeners. With the wide latitude offered by our EPI-REZ Waterborne Resins, EPIKURE™ Curing Agents, and HELOXY™ Modifiers, waterborne resin systems can be formulated to obtain:

Adhesion to a variety of substrates■■

Thermal resistance■■

Moisture resistance■■

Solvent resistance■■

Acid and alkali resistance■■

Flexibility■■

Toughness■■

Due to their high performance, unique handling characteristics, and low VOC content, these waterborne epoxy resin systems can be commercially utilized in a wide variety of applications and end uses as outlined below:

Fiber sizing—glass, synthetic and ■■

carbon fibers

Adhesives—tie-coats, primers and ■■

laminates

Textiles—saturants and back coatings■■

Non-wovens—saturants, binders and ■■

coatings

Civil engineering—floor coatings, ■■

grouts and sealants

Electrical—insulating materials■■

Electronic—photo imaging■■

Composites—prepreg and filament ■■

winding

The Formulator’s Choice

The purpose of this brochure is to introduce Hexion’s wide variety of available products and to provide guidance on their utility in order to meet the specific application and performance requirements of your end use. All of our products are manufactured to high standards of quality and have critical to quality property specifications.

The data contained in this brochure are intended to give only basic product information for quick reference—individual product technical bulletins with additional information are available for many of the products listed in this brochure. Additionally, our product line is always expanding as we respond to customer requests and technology advancements.

For additional information about any or all of these products, visit our website at www.hexion.com/epoxy.

As textile saturants, EPI-REZ™ Waterborne Resins can be used to meet or exceed the most stringent global emission standards, are easy to use in standard processes, provide chemical and water resistance, and offer superior mechanical properties.

4

Technology

EPI-REZ™ Waterborne Resins are dispersed with surfactants that keep the resin particles suspended in the water phase with minimal settling of the particles with time. This technology utilizes several proprietary non-ionic surfactants. The use of non-ionic surfactants ensures that the products are compatible with most components that are mixed into resin systems—including fillers, defoamers, coupling agents, most latexes, polyurethanes, phenolic modifiers, and other resins. EPI-REZ Waterborne Resin products contain minimal levels of surfactant to obtain optimal dispersions while maintaining resin performance. The typical properties that define a waterborne epoxy dispersion include weight per epoxide, non-volatile content, viscosity, particle size distribution, and pH.

The weight per epoxide—often noted as WPE or EEW (epoxide equivalent weight)—pertains to the resin polymer used to make the dispersion and defines the number of reactive epoxide sites in the resin. As the WPE decreases, the potential crosslink density of a resin will increase, and generally, the resin’s stiffness and chemical resistance properties will increase as well. The percent solids of a dispersion defines the quantity of resin in a dispersion with the remainder made up of water and, in

some cases, a co-solvent. The viscosity of dispersions, measured in centipoise (cP), is specified at a moderate level to facilitate handling. The relationship between the solids, the viscosity (see Figure 1 above), and the particle size are dependent on the type and level of surfactant used. Hexion’s waterborne dispersions have number average particle sizes of less than two microns, and many are less than one micron in particle size. This provides improved film coalescence and dispersion stability (pH 2–11), even though the pH of these dispersions is not buffered.

Definitions

Waterborne dispersion – A system containing two immiscible phases, water and a resin, in which one phase (the resin) is dispersed as small particles in the continuous phase (the water).

Surfactant – A compound that affects the surface activity of a liquid or solid in relation to other liquids or solids. Chemically, a surfactant contains hydrophilic and hydrophobic sections which allow it to interact with both the water and the resin.

Water-dispersible system – A system consisting of 100% solids product that can be dispersed when it is mixed with water.

Water-reducible system – A waterborne system that allows for the simple reduction of solids level by the addition of water.

EPI-REZ Resin 3522 - W - 60

“EPI-REZ Resin”Hexion tradename used for waterborne resins.

“3522”Waterborne product number for the base resin used in the solution.

“W”Indicates that water is the only solvent present in the dispersion (if another letter appears with the “W” it indicates that a co-solvent is also present).

“60”Indicates that the solids content is approximately 60% by weight.

Figure 1/Effect of Dilution and Shear on Viscosity of EPI-REZ™ Resin 3522-W-60*

54 55 56 57 58 59 60 61 620

5,000

10,000

15,000

20,000

Vis

cosi

ty a

t 25°

C, c

PNon-Volatiles, %

Spindle Speed5 RPM

Spindle Speed10 RPM

Spindle Speed20 RPM

Spindle Speed50 RPM

*Data collected on a Brookfield RVT viscometer and a #5 spindle at 25°C.

Product Nomenclature

Hexion employs a simple three-part coding system, following the product tradename, to designate the composition of resin products. The coding system consists of a number indicating the epoxy resin used in the particular solution, followed by one or more letters that describe the volatile portion of the product. The last two numbers indicate the percent solids (by weight) of the composition. For example:

5

Product Characteristics

Hexion’s EPI-REZ™ Waterborne Resin products exhibit non-Newtonian rheological behavior, which results in handling properties that differ from those of traditional resin solutions. It is important to consider this behavior when formulating systems with waterborne dispersions.

A plot of the percent non-volatiles of a dispersion versus the viscosity for varying shear rates is shown in Figure 1 (see page 4). This graph illustrates the pseudo-plastic behavior of the dispersion called “shear thinning.” Also note that there is a significant change in viscosity over a narrow solids range before the viscosity levels out.

Hexion’s waterborne resin dispersions are supplied at viscosities to facilitate handling. The initial viscosity of the waterborne system can easily be decreased (by further water dilution) or increased (by the use of thickening modifiers) in order to achieve the preferred handling characteristics for your specific system and application. In contrast to ionic (or “salted”) systems, EPI-REZ Waterborne Resins can be infinitely diluted with water without phase separation or deinversion.

Table 1/Typical Properties of EPI-REZ™ Resins

Product Description NV, %Weight per epoxide, g/eq pH

Viscosity at 25°C, cP Tg, °C1

EPI-REZ™ Resin 3510-W-60 Aqueous dispersion of a liquid Bisphenol A epoxy resin.

61 185–215 3.5 2,0002 -14

EPI-REZ Resin 3515-W-60 Aqueous dispersion of a semi-solid Bisphenol A epoxy resin.

63 225–275 4 9,0002 -8

EPI-REZ Resin 3522-W-60 Aqueous dispersion of a solid Bisphenol A epoxy resin.

60 615–715 8 12,0002 32

EPI-REZ Resin 3540-WY-55 Aqueous dispersion of a solid Bisphenol A epoxy resin with an organic co-solvent.

55 1,600–2,000 8 13,0003 44

EPI-REZ Resin 3546-WH-53 Aqueous dispersion of a solid Bisphenol A epoxy with a non-HAPs co-solvent.

53 1,900–2,200 8 5,0003 45

EPI-REZ Resin 5003-W-55 Aqueous dispersion of an epoxidized Bisphenol A novolac resin with an average epoxy functionality of 3.

58 195–215 4 7,0002 -1

EPI-REZ Resin 5520-W-60 Aqueous dispersion of a urethane modified epoxy resin with an average epoxy functionality of 2–3.

59 480–560 4 8,0002 27

EPI-REZ Resin 6006-W-68 Aqueous dispersion of an epoxidized o-cresylic novolac resin with an average epoxy functionality of 6.

65 230–270 9 1,0002 35

EPI-REZ Resin WD-510 Water dispersible Bisphenol A epoxy resin. 100 190–205 — 10,0002 —EPI-REZ Resin WD-512 Water dispersible Bisphenol A epoxy resin. 100 195–210 — 30,0002 —

1 Film Tg after drying.2 Brookfield RVT at 10 RPM, #5 spindle.3 Brookfield RVT at 20 RPM, #5 spindle.

EPI-REZ Waterborne Resins are supplied at viscosities which facilitate easy handling. As shown above, the viscosity and resin solids level can be readily lowered to any desired level by diluting the resins with water.

6

Product Characteristics (cont.)

The uncured film properties of the resins vary depending on the molecular weight of the base resin and the chemical structure. Table 2 above lists film properties of the uncured resins, including pencil hardness and tackiness.

With extended storage and shipping, some settling of the suspended particles may occur. In general, samples of these products should be lightly and thoroughly agitated before use to ensure uniformity. For ease of handling and optimum shelf life, epoxy dispersions should be stored in tightly sealed containers at temperatures between 50°F and 100°F (10–38°C). Do not allow the product to freeze. To prevent skinning or surface drying, do not leave the product uncovered for extended periods of time. If the need arises to store partially filled drums, replace the plastic top-sheet onto the surface of the liquid product. For more information on product handling and storage, visit our website at www.hexion.com/epoxy.

Table 2/Uncured Film PropertiesAmbient temperature After 3 minutes at 200°F

DispersionWeight per epoxide1 Clarity Tack Clarity Tack

Pencil hardness2

Bisphenol A epoxiesEPI-REZ™ Resin 3510-W-60 200 Clear Tacky Clear Tacky —

EPI-REZ Resin 3515-W-60 250 Clear Tacky Clear Tacky —EPI-REZ Resin 3522-W-60 650 Opaque Non-tacky Clear Non-tacky 3BEPI-REZ Resin 3540-WY-55 1800 Hazy Non-tacky Clear Non-tacky 3BEPI-REZ Resin 3546-WH-53 2050 Opaque Non-tacky Clear Non-tacky 3B

Polyfunctional epoxiesEPI-REZ Resin 5003-W-55 205 Clear Tacky Clear Tacky —EPI-REZ Resin 6006-W-68 250 Opaque Non-tacky Clear Non-tacky 3B

Urethane-modified epoxyEPI-REZ Resin 5520-W-60 525 Opaque Non-tacky Clear Non-tacky 3B

1 Based on percent non-volatiles, typical value.2 A pencil hardness of “3B” is softer than that of “B”, which in turn is softer than that of “H”. None of the uncured films listed above are considered hard compared to cured epoxy films, which may range from “H” (somewhat hard) to “9H” (extremely hard).

7

Formulating and Curing Waterborne Systems

EPI-REZ™ Resins can be cured either under ambient conditions or heat-cured (baked) conditions. To achieve the desired performance, there are many curing agent choices available in Hexion’s EPIKURE™ Curing Agent product line. For more information on these curing agents, please refer to the curing agent product bulletins available at the Hexion website at www.hexion.com/epoxy. Catalysts such as substituted imidazoles, e.g., 2-methylimidazole, and latent curing agents, e.g., dicyandiamide, are also very effective curatives in many applications. Curing Agents for EPI-REZ Waterborne Resins must be water stable and either water soluble or water miscible. These requirements exclude anhydrides as a class.

Structure-function relationships observed in traditional solventborne epoxy resin systems are comparable in waterborne systems. Table 3 above illustrates examples of the variety of amine-based curing agents that can be used with Hexion waterborne resins, and the properties which they impart to the cured state.

The waterborne system viscosity at a given non-volatile content is significantly affected by curing agent choice. The curing agent’s thickening effect on system viscosity in descending order is as follows (see Table 4 above for specific examples):

Polyamide type—EPIKURE Curing ■■

Agent 3100 series

Amidoamines—EPIKURE Curing ■■

Agent 3000 series

Cycloaliphatic amines—EPIKURE ■■

Curing Agent 3300 series

Aliphatic amine adducts—EPIKURE ■■

Curing Agent 3200 series

Table 3/Typical Properties of EPIKURE™ Curing Agents1

Description Property advantagesExample curing agent

Equivalent weight

Viscosity at 25°C, cP

Gardner color, max.

Aliphatic amine adduct Solvent resistanceLow colorLow viscosity

EPIKURE™

Curing Agent3295

45 150 3

Modified cycloaliphatic amine Low colorLow viscosityChemical resistance

EPIKURECuring Agent3370

73 120 1

Accelerated amidoamine Adhesion toughness EPIKURECuring Agent3072

65 700 12

Polymeric amidoamine AdhesionFlexibilityToughness

EPIKURECuring Agent3140

95 13,000 9

Modified polyamidoamine Water solutionChemical resistance

EPIKURECuring Agent8535-W-50

102 Z5 2 12

1 All curing agents listed are 100% non-volatile except EPIKURE Curing Agent 8535-W-50 which is supplied at 50% non-volatile content in water.2 Gardner-Holdt viscosity.

Table 4/System Viscosity of EPI-REZ™ Resins 3522-W-60 and 5520-W-60 with EPIKURE™ Curing Agents1

Product

EPIKURE Curing Agent 3072




EPI-REZ™ Resin 3522-W-60 6,400 11,600 80 280EPI-REZ Resin 5520-W-60 4,400 12,800 80 120

1 Viscosity at 25°C, as measured on a Brookfield RVT at 10 RPM, #5 spindle, cP.

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Formulating and Curing Waterborne Systems (cont.)

Gel time and viscosity data monitored through a 24-hour period after system compounding are indications of relative reactivity and potlife of the formulations. Higher epoxy functionality and/or lower amine equivalent weight are generally characterized by higher initial reactivity and shorter potlife. The higher reactivity permits a system to develop properties within a reasonable time at ambient cure temperatures.

The surface tension of EPI-REZ™ Waterborne Resins does not vary widely as the resin changes. However, for the total waterborne system, curing agent effects are observed to be very significant. For example, polyamide curing agents (EPIKURE™ Curing Agent 3100 series) are noted for their ability to wet a wide range of substrates for optimum adhesion, and thus, yield systems with the lowest surface tensions.

While cured waterborne systems demonstrate a degree of film hardness typical of traditional fully cured epoxy systems, higher cure temperatures can increase film hardness of homopolymerized systems in the case of more highly functional epoxy resins.

As with solventborne systems, the flexibility of amine-cured waterborne systems increases as the molecular weight of the epoxy resin increases, and/or as the functionality of the curing agent decreases, as shown in Tables 5A and 5B.

Glass transition temperature (Tg) development and solvent resistance of fully cured films generally correlate with the development of crosslink density. Thus, systems based on the highly functional EPI-REZ Resin 5003-W-55 consistently yield high Tg and solvent resistance, whereas with lower functionality resins, results are more dependent on curing agent choice (see Table 6).

Chemical resistance also depends on the choice of curing agent or catalyst. Cycloaliphatic amines demonstrate better chemical resistance than polyamides or accelerated amidoamines. A greater level of overall resistance is developed by resins homopolymerized with the catalyst 2-methylimidazole (2-MI) (see Table 7).

Table 5A/Flexibility of BPA Epoxy Resins with 2-MI Cure at 250°F for 10 Minutes

Product Weight per epoxide

2-MI1 concentration, phr

Reverse impact, in/lbs

EPI-REZ™ Resin 3510-W-60 200 3.0 < 20EPI-REZ Resin 3515-W-60 250 2.0 < 20EPI-REZ Resin 3522-W-60 650 2.4 > 160

1 2-methylimidazole.

Table 5B/Flexibility of EPI-REZ™ Resin 3522-W-60 Cured with EPIKURE™ Curing Agents at 250°F for 10 Minutes

Product Equivalent weight

Concentration, phr

Reverse impact, in/lbs

EPIKURE™ Curing Agent 3072 65 5.6 50EPIKURE Curing Agent 3140 95 7.1 < 20EPIKURE Curing Agent 3295 45 3.9 60

Table 6/Solvent Resistance and Tg Data for EPI-REZ™ Resins with EPIKURE™ Curing Agents

Product EPIKURE™ Curing Agent 3072

EPIKURE Curing Agent 3295 2-MI1

EPI-REZ Resin 5003-W-55 MEK double rubs2 Tg for 350°F cure3

> 10095°C

> 100130°C

> 100100°C


7477°C

> 10079°C

> 100134°C


> 10086°C

> 10071°C

> 100150°C


> 10080°C

> 10083°C

> 100100°C

1 2-methylimidazole.2 Cured at 250°F for 10 minutes.3 Cured at 350°F for 10 minutes.3 2-methylimidazole.

Table 7/Chemical Resistance for EPI-REZ™ Resin 3515-W-60 with EPIKURE™ Curing Agents1

Product

Curing agent concentration, phr

10% Acetic acid

10% Hydrochloric acid

10% Sodium hydroxide


16.4 Film softening Film softening No effect


20.9 Film softening Film softening Film softening


18.4 No effect No effect No effect

2-Methylimidazole (2-MI)

2.0 No effect No effect No effect

1 Cured at 250°F for 10 minutes.

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Formulating and Curing Waterborne Systems (cont.)

With water soluble or miscible curing agents, the recommended mixing procedure involves diluting the curing agent with the water used in the formulation and then adding this solution/emulsion to the epoxy resin dispersion with good agitation. This mixing procedure is imperative when using highly polymeric curing agents such as EPIKURE™ Curing Agent 3140. An excessively viscous, non-workable mixture will be formed if curing agents

Due to their high degree of compatibility with many components, EPI-REZ™ Waterborne Resins can be formulated with wetting agents, co-solvents, and coupling agents for improved film formation or adhesion. They can also be formulated with thickeners or thixotropes for rheology control to optimize the waterborne system.

When elevated temperature cure is planned, a drying step involving a short exposure to moderately elevated temperatures (e.g., 150°F) is usually desirable to enhance cured state performance. This short exposure period assures proper film formation and rapid cure. Once a smooth continuous film is formed, the cure can be further advanced at elevated temperatures.

Equivalent weight of curing agents x % NV of resin dispersion=

Weight of curing agent used per 100 parts (by weight) of resin dispersion, phrResin weight per epoxide, based on solids

NOTE: In the case of catalytic converters, catalyst levels are chosen based on optimized results.

In fiber sizing operations, EPI-REZ Waterborne Resins protect the fibers during processing. They are also compatible with various resin matrices and provide adhesion and thermal stability.

of the polymeric amidoamine type are added to the epoxy resin dispersion without prior water dilution.

With relatively hydrophobic curing agents, such as EPIKURE Curing Agent 3370, the curing agent should be added directly to the epoxy resin dispersion slowly and with moderate agitation. Water may then be added for further dilution.

Epoxy resin dispersion systems are formulated with a stoichiometric amount of EPIKURE Curing Agents using the following formula:

10

The polyfunctional and flexibilizer HELOXY Modifier products are used most frequently in waterborne systems. But even the monofunctional HELOXY Modifiers are used in waterborne systems, typically at low levels to improve wetting, reduce the viscosity during cure, and increase flexibility following cure. For more information on HELOXY Modifiers, please refer to the product bulletins available at the Hexion website at www.hexion.com.

The polyfunctional HELOXY products include HELOXY Modifiers 67 and 68— aliphatic modifiers which provide some increase in flexibility, while increasing the chemical resistance and mechanical performance of the system. HELOXY Modifier 107 is a cycloaliphatic modifier which improves mechanical properties such as compression strength and Tg. HELOXY Modifier 48 is trifunctional and can increase the crosslink density of a system which, in turn, increases the Tg.

Additives and Modifiers

A variety of additives can be used with waterborne dispersions to adjust the viscosity or surface tension of a system. EPI-REZ™ Waterborne Resin products are formulated with sufficient surfactant to support moderate quantities of fillers such as calcium carbonate, talc, and silicas. Additional surfactants can be added to act as wetting agents by lowering the surface tension of the waterborne dispersion. The addition of water soluble thickeners or protective colloids—such as polyvinyl alcohol, substituted celluloses, and some acrylics—improve the application properties and offset decreases in viscosity seen with water dilution. Silanes can be added to increase adhesion to certain substrates and fillers.

Various modifiers can be added to EPI-REZ Waterborne Resins to change the final properties of the cured material. Specifically, the addition of Hexion’s HELOXY™ Epoxy Functional Modifiers to the waterborne dispersions can add flexibility, improve wetting, and increase chemical resistance and mechanical strength. HELOXY Modifiers are epoxy functionalized alcohols, diols, and polyols—all of which blend easily with EPI-REZ Waterborne Resin products. There are three classes of HELOXY Modifiers:

Monofunctional glycidyl ethers■■

Polyfunctional glycidyl ethers■■

Flexibilizers■■

There are two HELOXY Modifier products that are primarily considered flexibilizers: HELOXY Modifiers 505 and 71, for which flexibility is provided by the long hydrocarbon chain of the molecule. HELOXY Modifier 505 has good color properties for outdoor applications and HELOXY Modifier 71 is used to increase the impact strength and toughness of a system.

Table 8/Typical Properties of Select HELOXY™ Modifiers1

Product Chemical name Weight per epoxide, g/eq Viscosity, cP

HELOXY™ Modifier 67 Diglycidyl ether of 1,4-butanediol

123–137 10–20

HELOXY Modifier 68 Diglycidyl ether of neopentyl glycol

130–145 13–25

HELOXY Modifier 107 Diglycidyl ether of cyclohexane dimethanol

155–165 55–75

HELOXY Modifier 48 Triglycidyl ether of trimethylolpropane

138–154 120–180

HELOXY Modifier 5052 Polyglycidyl ether of castor oil 550–650 250–500HELOXY Modifier 71 Dimer acid diglycidyl ether 390–470 400–900

1 For more information, visit the Hexion website at www.hexion.com to view the Hexion brochure entitled, “HELOXY Epoxy Functional Modifiers” or the individual product bulletin of interest.

2 HELOXY Modifier 505 is available in the U.S. only.

11

Application Data

EPI-REZ™ Waterborne Resin dispersions can be used in a variety of applications which currently use solvent-based or “high-solids” solutions. EPI-REZ Waterborne Resin products can also be used in conjunction with or to replace other waterborne resins, such as latexes, in many applications. The following tables suggest systems and provide data illustrating the high performance of Hexion waterborne systems. For additional application information on these topics, visit our website at www.hexion.com/epoxy.

Adhesives

EPI-REZ Waterborne Resin products can be used with various curing agents as adhesives on a variety of substrates, including aluminum, sheet molding compound, and cold rolled steel.

Table 9 illustrates the performance of EPI-REZ Resin 5003-W-55 and EPI-REZ Resin 3515-W-60 for a number of different substrates. Both Formulations A and B retained green strength after water was driven off. The higher functionality dispersion (EPI-REZ Resin 5003-W-55) outperformed the standard BPA-epoxy dispersion (EPI-REZ Resin 3515-W-60) in all cases except SMC:SMC and SMC:CRS adhesion. However, as shown for Formulation C, the addition of 1% epoxy silane boosted SMC adhesive performance for EPI-REZ Resin 5003-W-55. The potlife for these systems is several hours at room temperature.

Table 10 (see page 12) provides the performance properties on several latent cure systems that have a potlife of up to several days. These formulations also exhibit superior water resistance, as expected of dicyandiamide (DICY) formulations. EPI-REZ Waterborne Resins may be used as adhesives for various substrates in automobiles.

They have no, or minimal, VOC emissions and provide good thermal stability and chemical/ corrosion resistance.

Table 9/Automotive Substrates — Tensile Shear DataFormulation, by weight as supplied A B C

Type of failure

EPI-REZ™ Resin 5003-W-55 100.0 — 100.0 —EPI-REZ Resin 3515-W-60 — 100.0 — —EPIKURE™ Curing Agent 3046 24.1 21.6 24.1 —Tap water 50.0 60.0 50.0 —Epoxy Silane — — 0.6 —% NV 45 45 45 —

Tensile Shear Data,1 psiSubstrateAI:AI 2,210 1,070 — CohesiveCRS:CRS 1,480 780 1,433 CohesiveSMC:SMC 510 680 670 CohesiveNylon:Nylon 220 190 — AdhesiveTPO:TPO 56 0 — AdhesiveRIM:RIM > 2802 240 — CohesiveSMC:CRS 1,200 1,710 — Cohesive

1 Cure = 3 minutes at 150°F and 10 minutes at 200°F. Test method ASTM D1002.2 Substrate tear.

AI = Aluminum, 2043-T3, etched.CRS = Cold rolled steel, dry wiped.SMC = Sheet molding compound, ash phase alpha, rigid exterior, MEK wiped.Nylon = DuPont Minlon, rigid exterior, MEK wiped.TPO = Thermoplastic polyolefin, Himont ETA 3061, flexible exterior, MEK wiped.RIM = Reaction injection molding, Mobay BAYFLEX 110-35, flexible exterior, MEK wiped.

12

Non-Wovens

Hexion’s waterborne resins can also be used to strengthen paper and other non-woven substrates. Tables 11 and 12 (see page 13) list the performance properties for three resin systems used to saturate paper substrates.

In Tables 11 and 12, EPI-REZ Resin 5520-W-60 (a urethane-modified dispersion) is shown to have superior resistance to acid, whereas EPI-REZ Resin 3522-W-60 is tougher and less brittle, as indicated by its burst strength.

Table 13 (see page 13) illustrates the use of EPI-REZ Waterborne Resins as modifiers to various latex systems to increase their strength. The data indicate that as little as 10% waterborne epoxy can significantly increase the tensile strength and water resistance of latexes.

Table 10/DICY/2-MI Cured Epoxy Dispersions — Tensile Shear DataFormulation, by weight as supplied A B C

Type of failure

EPI-REZ™ Resin 3515-W-60 100 — — —EPI-REZ Resin 3522-W-60 — 100 — —EPI-REZ Resin 5520-W-60 — — 100 —Dicyandiamide1 3.50 2.25 2.25 —2-MI2 0.15 0.20 0.20 —Water 20.0 20.0 20.0 —% Resin solids 50.0 50.0 50.0 —

Cured state properties3

Tensile Shear Data,4 psiSubstrateAI:AI 3,290 3,560 2,860 CohesiveAI:AI (tested at 150°F) 2,852 1,260 2,900 CohesiveSMC:SMC 640 480 — CohesiveSMC:CRS 340 610 — Adhesive

Pencil hardness 4H 4H 4H —Reverse impact, in/lbs > 160 > 160 > 160 —

1 Supplied by SKW Chemicals, Inc.2 2-methylimidazole, supplied by BASF.3 Cure = 3 minutes at 150°F and 10 minutes at 340°F.4 Tested at 77°F, except where noted. Test method ASTM D1002.

AI = Aluminum, 2043-T3, etched.CRS = Cold rolled steel, dry wiped.SMC = Sheet molding compound, ash phase alpha, rigid exterior, MEK wiped.

13

Table 11/Non-Woven Applications — Tensile Strength

Resin Curing agent

Initial tensile strength (lbs/in2), dry

% Retention (wet) 1 minute in 1% Triton X-100

% Retention (acid) 3 hours in 5% HCl, 77°F

% Retention (HF) 24 hours in hydraulic fluid, 200°F

EPI-REZ™ Resin 3522-W-60 Polyamide 47 55 45 56EPI-REZ Resin 5520-W-60 Polyamide 51 59 71 53

Table 12/Paper Saturants Study — Burst StrengthResin Curing agent Mullen burst strength, (lbs/in2)EPI-REZ Resin 3522-W-60 Polyamide 57EPI-REZ Resin 5520-W-60 Polyamide 50

Table 13/Latex-Epoxy HybridsVCL1 ACR SBR1 ACR1 VCL VCL

Latex properties Tg,°C 73 55 -9 56 8 50Carboxyl Yes Yes Yes Yes No NoAmine No No No Yes No NoHeat reactive Yes Yes Yes No No No

Cured properties2 Dry tensile strength, paper substrate2

Unmodified, PLI 14.2 10.2 29.1 31.0 26.3 31.2Modified, % improvement EPI-REZ Resin 3510-W-60 23 28 NI4 NI NI 28EPI-REZ Resin 5003-W-55, 10% by wt. 27 25 NI NI 11 28

Wet tensile strength, paper substrate2

Unmodified, PLI3 11.7 35.0 17.1 10.9 12.0 11.4Modified, % Improvement EPI-REZ Resin 3510-W-60 20 16 7.1 100 49 79EPI-REZ Resin 5003-W-55, 10% by wt. 24 14 20 70 48 86

1 Uncatalyzed.2 Cure = 10 minutes at 300°F.3 PLI = Pounds/linear inch4 NI = No improvement

VCL = Vinyl chloride latexACR = Acrylic latexSBR = Styrene butadiene latex

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Table 14/Prepreg and Laminates — Various Waterborne Resins cured with DICY/2-MI1

A B C DFormulation, by weight as suppliedEPI-REZ™ Resin 3522-W-60 100 — — —EPI-REZ Resin 5520-W-60 — 100 — —EPI-REZ Resin 5003-W-55 — — 100 —EPON™ Resin 1007-solution2 — — — 100DICY/2-MI1 1.2/0.15 1.4/0.15 3.5/0.10 1.2/0.08Water 21 21 13 232

B-Stage condition 10 minutes at 250°F

10 minutes at 250°F



Prepreg gel time, 340°F 83 sec. 60 sec. 33 sec.3 67 sec.

8-Ply laminates4 Resin content 40 41 40 39Tg by DMA5,°C 98 108 186 121Flexural strength, 23°C Lengthwise, psi 60,670 62,800 65,100 69,860Crosswise, psi 51,070 46,510 58,580 53,950Dielectric constant at 1 MHz, 23°C 5.35 5.38 5.61 5.14Dissipation factor at 1 MHz, 23°C 0.025 0.027 0.025 0.020Volume resistivity, 23°C, ohm-cm 1.5 x 101 5 1.0 x 101 5 5.6 x 101 4 1.0 x 101 5

Moisture absorption, % (1 hour at 15 psi steam) 1.16 1.12 0.81 0.75MEK absorption, % (30 minute soak) 1.12 1.73 0 1.40

1 2-methylimidazole.2 Solventborne control sample—propylene glycol monomethyl ether used instead of water.3 Prepreg slightly tacky at room temperature.4 Eight plies of 8-inch x 8-inch prepreg pressed 60 minutes at 340°F and 150 psi. Prepreg made with 7628 style woven fiberglass cloth.5 Tg measured on DuPont Dynamic Mechanical Analyzer in the vertical mode at a heat rate of 5°C per minute.

Prepreg and Laminates

Waterborne products can also be used in laminate applications. Table 14 above illustrates the mechanical, thermal, and electrical properties of laminates made from various resins with a Dicyandiamide/2-MI curing system. The laminates were constructed from eight plies of 8-inch by 8-inch fiberglass prepreg pressed for 60 minutes at 340°F and 150 psi.

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Summary

EPI-REZ™ Waterborne Epoxy Resins from Hexion Specialty Chemicals offer unique handling and applications characteristics for epoxy and other thermoset resins. These waterborne resins are compatible with one another and allow the formulator to easily combine resin types and molecular weights. They can be diluted to any desired solids level simply with water. Furthermore, cleanup with water eliminates the need for solvents. EPI-REZ Waterborne Resins can be used in most traditional applications—such as civil engineering, adhesives, etc.—to reduce or eliminate VOCs and formaldehyde without sacrificing performance. In addition, EPI-REZ Waterborne Resins are compatible with most commonly used epoxy curing agents, epoxy modifiers, and other additives (such as fillers and wetting agents) used by formulators.

Due to their ease in handling, waterborne epoxies can now be used in many non-traditional epoxy applications where solventborne and highly viscous epoxy resins cannot be used. Saturants and coatings for non-wovens and textiles are examples of these non-traditional applications. All of the performance advantages of epoxy resins, such as chemical and water resistance and strength properties, can now be brought to these new applications. EPI-REZ Waterborne Resins can be combined with other waterborne polymers such as polyurethanes, various latex polymers, and phenolic resins so that unique performance properties can be obtained in each specific application.

EPI-REZ Waterborne Resins offer creative challenges and exciting new performance possibilities for engineers and chemists in the design and formulation of new products to gain a competitive advantage in the marketplace.

For additional information about any or all of these products, visit our website at www.hexion.com/epoxy.

The formulations provided in this document are starting point formulations and are not proven for use in the user’s particular application, but are simply meant to demonstrate the efficacy of the products and to assist in the development of the user’s own formulations. It is the user’s responsibility to fully test and qualify the formulation, along with the ingredients, methods, applications, or equipment identified herein (“Information”), by the user’s knowledgeable formulator or scientist, and to determine the appropriate use conditions and legal restrictions, prior to use of any Information.

Exposure to these materials should be minimized and avoided, if feasible, through the observance of proper precautions, use of appropriate engineering controls and proper personal protective clothing and equipment, and adherence to proper handling procedures. None of these materials should be used, stored, or transported until the handling precautions and recommendations as stated in the Material Safety Data Sheet (MSDS) for these and all other products being used are understood by all persons who will work with them. Questions and requests for information on Hexion Specialty Chemicals, Inc. (“Hexion”) products should be directed to your Hexion sales representative, or the nearest Hexion sales office. Information and MSDSs on non-Hexion products should be obtained from the respective manufacturer.

Contact Information

For product prices, availability, or order placement, call our toll-free customer service number at 866.443.9466. For literature and technical assistance, visit our website at: www.hexion.com/epoxy.

For worldwide locations visit hexion.com® and ™ Licensed trademarks of Hexion Specialty Chemicals, Inc. © 2009 Hexion Specialty Chemicals, Inc. HCI-223 8/09 Printed in U.S.A.

The information provided herein was believed by Hexion Specialty Chemicals (“Hexion”) to be accurate at the time of preparation or prepared from sources believed to be reliable, but it is the responsibility of the user to investigate and understand other pertinent sources of information, to comply with all laws and procedures applicable to the safe handling and use of the product and to determine the suitability of the product for its intended use. All products supplied by Hexion are subject to Hexion’s terms and conditions of sale. HEXION MAKES NO WARRANTY, EXPRESS OR IMPLIED, CONCERNING THE PRODUCT OR THE MERCHANTABILITY OR FITNESS THEREOF FOR ANY PURPOSE OR CONCERNING THE ACCURACY OF ANY INFORMATION PROVIDED BY HEXION, except that the product shall conform to Hexion’s specifications. Nothing contained herein constitutes an offer for the sale of any product.

Hexion Specialty Chemicals, Inc.Epoxy Resins PO Box 4500 Houston, TX 77210-4500 USA+1 614 986 2498

World Headquarters/North America:

Hexion Specialty Chemicals, Inc. 180 East Broad Street Columbus, OH 43215-3799 +1 614 225 4000

Regional Headquarters:

AsiaHexion Specialty Chemicals Singapore Pte Ltd. Lippo Plaza # 3701 222 Central Huaihai Road Shanghai 200021 China +86 21 3318 4800

AustraliaHexion Specialty Chemicals Pty. Ltd. 2–8 James Street Laverton North Victoria 3026 Australia +61 3 9368 8900

EuropeHexion Specialty Chemicals B.V. Koddeweg 67 3194 DH Hoogvliet Rotterdam, The Netherlands +31 10 295 4000

Latin AmericaHexion Química Ind. e Com. Ltda. Rua Cyro Correa Pereira, 2525 Area-Sul - CIC 81450-090 Curitiba, Brazil +55 41 3212 1600

The Global Leader in Thermoset Resins

As the world’s largest producer of thermoset resins and the leader in adhesive and structural resins and coatings, Hexion Specialty Chemicals meets customers’ specific application needs with a total solutions approach of products and services. Hexion offers the broadest range of thermoset resin technologies and unmatched technical support—and provides them around the globe. With our extensive research and development capabilities and applications know-how, we are uniquely able to work in partnership with customers to co-develop better products and systems. Plus, Hexion’s worldwide production network facilitates assured supply and prompt delivery wherever our customers do business.

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